JP2001328051A - Polishing method and device for edge portion of workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To highly efficiently and precisely polish an edge portion of a workpiece. SOLUTION: A polishing member 6 is provided adjacent to a workpiece holding member 2 rotatably holding the workpiece 20. The polishing member 6 comprises a feed drum 8, a polishing belt 9 winding around the feed drum 8, a winding drum 10 for the polishing belt 9 fed from the feed drum 8, and a pair of guide members 11 and 11 guiding the polishing belt 9. The polishing member 6 is moved in the direction of the workpiece holding member 2, the edge portion 20a of the workpiece 20 is positioned in a part of the polishing belt 9 positioned between the pair of guide members 11 and 11, and a chamfer portion 20b of the edge portion 20a of the workpiece 20 is press contacted with the part of the polishing belt 9 positioned on the inclined face 11a of each guide member 11. The workpiece 20 is rotated integrally with the workpiece holding member 2 so that the chamfered part 20b of the edge portion 20a of the workpiece 20 is polished.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for polishing an edge portion of an object to be polished and a polishing apparatus therefor, and more particularly, to an outer periphery of a disk-shaped object to be polished such as a semiconductor wafer, a glass plate, a quartz plate, and a ceramic substrate. TECHNICAL FIELD The present invention relates to a method for polishing an object to be polished, which is effective for polishing a portion (edge portion, hereinafter referred to as an edge portion), and a polishing apparatus therefor.

[0002]

2. Description of the Related Art For example, a wafer used as a substrate of a semiconductor device is obtained by slicing a single crystal ingot such as silicon, and chamfering, lapping, etching, annealing, polishing, and the like are performed on the sliced product. And the like.

A chamfering step among these steps is performed to prevent chipping from occurring at an edge portion of the object to be polished, and is usually a hard and rigid grindstone such as a diamond grindstone. A method of grinding an edge portion of an object to be polished by using a method has been adopted.

However, when chamfering an edge portion of an object to be polished using a hard and rigid grindstone such as a diamond grindstone, the chamfered portion may generate dust and adversely affect a subsequent process. The part must be further polished to a mirror finish.

Japanese Patent No. 2857816 discloses an example of a polishing apparatus for finishing a chamfered portion of an edge portion of a workpiece to a mirror finish.
And Japanese Patent No. 2889108.

The polishing apparatus described in Japanese Patent No. 2857816 discloses a rotating mechanism for rotatably holding a wafer material to be polished, a tape transport mechanism for transporting a polishing tape, and a reciprocating tape transport mechanism. A moving mechanism, a swinging mechanism for swinging a tape transfer mechanism, a pressure receiving pad elastically deformable by a pressing force between a polishing tape and a wafer material, a swinging mechanism for swinging the pressure receiving pad, and a tape. And a feed mechanism for causing the transfer mechanism to make a feed motion to slide the polishing tape into contact with the wafer material.

In order to polish the edge portion of the wafer material by the polishing apparatus having the above-described configuration, the wafer material is rotated by the rotating mechanism, the polishing tape is transported by the tape transport mechanism, and the tape is rotated by the oscillation mechanism. The transfer mechanism is oscillated, and the tape transfer mechanism is moved by the movement mechanism to bring the polishing tape into pressure contact with the circumferential edge of the edge of the wafer material. Alternatively, the rotation of the wafer material is stopped, the polishing tape is transferred by the tape transfer mechanism, the tape transfer mechanism is oscillated by the swinging mechanism, and the tape transfer mechanism is moved by the moving mechanism to transfer the polishing tape to the wafer material. The polishing tape is brought into pressure contact with the linear edge surface of the edge portion, and the tape transport mechanism is fed by the feed mechanism, so that the polishing tape slides on the linear edge surface of the edge portion of the wafer material.

However, in the polishing apparatus having the above configuration, the polishing tape is transported by the tape transport mechanism during the polishing process, and the polishing tape is oscillated by the oscillation mechanism. As a result, the polishing load varies, and the entire edge portion of the wafer material cannot be uniformly polished, resulting in variation in finishing accuracy. In other words, the polishing load by the polishing tape is maximized at the peripheral surface of the edge portion of the wafer material,
The chamfers on the upper surface and the lower chamfer are smaller than the chamfers, so that the entire edge of the wafer material is not uniform. Further, in the polishing apparatus having the above-described configuration, polishing marks by the polishing tape are likely to remain on the edge of the wafer material. Further, since the structure of each mechanism is complicated, processing and assembly are troublesome, and the price of the entire apparatus is increased.

On the other hand, in the apparatus disclosed in Japanese Patent No. 2889108, it is necessary to incline the rotary drum in the front-rear direction at the time of polishing, and the inclining mechanism for this incline is complicated. In addition, there is a problem that it becomes expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and can uniformly polish the entire edge portion of the object to be polished, thereby achieving uniform finishing accuracy. A method for polishing an edge portion of an object to be polished, which can be made and has no polishing marks left on the edge portion, has a simple structure, is easy to process and assemble, and can reduce the price as a whole. And a polishing apparatus therefor.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a polishing belt which rotatably holds an object to be polished by a member to be polished and guides the polishing band which can be fed out and the polishing band. A polishing member having a guide member to be moved in the direction of the polished work holding member, and guiding the edge of the polished work to a portion of the polishing band, which is guided by the guide member and stops feeding. Means is employed in which the object to be polished is rotated and the end surface of the edge of the object to be polished is polished while being pressed against and supplying the slurry from the slurry supply source. Further, the present invention provides a polishing object holding member that rotatably holds an object to be polished, and a pair of guide members that guide the polishing band and the polishing band that can be fed out and that have opposing portions formed on an inclined surface. Approaching the direction of the polishing member holding member, the edge portion of the polishing object is pressed against the portion of the polishing band that is being guided by the pair of guide members and has stopped feeding. Means for rotating the workpiece holding member while the slurry is being supplied from a slurry supply source to grind a chamfered edge portion of the workpiece. In addition, the present invention
The object to be polished is held rotatably by the object to be polished, and one of the polishing members having a feedable polishing band and a guide member for guiding the polishing band is brought closer to the object to be polished holding member, An edge portion of the object to be polished is pressed against a portion of the polishing band that is guided by the guide member and is stopped from being fed, and a portion that guides the polishing band that can be fed out and opposes the polishing band. The other polishing member having a pair of guide members formed on the inclined surface is approached in the direction of the object-to-be-polished holding member, and the polishing is guided by the pair of guide members and the feeding is stopped. The edge portion of the object to be polished is pressed against the band portion, and while the slurry is supplied from the slurry supply source, the end surface portion and the chamfered portion of the edge portion of the object to be polished are simultaneously rotated by rotating the object to be polished. Polish It is obtained by adopting the means. Further, the present invention includes a polished work holding member that rotatably holds a polished work, a polishing member that can be brought into contact with and separated from the polished work holding member, and a slurry supply source that supplies slurry, The polishing member has a feedable polishing band and a guide member for guiding the polishing band. The polishing member is brought close to the workpiece holding member, guided by the guide member, and fed. The edge of the object to be polished is pressed against the portion of the polishing band where the polishing is stopped, and the edge of the object to be polished is rotated by rotating the object to be polished while the slurry is supplied from the slurry supply source. Means for polishing the end face of the substrate. Further, the present invention includes a polished work holding member that rotatably holds a polished work, a polishing member that can be brought into contact with and separated from the polished work holding member, and a slurry supply source that supplies slurry, The polishing member has a pair of guide members that can be fed out and a pair of guide members that are formed on an inclined surface to guide the polishing band, so that the polishing member approaches the workpiece holding member. The edge of the object to be polished is pressed against a portion of the polishing band which is located between the pair of guide members while the feeding is stopped, and the object to be polished is supplied with the slurry supplied from the slurry supply source. A means for rotating the holding member and polishing the chamfered portion of the edge of the object to be polished is employed. Further, the present invention provides a polishing object holding member that rotatably holds a polishing object, two polishing members that can be moved toward and away from the polishing object holding member, and a slurry supply source that supplies slurry. In one embodiment, the one polishing member has a feedable polishing band and a guide member for guiding the polishing band, and the other polishing member has a feedable polishing band,
A pair of guide members having inclined surfaces facing each other while guiding the polishing band, and bringing the two polishing members closer to the direction of the object-to-be-polished holding member so that they are guided by the guide members and fed out. The edge of the object to be polished is pressed against the portion of the polishing band that is stopped, and the object to be polished is chamfered by rotating the object to be polished while the slurry is supplied from the slurry supply source. A means for simultaneously polishing the end face and the chamfered portion of the portion is employed.

[0012]

According to the present invention, by employing the above-described means, the object to be polished is held by the object to be polished, the feeding of the polishing band of the polishing member is stopped, and the object to be polished is held by the member to be polished. Direction, the edge of the object to be polished is pressed against the portion of the polishing band located on the guide member, and the end surface of the edge of the object to be polished is rotated by rotating the object to be polished in this state. Will be polished. Further, the feeding of the polishing band of the polishing member is stopped, and the polishing member is moved closer to the polishing object holding member, and the edge portion of the polishing object is placed on a portion of the polishing band located on the inclined surface of the pair of guide members. Is pressed, and the workpiece holding member is rotated in this state, whereby the chamfered portion of the edge of the workpiece is polished.
Further, the object to be polished is held on the object to be polished, the unwinding of the polishing band of one of the polishing members is stopped, and one of the members is brought close to the direction of the object to be polished. The edge of the object to be polished is pressed against the portion of the polishing band located at the position, the feeding of the polishing band of the other polishing member is stopped, and the other polishing member is moved closer to the direction of the object to be polished,
The edge portion of the object to be polished is pressed against the portion of the polishing band located on the inclined surface of the pair of guide members, and by rotating the object to be polished in this state, the end surface of the edge portion of the object to be polished and The chamfer will be polished at the same time.

[0013]

Embodiments of the present invention shown in the drawings will be described below. 1 and 2 show an embodiment of a polishing apparatus for an edge portion of an object to be polished according to the present invention. The polishing apparatus 1 includes a polishing object holding member 2 for holding a disk-shaped polishing object 20 such as a semiconductor wafer, a glass plate, a quartz plate, and a ceramic plate, and a polishing apparatus for polishing an edge portion 20a of the polishing object 20. Member 6 and workpiece holding member 2
And a slurry supply source 5 for supplying slurry between the polishing member 6.

The workpiece holding member 2 has a disk-shaped holding plate 3 for holding one side of the workpiece 20 by means of vacuum suction or the like, and a rotating shaft 4 integrally provided at the center of the lower surface of the holding plate 3. And a drive source (not shown) for driving the rotation shaft 4 to rotate. By operating the drive source, the workpiece 20 held on the upper portion of the holding plate 3 is moved in the horizontal direction. It can be driven to rotate.

A slurry supply source 5 is provided above the workpiece holding member 2. By operating the slurry supply source 5, a gap between the workpiece 20 and the polishing member 6 during polishing of the workpiece 20 is provided. Can be supplied to the slurry.

The polishing member 6 is provided adjacent to the workpiece holding member 2. The polishing member 6 is horizontally moved by a horizontal moving member (not shown) to be polished.
It can be moved away.

The polishing member 6 comprises a base frame 7 composed of an upper plate 7a, a lower plate 7b and a back plate 7c, and an upper plate 7a and a lower plate 7 of the base frame 7.
b, rotatable pay-out drums 8, 8 respectively
And a polishing band 9 wound around each of the feeding drums 8 so as to be able to be freely fed, a rotatable winding drum 10 for winding the polishing band 9 fed from each of the feeding drums 8, and a back plate 7c of the base frame 7. And each feeding drum 8
And a pair of guide members 11 for guiding a part of the polishing band 9 drawn out from the belt.

The guide member 11 is provided on a pair of movable bases 13, 13 which can be moved up and down and positioned at predetermined positions on a base 12 provided on a back plate 7c of the base frame 7, It is mounted via a movable base 13 and can be vertically moved integrally with the movable base 13 and the supporting members 14 and 14 and can be positioned at a predetermined position.

As shown in FIG. 7, the guide member 11 has a shape corresponding to the shape of the portion to be polished on the edge portion 20a of the object 20 to be polished. For example, when the portion to be polished is the chamfered portion 20b of the edge portion 20a of the workpiece 20, the guide member 11 is attached to the tip of each support member 14 as shown in FIG. In this case, each guide member 11 is a chamfered portion 20b of the edge portion 20a of the workpiece 20.
Is provided.

The polishing belt 9 fed from each feeding drum 8 passes through guide rollers 15, 15, between the pair of guide members 11, 11, and between the pair of guide rollers 15, 15, and is wound on the take-up drum 10. Removed and placed without slack.

Then, the workpiece 20 on the holding plate 3 of the workpiece holding member 2 is held by means such as vacuum suction, and the horizontal moving member is operated to move the polishing member 6 from the horizontal direction. 2, the edge 20a of the object 20 is pushed into the polishing strips 9, 9 located between the pair of guide members 11, 11 of the polishing member 6, and the inclined surface 11a of each guide member 11 is pressed. The portion of each of the polishing bands 9 located on the upper side is each chamfered portion 20b of the edge portion 20a of the workpiece 20.
Press against In this state, the gap between the pair of guide members 11, 11 is adjusted in advance so that the object 20 does not enter further inward. That is, both guide members 1
The support members 14 and 14 can be separated from each other by the support members 14 and 14 so that the predetermined distance does not change so that the object to be polished 20 does not enter further inward. Has become.

FIGS. 3 and 4 show the pair of guide members 1.
A gap adjusting mechanism 30 for adjusting the distance between the two in advance
Is shown. 3, the same members as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. However, the gap adjusting mechanism 30 shown in FIG. A gap adjusting plate 32 having slots 31, 31 provided at portions opposed to the slots 14, respectively, and a gap adjusting plate 32 which is positioned inside the slots 31, 31 and is screwed with the supporting members 14, 14 to support the gap adjusting plate 32. It has screws 33, 33 for pressing the members 14, 14, and the gap between the two support members 14, 14 is fixed at an arbitrary distance and adjusted by tightening the gap adjusting plate 32 with the screws 33, 33. be able to.
Reference numeral 37 denotes a stopper for regulating the lowering position of the lower support member 14. In addition, in the example of the gap adjusting mechanism 30 shown in FIG. 4, the same members as those in FIG. Locking portions 35, 35 are provided on both sides of 14, respectively, and a spring 36 is disposed between the locking portions 35, 35, respectively. In the drawings, both support members 14, 14 are shown.
, Only the locking portions 35 and 35 and the spring 36 on the near side of FIG. Reference numeral 37 denotes a stopper for regulating the lowering position of the lower support member 14. Even in the case of such a configuration, the interval between the two support members 14 can be adjusted in advance, and unlike the one shown in FIG. Can be pressed.

Then, in this state, the slurry supply source 5 is operated to supply the slurry between the edge portion 20a of the polishing object 20 and the polishing band 9, and the driving source is operated to make the polishing object holding member 2 By integrally rotating the object 20 to be polished, the double-sided portion 20 of the edge portion 20a of the object 20 is polished.
b and 20b can be polished.

On the other hand, when the portion to be polished is the end face portion 20c of the edge portion 20a of the workpiece 20, as shown in FIG. Attach. The guide member 11 in this case has a flat surface.

Then, the polishing band 9 is fed out from the feeding drum 8 on the upper plate 7a side of the base frame 7, and the guide rollers 15
15 and the guide member 11, pass through guide rollers 15, 15 located below, and pass between a pair of guide rollers 15, 15 located inside the base frame 7, take-up drum The winding of the polishing band 9 is stopped in a state where the belt is wound around 10 and slack is eliminated. In this case, the feeding drum 8 on the lower plate 7b side of the base frame 7 is not disposed, or the polishing band 9 is not fed even if it is disposed.

Then, the workpiece 20 is held above the holding plate 3 of the workpiece holding member 2, and the horizontal moving member is operated to bring the polishing member 6 closer to the workpiece holding member 2 from the horizontal direction. The end surface 2 of the edge 20a of the workpiece 20
Oc is pressed against the portion of the polishing band 9 located on the surface of the guide member 11 of the polishing member 6.

Then, in this state, the slurry supply source 5 is operated to supply the slurry between the edge portion 20a of the workpiece 20 and the polishing band 9, and the drive source is activated so that the workpiece holding member 2 By integrally driving the object 20 to be rotated, the end surface 20c of the edge 20a of the object 20 can be polished.

In the polishing apparatus 1 according to the present embodiment configured as described above, the edge portion 20 of the object 20 is polished.
Since the feeding of the polishing band 9 is stopped during the polishing of a,
The polishing load on the edge portion 20a of the workpiece 20 does not vary, and the edge portion 20a of the workpiece 20 does not vary.
Can be uniformly polished.

Since the edge 20a of the object 20 is polished while the slurry is supplied between the edge 20a of the object 20 and the polishing band 9, the polishing is performed on the edge 20a of the object 20. No polishing marks due to the band 9 remain.

Further, since the structure of each part of the polishing member 6 is simple, the labor required for processing and assembly is reduced.
As a result, the price of the entire apparatus can be reduced.

When the portion used for polishing the polishing band 9 is worn, the polishing band 9 is fed out from the feeding drum 8 and wound up by the winding drum 10, and the worn portion of the polishing band 9 can be sent forward. It is good.

In this embodiment, one polishing member 6 is provided for one polishing object holding member 2, but two or more polishing members are provided for one polishing object holding member 2. 6 may be provided.

FIGS. 5 and 6 show another embodiment of the polishing apparatus according to the present invention. A polishing apparatus 17 according to this embodiment includes a polishing apparatus 17 adjacent to the workpiece holding member 2. One polishing member 6, 6 is provided.

In this case, one of the polishing members 6 has the same configuration as that shown in FIG. 1, that is, for polishing the chamfered portion 20b of the edge portion 20a of the object 20 to be polished, and the other one. The polishing member 6 has the same configuration as that shown in FIG.
For polishing the end face portion 20c.

The polishing belt 9 fed from each of the feeding drums 8 of one of the polishing members 6 is provided with a plurality of guide rollers 15, 15, between the pair of guide members 11, 11.
After passing between the pair of guide rollers 15, 15, it is wound on the winding drum 10 and arranged in a state where slack has been eliminated.

The upper plate 7 of the base frame 7 of the other polishing member 6
The polishing band 9 fed from the feeding drum 8 on the a side passes over the surfaces of the guide rollers 15 and 15 and the guide member 11, and is located below the guide roller 15,
After passing through a pair of guide rollers 15 and 15 located inside the base frame 7, the guide roller 15 is wound around the winding drum 10 and arranged without slack. In this case, the polishing band 9 is not disposed on the feeding drum 8 on the lower plate 7b side of the base frame 7, or the polishing band 9 is not fed even if it is disposed.

Then, the workpiece 20 is held on the holding plate 3 of the workpiece holding member 2 by means such as vacuum suction, and the horizontal moving member is operated to move one polishing member 6 from the horizontal direction. By approaching the polished object holding member 2, the edge portion 20 a of the polished object 20 is inserted between the two polishing bands 9, 9 located between the pair of guide members 11, 11 of the polishing member 6. Each chamfered portion 20b of the edge portion 20a of the object to be polished 20 is pressed against a portion of each polishing band 9 located on the inclined surface 11a. In this case, the entire chamfered portion 20b of the edge portion 20a of the workpiece 20 is
1 is pressed into contact with each polishing strip 9 located on the slope.

Further, the other polishing member 6 is caused to approach the workpiece holding member 2 from the horizontal direction by operating the other horizontal moving member, and the end face 20b of the edge portion 20a of the workpiece 20 is polished. 6 is pressed against the portion of the polishing band 9 located on the surface of the guide member 11.

In this state, the slurry supply source 5 is operated to supply the slurry between the edge portion 20a of the workpiece 20 and the polishing band 9, and the drive source is activated to allow the workpiece holding member 2 By integrally rotating the workpiece 20, the chamfered portion 20 b and the end face 20 c of the edge 20 a of the workpiece 20 can be simultaneously polished.

In the polishing apparatus 17 according to this embodiment having the above-described configuration, similarly to the polishing apparatus 1 according to the above-described embodiment, the polishing band 9 is polished at the time of polishing the edge portion 20a of the workpiece 20. Is stopped, the polishing load on the edge portion 20a of the workpiece 20 does not vary, and the edge portion 20a of the workpiece 20 can be uniformly polished.

Since the edge 20a of the object 20 is polished while the slurry is supplied between the edge 20a of the object 20 and the polishing band 9, the polishing is performed on the edge 20a of the object 20. No polishing marks due to the band 9 remain.

Furthermore, since the structure of each part of the polishing member 6 is simple, the labor required for processing and assembly is reduced.
As a result, the price of the entire apparatus can be reduced.

When the portion used for polishing of the polishing band 9 is worn, the polishing band 9 is drawn out from the feeding drum 8 and taken up by the winding drum 10, and the worn portion of the polishing band 9 can be sent forward. It is good.

In this embodiment, one polishing member 6 for a chamfered portion and one polishing member 6 for an end surface portion are provided for one workpiece holding member 2. The polishing member 6 for two or more chamfers and the polishing member 6 for two or more end faces may be provided.

[0045]

According to the present invention, the edge of the workpiece is polished while the feeding of the polishing band is stopped, so that the polishing load on the edge of the workpiece can be reduced. There is no variation, and the edge of the object to be polished can be uniformly polished. Also, since the slurry is supplied between the edge of the object to be polished and the polishing band when polishing the edge of the object to be polished, polishing marks due to the polishing band may remain on the edge of the object to be polished. There is no. Furthermore, by using a guide member according to the shape of the portion to be polished at the edge portion of the object to be polished, the end face portion of the edge portion of the object to be polished, the chamfered portion, and the like can be polished. Can be simplified, processing and assembly can be simplified, and the price of the entire apparatus can be reduced. Furthermore, when the polishing band is worn, the portion can be fed forward and an unused portion can be used, so that the edge portion of the object to be polished can always be polished with a constant polishing accuracy, Production efficiency can be greatly increased.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an embodiment of a polishing apparatus according to the present invention, and is an explanatory diagram in a case where a portion to be polished is a chamfered portion of an edge portion of an object to be polished.

FIG. 2 is an explanatory diagram showing an aspect in a case where a portion to be polished is an end surface portion of an edge portion of an object to be polished;

FIG. 3 is a schematic diagram for explaining a gap adjusting mechanism.

FIG. 4 is a schematic diagram for explaining another example of the gap adjusting mechanism.

FIG. 5 is a schematic diagram showing another embodiment of the polishing apparatus according to the present invention.

FIG. 6 is an explanatory diagram showing a relationship between the object to be polished and the object to be polished shown in FIG.

FIG. 7 is a partially enlarged cross-sectional view of an object to be polished.

[Explanation of symbols]

 1, 17 Polishing device 2 Polishing member holding member 3 Holding plate 4 Rotating shaft 5 Slurry supply source 6 Polishing member 7 Base frame 7a Upper plate 7b Lower Plate 7c ... Back plate 8 ... Feeding drum 9 ... Polishing band 10 ... Winding drum 11 ... Guide member 11a ... Inclined surface 12 ... Base 13 ... Moving table 14 ... Support member 15 ... Guide roller 20: Polished object 20a: Edge portion 20b: Chamfered portion 20c: End surface portion 30: Gap adjusting mechanism 31: Slot 32: Gap adjusting plate 33: Screw 35: Locking portion 36 Spring 37 Stopper

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toru Asai 2647 Hayakawa Hayakawa, Ayase City, Kanagawa Prefecture Inside (72) Inventor Tomohiro Aizawa 2647 Hayakawa Hayakawa, Ayase City, Kanagawa Prefecture Inside F Fam IPC Corporation Terms (reference) 3C049 AA05 AA11 AA14 AA16 AB01 AB04 AB06 CA05 CB01 CB03 3C058 AA05 AA11 AA14 AA16 AB01 AB04 AB06 CB01 CB03 DA17

Claims (6)

[Claims] 1. A polishing member which rotatably holds an object to be polished by a member to be polished and has a polishing band which can be extended and a guide member for guiding the polishing band, is provided in the direction of the member to be polished. The edge of the object to be polished is brought into pressure contact with the portion of the polishing band that has been brought close and guided by the guide member and has stopped feeding, and the object to be polished is held while the slurry is supplied from a slurry supply source. A method of polishing an edge portion of an object to be polished, comprising rotating a member to polish an end surface of an edge portion of the object to be polished. 2. A polishing belt which rotatably holds an object to be polished by a member to be polished and which can be fed out, and a pair of guide members which guide the polishing band and have opposing portions formed on inclined surfaces. Approaching the polishing member having in the direction of the polished object holding member, the edge of the polished object is pressed against the portion of the polishing band that is being guided by the pair of guide members and has stopped being fed out, A method for polishing an edge portion of an object to be polished, wherein the chamfered portion of the edge portion of the object to be polished is polished by rotating the object to be polished while supplying a slurry from a slurry supply source. 3. A polishing member that rotatably holds an object to be polished by a member to be polished and has a polishing band that can be fed out and a guide member that guides the polishing band is used as one of the polishing members. In the direction, the edge portion of the object to be polished is pressed against the portion of the polishing band which is being guided by the guide member and stopping the feeding, and also guides the polishing band which can be fed and the polishing band. And the other polishing member having a pair of guide members whose opposing portions are formed on an inclined surface is brought closer to the polished work holding member, guided by the pair of guide members, and stopped feeding. The edge portion of the object to be polished is pressed against the portion of the polishing band that is being polished, and while the slurry is supplied from a slurry supply source, the member to be polished is rotated to rotate the end portion of the edge portion of the object to be polished. And the chamfer A method for polishing an edge portion of an object to be polished, characterized by simultaneously polishing. 4. A polishing apparatus comprising: an object holding member for rotatably holding an object to be polished; a polishing member capable of coming into contact with and separating from the object to be polished; and a slurry supply source for supplying slurry. The polishing member has a polishing band that can be extended, and a guide member that guides the polishing band.The polishing member is brought close to the workpiece holding member, guided by the guide member, and is extended. The edge of the object to be polished is pressed against the portion of the polishing band that is stopped, and the object to be polished is rotated by rotating the object to be polished while the slurry is being supplied from the slurry supply source. A polishing apparatus for polishing an end face. 5. A polished work holding member for rotatably holding a polished work, a polishing member capable of coming into contact with and separating from the polished work holding member, and a slurry supply source for supplying a slurry. The polishing member has a pair of guide members that are capable of being fed out and a pair of guide members that guide the polishing band by forming an opposing portion on an inclined surface, and bring the polishing member closer to the workpiece holding member. The edge of the object to be polished is pressed against the portion of the polishing band which is stopped and the polishing belt is located between the pair of guide members, and the object to be polished is held while the slurry is supplied from the slurry supply source. A polishing apparatus characterized in that a member is rotated to polish a chamfer at an edge of the object to be polished. 6. An object-to-be-polished holding member rotatably holding an object-to-be-polished;
One polishing member, and a slurry supply source for supplying slurry, the one polishing member has a polishing band that can be fed out, and a guide member that guides the polishing band, and the other polishing member has A polishing band that can be fed out, and a pair of guide members that guide the polishing band and have a pair of inclined surfaces facing each other, and bring the two polishing members closer to the direction of the object-to-be-polished holding member; The edge of the object to be polished is pressed into contact with the portion of the polishing band which is guided and stopped at the feeding, and the object to be polished is rotated by rotating the object to be polished while the slurry is supplied from the slurry supply source. A polishing apparatus for simultaneously polishing an end surface and a chamfered portion of a chamfered portion of an edge portion of a polished object.