CN101317247B - 复合氮化物半导体结构的外延成长 - Google Patents

复合氮化物半导体结构的外延成长 Download PDF

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Publication number
CN101317247B
CN101317247B CN2007800003652A CN200780000365A CN101317247B CN 101317247 B CN101317247 B CN 101317247B CN 2007800003652 A CN2007800003652 A CN 2007800003652A CN 200780000365 A CN200780000365 A CN 200780000365A CN 101317247 B CN101317247 B CN 101317247B
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layer
group iii
precursor
processing chamber
nitrogen
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Expired - Fee Related
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CN2007800003652A
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Chinese (zh)
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CN101317247A (zh
Inventor
S·尼杰哈瓦
D·布尔
L·华盛顿
J·史密斯
R·斯蒂文斯
D·埃格莱希姆
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Applied Materials Inc
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Applied Materials Inc
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B35/00Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2921Materials being crystalline insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3214Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3216Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
CN2007800003652A 2006-04-14 2007-04-11 复合氮化物半导体结构的外延成长 Expired - Fee Related CN101317247B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110079465.7A CN102174708B (zh) 2006-04-14 2007-04-11 Iii族复合氮化物半导体结构的外延生长

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/404,516 US20070240631A1 (en) 2006-04-14 2006-04-14 Epitaxial growth of compound nitride semiconductor structures
US11/404,516 2006-04-14
PCT/US2007/066468 WO2007121270A1 (en) 2006-04-14 2007-04-11 Epitaxial growth of iii-nitride compound semiconductors structures

Related Child Applications (1)

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CN201110079465.7A Division CN102174708B (zh) 2006-04-14 2007-04-11 Iii族复合氮化物半导体结构的外延生长

Publications (2)

Publication Number Publication Date
CN101317247A CN101317247A (zh) 2008-12-03
CN101317247B true CN101317247B (zh) 2011-05-25

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CN201110079465.7A Expired - Fee Related CN102174708B (zh) 2006-04-14 2007-04-11 Iii族复合氮化物半导体结构的外延生长

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Country Link
US (2) US20070240631A1 (https=)
EP (1) EP2008297A1 (https=)
JP (2) JP2009533879A (https=)
KR (2) KR101338230B1 (https=)
CN (2) CN101317247B (https=)
TW (2) TWI435374B (https=)
WO (1) WO2007121270A1 (https=)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240631A1 (en) * 2006-04-14 2007-10-18 Applied Materials, Inc. Epitaxial growth of compound nitride semiconductor structures
US20070254093A1 (en) * 2006-04-26 2007-11-01 Applied Materials, Inc. MOCVD reactor with concentration-monitor feedback
US20070254100A1 (en) * 2006-04-26 2007-11-01 Applied Materials, Inc. MOCVD reactor without metalorganic-source temperature control
US7374960B1 (en) * 2006-08-23 2008-05-20 Applied Materials, Inc. Stress measurement and stress balance in films
JP4312805B2 (ja) * 2007-03-27 2009-08-12 Okiセミコンダクタ株式会社 半導体製造装置とそれを用いた半導体ウェハの製造方法およびそのプログラムを記録した記録媒体
US20090095221A1 (en) * 2007-10-16 2009-04-16 Alexander Tam Multi-gas concentric injection showerhead
US20090095222A1 (en) * 2007-10-16 2009-04-16 Alexander Tam Multi-gas spiral channel showerhead
US7976631B2 (en) 2007-10-16 2011-07-12 Applied Materials, Inc. Multi-gas straight channel showerhead
US20090194024A1 (en) * 2008-01-31 2009-08-06 Applied Materials, Inc. Cvd apparatus
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8183132B2 (en) * 2009-04-10 2012-05-22 Applied Materials, Inc. Methods for fabricating group III nitride structures with a cluster tool
US20100273291A1 (en) * 2009-04-28 2010-10-28 Applied Materials, Inc. Decontamination of mocvd chamber using nh3 purge after in-situ cleaning
CN102414786B (zh) * 2009-04-28 2016-08-24 应用材料公司 在原位清洁后利用nh3净化对mocvd腔室进行去污染处理
US20110027973A1 (en) * 2009-07-31 2011-02-03 Applied Materials, Inc. Method of forming led structures
WO2011017222A2 (en) * 2009-08-04 2011-02-10 Applied Materials, Inc. Method and apparatus for dry cleaning a cooled showerhead
KR20120050471A (ko) * 2009-08-05 2012-05-18 어플라이드 머티어리얼스, 인코포레이티드 화학기상증착 장치
US8080466B2 (en) * 2009-08-10 2011-12-20 Applied Materials, Inc. Method for growth of nitrogen face (N-face) polarity compound nitride semiconductor device with integrated processing system
DE102009043840A1 (de) * 2009-08-24 2011-03-03 Aixtron Ag CVD-Reaktor mit streifenförmig verlaufenden Gaseintrittszonen sowie Verfahren zum Abscheiden einer Schicht auf einem Substrat in einem derartigen CVD-Reaktor
JP2011060900A (ja) * 2009-09-08 2011-03-24 Showa Denko Kk 半導体発光素子の製造方法およびランプ、電子機器、機械装置
CN102414846A (zh) * 2009-10-07 2012-04-11 应用材料公司 用于led制造的改良多腔室分离处理
CN102804412A (zh) * 2009-12-14 2012-11-28 丽佳达普株式会社 衬底处理方法
US8318522B2 (en) * 2009-12-15 2012-11-27 Applied Materials, Inc. Surface passivation techniques for chamber-split processing
KR101113700B1 (ko) * 2009-12-31 2012-02-22 엘아이지에이디피 주식회사 화학기상증착방법
US20110171758A1 (en) * 2010-01-08 2011-07-14 Applied Materials, Inc. Reclamation of scrap materials for led manufacturing
US20110204376A1 (en) * 2010-02-23 2011-08-25 Applied Materials, Inc. Growth of multi-junction led film stacks with multi-chambered epitaxy system
JP2012028495A (ja) * 2010-07-22 2012-02-09 Showa Denko Kk 半導体発光素子の製造方法および半導体発光素子、ランプ、電子機器、機械装置
US9076827B2 (en) 2010-09-14 2015-07-07 Applied Materials, Inc. Transfer chamber metrology for improved device yield
CN102054910B (zh) * 2010-11-19 2013-07-31 理想能源设备(上海)有限公司 Led芯片工艺集成系统及其处理方法
KR20120070881A (ko) * 2010-12-22 2012-07-02 삼성엘이디 주식회사 발광 다이오드 제조방법
KR101684859B1 (ko) 2011-01-05 2016-12-09 삼성전자주식회사 발광 다이오드 제조방법 및 이에 의하여 제조된 발광 다이오드
KR101895307B1 (ko) 2011-03-01 2018-10-04 어플라이드 머티어리얼스, 인코포레이티드 듀얼 로드락 구성의 저감 및 스트립 프로세스 챔버
US8845816B2 (en) * 2011-03-01 2014-09-30 Applied Materials, Inc. Method extending the service interval of a gas distribution plate
WO2012148568A1 (en) 2011-03-01 2012-11-01 Applied Materials, Inc. Method and apparatus for substrate transfer and radical confinement
US11171008B2 (en) 2011-03-01 2021-11-09 Applied Materials, Inc. Abatement and strip process chamber in a dual load lock configuration
CN102751397A (zh) * 2011-04-22 2012-10-24 比亚迪股份有限公司 一种蓝宝石图形衬底激光剥离的方法
US20130023079A1 (en) * 2011-07-20 2013-01-24 Sang Won Kang Fabrication of light emitting diodes (leds) using a degas process
US9109754B2 (en) 2011-10-19 2015-08-18 Applied Materials, Inc. Apparatus and method for providing uniform flow of gas
CN103137461B (zh) * 2011-12-02 2015-10-14 中芯国际集成电路制造(上海)有限公司 高k栅介质层的形成方法及形成装置、晶体管的形成方法
JP6545460B2 (ja) 2012-02-29 2019-07-17 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated ロードロック構成内の除害・剥離処理チャンバ
KR101710770B1 (ko) 2012-05-18 2017-02-27 비코 인스트루먼츠 인코포레이티드 화학적 기상 증착을 위한 페로플루이드 밀봉부를 갖는 회전 디스크 리액터
US8822314B2 (en) * 2012-06-14 2014-09-02 Palo Alto Research Center Incorporated Method of growing epitaxial layers on a substrate
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films
JP2014194921A (ja) * 2013-03-01 2014-10-09 Tokyo Electron Ltd マイクロ波処理装置及びマイクロ波処理方法
US20150140798A1 (en) * 2013-11-15 2015-05-21 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor manufacturing method and equipment thereof
WO2016014696A1 (en) 2014-07-23 2016-01-28 Rayvio Corporation Uv light emitting devices and systems and methods for production
KR102764217B1 (ko) 2017-02-10 2025-02-06 어플라이드 머티어리얼스, 인코포레이티드 딥 트렌치에서의 저온 선택적 에피택시를 위한 방법 및 장치
CN109346567B (zh) * 2018-08-31 2020-09-25 华灿光电(浙江)有限公司 一种发光二极管的外延片的制备方法及外延片
CN110190514B (zh) * 2019-06-04 2020-03-24 厦门乾照半导体科技有限公司 一种vcsel芯片制备方法
CN115548102A (zh) * 2022-06-28 2022-12-30 徐州金沙江半导体有限公司 一种氮化镓hemt外延结构的生长方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940684A (en) * 1996-05-23 1999-08-17 Rohm, Co., Ltd. Method and equipment for manufacturing semiconductor device

Family Cites Families (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1901243A (en) * 1930-01-17 1933-03-14 Menasha Products Company Dispenser
US3946220A (en) * 1974-06-10 1976-03-23 Transactron, Inc. Point-of-sale system and apparatus
US4073368A (en) * 1975-01-20 1978-02-14 Mustapick Andrew James Automated merchandising system
USRE32115F1 (en) * 1980-07-11 1997-08-12 Lawrence B Lockwood Self-service terminal
US4385366A (en) * 1980-09-02 1983-05-24 Texas Instruments Incorporated Programmable device using selectively connectable memory module to simultaneously define the functional capability and the display associated with input switches
US4569421A (en) * 1980-11-17 1986-02-11 Sandstedt Gary O Restaurant or retail vending facility
US4388689A (en) * 1981-01-28 1983-06-14 Ocr Marketing Associates, Inc. Restaurant video display system
US4519522A (en) * 1981-07-06 1985-05-28 Photo Vending Corporation Apparatus and method for storing and retrieving articles
US4449186A (en) * 1981-10-15 1984-05-15 Cubic Western Data Touch panel passenger self-ticketing system
US4722053A (en) * 1982-12-29 1988-01-26 Michael Dubno Food service ordering terminal with video game capability
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
JPS60153593A (ja) * 1984-01-24 1985-08-13 カシオ計算機株式会社 電子レジスタ
US4567359A (en) * 1984-05-24 1986-01-28 Lockwood Lawrence B Automatic information, goods and services dispensing system
US4723212A (en) * 1984-07-18 1988-02-02 Catalina Marketing Corp. Method and apparatus for dispensing discount coupons
US4592568A (en) * 1984-07-23 1986-06-03 Priskich Damir R Ski boot mounting structure for facilitating monoskiing on snow
US4812629A (en) * 1985-03-06 1989-03-14 Term-Tronics, Incorporated Method and apparatus for vending
US4734005A (en) * 1985-07-19 1988-03-29 Marvin Blumberg Vending machine for video cassettes
US4668150A (en) * 1985-07-19 1987-05-26 Blumberg Marvin R Vending machine for video cassettes
GB8519701D0 (en) * 1985-08-06 1985-09-11 Videomat Automation Ltd Dispensing apparatus
US4675515A (en) * 1986-03-04 1987-06-23 Lucero James L Drive-through credit card payment device
US4839505A (en) * 1986-05-29 1989-06-13 Videomat Associates Apparatus and method for storing and retrieving articles
US4814592A (en) * 1986-05-29 1989-03-21 Videomat Associates Apparatus and method for storing and retrieving articles
US4825045A (en) * 1986-07-24 1989-04-25 Advance Promotion Technologies, Inc. System and method for checkout counter product promotion
US4763602A (en) * 1987-02-25 1988-08-16 Glasstech Solar, Inc. Thin film deposition apparatus including a vacuum transport mechanism
US4797818A (en) * 1987-03-26 1989-01-10 Jeno F. Paulucci Food order/delivery system
JPS63271697A (ja) * 1987-04-30 1988-11-09 沖電気工業株式会社 商品自動貸出装置における商品の予約方法
JPH0195362A (ja) * 1987-10-07 1989-04-13 Omron Tateisi Electron Co デビット兼用クレジットターミナル
US4896024A (en) * 1987-10-19 1990-01-23 Diebold, Incorporated Apparatus for dispensing and accepting return of reusable articles
US4903815A (en) * 1988-03-25 1990-02-27 I.V.D.M. Ltd. Automatic vending machine and system for dispensing articles
US5013897A (en) * 1988-08-03 1991-05-07 Thru-The-Wall Corporation Automated videocassette dispensing terminal coupled to store's computerized rental system
US5095195A (en) * 1988-08-03 1992-03-10 Thru-The-Wall Corporation Automated videocassette dispensing terminal with reservation feature
US4991739A (en) * 1988-08-10 1991-02-12 Coin Acceptors, Inc. Vending machine
US5036472A (en) * 1988-12-08 1991-07-30 Hallmark Cards, Inc. Computer controlled machine for vending personalized products or the like
US4982346A (en) * 1988-12-16 1991-01-01 Expertel Communications Incorporated Mall promotion network apparatus and method
US5007518A (en) * 1989-02-13 1991-04-16 Sam Crivello Apparatus for renting articles
US5383111A (en) * 1989-10-06 1995-01-17 Hitachi, Ltd. Visual merchandizing (VMD) control method and system
US5020686A (en) * 1989-11-29 1991-06-04 Continental Plastics, Inc. Closure for a resealable container
US5313392A (en) * 1990-03-16 1994-05-17 Hitachi, Ltd. Method for supporting merchandise management operation and system therefor
US5212649A (en) * 1990-03-28 1993-05-18 Florent Pelletier Electronic robot key distributor
US5091713A (en) * 1990-05-10 1992-02-25 Universal Automated Systems, Inc. Inventory, cash, security, and maintenance control apparatus and method for a plurality of remote vending machines
US5206814A (en) * 1990-10-09 1993-04-27 Robot Aided Manufacturing Center, Inc. Robotic music store
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
DE69229265T2 (de) * 1991-03-18 1999-09-23 Trustees Of Boston University, Boston Verfahren zur herstellung und dotierung hochisolierender dünner schichten aus monokristallinem galliumnitrid
US5426747A (en) * 1991-03-22 1995-06-20 Object Design, Inc. Method and apparatus for virtual memory mapping and transaction management in an object-oriented database system
US5510979A (en) * 1991-07-30 1996-04-23 Restaurant Technology, Inc. Data processing system and method for retail stores
DE4202801C2 (de) * 1992-01-31 1995-09-14 Accumulata Verwaltungs Gmbh Verkaufseinrichtung
US5323327A (en) * 1992-05-01 1994-06-21 Storage Technology Corporation On-the-fly cataloging of library cell contents in an automated robotic tape library
US5408417A (en) * 1992-05-28 1995-04-18 Wilder; Wilford B. Automated ticket sales and dispensing system
US5484988A (en) * 1992-11-13 1996-01-16 Resource Technology Services, Inc. Checkwriting point of sale system
US5376580A (en) * 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US5754850A (en) * 1994-05-11 1998-05-19 Realselect, Inc. Real-estate method and apparatus for searching for homes in a search pool for exact and close matches according to primary and non-primary selection criteria
US5724069A (en) * 1994-07-15 1998-03-03 Chen; Jack Y. Special purpose terminal for interactive user interface
US5637845A (en) * 1994-12-12 1997-06-10 Usa Technologies, Inc. Credit and bank issued debit card operated system and method for controlling a prepaid card encoding/dispensing machine
US6056194A (en) * 1995-08-28 2000-05-02 Usa Technologies, Inc. System and method for networking and controlling vending machines
US5594791A (en) * 1994-10-05 1997-01-14 Inventions, Inc. Method and apparatus for providing result-oriented customer service
US5804834A (en) * 1994-10-28 1998-09-08 Mitsubishi Chemical Corporation Semiconductor device having contact resistance reducing layer
US5724521A (en) * 1994-11-03 1998-03-03 Intel Corporation Method and apparatus for providing electronic advertisements to end users in a consumer best-fit pricing manner
US5504675A (en) * 1994-12-22 1996-04-02 International Business Machines Corporation Method and apparatus for automatic selection and presentation of sales promotion programs
US5499707A (en) * 1995-01-31 1996-03-19 Compu-Shop, Inc. Automated merchandising kiosk
US5482139A (en) * 1995-02-16 1996-01-09 M.A. Rivalto Inc. Automated drive-up vending facility
US5768142A (en) * 1995-05-31 1998-06-16 American Greetings Corporation Method and apparatus for storing and selectively retrieving product data based on embedded expert suitability ratings
US5875110A (en) * 1995-06-07 1999-02-23 American Greetings Corporation Method and system for vending products
JPH0945670A (ja) * 1995-07-29 1997-02-14 Hewlett Packard Co <Hp> Iii族−n系結晶の気相エッチング方法および再成長方法
US5873069A (en) * 1995-10-13 1999-02-16 American Tv & Appliance Of Madison, Inc. System and method for automatic updating and display of retail prices
CA2160496A1 (en) * 1995-10-13 1997-04-14 Allan M. Brown Electronic funds acceptor for vending machines
US5732398A (en) * 1995-11-09 1998-03-24 Keyosk Corp. Self-service system for selling travel-related services or products
US5879962A (en) * 1995-12-13 1999-03-09 Minnesota Mining And Manufacturing Company III-V/II-VI Semiconductor interface fabrication method
US6014137A (en) * 1996-02-27 2000-01-11 Multimedia Adventures Electronic kiosk authoring system
JPH09295890A (ja) * 1996-04-26 1997-11-18 Mitsubishi Chem Corp 半導体製造装置および半導体製造方法
US6181981B1 (en) * 1996-05-15 2001-01-30 Marconi Communications Limited Apparatus and method for improved vending machine inventory maintenance
KR100269097B1 (ko) * 1996-08-05 2000-12-01 엔도 마코토 기판처리장치
KR100296692B1 (ko) * 1996-09-10 2001-10-24 사토 도리 플라즈마cvd장치
DE19641092A1 (de) * 1996-10-04 1998-04-09 Martin Dr Finsterwald Verfahren zum Aufbau einer Kundendaten beinhaltenden Datenbank
US6058373A (en) * 1996-10-16 2000-05-02 Microsoft Corporation System and method for processing electronic order forms
JPH10141310A (ja) * 1996-11-13 1998-05-26 Komatsu Ltd 圧油供給装置
US6152070A (en) * 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US5855675A (en) * 1997-03-03 1999-01-05 Genus, Inc. Multipurpose processing chamber for chemical vapor deposition processes
JPH10250856A (ja) * 1997-03-12 1998-09-22 Asahi Seiko Co Ltd カード払い出し装置システム
US6367653B1 (en) * 1997-04-22 2002-04-09 Frank Ruskin Centralized machine vending method
US6270569B1 (en) * 1997-06-11 2001-08-07 Hitachi Cable Ltd. Method of fabricating nitride crystal, mixture, liquid phase growth method, nitride crystal, nitride crystal powders, and vapor phase growth method
EP1002274B1 (en) * 1997-08-08 2014-04-02 Thomson Licensing Digital department system
US6044362A (en) * 1997-09-08 2000-03-28 Neely; R. Alan Electronic invoicing and payment system
US5900608A (en) * 1997-10-16 1999-05-04 Iida; Takahito Method of purchasing personal recording media, system for purchasing personal recording media, and media recorded with personal recording media purchasing program
US6061660A (en) * 1997-10-20 2000-05-09 York Eggleston System and method for incentive programs and award fulfillment
US6019247A (en) * 1997-11-12 2000-02-01 Hamilton Safe Company, Inc. Rotary rolled coin dispenser
JPH11185120A (ja) * 1997-12-19 1999-07-09 Sanyo Electric Co Ltd ネットワークに接続するための自動販売機及び自動販売機ネットワークシステム
US6182857B1 (en) * 1998-12-31 2001-02-06 Doug A. Hamm Office supply vending system and apparatus
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
US5998933A (en) * 1998-04-06 1999-12-07 Shun'ko; Evgeny V. RF plasma inductor with closed ferrite core
US6218280B1 (en) * 1998-06-18 2001-04-17 University Of Florida Method and apparatus for producing group-III nitrides
US6319742B1 (en) * 1998-07-29 2001-11-20 Sanyo Electric Co., Ltd. Method of forming nitride based semiconductor layer
US6534791B1 (en) * 1998-11-27 2003-03-18 Lumileds Lighting U.S., Llc Epitaxial aluminium-gallium nitride semiconductor substrate
US6179206B1 (en) * 1998-12-07 2001-01-30 Fujitsu Limited Electronic shopping system having self-scanning price check and purchasing terminal
US6309465B1 (en) * 1999-02-18 2001-10-30 Aixtron Ag. CVD reactor
US6290774B1 (en) * 1999-05-07 2001-09-18 Cbl Technology, Inc. Sequential hydride vapor phase epitaxy
US6397126B1 (en) * 1999-05-11 2002-05-28 Kim Marie Nelson Interfaced dispensing machines and remote automated payment and inventory management system
US6503843B1 (en) * 1999-09-21 2003-01-07 Applied Materials, Inc. Multistep chamber cleaning and film deposition process using a remote plasma that also enhances film gap fill
JP4778655B2 (ja) * 2000-02-04 2011-09-21 アイクストロン、アーゲー 1つまたは多くの被膜を基板に沈積する方法および装置
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP3846150B2 (ja) * 2000-03-27 2006-11-15 豊田合成株式会社 Iii族窒化物系化合物半導体素子および電極形成方法
TW518767B (en) * 2000-03-31 2003-01-21 Toyoda Gosei Kk Production method of III nitride compound semiconductor and III nitride compound semiconductor element
US6539282B2 (en) * 2000-05-08 2003-03-25 The Detsky Group, L.P. Vending machine for vending age-restricted products using a credit card and associated methods
US10127518B2 (en) * 2000-05-25 2018-11-13 Redbox Automated Retail, Llc System and kiosk for commerce of optical media through multiple locations
GB2363518A (en) * 2000-06-17 2001-12-19 Sharp Kk A method of growing a nitride layer on a GaN substrate
ATE528421T1 (de) * 2000-11-30 2011-10-15 Univ North Carolina State Verfahren zur herstellung von gruppe-iii- metallnitrid-materialien
US6540100B2 (en) * 2001-03-06 2003-04-01 The Coca-Cola Company Method and apparatus for remote sales of vended products
DE10118130A1 (de) * 2001-04-11 2002-10-17 Aixtron Ag Vorrichtung oder Verfahren zum Abscheiden von insbesondere kristallinen Schichten auf insbesondere kristallinen Substraten aus der Gasphase
JP4663912B2 (ja) * 2001-05-30 2011-04-06 住友化学株式会社 半導体製造装置
KR100387242B1 (ko) * 2001-05-26 2003-06-12 삼성전기주식회사 반도체 발광소자의 제조방법
JP2003051457A (ja) * 2001-05-30 2003-02-21 Sumitomo Chem Co Ltd 3−5族化合物半導体の製造方法及び装置並びに3−5族化合物半導体
US6555167B2 (en) * 2001-06-18 2003-04-29 Samsung Electro-Mechanics Co., Ltd. Method for growing high quality group-III nitride thin film by metal organic chemical vapor deposition
US7211833B2 (en) * 2001-07-23 2007-05-01 Cree, Inc. Light emitting diodes including barrier layers/sublayers
JP2003048799A (ja) * 2001-08-01 2003-02-21 Ngk Insulators Ltd Iii族窒化物膜の製造方法
JP3660897B2 (ja) * 2001-09-03 2005-06-15 株式会社ルネサステクノロジ 半導体装置の製造方法
US6854642B2 (en) * 2001-10-19 2005-02-15 Chesterfield Holdings, L.L.C. System for vending products and services using an identification card and associated methods
US6708879B2 (en) * 2001-11-16 2004-03-23 Audio Visual Services Corporation Automated unmanned rental system and method
US6847861B2 (en) * 2001-11-30 2005-01-25 Mckesson Automation, Inc. Carousel product for use in integrated restocking and dispensing system
AUPS240402A0 (en) * 2002-05-17 2002-06-13 Macquarie Research Limited Gallium nitride
KR100568701B1 (ko) * 2002-06-19 2006-04-07 니폰덴신뎅와 가부시키가이샤 반도체 발광 소자
US20040016620A1 (en) * 2002-06-28 2004-01-29 Davis Melanee A. Method for providing vendable items of entertainment
KR100476370B1 (ko) * 2002-07-19 2005-03-16 주식회사 하이닉스반도체 배치형 원자층증착장치 및 그의 인시튜 세정 방법
DE10232731A1 (de) * 2002-07-19 2004-02-05 Aixtron Ag Be- und Entladevorrichtung für eine Beschichtungseinrichtung
JP3929939B2 (ja) * 2003-06-25 2007-06-13 株式会社東芝 処理装置、製造装置、処理方法及び電子装置の製造方法
JP4130389B2 (ja) * 2003-08-18 2008-08-06 豊田合成株式会社 Iii族窒化物系化合物半導体基板の製造方法
TW200529464A (en) * 2004-02-27 2005-09-01 Super Nova Optoelectronics Corp Gallium nitride based light-emitting diode structure and manufacturing method thereof
US20060005856A1 (en) * 2004-06-29 2006-01-12 Applied Materials, Inc. Reduction of reactive gas attack on substrate heater
US7368368B2 (en) * 2004-08-18 2008-05-06 Cree, Inc. Multi-chamber MOCVD growth apparatus for high performance/high throughput
EP1809788A4 (en) * 2004-09-27 2008-05-21 Gallium Entpr Pty Ltd Method and apparatus for growing a group (iii) metal nitride film and a group (iii) metal nitride film
US20070240631A1 (en) * 2006-04-14 2007-10-18 Applied Materials, Inc. Epitaxial growth of compound nitride semiconductor structures
US7585769B2 (en) * 2006-05-05 2009-09-08 Applied Materials, Inc. Parasitic particle suppression in growth of III-V nitride films using MOCVD and HVPE
US7374960B1 (en) * 2006-08-23 2008-05-20 Applied Materials, Inc. Stress measurement and stress balance in films
US20080050889A1 (en) * 2006-08-24 2008-02-28 Applied Materials, Inc. Hotwall reactor and method for reducing particle formation in GaN MOCVD
EP2017884A3 (en) * 2007-07-20 2011-03-23 Gallium Enterprises Pty Ltd Buried contact devices for nitride-based films and manufacture thereof
KR100888440B1 (ko) * 2007-11-23 2009-03-11 삼성전기주식회사 수직구조 발광다이오드 소자의 제조방법
CA2653581A1 (en) * 2009-02-11 2010-08-11 Kenneth Scott Alexander Butcher Migration and plasma enhanced chemical vapour deposition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940684A (en) * 1996-05-23 1999-08-17 Rohm, Co., Ltd. Method and equipment for manufacturing semiconductor device

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WO2007121270A1 (en) 2007-10-25
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