CN101292338A - 半导体封装的分类方法 - Google Patents

半导体封装的分类方法 Download PDF

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Publication number
CN101292338A
CN101292338A CNA2006800391422A CN200680039142A CN101292338A CN 101292338 A CN101292338 A CN 101292338A CN A2006800391422 A CNA2006800391422 A CN A2006800391422A CN 200680039142 A CN200680039142 A CN 200680039142A CN 101292338 A CN101292338 A CN 101292338A
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CN
China
Prior art keywords
pallet
tray
bad product
unloading
bad
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Pending
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CNA2006800391422A
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English (en)
Chinese (zh)
Inventor
姜珉求
李贤珉
宋京洙
李相允
林双根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intek Plus Co Ltd
Intekplus Co Ltd
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Intek Plus Co Ltd
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Publication date
Application filed by Intek Plus Co Ltd filed Critical Intek Plus Co Ltd
Publication of CN101292338A publication Critical patent/CN101292338A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNA2006800391422A 2005-10-19 2006-10-18 半导体封装的分类方法 Pending CN101292338A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050098855A KR100705655B1 (ko) 2005-10-19 2005-10-19 반도체 패키지의 분류 방법
KR10-2005-0098855 2005-10-19

Publications (1)

Publication Number Publication Date
CN101292338A true CN101292338A (zh) 2008-10-22

Family

ID=37962691

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800391422A Pending CN101292338A (zh) 2005-10-19 2006-10-18 半导体封装的分类方法

Country Status (4)

Country Link
KR (1) KR100705655B1 (ko)
CN (1) CN101292338A (ko)
TW (1) TWI317815B (ko)
WO (1) WO2007046629A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101826476A (zh) * 2009-03-05 2010-09-08 宰体有限公司 视觉检测仪器
CN104900555A (zh) * 2015-04-29 2015-09-09 海太半导体（无锡）有限公司 一种半导体封装测试装置
CN106841989A (zh) * 2017-02-13 2017-06-13 张家港市欧微自动化研发有限公司 一种cmos传感器测试方法
CN111620118A (zh) * 2020-05-29 2020-09-04 苏州天准科技股份有限公司 下料设备及摄像头保护模块检测系统

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG154364A1 (en) * 2008-01-30 2009-08-28 Rokko Mechatronics Pte Ltd System and method for the sorting of ic units
KR101275862B1 (ko) 2011-10-12 2013-06-17 한미반도체 주식회사 반도체 제조 시스템 및 이의 제어방법
CN103021899B (zh) * 2012-12-21 2015-07-15 日月光半导体（昆山）有限公司 半导体产品检测机及其检测方法
KR102391516B1 (ko) * 2015-10-08 2022-04-27 삼성전자주식회사 반도체 테스트 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08262102A (ja) * 1995-03-23 1996-10-11 Advantest Corp Ｉｃテスタ用ハンドラにおけるデバイス再検査方法
KR100481297B1 (ko) * 1997-10-27 2005-07-07 삼성전자주식회사 반도체패키지의포장시스템및그포장방법
JP2000258496A (ja) 1999-03-05 2000-09-22 Nec Corp 半導体装置の検査方法及び装置
KR100338194B1 (ko) * 1999-10-16 2002-05-27 김주환 3차원 반도체 패키지 검사방법 및 검사장치
KR100819796B1 (ko) * 2002-05-02 2008-04-07 삼성테크윈 주식회사 반도체패키지의 분류방법
KR100498496B1 (ko) * 2003-05-07 2005-07-01 삼성전자주식회사 자투리 반도체 소자의 검사 방법
KR200339601Y1 (ko) * 2003-10-13 2004-01-24 한미반도체 주식회사 반도체 소자 비전 검사장치

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101826476A (zh) * 2009-03-05 2010-09-08 宰体有限公司 视觉检测仪器
CN101826476B (zh) * 2009-03-05 2012-10-10 宰体有限公司 视觉检测仪器
CN104900555A (zh) * 2015-04-29 2015-09-09 海太半导体（无锡）有限公司 一种半导体封装测试装置
CN106841989A (zh) * 2017-02-13 2017-06-13 张家港市欧微自动化研发有限公司 一种cmos传感器测试方法
CN111620118A (zh) * 2020-05-29 2020-09-04 苏州天准科技股份有限公司 下料设备及摄像头保护模块检测系统

Also Published As

Publication number Publication date
WO2007046629A1 (en) 2007-04-26
TWI317815B (en) 2009-12-01
KR100705655B1 (ko) 2007-04-09
TW200745574A (en) 2007-12-16

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Open date: 20081022