TWI317815B - Semiconductor package sorting method - Google Patents
Semiconductor package sorting methodInfo
- Publication number
- TWI317815B TWI317815B TW095137752A TW95137752A TWI317815B TW I317815 B TWI317815 B TW I317815B TW 095137752 A TW095137752 A TW 095137752A TW 95137752 A TW95137752 A TW 95137752A TW I317815 B TWI317815 B TW I317815B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor package
- sorting method
- package sorting
- semiconductor
- sorting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050098855A KR100705655B1 (ko) | 2005-10-19 | 2005-10-19 | 반도체 패키지의 분류 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200745574A TW200745574A (en) | 2007-12-16 |
TWI317815B true TWI317815B (en) | 2009-12-01 |
Family
ID=37962691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095137752A TWI317815B (en) | 2005-10-19 | 2006-10-13 | Semiconductor package sorting method |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100705655B1 (ko) |
CN (1) | CN101292338A (ko) |
TW (1) | TWI317815B (ko) |
WO (1) | WO2007046629A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG154364A1 (en) * | 2008-01-30 | 2009-08-28 | Rokko Mechatronics Pte Ltd | System and method for the sorting of ic units |
KR101134985B1 (ko) * | 2009-03-05 | 2012-04-09 | (주)제이티 | 비전검사장치 |
KR101275862B1 (ko) | 2011-10-12 | 2013-06-17 | 한미반도체 주식회사 | 반도체 제조 시스템 및 이의 제어방법 |
CN103021899B (zh) * | 2012-12-21 | 2015-07-15 | 日月光半导体(昆山)有限公司 | 半导体产品检测机及其检测方法 |
CN104900555A (zh) * | 2015-04-29 | 2015-09-09 | 海太半导体(无锡)有限公司 | 一种半导体封装测试装置 |
KR102391516B1 (ko) * | 2015-10-08 | 2022-04-27 | 삼성전자주식회사 | 반도체 테스트 장치 |
CN106841989A (zh) * | 2017-02-13 | 2017-06-13 | 张家港市欧微自动化研发有限公司 | 一种cmos传感器测试方法 |
CN111620118A (zh) * | 2020-05-29 | 2020-09-04 | 苏州天准科技股份有限公司 | 下料设备及摄像头保护模块检测系统 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08262102A (ja) * | 1995-03-23 | 1996-10-11 | Advantest Corp | Icテスタ用ハンドラにおけるデバイス再検査方法 |
KR100481297B1 (ko) * | 1997-10-27 | 2005-07-07 | 삼성전자주식회사 | 반도체패키지의포장시스템및그포장방법 |
JP2000258496A (ja) | 1999-03-05 | 2000-09-22 | Nec Corp | 半導体装置の検査方法及び装置 |
KR100338194B1 (ko) * | 1999-10-16 | 2002-05-27 | 김주환 | 3차원 반도체 패키지 검사방법 및 검사장치 |
KR100819796B1 (ko) * | 2002-05-02 | 2008-04-07 | 삼성테크윈 주식회사 | 반도체패키지의 분류방법 |
KR100498496B1 (ko) * | 2003-05-07 | 2005-07-01 | 삼성전자주식회사 | 자투리 반도체 소자의 검사 방법 |
KR200339601Y1 (ko) * | 2003-10-13 | 2004-01-24 | 한미반도체 주식회사 | 반도체 소자 비전 검사장치 |
-
2005
- 2005-10-19 KR KR1020050098855A patent/KR100705655B1/ko active IP Right Grant
-
2006
- 2006-10-13 TW TW095137752A patent/TWI317815B/zh active
- 2006-10-18 WO PCT/KR2006/004229 patent/WO2007046629A1/en active Application Filing
- 2006-10-18 CN CNA2006800391422A patent/CN101292338A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2007046629A1 (en) | 2007-04-26 |
KR100705655B1 (ko) | 2007-04-09 |
CN101292338A (zh) | 2008-10-22 |
TW200745574A (en) | 2007-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI372450B (en) | Semiconductor package | |
TWI318439B (en) | Method for manufacturing semiconductor device | |
TWI365158B (en) | Packages | |
TWI366910B (en) | Semiconductor package | |
EP1953814A4 (en) | WAFER HOUSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | |
EP1929545A4 (en) | SEMICONDUCTOR ELECTROLUMINESCENT DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
TWI315570B (en) | Electronic package | |
TWI366540B (en) | Package | |
EP1773679A4 (en) | PACKAGING | |
EP1921674A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
EP1887624A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
EP1848043A4 (en) | SEMICONDUCTOR LUMINOUS ELEMENT AND METHOD THEREFOR | |
GB0426825D0 (en) | Package | |
EP2164098A4 (en) | SEMICONDUCTOR PACK AND MANUFACTURING METHOD THEREFOR | |
ZAA200501234S (en) | Packages | |
TWI348753B (en) | Semiconductor package and the method for fabricating thereof | |
EP1965435A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
TWI317815B (en) | Semiconductor package sorting method | |
EP1966826A4 (en) | SEMICONDUCTOR COMPONENT AND METHOD FOR THEIR FORMING | |
GB2442391B (en) | Lead-free semiconductor package | |
EP1962333A4 (en) | MANUFACTURING METHOD FOR SEMICONDUCTOR COMPONENTS | |
EP1918987A4 (en) | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | |
GB0519661D0 (en) | Packages | |
TWI318444B (en) | Multi-chip package | |
TWI316289B (en) | Method for fabricating semiconductor device |