CN101274407A - 载物台装置 - Google Patents

载物台装置 Download PDF

Info

Publication number
CN101274407A
CN101274407A CNA2008100872777A CN200810087277A CN101274407A CN 101274407 A CN101274407 A CN 101274407A CN A2008100872777 A CNA2008100872777 A CN A2008100872777A CN 200810087277 A CN200810087277 A CN 200810087277A CN 101274407 A CN101274407 A CN 101274407A
Authority
CN
China
Prior art keywords
table device
objective table
tower portion
derrick tower
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008100872777A
Other languages
English (en)
Chinese (zh)
Inventor
中森靖仁
吉田达矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN101274407A publication Critical patent/CN101274407A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Machine Tool Units (AREA)
CNA2008100872777A 2007-03-27 2008-03-26 载物台装置 Pending CN101274407A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP081987/2007 2007-03-27
JP2007081987A JP4328364B2 (ja) 2007-03-27 2007-03-27 ステージ装置

Publications (1)

Publication Number Publication Date
CN101274407A true CN101274407A (zh) 2008-10-01

Family

ID=39114853

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008100872777A Pending CN101274407A (zh) 2007-03-27 2008-03-26 载物台装置

Country Status (4)

Country Link
JP (1) JP4328364B2 (enrdf_load_stackoverflow)
KR (1) KR20080087724A (enrdf_load_stackoverflow)
CN (1) CN101274407A (enrdf_load_stackoverflow)
TW (1) TW200844020A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111715943A (zh) * 2019-03-22 2020-09-29 江苏中朕智能工程有限公司 一种停车场道闸管理系统闸杆裁剪用切割机

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4964853B2 (ja) * 2008-09-24 2012-07-04 住友重機械工業株式会社 ステージ装置
JP5550255B2 (ja) * 2009-04-28 2014-07-16 株式会社日立製作所 ペースト塗布装置及び塗布方法
JP5380225B2 (ja) * 2009-09-24 2014-01-08 株式会社日立ハイテクノロジーズ ガラス基板の検査装置
JP6025516B2 (ja) * 2012-11-15 2016-11-16 三菱重工業株式会社 取付加工機および加工方法
JP2014195805A (ja) * 2014-05-19 2014-10-16 芝浦メカトロニクス株式会社 ペースト塗布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111715943A (zh) * 2019-03-22 2020-09-29 江苏中朕智能工程有限公司 一种停车场道闸管理系统闸杆裁剪用切割机

Also Published As

Publication number Publication date
KR20080087724A (ko) 2008-10-01
TW200844020A (en) 2008-11-16
JP4328364B2 (ja) 2009-09-09
JP2008023698A (ja) 2008-02-07

Similar Documents

Publication Publication Date Title
CN101274407A (zh) 载物台装置
KR101087529B1 (ko) 스테이지장치
WO2008035752A1 (fr) Appareil d'inspection de substrat
IT1320224B1 (it) Metodo e macchina di molatura per la lavorazione di lastre di vetro.
KR20180099485A (ko) 커터 홀더 부착 구조 및 홀더 조인트
JP2008063130A (ja) 基板検査装置
KR101049722B1 (ko) Ｘｙ 스테이지장치
KR100777983B1 (ko) 기판 절단 장치
CN101326625B (zh) 台架装置
JP2006210393A (ja) 基板加工装置、基板搬送装置、基板制御方法
CN107151091B (zh) 划片设备
KR20050044315A (ko) 기판의 흡인지지 방법 및 그 방법을 이용하는 흡인지지반송기
CN1310653A (zh) 工件的激光加工装置
JP3238790U (ja) 基板の切断装置
KR20160008057A (ko) 기판 절단 장치
TWI857022B (zh) 刻劃頭及刻劃裝置
WO2018016038A1 (ja) 切断装置及び切断方法
JP2012201506A (ja) 生産装置
JP2009147298A (ja) ステージ装置
JP6760811B2 (ja) 搬送装置
CN113562966A (zh) 全自动双梁玻璃激光打标切割设备及其工作方法
JP2012528010A (ja) 移動ステージの混成解像度フィードバックのための方法および装置
KR100399023B1 (ko) 복수개의 갠트리가 구비된 표면실장기
KR20100117421A (ko) 이송 유니트 및 이를 구비하는 이송 장치
JP2009276100A (ja) 基板検査装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20081001