JP4328364B2 - ステージ装置 - Google Patents
ステージ装置 Download PDFInfo
- Publication number
- JP4328364B2 JP4328364B2 JP2007081987A JP2007081987A JP4328364B2 JP 4328364 B2 JP4328364 B2 JP 4328364B2 JP 2007081987 A JP2007081987 A JP 2007081987A JP 2007081987 A JP2007081987 A JP 2007081987A JP 4328364 B2 JP4328364 B2 JP 4328364B2
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- JP
- Japan
- Prior art keywords
- gantry
- divided
- base
- base frame
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Machine Tool Units (AREA)
Description
図1は、本発明の第1の実施形態に係るステージ装置1を示す斜視図、図2は、図1に示すステージ装置1の駆動部及びその近傍の部分拡大斜視図、図3は、図1に示すステージ装置1にワーク定盤(ワーク)15をセットした斜視図、図4は、図3に示すステージ装置1の部分正面図である。
図5は、本発明の第2の実施形態に係るステージ装置21の部分正面図である。この第2の実施形態が第1の実施形態と違う点は、ガントリ部9を分割しない構成とした点である。
図6は、本発明の第3の実施形態に係るステージ装置31の部分正面図である。この第3の実施形態が第2の実施形態と違う点は、ベースフレーム2を更に分割可能な構成とした点である。
Claims (3)
- 基台に支持され、当該基台上を進行方向である一軸方向に移動するガントリ部を有するステージ装置において、
前記基台は、ワークを載置する載置領域と、前記ガントリ部を移動方向に案内する一対のガイドレールが前記移動方向に延在するように設けられると共に前記ガントリ部を前記移動方向に移動させる駆動部が前記ガイドレールより外側の領域に設けられて前記ガントリ部を支持する領域とを有すると共に、前記ガントリ部の移動方向と直交する水平方向に、前記載置領域及び前記ガイドレールを有する本体部と前記駆動部を有する分割部とに、連結及び分割可能に構成されていることを特徴とするステージ装置。 - 前記ガントリ部には、前記ガイドレールに沿って案内される一対のガイド部が設けられ、
前記ガントリ部は、前記移動方向と直交する水平方向に分割可能に構成され、その分割面は、前記ガイド部より外側の領域に形成されることを特徴とする請求項1記載のステージ装置。 - 前記ガントリ部は、鉛直方向に延在する中心軸線周りに回動可能に支持されていることを特徴とする請求項1記載のステージ装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007081987A JP4328364B2 (ja) | 2007-03-27 | 2007-03-27 | ステージ装置 |
TW097106465A TW200844020A (en) | 2007-03-27 | 2008-02-25 | Stage device |
KR1020080027701A KR20080087724A (ko) | 2007-03-27 | 2008-03-26 | 스테이지장치 |
CNA2008100872777A CN101274407A (zh) | 2007-03-27 | 2008-03-26 | 载物台装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007081987A JP4328364B2 (ja) | 2007-03-27 | 2007-03-27 | ステージ装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008023698A JP2008023698A (ja) | 2008-02-07 |
JP2008023698A5 JP2008023698A5 (ja) | 2008-03-21 |
JP4328364B2 true JP4328364B2 (ja) | 2009-09-09 |
Family
ID=39114853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007081987A Expired - Fee Related JP4328364B2 (ja) | 2007-03-27 | 2007-03-27 | ステージ装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4328364B2 (ja) |
KR (1) | KR20080087724A (ja) |
CN (1) | CN101274407A (ja) |
TW (1) | TW200844020A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4964853B2 (ja) * | 2008-09-24 | 2012-07-04 | 住友重機械工業株式会社 | ステージ装置 |
JP5550255B2 (ja) * | 2009-04-28 | 2014-07-16 | 株式会社日立製作所 | ペースト塗布装置及び塗布方法 |
JP5380225B2 (ja) * | 2009-09-24 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | ガラス基板の検査装置 |
JP6025516B2 (ja) * | 2012-11-15 | 2016-11-16 | 三菱重工業株式会社 | 取付加工機および加工方法 |
JP2014195805A (ja) * | 2014-05-19 | 2014-10-16 | 芝浦メカトロニクス株式会社 | ペースト塗布装置 |
CN111715943A (zh) * | 2019-03-22 | 2020-09-29 | 江苏中朕智能工程有限公司 | 一种停车场道闸管理系统闸杆裁剪用切割机 |
-
2007
- 2007-03-27 JP JP2007081987A patent/JP4328364B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-25 TW TW097106465A patent/TW200844020A/zh unknown
- 2008-03-26 CN CNA2008100872777A patent/CN101274407A/zh active Pending
- 2008-03-26 KR KR1020080027701A patent/KR20080087724A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2008023698A (ja) | 2008-02-07 |
KR20080087724A (ko) | 2008-10-01 |
TW200844020A (en) | 2008-11-16 |
CN101274407A (zh) | 2008-10-01 |
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