CN1310653A - 工件的激光加工装置 - Google Patents

工件的激光加工装置 Download PDF

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Publication number
CN1310653A
CN1310653A CN99808537A CN99808537A CN1310653A CN 1310653 A CN1310653 A CN 1310653A CN 99808537 A CN99808537 A CN 99808537A CN 99808537 A CN99808537 A CN 99808537A CN 1310653 A CN1310653 A CN 1310653A
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CN
China
Prior art keywords
workpiece
laser
circuit board
printed circuit
cells
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN99808537A
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English (en)
Inventor
B·F·肖尔
L·米勒
W·荣
S·迪特里希
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Siemens AG
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Siemens Production and Logistics Systems AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Production and Logistics Systems AG filed Critical Siemens Production and Logistics Systems AG
Publication of CN1310653A publication Critical patent/CN1310653A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)

Abstract

将例如作为印刷电路板构成的工件(3)置于两个激光单元(2)之间移动,激光单元发出的射束相互对准。该装置可同时加工工件(3)的两面,其加工面相同,而加工时间缩短。

Description

工件的激光加工装置
本发明涉及一种激光加工装置，用于加工具有径向相对设置的加工面的工件。
在制造精细表面结构，例如印刷电路板时，公知的方法是用一个激光射束以高精度构造出导电层或覆盖层。对于双面覆层的印刷电路板，必须将印刷电路板反转，并且第二次置于激光单元的工作区内。
本发明的任务是，提高加工精度，缩短加工时间。
根据本发明，以上任务的解决方案体现在权利要求1中。因为对两个激光单元可相互独立地控制，所以可在两面产生不同的图形，而无需移动印刷电路板，这样便可使加工时间减半。此外还取消了加工印刷电路板第二面所需的反转、更换和调整开销。工件的位置只需要一次性确定即可。两个激光单元可按以下方式预先调整，即无差别地覆盖印刷电路板两面的加工区域。
按照权利要求2所述方案，无需使用掩模即可在印刷电路板的两面产生不同的结构。
下面对照附图所示实施例对本发明作进一步的说明。图1表示一个示意性侧视图，包括一个具有两个激光单元2的机架1，一个作为印刷电路板构成的工件3和一个作为线生输送装置构成的移动支架4，其输送方向垂直于附图平面。
所述激光单元2由一个激光射束发生器6和一个偏转装置5组成，通过该偏转装置可使激光射束在两个坐标方向上偏转，即激光射束总是垂直于工件表面。两个激光单元2分别设置在工件3的上方和下方，两者发出的射束分别指向对方。激光射束打到工件3的两个表面上。此时可同时加工工件表面，然后通过移动支架4使工件移动，将印刷电路板的另一个加工部位置于激光单元2的照射区内，或者使工件3离开激光照射区。
所述工件3例如可以是普通的印刷电路板，其各个区域必须精确地构成。但是也可以不使用印刷电路板，例如使用一种导电薄膜，使其以步进方式在两个偏转装置5之间穿过。所述工件3例如也可以是相对较小的芯片基板，它被固定在一个工件托架的若干安装槽内，所述工件托架上具有对应的通孔，用于穿过激光射束。在这种情况下，支架4将工件托架夹紧并携带其运动，使各个工件依次进入激光射束照射区。

Claims (2)

1、激光加工装置，用于加工具有径向相对设置的加工面的工件(3)，特别是加工具有双面覆层的板状导电条载体，本发明的特征是，所述装置具有两个相对布置的激光单元(2)，工件固定在一个可移动的支架(4)上，并且可在两个激光单元(2)之间定位，所述两个激光单元(2)可同时驱动。
2、如权利要求1所述的装置，其特征是，所述两个激光单元具有一个内部射束偏转装置(例如5)，它分别覆盖工件(3)的待加工区域。
CN99808537A 1998-07-13 1999-07-01 工件的激光加工装置 Pending CN1310653A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19831343 1998-07-13
DE19831343.8 1998-07-13

Publications (1)

Publication Number Publication Date
CN1310653A true CN1310653A (zh) 2001-08-29

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ID=7873891

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99808537A Pending CN1310653A (zh) 1998-07-13 1999-07-01 工件的激光加工装置

Country Status (9)

Country Link
US (1) US6759625B1 (zh)
EP (1) EP1097023B1 (zh)
JP (1) JP2002520163A (zh)
KR (1) KR100621258B1 (zh)
CN (1) CN1310653A (zh)
AT (1) ATE269185T1 (zh)
DE (1) DE59909758D1 (zh)
TW (1) TW403685B (zh)
WO (1) WO2000003831A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100384579C (zh) * 2002-03-07 2008-04-30 日立Via机械株式会社 激光加工设备的工作方法
CN102020417A (zh) * 2009-09-16 2011-04-20 昆山汉白精密设备有限公司 电子产品用玻璃的加工工艺
CN102886606A (zh) * 2012-10-16 2013-01-23 江苏大学 一种激光再制造金属薄板焊接件的方法和装置
CN101977722B (zh) * 2008-02-23 2014-08-06 万佳雷射有限公司 加工工件的激光器
CN106997929A (zh) * 2016-01-22 2017-08-01 上海微电子装备有限公司 一种双面激光准同步封装系统及封装方法

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GB2371191B (en) 2001-01-11 2005-06-15 Mitel Corp Double-talk and path change detection using a matrix of correlation coefficients
US6652731B2 (en) 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE102004020737A1 (de) * 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
US7223674B2 (en) * 2004-05-06 2007-05-29 Micron Technology, Inc. Methods for forming backside alignment markers useable in semiconductor lithography
CN104253883A (zh) * 2013-06-27 2014-12-31 王荷琴 手机玻璃的制作方法
CN103979803A (zh) * 2014-03-19 2014-08-13 昆山瑞咏成精密设备有限公司 一种电子产品玻璃面板的制造工艺

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JPS59212185A (ja) * 1983-05-18 1984-12-01 Inoue Japax Res Inc レ−ザ加工装置
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100384579C (zh) * 2002-03-07 2008-04-30 日立Via机械株式会社 激光加工设备的工作方法
CN101977722B (zh) * 2008-02-23 2014-08-06 万佳雷射有限公司 加工工件的激光器
CN102020417A (zh) * 2009-09-16 2011-04-20 昆山汉白精密设备有限公司 电子产品用玻璃的加工工艺
CN102886606A (zh) * 2012-10-16 2013-01-23 江苏大学 一种激光再制造金属薄板焊接件的方法和装置
CN102886606B (zh) * 2012-10-16 2015-08-26 江苏大学 一种激光再制造金属薄板焊接件的方法和装置
CN106997929A (zh) * 2016-01-22 2017-08-01 上海微电子装备有限公司 一种双面激光准同步封装系统及封装方法

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Publication number Publication date
TW403685B (en) 2000-09-01
EP1097023B1 (de) 2004-06-16
ATE269185T1 (de) 2004-07-15
KR100621258B1 (ko) 2006-09-13
DE59909758D1 (de) 2004-07-22
JP2002520163A (ja) 2002-07-09
KR20010053486A (ko) 2001-06-25
WO2000003831A1 (de) 2000-01-27
EP1097023A1 (de) 2001-05-09
US6759625B1 (en) 2004-07-06

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