CN101273303A - 正型感光性树脂组合物 - Google Patents
正型感光性树脂组合物 Download PDFInfo
- Publication number
- CN101273303A CN101273303A CNA2006800356221A CN200680035622A CN101273303A CN 101273303 A CN101273303 A CN 101273303A CN A2006800356221 A CNA2006800356221 A CN A2006800356221A CN 200680035622 A CN200680035622 A CN 200680035622A CN 101273303 A CN101273303 A CN 101273303A
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- CN
- China
- Prior art keywords
- compound
- group
- mass parts
- positive type
- type photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Polyamides (AREA)
Abstract
Description
羟基聚酰胺 | 光致产酸剂 | 萜烯化合物 | |
实施例1 | P-1 | Q-1(18质量份) | C-1(15质量份) |
实施例2 | P-1 | Q-1(18质量份) | C-2(15质量份) |
实施例3 | P-1 | Q-1(18质量份) | C-3(15质量份) |
实施例4 | P-1 | Q-1(18质量份) | C-4(15质量份) |
实施例5 | P-1 | Q-1(18质量份) | C-5(15质量份) |
实施例6 | P-1 | Q-1(18质量份) | C-6(15质量份) |
实施例7 | P-1 | Q-1(18质量份) | C-7(15质量份) |
实施例8 | P-1 | Q-1(18质量份) | C-8(15质量份) |
实施例9 | P-1 | Q-1(18质量份) | C-9(15质量份) |
实施例10 | P-1 | Q-1(18质量份) | C-10(15质量份) |
实施例11 | P-1 | Q-1(18质量份) | C-10(30质量份) |
实施例12 | P-1 | Q-1(18质量份) | C-11(15质量份) |
实施例13 | P-1 | Q-1(18质量份) | C-12(15质量份) |
实施例14 | P-1 | Q-1(18质量份) | C-13(15质量份) |
实施例15 | P-1 | Q-1(18质量份) | C-14(15质量份) |
实施例16 | P-1 | Q-1(18质量份) | C-15(15质量份) |
实施例17 | P-1 | Q-1(18质量份) | C-15(30质量份) |
实施例18 | P-1 | Q-1(18质量份) | C-16(15质量份) |
实施例19 | P-1 | Q-1(18质量份) | C-17(15质量份) |
实施例20 | P-1 | Q-1(18质量份) | C-18(各15质量份) |
实施例21 | P-1 | Q-1(18质量份) | C-19(各15质量份) |
实施例22 | P-1 | Q-1(18质量份) | C-20(各15质量份) |
实施例23 | P-1 | Q-1(18质量份) | C-21(各15质量份) |
实施例24 | P-1 | Q-1(18质量份) | C-22(各15质量份) |
实施例25 | P-1 | Q-1(18质量份) | C-23(各15质量份) |
实施例26 | P-1 | Q-1(18质量份) | C-24(各15质量份) |
实施例27 | P-1 | Q-1(18质量份) | C-25(各15质量份) |
实施例28 | P-1 | Q-1(18质量份) | C-26(各15质量份) |
实施例29 | P-1 | Q-1(18质量份) | C-27(各15质量份) |
实施例30 | P-1 | Q-1(18质量份) | C-28(各15质量份) |
实施例31 | P-1 | Q-1(18质量份) | C-29(各15质量份) |
比较例1 | P-1 | Q-1(18质量份) | 无 |
灵敏度 | 解像度 | 剥离 | |
实施例1 | 225 | 3 | 无 |
实施例2 | 230 | 3 | 无 |
实施例3 | 225 | 3 | 无 |
实施例4 | 245 | 3 | 无 |
实施例5 | 245 | 3 | 无 |
实施例6 | 250 | 3 | 无 |
实施例7 | 250 | 3 | 无 |
实施例8 | 260 | 3 | 无 |
实施例9 | 265 | 3 | 无 |
实施例10 | 240 | 3 | 无 |
实施例11 | 225 | 3 | 无 |
实施例12 | 255 | 3 | 无 |
实施例13 | 260 | 3 | 无 |
实施例14 | 225 | 3 | 无 |
实施例15 | 260 | 3 | 无 |
实施例16 | 240 | 3 | 无 |
实施例17 | 220 | 3 | 无 |
实施例18 | 310 | 3 | 无 |
实施例19 | 330 | 3 | 无 |
实施例20 | 205 | 3 | 无 |
实施例21 | 210 | 3 | 无 |
实施例22 | 215 | 3 | 无 |
实施例23 | 210 | 3 | 无 |
实施例24 | 200 | 3 | 无 |
实施例25 | 225 | 3 | 无 |
实施例26 | 210 | 3 | 无 |
实施例27 | 230 | 3 | 无 |
实施例28 | 220 | 3 | 无 |
实施例29 | 250 | 3 | 无 |
实施例30 | 240 | 3 | 无 |
实施例31 | 245 | 3 | 无 |
比较例1 | 425 | 3 | 有 |
Claims (8)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005311248 | 2005-10-26 | ||
JP311248/2005 | 2005-10-26 | ||
JP191014/2006 | 2006-07-12 | ||
JP2006191014 | 2006-07-12 | ||
PCT/JP2006/320965 WO2007049524A1 (ja) | 2005-10-26 | 2006-10-20 | ポジ型感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101273303A true CN101273303A (zh) | 2008-09-24 |
CN101273303B CN101273303B (zh) | 2011-07-06 |
Family
ID=37967636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800356221A Active CN101273303B (zh) | 2005-10-26 | 2006-10-20 | 正型感光性树脂组合物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7674566B2 (zh) |
JP (1) | JP4397418B2 (zh) |
KR (1) | KR100927071B1 (zh) |
CN (1) | CN101273303B (zh) |
TW (1) | TW200732841A (zh) |
WO (1) | WO2007049524A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101727006B (zh) * | 2008-10-20 | 2014-06-25 | 第一毛织株式会社 | 正光敏树脂组合物 |
CN104570608A (zh) * | 2013-10-23 | 2015-04-29 | 第一毛织株式会社 | 正型光敏树脂组合物、使用其制备的光敏树脂膜以及显示装置 |
CN104870565A (zh) * | 2012-12-21 | 2015-08-26 | 日立化成杜邦微系统股份有限公司 | 聚酰亚胺前体树脂组合物 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7687208B2 (en) | 2006-08-15 | 2010-03-30 | Asahi Kasei Emd Corporation | Positive photosensitive resin composition |
JP4931634B2 (ja) * | 2007-02-22 | 2012-05-16 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
JP5078992B2 (ja) * | 2007-04-04 | 2012-11-21 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP5234573B2 (ja) * | 2007-07-17 | 2013-07-10 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
CN101827880B (zh) * | 2007-12-26 | 2013-08-21 | 旭化成电子材料株式会社 | 耐热性树脂前体及使用其的感光性树脂组合物 |
KR100913058B1 (ko) * | 2008-08-25 | 2009-08-20 | 금호석유화학 주식회사 | 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자 |
JP2011100097A (ja) * | 2010-05-24 | 2011-05-19 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物、硬化レリーフパターン及び半導体装置 |
KR101423176B1 (ko) * | 2011-11-29 | 2014-07-25 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
KR101413076B1 (ko) * | 2011-12-23 | 2014-06-30 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
KR101432603B1 (ko) | 2011-12-29 | 2014-08-21 | 제일모직주식회사 | 감광성 노볼락 수지, 이를 포함하는 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 이를 포함하는 반도체 소자 |
US9751984B2 (en) | 2012-12-21 | 2017-09-05 | Hitachi Chemical Dupont Microsystems, Ltd. | Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5021320A (en) | 1986-10-02 | 1991-06-04 | Hoechst Celanese Corporation | Polyamide containing the hexafluoroisopropylidene group with O-quinone diazide in positive working photoresist |
ATE67611T1 (de) | 1986-10-02 | 1991-10-15 | Hoechst Celanese Corp | Polyamide mit hexafluorisopropyliden-gruppen, diese enthaltende positiv arbeitende lichtempfindliche gemische und damit hergestellte aufzeichnungsmaterialien. |
JPH09160234A (ja) * | 1995-12-08 | 1997-06-20 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
JP4023867B2 (ja) * | 1997-05-09 | 2007-12-19 | 沖電気工業株式会社 | レジスト用感光性樹脂組成物 |
JP4036986B2 (ja) | 1998-10-15 | 2008-01-23 | 富士フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP4207581B2 (ja) * | 2002-11-06 | 2009-01-14 | 日立化成デュポンマイクロシステムズ株式会社 | 耐熱感光性樹脂組成物、レリーフパターンの製造方法及び電子部品 |
JP4128116B2 (ja) | 2003-07-29 | 2008-07-30 | 旭化成エレクトロニクス株式会社 | ポジ型感光性樹脂組成物 |
JP4651283B2 (ja) | 2004-02-04 | 2011-03-16 | ダイセル化学工業株式会社 | 不飽和カルボン酸ヘミアセタールエステル、高分子化合物及びフォトレジスト用樹脂組成物 |
JP2005250160A (ja) | 2004-03-04 | 2005-09-15 | Kyocera Chemical Corp | ポジ型感光性樹脂組成物及びその硬化物 |
-
2006
- 2006-10-20 CN CN2006800356221A patent/CN101273303B/zh active Active
- 2006-10-20 JP JP2007542351A patent/JP4397418B2/ja active Active
- 2006-10-20 KR KR1020087009919A patent/KR100927071B1/ko active IP Right Grant
- 2006-10-20 US US12/091,122 patent/US7674566B2/en active Active
- 2006-10-20 WO PCT/JP2006/320965 patent/WO2007049524A1/ja active Application Filing
- 2006-10-25 TW TW095139370A patent/TW200732841A/zh unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101727006B (zh) * | 2008-10-20 | 2014-06-25 | 第一毛织株式会社 | 正光敏树脂组合物 |
CN104870565A (zh) * | 2012-12-21 | 2015-08-26 | 日立化成杜邦微系统股份有限公司 | 聚酰亚胺前体树脂组合物 |
CN104870565B (zh) * | 2012-12-21 | 2019-04-26 | 日立化成杜邦微系统股份有限公司 | 聚酰亚胺前体树脂组合物 |
CN104570608A (zh) * | 2013-10-23 | 2015-04-29 | 第一毛织株式会社 | 正型光敏树脂组合物、使用其制备的光敏树脂膜以及显示装置 |
CN104570608B (zh) * | 2013-10-23 | 2018-12-21 | 第一毛织株式会社 | 正型光敏树脂组合物、使用其制备的光敏树脂膜以及显示装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20080049140A (ko) | 2008-06-03 |
US20090233228A1 (en) | 2009-09-17 |
CN101273303B (zh) | 2011-07-06 |
TWI341442B (zh) | 2011-05-01 |
US7674566B2 (en) | 2010-03-09 |
JPWO2007049524A1 (ja) | 2009-04-30 |
WO2007049524A1 (ja) | 2007-05-03 |
JP4397418B2 (ja) | 2010-01-13 |
TW200732841A (en) | 2007-09-01 |
KR100927071B1 (ko) | 2009-11-13 |
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ASS | Succession or assignment of patent right |
Owner name: ASAHI KASEI ELECTRONICS MATERIALS CO., LTD. Free format text: FORMER OWNER: ASAHI KASEI ELECTRONICS COMPONENTS CO., LTD. Effective date: 20090522 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20090522 Address after: Tokyo, Japan Applicant after: Asahi Chemical Corp. Address before: Tokyo, Japan Applicant before: Asahi Chemical Ind |
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Effective date of registration: 20160420 Address after: Tokyo, Japan, Japan Patentee after: Asahi Kasei Kogyo K. K. Address before: Tokyo, Japan Patentee before: Asahi Chemical Corp. |