CN101271870B - 硅外延片 - Google Patents

硅外延片 Download PDF

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Publication number
CN101271870B
CN101271870B CN2008100955430A CN200810095543A CN101271870B CN 101271870 B CN101271870 B CN 101271870B CN 2008100955430 A CN2008100955430 A CN 2008100955430A CN 200810095543 A CN200810095543 A CN 200810095543A CN 101271870 B CN101271870 B CN 101271870B
Authority
CN
China
Prior art keywords
silicon substrate
monocrystalline silicon
silicon
vapor phase
peripheral part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100955430A
Other languages
English (en)
Chinese (zh)
Other versions
CN101271870A (zh
Inventor
保科祐章
田中纪通
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of CN101271870A publication Critical patent/CN101271870A/zh
Application granted granted Critical
Publication of CN101271870B publication Critical patent/CN101271870B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04DROOF COVERINGS; SKY-LIGHTS; GUTTERS; ROOF-WORKING TOOLS
    • E04D11/00Roof covering, as far as not restricted to features covered by only one of groups E04D1/00 - E04D9/00; Roof covering in ways not provided for by groups E04D1/00 - E04D9/00, e.g. built-up roofs, elevated load-supporting roof coverings
    • E04D11/02Build-up roofs, i.e. consisting of two or more layers bonded together in situ, at least one of the layers being of watertight composition
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04DROOF COVERINGS; SKY-LIGHTS; GUTTERS; ROOF-WORKING TOOLS
    • E04D13/00Special arrangements or devices in connection with roof coverings; Protection against birds; Roof drainage ; Sky-lights
    • E04D13/17Ventilation of roof coverings not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Weting (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CN2008100955430A 2003-05-21 2004-05-21 硅外延片 Expired - Fee Related CN101271870B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-143633 2003-05-21
JP2003143633A JP4066881B2 (ja) 2003-05-21 2003-05-21 表面処理方法、シリコンエピタキシャルウェーハの製造方法及びシリコンエピタキシャルウェーハ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100457066A Division CN100401483C (zh) 2003-05-21 2004-05-21 单晶硅基片的表面处理方法和硅外延片的制造方法

Publications (2)

Publication Number Publication Date
CN101271870A CN101271870A (zh) 2008-09-24
CN101271870B true CN101271870B (zh) 2010-12-08

Family

ID=33531359

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2004100457066A Expired - Fee Related CN100401483C (zh) 2003-05-21 2004-05-21 单晶硅基片的表面处理方法和硅外延片的制造方法
CN2008100955430A Expired - Fee Related CN101271870B (zh) 2003-05-21 2004-05-21 硅外延片

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNB2004100457066A Expired - Fee Related CN100401483C (zh) 2003-05-21 2004-05-21 单晶硅基片的表面处理方法和硅外延片的制造方法

Country Status (4)

Country Link
JP (1) JP4066881B2 (enExample)
KR (1) KR101050679B1 (enExample)
CN (2) CN100401483C (enExample)
TW (1) TW200509224A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100365889C (zh) * 2006-05-18 2008-01-30 中微光电子(潍坊)有限公司 一种防止垂直腔面发射半导体激光器在湿法氧化时开裂的方法
CN101311340B (zh) * 2008-03-19 2010-06-02 南京国盛电子有限公司 硅反外延片的制造方法及其专用设备
WO2010035409A1 (ja) * 2008-09-26 2010-04-01 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
JP5141541B2 (ja) * 2008-12-24 2013-02-13 株式会社Sumco エピタキシャルウェーハの製造方法
KR101022567B1 (ko) * 2009-02-02 2011-03-16 주식회사 엘지실트론 에피택셜 웨이퍼 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010037761A1 (en) * 2000-05-08 2001-11-08 Ries Michael J. Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof
US20010055863A1 (en) * 1998-06-04 2001-12-27 Masatake Nakano Methods for manufacturing soi wafer and soi wafer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04245431A (ja) * 1991-01-30 1992-09-02 Kyushu Electron Metal Co Ltd 半導体基板の酸化膜除去方法とその装置
JP2970499B2 (ja) * 1995-10-30 1999-11-02 日本電気株式会社 半導体装置の製造方法
JP3727602B2 (ja) * 2002-03-11 2005-12-14 大日本スクリーン製造株式会社 基板周縁処理装置および基板周縁処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010055863A1 (en) * 1998-06-04 2001-12-27 Masatake Nakano Methods for manufacturing soi wafer and soi wafer
US20010037761A1 (en) * 2000-05-08 2001-11-08 Ries Michael J. Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP平1-248527A 1989.10.04
JP平4-245431A 1992.09.02
JP平8-279470A 1996.10.22

Also Published As

Publication number Publication date
KR20040100937A (ko) 2004-12-02
TW200509224A (en) 2005-03-01
CN1574247A (zh) 2005-02-02
TWI334167B (enExample) 2010-12-01
CN100401483C (zh) 2008-07-09
CN101271870A (zh) 2008-09-24
JP2004349405A (ja) 2004-12-09
KR101050679B1 (ko) 2011-07-22
JP4066881B2 (ja) 2008-03-26

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Granted publication date: 20101208

CF01 Termination of patent right due to non-payment of annual fee