CN101219576A - 无线使能装置 - Google Patents

无线使能装置 Download PDF

Info

Publication number
CN101219576A
CN101219576A CNA200710164682XA CN200710164682A CN101219576A CN 101219576 A CN101219576 A CN 101219576A CN A200710164682X A CNA200710164682X A CN A200710164682XA CN 200710164682 A CN200710164682 A CN 200710164682A CN 101219576 A CN101219576 A CN 101219576A
Authority
CN
China
Prior art keywords
housing
depression
thermoplastic
housings
wireless electron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA200710164682XA
Other languages
English (en)
Other versions
CN101219576B (zh
Inventor
A·伯克
J·W·马尔登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMD Millipore Corp
Original Assignee
Millipore Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Millipore Corp filed Critical Millipore Corp
Publication of CN101219576A publication Critical patent/CN101219576A/zh
Application granted granted Critical
Publication of CN101219576B publication Critical patent/CN101219576B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
    • B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
    • B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/61—Joining from or joining on the inside
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30221—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being point-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

本发明提供一种例如RFID标签的嵌入式无线装置，所述无线装置成型在单独的壳体中，所述壳体由任意热塑性材料构成，构成壳体的热塑性材料与所述壳体连接于其上的装置的塑料材料相容。随后，封装的标签组件能够通过多种行业内公知并认可的手段热粘接在所述装置上。

Description

无线使能装置
相关申请的交叉引用
本申请要求2006年12月8日申请的序列号为60/873712的美国临时专利申请的优先权，在此结合该申请的全部内容以供参考。
技术领域
本发明涉及制造一种装置的产品和方法，所述装置用于封装无线元件并将其固定在指定部件的热塑性表面上。更具体地，其涉及制造一种装置的产品和方法，所述装置用于封装例如是RFID标签的无线元件，并将其固定在指定装置例如是过滤器或过滤器盒、生物袋(biobag)等的热塑性表面上。
背景技术
由于包括生产管理和证明文件系统的更广泛应用、批号可追踪、易于使用和产品识别在内的各种因素，顾客需要产品的具体信息，例如用于在其生产过程中使用的每个过滤器、介质和元件的产品目录号码、批号和序列号。当前，使用例如印刷、雕刻、激光打标、标签和条形码的技术向顾客提供这些信息。
对于过滤芯以及其他在使用过程中完全位于流体通道上的产品而言，由于粘接剂、油墨或任何杂质可能会将可萃取物质溶解在最终产品中，需要对其进行识别、确定数量并且如果远高于某一水平则需要除去，因而极为不受欢迎。因此目前人们更乐于选择雕刻和激光打标来识别过滤芯。不幸的是，这需要终端的使用者手动地读写或键入信息。由于半透明部分上的雕刻难于读取，这一过程容易出错。由于滤芯需要通过接收进行追踪、多次使用、存储和处置，顾客需要更好的方法。
正在开发使用无线标签，例如RFID标签，以作为可能的解决方案。这样的标签通常包括某种无线收发机和天线，二者均安装在卡片或其他的基底上且通常封装在环氧树脂或氨基甲酸乙酯中。这些标签通过使用粘接剂，特别是自粘粘接剂粘贴在产品上。尤其在流体通道中会发生粘接剂的问题。另外，粘接剂易于随着时间劣化并可能使标签丢失而导致整个系统不能工作。
结合无线识别技术的模制标签的最新进展为这一问题提供了解决方案，其摒弃了传统的粘接式无线标签而将无线标签嵌入在装置自身当中，从而将其与流体流隔离。然而，用于实现这种改变的设备价格不菲，并且根据需要贴标签的部位而不同，因而延缓了其利用和实施的进程。
发明内容
此处所述的本发明通过提供一种例如RFID标签或Zigbee装置的嵌入式无线装置，解决了上述问题，所述无线装置成型在单独的壳体中，所述壳体由任意热塑性材料构成，构成所述壳体的热塑性材料与所述标签和所述壳体连接于其上的装置的塑料材料相容。随后，例如通过热粘接、溶剂粘接或粘接剂粘接，标签装置能够如行业内公知的那样粘贴在所述装置上。
优选地，壳体的一个表面具有两个或多个间隔开的突出部，所述突出部对中并有助于实现壳体与装置的连接。更为优选地，这些突出部用作能量导向器，其最好是熔融的，用于将壳体连接在装置上。另外，这些突出部也作为用于实现机械连接所必需的供体材料的主体。
最终的结果是用户无需任何新材料介入其生产过程并且可将无线技术的所有优势应用在多个产品上。
该装置的另一个优势在于，通过在标签中集成传感器，新一代的无线标签将向顾客提供实时的生产信息。这些标签需要位于流体通道中，并且以最少的新结构材料实现通用的连接手段将产生极大的优势。
在一个实施例中，所述突出部由热塑性塑料制成，并借助热能粘接例如超声波或振动焊接。突出部作为能量导向器且优先在其与所述装置毗邻的表面上吸收能量，其中所述突出部朝向所述装置放置以在壳体和装置之间形成熔融的热塑性粘接。在该实施例中，壳体和壳体连接于其上的装置的热塑性塑料必须相容且可相互粘接。在另一个实施例中，它们相容并且一个的熔点低于另一个的熔点。在另外一个实施例中，它们相容且突出部的熔点低于所述装置表面的熔点。在另一个实施例中，所述塑料是相同的。
适合的热塑性塑料包括但不限于聚乙烯，聚丙烯，EVA共聚物，α烯烃以及茂金属共聚物，PFA，MFA，聚碳酸酯，例如聚氯乙烯(PVC)的乙烯共聚物，例如尼龙的聚酰胺，聚酯，丙烯腈丁二烯苯乙烯共聚物(ABS)，聚砜，聚醚砜，聚芳醚砜，聚苯醚砜，聚丙烯腈，聚偏二氟乙烯(PVDF)，及其混合物。
附图说明
图1所示为包含凹穴的装置的一部分的透视图。
图2所示为包含凹穴和位于其中的无线元件的装置的一部分的透视图；
图3所示为壳体的一个实施例的截面图，其中无线元件位于凹穴内且被壳体的第二片覆盖。
图4所示为所述装置的包含有突出部的外表面的一个优选实施例的透视图。
图5所示为本发明的一个优选实施例的透视图，其中所述装置朝向其待粘接的表面进行安装。
图6A-6E所示为所述装置的包含有突出部的外表面的其他优选实施例的透视图。
具体实施方式
图1所示为具有第一封闭面4和用于容纳无线装置(未示出)的凹穴6的模制壳体2。
图2所示为位于壳体2的凹穴6内的无线装置8。在该具体实施例中，无线装置是RFID标签及天线装置，然而其可以是使用例如Zigbee、蓝牙或WUSB无线协议的任何装置。
凹穴随后由盖体10密封，其中虽然整个盖体10需要与壳体2的塑料相容从而其可以液体密封地密封到壳体上，盖体10最好由与壳体2相同的塑料形成。壳体的盖体10可以是单独模制的或预成型的，通过热、超声波或振动焊接、粘接、溶剂粘合等方式连接在壳体2的边缘12上。或者优选地，其可通过例如注射模塑法直接成型在无线装置和凹穴上。
优选地，所示装置的一个表面，壳体2的第一封闭表面4或如图4所示的盖体10的表面14(在该所示实施例中其为盖体14)具有形成在其上的一个或多个突出部16，并且这些突出部16从表面14延伸出来。
图4的实施例中示出了一种优选方式，其中有三个突出部16A、16B、16C，其中两个，即16A和16C具有相同的尺寸、形状及其他轮廓。在该实施例中，第三突出部16B具有不同的尺寸和轮廓，以高度和长度表示。这种装置允许将在壳体2中封装的无线元件(未示出)与一装置(未示出)的平面18或球形表面20相对地放置，其中，无线元件与所述装置连接，如图5所示，并使无线装置与壳体在该表面上对中并保持良好接触。
壳体中的无线装置连接在其所安装的装置的表面上，它通过传统的手段安装在其上，例如溶剂粘接、粘接剂、热粘接，例如通过超声波或振动焊接或突出部的塑料和/或所述装置的塑料的辐射热或传导热。
优选地，突出部由热塑性塑料制成且通过基于诸如超声波或振动焊接的能量热粘接。突出部除了作为稳定器或对中部件还用作能量导向器，并且优选地在其与装置毗邻的表面上吸收能量，其中突出部与所述装置相对地放置，以在壳体和所述装置之间形成熔融的热塑性塑料粘接。在该实施例中，壳体及壳体连接于其上的装置的热塑性塑料必须是相容的且可相互粘接。在另一个实施例中，它们相容并且一个的熔点低于另一个的熔点。在另一个实施例中，它们是相容的且突出部的熔点低于所述装置表面的熔点。在另一个实施例中，塑料是相同的。
突出部更为特别的是他们是用于机械地粘接在配合表面上的供体材料。其尺寸、形状及间隔可定制以提供粘接所需的足量的供体材料。该供体材料是该实施例中唯一可变形的元件，其中，电子组件和直接围绕的包覆材料在粘接过程上不直接被使用。同样，它粘接于其上的表面，例如过滤器壳体或过滤芯、或生物袋(biobag)或一次性探针、阀或接头的外表面，不变形或扭曲。
适合的热塑性塑料包括但不限于聚乙烯，聚丙烯，EVA共聚物，α烯烃以及茂金属共聚物，PFA，MFA，聚碳酸酯，例如聚氯乙烯(PVC)的乙烯共聚物，例如尼龙的聚酰胺，聚酯，丙烯腈丁二烯苯乙烯共聚物(ABS)，聚砜，聚醚砜，聚芳醚砜，聚苯醚砜，聚丙烯腈，聚偏二氟乙烯(PVDF)，及其混合物。
可采用其他形状的突出部16，图6A至6D示出了其中一些。它们可形成为图6A的圆形16D，图6B的椭圆形16E，图6C的金字塔形16F或图6D的长方形或正方形16G。其它的形状和组合对本领域技术人员来说是显而易见的。如图6A和6D所示，可以有四个突出部，而在图6B和6C中仅有两个。也可如图6E所示地采用5个突出部。可采用其它数量的突出部，并且这对本领域技术人员来说是显而易见的。
所述装置可用几种方法制得。
第一方法是预形成一种热塑性装置，其由壳体构成，所述壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴。无线元件，例如RFID芯片和天线随后放置在所述的至少一个凹穴中。它可以只是松散地缚在其中，或者，必要的话，可粘接在其中的适当位置，必要的话，使用例如热熔化的热塑性塑料的粘接剂。盖体随后由热塑性塑料包覆成型在至少一个凹穴及元件上，以便封装元件并形成壳体的第二外表面。壳体的第一外表面或第二外表面具有从所选定的外表面延伸出的两个或多个间隔开的突出部。
第二方法是预形成一种热塑性装置，其由壳体构成，所述壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴。无线元件，例如RFID芯片和天线随后放置在所述的至少一个凹穴中。它可以只是松散地缚在其中，或者，必要的话，可粘接在其中的适当位置，必要的话，使用例如热熔化的热塑性塑料的粘接剂。盖体随后由热塑性塑料包覆成型在至少一个凹穴及元件上，以便封装元件并形成壳体的第二外表面。壳体的第一外表面或第二外表面具有从所选定的外表面延伸出的两个或多个间隔开的突出部。随后将所述装置的两个或多个突出部挤压在例如是筒形外部壳体的热塑性组件上，并且使两个或多个突出部至少部分地熔化以在热塑性组件和所述装置的热塑性塑料突出部之间形成粘接。
第三方法是模制一种热塑性装置，其由壳体构成，所述壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴。在仍处于模具中时，无线元件，例如RFID芯片和天线随后放置在所述至少一个凹穴中。盖体随后由热塑性塑料包覆成型在至少一个凹穴及元件上，以便封装元件并形成壳体的第二外表面。壳体的第一外表面或第二外表面具有从所述装置的所选定的外表面延伸出的两个或多个间隔开的突出部。
第四方法是预形成一种热塑性装置，其由壳体构成，所述壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴。无线元件，例如RFID芯片和天线随后放置在所述的至少一个凹穴中。它可以只是松散地缚在其中，或者，必要的话，可粘接在其中的适当位置，必要的话，使用例如热熔化的热塑性塑料的粘接剂。预成型盖体随后利用热塑性塑料放置在至少一个凹穴及元件上，并通过壳体和盖体之间的热粘接粘接在其上，例如通过辐射热、振动或超声波焊接或热熔化的粘接剂等，以便封装元件并形成壳体的第二外表面。壳体的第一外表面或第二外表面具有从所述装置的所选定的外表面延伸出的两个或多个间隔开的突出部。
第五方法是预形成一种热塑性装置，其由壳体构成，所述壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴。无线元件，例如RFID芯片和天线随后放置在所述的至少一个凹穴中。它可以只是松散地缚在其中，或者，必要的话，可粘接在其中的适当位置，必要的话，使用例如热熔化的热塑性塑料的粘接剂。预成型盖体随后利用热塑性塑料放置在至少一个凹穴及元件上，并且包覆成型壳体和盖体以将盖体和壳体粘接在一起，以便封装元件并形成壳体的第二外表面。壳体的第一外表面或第二外表面具有从所述装置的所选定的外表面延伸出的两个或多个间隔开的突出部。
其它的方法也可作为本发明的一部分加以采用，并且这对于本领域技术人员来说是显而易见的。
实例
无线装置，在本例中是由读/写芯片构成的RFID标签和天线，可从法国的Tagsys S.A.获得的在产品目录单中标示为Ario TM SM-ISORFID标签被选择用于该实施例。该无线装置尺寸为14mm宽、14mm长、2mm高。
壳体由聚丙烯构成，具有空腔，内空腔的尺寸略大于无线装置的尺寸。
无线装置在插入壳体中之前进行测试，该测试通过利用由Tagsys公司提供的手持式阅读器读取该装置进行。
盖体利用注射模塑机从上方形成在壳体的空腔内以便将无线装置封装在空腔内。
壳体的与空腔开口部相对的外表面具有三个类似于图4所示形状的倒圆角长方形的突出部。
将壳体放置在超高频(SHF)过滤器的热塑性(聚丙烯)外表面上，并通过使用标准振动热焊机向二者之间持续加压约1分钟对突出部和壳体进行加热而将壳体粘接在过滤器的外表面上，其中超高频(SHF)过滤器可由马萨诸塞州(Massachusetts)，Billerica的Millipore公司获得。随后停止振动，以允许对过滤器和壳体进行冷却，接着测试无线装置以确信信息的读取和写入均可进行。

Claims (13)

1.一种用于将热塑性装置中的无线电子元件连接在热塑性组件上的方法，所述方法包括以下步骤：
a.形成一热塑性装置，其由具有第一封闭的基本平坦的内表面、第二外表面和至少一个用于容纳所述元件的凹穴的壳体构成；
b.将所述元件放置在所述至少一个凹穴中；
c.以热塑性塑料包覆成型所述至少一个凹穴及元件，以便封装元件并形成壳体的第二外表面；其中，壳体的第一外表面或第二外表面具有从所述外表面延伸出的两个或多个间隔开的突出部；
d.将所述装置的两个或多个突出部压靠在热塑性组件上，并且使所述两个或多个突出部至少部分地熔化以在热塑性组件和所述装置的热塑性塑料之间形成粘接。
2.如权利要求1所述的方法，其特征在于，突出部的数量至少为三个。
3.如权利要求1所述的方法，其特征在于，突出部的数量至少为三个，并且突出部用作对中部件和能量导向器，用于将所述装置热粘接在所述组件上。
4.如权利要求1所述的方法，其特征在于，所述组件选自由过滤器盒、过滤芯、过滤器壳体、生物袋、采样装置、阀、接头、导管及其组合构成的组。
5.如权利要求1所述的方法，其特征在于，所述突出部通过利用由一种方法所产生的热量粘接在所述组件的热塑性塑料上，所述方法选自由振动焊接、超声波焊接及辐射热构成的组。
6.一种用于将无线电子元件安装到一表面上的装置，包括具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴的热塑性壳体；无线电子元件保持在所述凹穴中，包覆成型的盖体连接到凹穴和壳体上，以便封装元件并形成壳体的第二外表面；其中，壳体的第一外表面或第二外表面具有从所述外表面延伸出的两个或多个间隔开的突出部。
7.一种用于将无线电子元件安装到一热塑性表面上的装置，包括具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴的壳体；无线电子元件保持在所述凹穴中，包覆成型的盖体连接到凹穴和壳体上，以便封装元件并形成壳体的第二外表面；其中，选自由壳体的第一外表面和第二外表面构成的组中的一个表面具有从所述外表面延伸出的两个或多个间隔开的突出部，所述突出部用作对中部件和能量导向器以将所述装置热粘接在组件上。
8.一种过滤装置，包括容纳在热塑性壳体内的过滤芯，所述壳体具有以液体密封的方式通向壳体内部及过滤芯外部的入口和与过滤芯出口形成连接的出口，所述壳体由热塑性材料构成并且用于安装无线电子元件的装置粘接在壳体的热塑性表面上，用于安装无线电子元件的所述装置由热塑性元件壳体构成，所述元件壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴；无线电子元件保持在所述凹穴中，包覆成型的盖体连接到凹穴和元件壳体上，以便封装元件并形成所述元件壳体的第二外表面；其中，选自由元件壳体的第一外表面和第二外表面构成的组中的一个表面具有从所述外表面延伸出的两个或多个间隔开的突出部，所述突出部用作对中部件和能量导向器以将所述装置热粘接在所述组件上。
9.一种生物袋，包括由一片或多片薄膜构成并具有中央封闭空腔的袋体，所述袋体具有以液体密封的方式通向空腔的一个或多个入口以及一个或多个出口，所述袋体由一种或多种热塑性材料构成并且用于安装无线电子元件的装置粘接在袋体的热塑性表面上，用于安装无线电子元件的所述装置由热塑性元件壳体构成，所述元件壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴；无线电子元件保持在所述凹穴中，盖体连接到凹穴和元件壳体上，以便封装元件并形成所述元件壳体的第二外表面；其中，选自由元件壳体的第一外表面和第二外表面构成的组中的一个表面具有从所述外表面延伸出的两个或多个间隔开的突出部，所述突出部用作对中部件和能量导向器以将所述装置热粘接在所述袋体的表面上。
10.一种过滤装置，包括由被一个或多个多孔过滤层环围的多孔芯体构成的过滤芯，与所述一个或多个过滤层间隔开并围绕它们的外部热塑性罩体，形成在罩体、一个或多个过滤层和芯体的第一端上的第一顶部封闭端盖，具有与芯体成直线的开口的第二端盖，所述第二端盖形成在罩体、一个或多个过滤层和芯体的第二端上，所述罩体具有全部以液体密封的方式通向所述一个或多个过滤层外表面的一系列入口和与所述第二端盖的开口连接的出口，并且用于安装无线电子元件的装置粘接在壳体的热塑性表面上，用于安装无线电子元件的所述装置由热塑性元件壳体构成，所述元件壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴；无线电子元件保持在所述凹穴中，包覆成型的盖体连接到凹穴和元件壳体上，以便封装元件并形成所述元件壳体的第二外表面；其中，选自由元件壳体的第一外表面和第二外表面构成的组中的一个表面具有从所述外表面延伸出的两个或多个间隔开的突出部，所述突出部用作对中部件和能量导向器以将所述装置热粘接在所述罩体的外表面上。
11.一种一次性接头组件，包括接头，所述接头具有对环境选择性封闭和打开的第一端，位于第一端下游的主体以及按比例位于第一端下游的主体上的第二端，当第一端处于打开状态时流体可从主体中的孔流过，第二端连接一导管的第一端且所述导管的第二端与一装置连接，所述装置选自由过滤囊、袋体以及第二一次性接头构成的组，所述接头至少具有由热塑性材料构成的外部部分并且用于安装无线电子元件的装置粘接在接头的热塑性部分上，用于安装无线电子元件的所述装置由热塑性元件壳体构成，所述元件壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴；无线电子元件保持在所述凹穴中，包覆成型的盖体连接到凹穴和元件壳体上，以便封装元件并形成所述元件壳体的第二外表面；其中，选自由元件壳体的第一外表面和第二外表面构成的组中的一个表面具有从所述外表面延伸出的两个或多个间隔开的突出部，所述突出部用作对中部件和能量导向器以将所述装置热粘接在所述接头的热塑性部分上。
12.一种一次性采样组件，包括具有第一端和第二端的采样针，具有第一端和第二端的导管，导管的第一端与针的第二端连接，导管的第二端与一个或多个热塑性采样袋连接，以便在针的第一端与一个或多个采样袋之间建立一流体通道，用于安装无线电子元件的装置粘接在采样组件的热塑性表面上，用于安装无线电子元件的所述装置由热塑性元件壳体构成，所述元件壳体具有第一封闭的基本平坦的内表面、第一外表面和至少一个用于容纳元件的凹穴；无线电子元件保持在所述凹穴中，包覆成型的盖体连接到凹穴和元件壳体上，以便封装元件并形成所述元件壳体的第二外表面；其中，选自由元件壳体的第一外表面和第二外表面构成的组中的一个表面具有从所述外表面延伸出的两个或多个间隔开的突出部，所述突出部用作对中部件和能量导向器以将所述装置热粘接在所述采样组件上。
13.如权利要求1所述的方法，其特征在于，所述元件壳体的所述热塑性塑料和元件壳体连接于其上的所述组件的热塑性塑料相容。
CN200710164682XA 2006-12-08 2007-12-07 无线使能装置 Active CN101219576B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87371206P 2006-12-08 2006-12-08
US60/873,712 2006-12-08

Publications (2)

Publication Number Publication Date
CN101219576A true CN101219576A (zh) 2008-07-16
CN101219576B CN101219576B (zh) 2011-12-21

Family

ID=39615577

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710164682XA Active CN101219576B (zh) 2006-12-08 2007-12-07 无线使能装置

Country Status (6)

Country Link
US (2) US7892471B2 (zh)
EP (2) EP2474942B1 (zh)
JP (1) JP4820356B2 (zh)
CN (1) CN101219576B (zh)
ES (2) ES2549978T3 (zh)
SG (2) SG175585A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101513297B (zh) * 2009-02-26 2011-08-03 上海造币有限公司 一种镶嵌rfid电子标签的金属币章及其制作工艺
CN102294821A (zh) * 2010-06-25 2011-12-28 新普科技股份有限公司 电池外壳的制造方法
CN104091196A (zh) * 2014-08-06 2014-10-08 朱云晖 一种耐水洗、耐高温的rfid标签及其复合成型工艺
CN108100452A (zh) * 2017-11-28 2018-06-01 苏州良才物流科技股份有限公司 带rfid电子标签的周转箱
CN111032323A (zh) * 2017-08-21 2020-04-17 甘布罗伦迪亚股份公司 用于密封医疗器械的方法
CN112739286A (zh) * 2018-09-26 2021-04-30 卡沃牙科公司 具有rfid应答器的牙科手持件或手术手持件

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7892471B2 (en) * 2006-12-08 2011-02-22 Millipore Corporation Wireless enabled device
GB2454210A (en) * 2007-10-31 2009-05-06 Intellident Ltd Radio frequency identification tag enclosure and method of manufacture
JP2009225193A (ja) * 2008-03-17 2009-10-01 Fujitsu Ltd 携帯端末装置
DE102009014343A1 (de) * 2009-03-21 2010-09-23 Deutsche Telekom Ag Verfahren zum Herstellen einer eine kontaktlose und eine kontaktbehaftete Schnittstelle aufweisenden Chipkarte
US9682335B2 (en) * 2011-02-24 2017-06-20 Saint-Gobain Performance Plastics Corporation Modular filter capsule apparatus
ES2968249T3 (es) 2011-05-17 2024-05-08 Merck Millipore Ltd Dispositivo con membranas tubulares en capas para cromatografía
WO2014007342A1 (ja) * 2012-07-06 2014-01-09 帝人株式会社 繊維強化複合材料－金属部材接合体の製造方法、およびそれに用いる繊維強化複合材料
US9592101B2 (en) * 2012-09-24 2017-03-14 Satyatek Sa Radio frequency identification capsule (RFID)
GB201302467D0 (en) * 2013-02-12 2013-03-27 Bofa Internat Ltd Filter assemblies
WO2014197573A1 (en) 2013-06-05 2014-12-11 Haemonetics Corporation Frangible rfid tag and method of producing same
WO2014204844A1 (en) 2013-06-18 2014-12-24 Haemonetics Corporation Rfid tag and method of securing same to object
US9159017B2 (en) * 2013-10-18 2015-10-13 William Frick And Company Passive, metal mount, UHF, RFID tag capable of a long read range
DE102014117725A1 (de) 2014-12-02 2016-06-02 Aquis Wasser-Luft-Systeme Gmbh, Lindau, Zweigniederlassung Rebstein Filter zum Einsetzen in einen Wasservorratstank eines Haushaltsgerätes, insbesondere einer Getränkemaschine
JP6010641B2 (ja) * 2015-01-28 2016-10-19 富士重工業株式会社 樹脂部材及び樹脂部材の接合方法
FR3044561B1 (fr) * 2015-12-08 2021-05-14 Ac Sp Etude & Rech En Hygiene Industrielle Porte-filtre, dispositif de filtration et procede de fabrication d'un porte-filtre
US10286343B2 (en) 2016-10-28 2019-05-14 Pall Corporation Filter including RFID tag
DE102018213005B3 (de) 2018-08-03 2019-07-25 Sisto Armaturen S.A. Membran mit Elektronikbauteil

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458380A (en) * 1965-08-26 1969-07-29 Union Carbide Corp Method of bonding thermoplastics
AT332801B (de) 1972-10-05 1976-10-25 Ralfs Gmbh Forderbehalter
US4045350A (en) * 1975-03-19 1977-08-30 Statni Vyzkumny Ustav Materialu Filter assembly made of thermoplastic materials
US4992166A (en) * 1988-06-13 1991-02-12 Facet Enterprises, Inc. Plastic fluid filter and method for manufacturing same
US5328597A (en) * 1992-07-27 1994-07-12 The Clorox Corporation Electronic monitoring unit for monitoring number of uses of cartridge
JPH09240179A (ja) * 1996-03-06 1997-09-16 Shinsei Kagaku Kogyo Kk Ｉｃカード及びｉｃカードの製造方法並びに ｉｃカード基板の製造方法
JP2002082120A (ja) * 2000-09-06 2002-03-22 Itochu Fine Chemical Corp 情報自動読取り可能な生物・生体試料容器と情報自動読取りシステム
US6471853B1 (en) * 2000-11-22 2002-10-29 Pti Technologies, Inc. Prognostic health monitoring of fluidic systems using MEMS technology
US6533926B2 (en) * 2001-04-05 2003-03-18 Fleetguard, Inc. Filter cartridge with concentric circuit rings for data transmission
JP2003066301A (ja) 2001-08-29 2003-03-05 Mitsumi Electric Co Ltd レンズとレンズホルダの接合構造及び接合方法
DE10151270B4 (de) * 2001-10-17 2006-10-26 Sartorius Ag System und Verfahren zur Überwachung der Integrität eines Filterelementes
US6769316B2 (en) * 2002-06-21 2004-08-03 Rupprecht & Patashnick Company, Inc. Sampling cartridge for gas sampling apparatus
US7258781B2 (en) * 2002-09-09 2007-08-21 Clarity Filters Llc Single-use long-life faucet-mounted water filtration devices
US7252757B2 (en) * 2002-09-09 2007-08-07 Clarity Filters Llc Faucet-mounted water filtration device including gate position sensor
DE10328695A1 (de) 2003-04-17 2004-10-28 Aeg Identifikationssysteme Gmbh Transponderanordnung und Gegenstand mit einer solchen Transponderanordnung
US20050163667A1 (en) * 2004-01-26 2005-07-28 Krause Richard J. Single-use biobags with sendors: DO, pH, CO2 and temperature
US7481917B2 (en) * 2004-03-05 2009-01-27 Hydranautics Filtration devices with embedded radio frequency identification (RFID) tags
AU2005223452B2 (en) * 2004-03-16 2008-05-15 Newage Industries, Inc. Process equipment tracking system
JP4680540B2 (ja) 2004-06-29 2011-05-11 トッパン・フォームズ株式会社 半導体装置の製造方法
JP4256320B2 (ja) * 2004-09-28 2009-04-22 ダイキョーニシカワ株式会社 樹脂成形体の接合構造および接合方法
JP2006277524A (ja) * 2005-03-30 2006-10-12 Sato Corp Ｒｆｉｄラベルおよびその貼付方法
DE102004054172A1 (de) * 2004-11-10 2006-05-18 Hydac Filtertechnik Gmbh Filterelement und zugehörige Datenübertragungsvorrichtung
GB0521702D0 (en) 2005-10-25 2005-11-30 Bryant Keith C Rfid enabled plastic container
US7705733B2 (en) * 2006-01-06 2010-04-27 Warsaw Orthopedic, Inc. Coiled RFID tag
US7699989B2 (en) * 2006-10-17 2010-04-20 Millipore Corporation Powered cartridges and other devices within housings
US7892471B2 (en) * 2006-12-08 2011-02-22 Millipore Corporation Wireless enabled device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101513297B (zh) * 2009-02-26 2011-08-03 上海造币有限公司 一种镶嵌rfid电子标签的金属币章及其制作工艺
CN102294821A (zh) * 2010-06-25 2011-12-28 新普科技股份有限公司 电池外壳的制造方法
CN104091196A (zh) * 2014-08-06 2014-10-08 朱云晖 一种耐水洗、耐高温的rfid标签及其复合成型工艺
CN104091196B (zh) * 2014-08-06 2018-05-22 朱云晖 一种耐水洗、耐高温的rfid标签及其复合成型工艺
CN111032323A (zh) * 2017-08-21 2020-04-17 甘布罗伦迪亚股份公司 用于密封医疗器械的方法
CN108100452A (zh) * 2017-11-28 2018-06-01 苏州良才物流科技股份有限公司 带rfid电子标签的周转箱
CN112739286A (zh) * 2018-09-26 2021-04-30 卡沃牙科公司 具有rfid应答器的牙科手持件或手术手持件

Also Published As

Publication number Publication date
US7892471B2 (en) 2011-02-22
EP2474942A2 (en) 2012-07-11
US8100585B2 (en) 2012-01-24
SG175585A1 (en) 2011-11-28
JP4820356B2 (ja) 2011-11-24
EP1930845B1 (en) 2015-05-06
ES2549978T3 (es) 2015-11-03
EP2474942B1 (en) 2022-08-03
SG143219A1 (en) 2008-06-27
EP1930845A2 (en) 2008-06-11
EP2474942A3 (en) 2012-10-24
ES2927139T3 (es) 2022-11-02
US20110031178A1 (en) 2011-02-10
EP1930845A3 (en) 2009-10-14
JP2008226226A (ja) 2008-09-25
US20080213135A1 (en) 2008-09-04
CN101219576B (zh) 2011-12-21

Similar Documents

Publication Publication Date Title
CN101219576B (zh) 无线使能装置
CN101076491B (zh) 具有射频识别标签的联接器
EP2348461B1 (en) RFID tag for high temperature environment
US20100032437A1 (en) Container with Transponder
JP5934741B2 (ja) 無線機能付き袋および容器
JP2017213416A (ja) 統合されたｒｆｉｄタグを有する容器／システム
JP2011527658A (ja) 電波による個体識別タグを有する容器およびｒｆｉｄを容器に適用する方法
JP2006298144A (ja) パネルおよびパネルの製造方法
US20060016895A1 (en) Non-contact communication system information carrier
CN204093465U (zh) 一种封样管
JPH1141154A (ja) データキャリア及びその製造方法
JP2007512190A (ja) 電子部品を備えた軟質チューブ
CN102879246A (zh) 封装芯片金相制样方法以及金相样品模具
CN108146087B (zh) 用于固定rfid芯片的方法以及印章板
JP2000331135A (ja) 非接触データキャリア及び当該非接触データキャリアの製造方法
JPH1026934A (ja) 電子タグ及びその製造方法
JPH1026933A (ja) 電子タグ及びその製造方法
JP3063368U (ja) 電子タグ構成部品
CN108435267A (zh) 液体处理装置
TWI249711B (en) Label to be attached on a plastic product formed in a mold and identifiable by a wireless detecting device
KR20170128759A (ko) 혈액 추출 제품용 병 상에 배치되는 rfid 태그와 그 사용방법
CN115806118A (zh) 无线射频识别胶帽及其制备方法和应用
JP2003099746A (ja) 非接触通信媒体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: EMD MILLIPORE CORPORATION

Free format text: FORMER NAME: MILLIPORE CORP.

CP01 Change in the name or title of a patent holder

Address after: Massachusetts, USA

Patentee after: Millipore Corp.

Address before: Massachusetts, USA

Patentee before: Millipore Corp.