GB2454210A - Radio frequency identification tag enclosure and method of manufacture - Google Patents
Radio frequency identification tag enclosure and method of manufacture Download PDFInfo
- Publication number
- GB2454210A GB2454210A GB0721392A GB0721392A GB2454210A GB 2454210 A GB2454210 A GB 2454210A GB 0721392 A GB0721392 A GB 0721392A GB 0721392 A GB0721392 A GB 0721392A GB 2454210 A GB2454210 A GB 2454210A
- Authority
- GB
- United Kingdom
- Prior art keywords
- parts
- enclosure
- radio frequency
- frequency identification
- tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title description 3
- 230000013011 mating Effects 0.000 claims abstract description 12
- 239000003566 sealing material Substances 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000004743 Polypropylene Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- -1 polypropylene Polymers 0.000 claims abstract description 5
- 229920001155 polypropylene Polymers 0.000 claims abstract description 5
- 239000004033 plastic Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Radar Systems Or Details Thereof (AREA)
Abstract
A radio frequency identification tag enclosure comprises a first part and a second part, each including means for mating the first and second parts together. The first and second parts include a respective seal receiving portion for receiving a sealing material to thereby substantially seal the mated first and second parts together. The first part, second part and sealing material preferably comprise polypropylene. The enclosure may comprise an integrated RFID tag and connection means for connecting the RFID tag to an antenna. A method of forming a RFID tag enclosure comprises molding first and second parts including forming mating means, receiving a RFID tag, mating first and second parts and overmolding at least a portion of the first and second parts with a sealing material, the sealing material preferably being the same material as the first and second parts.
Description
Radio Frequency Identification Tag Enclosure and Method of Manufacture
Field of the Invention
The present invention relates to an REID tag enclosure and method of manufacture.
Background to the Invention
A radio frequency identification (REID) tag is typically an object that can be attached to or incorporated into a product, animal, or person for the purpose of identification using radio waves. RFID tags normally contain at least two parts: an integrated circuit for storing and processing information, modulating and demodulating a radio frequency (RE) signal and perhaps other specialized functions; and an RE antenna for receiving and transmitting the signal.
The RE antennas are relatively fragile components and need to be physically protected when they are attached to assets. This is usually achieved by sticking the inlay to one half of a plastic moulding and enclosing it with the other half of the moulding, in the form of a clam' enclosure. The two halves of the moulding must then be held firmly together. RE signals are severely affected when moisture collects on, or near, the antenna and/or the integrated circuit. There is, therefore, a need to hermetically seal the clam' enclosure to prevent ingress of moisture.
Applications for REID tags are many any varied. REID tags can be expected to be used on all forms of asset, in all weathers. REID tags are expected to be able to withstand high temperatures when left in the sun in hot climates, and low temperatures when left overnight in cold climates, or when operated in such extremes.
In conventional REID tags, internal air expands when the tag is exposed to heat. As a result, the tag enclosure is pressurised. This pressure can force air to escape through any gaps in the join between the two halves of the tag enclosure. Vice-versa, when a tag enclosure is exposed to low temperatures, the pressure of the air around the tag reduces and cool, typically moist, air is sucked' into the tag enclosure, which then compromises the RF performance.
Tags will also be subjected to high water pressures and temperatures when assets are cleaned.
Various methods of sealing the two parts of a clam enclosure have been suggested in the past. Glues have been found to be generally unsatisfactory when a tag is to be used at lower temperatures (say <- 10 deg C). Typically, glues become brittle at such temperatures and a glued enclosure would then crack if shocked (for example if the tag enclosure was dropped) and allow water ingress.
Additionally, tag enclosures and assets are generally manufactured from Polypropylene. It is notoriously difficult to ensure glues adhere to this plastic.
Because of its oily nature, the plastic will not allow full bonding. It is well known that polypropylene has a very low surface energy. This makes it difficult to bond, join or coat, due to the difficulty in wetting' the surface").
Glue is also messy and often difficult to apply.
Welding of complementary plastic parts to form an enclosure around a tag is another technique used to seal tags within enclosures. Unfortunately, it is often difficult to control welding parameters to ensure a good consistent seal.
Materials have to be selected for laser welding, to ensure one half of the assembly is transmissive to laser light and one half is opaque.
Vibration and ultrasonic welding processes generate molten plastic which must be lost' in the design. This adds to design complexity and, therefore, cost. In either case, welding is relatively expensive as it is a labour intensive process. A correct weld can provide an excellent seal but the cost and labour factors mean this technique is not particularly popular.
Statement of the Invention
According to an aspect of the present invention, there is provided a radio frequency identification tag enclosure comprising a first part and a second part, the first and second parts each including mating means for mating the first and second parts together, the first and second parts defining between them, when mated, a cavity suitable for holding an REID tag, the first and second parts further including a respective seal receiving portion for receiving a sealing material to thereby substantially seal the mated first and second parts together.
Brief Description of the Drawings
Figures 1, 2 and 3 are perspective views of the assembly of a radio frequency identification tag enclosure according to an embodiment of the present invention.
Detailed Description
Figures 1, 2 and 3 are perspective views of the assembly of a radio frequency identification tag enclosure according to an embodiment of the present invention.
The radio frequency identification tag enclosure 10 includes a first part 20 and a second part 30. The first and second parts each including mating means 25, 35 respectively for mating the first and second parts together. When mated together, the first and second parts define between them a cavity 40 suitable for holding an REID tag 50.
The first and second parts each further include a respective seal receiving portion 26, 36 respectively for receiving a sealing material to thereby substantially seal the mated first and second parts together.
Figure 1 shows the separated parts of the enclosure assembly. Figure 2 shows the first and second parts mated together prior to receiving the sealing material. The sealed enclosure is shown in Figure 3.
A preferred embodiment of the present invention uses a technique referred to in the art as "overmoulding".
Overmoulding is a well proven moulding technique. It is a derivative of two-shot' moulding (which is used for example in forming modern two-texture toothbrush handles).
In preferred embodiments of the present invention, the first and second parts are individually moulded from polypropylene. Alternative materials could be used, but would require to be capable of being molecularly bonded to the overmoulding material. The antenna is inserted inside one of the parts. The parts are then clipped together and the whole enclosure is inserted into a second mould tool and additional plastic is injected around the join, and a seal is moulded.
This technique provides:- * A strong join, as the secondary plastic overmould' is molecularly bonded to the two halves of the tag rather than chemically bonded.
The join and seal are as strong as the rest of the tag.
* A 100% seal. No danger of moisture ingress.
* Additional strength for the final tag, to help make it mechanically robust.
* Process can be semi-automated. Reduced costs, improved consistency and reliability.
Although the embodiments of the present invention have been discussed in the context of an enclosure for an RFID tag, it will be appreciated that the REID tag may be integrated with the enclosure. In this situation, the antenna may instead be inserted into the cavity of the tag/enclosure. p 5
Claims (7)
- Claims 1. A radio frequency identification tag enclosure comprising a first part and a second part, the first and second parts each including mating means for mating the first and second parts together, the first and second parts defining between them, when mated, a cavity suitable for holding a radio frequency identification tag, the first and second parts further including a respective seal receiving portion for receiving a sealing material to thereby substantially seal the mated first and second parts together.
- 2. An enclosure as claimed in claim 1, wherein the first and second parts and the sealing material comprise polypropylene.
- 3. A radio frequency identification tag sealed within an enclosure according to claim 1 or 2.
- 4. An enclosure as claimed in claim I or 2 further comprising an integrated radio frequency tag.
- 5. An enclosure as claimed in claim 4, further comprising connection means for connecting the radio frequency tag to an antenna.
- 6. A method of forming a radio frequency identification tag enclosure comprising: molding a first part and a second part of the enclosure including forming mating means on each part for mating the first and second parts together and forming a cavity portion in each part, whereby the cavity portion of the first and second parts defining between them, when mated, a cavity suitable for holding a radio frequency identification tag; receiving a radio frequency identification tag into the cavity; mating the first part and second part together; and, overmolding at least a portion of the first and second parts with a sealing material to thereby substantially seal the mated first and second parts together.
- 7. A method as claimed in claim 6 further comprising: using the same material type for molding the first and second parts and the sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0721392A GB2454210A (en) | 2007-10-31 | 2007-10-31 | Radio frequency identification tag enclosure and method of manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0721392A GB2454210A (en) | 2007-10-31 | 2007-10-31 | Radio frequency identification tag enclosure and method of manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0721392D0 GB0721392D0 (en) | 2007-12-12 |
| GB2454210A true GB2454210A (en) | 2009-05-06 |
Family
ID=38834616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0721392A Withdrawn GB2454210A (en) | 2007-10-31 | 2007-10-31 | Radio frequency identification tag enclosure and method of manufacture |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2454210A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2358253A1 (en) * | 1976-07-13 | 1978-02-10 | Caillot Raymond | Melt sealed joints for split casings of capacitors etc. - using deformed bevelled joint faces to exclude the thermoplastic melt |
| EP0987646A2 (en) * | 1998-09-14 | 2000-03-22 | Brady Worldwide, Inc. | RFID reader/writer device |
| US20020186123A1 (en) * | 1999-07-02 | 2002-12-12 | Kivisto Bruce Arthur | Hermatically sealed communication device |
| EP1930845A2 (en) * | 2006-12-08 | 2008-06-11 | Millipore Corporation | Method and device for mounting a wireless electronic component to a surface |
-
2007
- 2007-10-31 GB GB0721392A patent/GB2454210A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2358253A1 (en) * | 1976-07-13 | 1978-02-10 | Caillot Raymond | Melt sealed joints for split casings of capacitors etc. - using deformed bevelled joint faces to exclude the thermoplastic melt |
| EP0987646A2 (en) * | 1998-09-14 | 2000-03-22 | Brady Worldwide, Inc. | RFID reader/writer device |
| US20020186123A1 (en) * | 1999-07-02 | 2002-12-12 | Kivisto Bruce Arthur | Hermatically sealed communication device |
| EP1930845A2 (en) * | 2006-12-08 | 2008-06-11 | Millipore Corporation | Method and device for mounting a wireless electronic component to a surface |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0721392D0 (en) | 2007-12-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |