CN101188924A - 便携电子设备 - Google Patents

便携电子设备 Download PDF

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Publication number
CN101188924A
CN101188924A CNA2007101596996A CN200710159699A CN101188924A CN 101188924 A CN101188924 A CN 101188924A CN A2007101596996 A CNA2007101596996 A CN A2007101596996A CN 200710159699 A CN200710159699 A CN 200710159699A CN 101188924 A CN101188924 A CN 101188924A
Authority
CN
China
Prior art keywords
base material
radiation film
case
radiation
housing base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101596996A
Other languages
English (en)
Chinese (zh)
Inventor
远藤元气
中村修
盐谷雅治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of CN101188924A publication Critical patent/CN101188924A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fuel Cell (AREA)
  • Studio Devices (AREA)
  • Secondary Cells (AREA)
  • Telephone Set Structure (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
CNA2007101596996A 2006-11-20 2007-11-20 便携电子设备 Pending CN101188924A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP312666/2006 2006-11-20
JP2006312666A JP4315187B2 (ja) 2006-11-20 2006-11-20 携帯電子機器

Publications (1)

Publication Number Publication Date
CN101188924A true CN101188924A (zh) 2008-05-28

Family

ID=39416713

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101596996A Pending CN101188924A (zh) 2006-11-20 2007-11-20 便携电子设备

Country Status (3)

Country Link
US (1) US20080117599A1 (https=)
JP (2) JP4315187B2 (https=)
CN (1) CN101188924A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103380533A (zh) * 2011-02-16 2013-10-30 日产自动车株式会社 电池外壳及电池外壳的安装结构
CN106462203A (zh) * 2014-05-19 2017-02-22 微软技术许可有限责任公司 具有光谱选择性辐射发散设备的计算设备
WO2018218798A1 (zh) * 2017-05-27 2018-12-06 深圳市光峰光电技术有限公司 一种投影设备

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4450070B2 (ja) * 2007-12-28 2010-04-14 ソニー株式会社 電子機器
JP2010020119A (ja) * 2008-07-11 2010-01-28 Hitachi Ltd 平面型表示機器
JP5408528B2 (ja) * 2009-01-19 2014-02-05 日本電気株式会社 電子機器
JP2010198927A (ja) * 2009-02-25 2010-09-09 Ssec Kk Ｌｅｄランプ
JP2012174767A (ja) * 2011-02-18 2012-09-10 Kyoshin Kogyo Co Ltd ヒートシンク及びヒートシンクの製造方法
EP2554935B1 (en) * 2011-08-01 2014-02-26 Continental Automotive GmbH Apparatus for passive cooling
EP2982941B1 (en) * 2014-08-07 2019-02-27 Conti Temic microelectronic GmbH Sensor device housing
JP6406216B2 (ja) * 2015-11-09 2018-10-17 トヨタ自動車株式会社 金属製の筐体の製造方法
JP6528741B2 (ja) * 2016-08-24 2019-06-12 トヨタ自動車株式会社 ヒートシンクの製造方法
CN107566565A (zh) * 2017-08-29 2018-01-09 努比亚技术有限公司 摄像头散热组件、移动终端及散热控制方法
US20190263330A1 (en) * 2018-02-26 2019-08-29 Trw Automotive U.S. Llc Driver assist system
JP7131439B2 (ja) * 2019-03-07 2022-09-06 株式会社オートネットワーク技術研究所 外装部材及びワイヤハーネス

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0484496A (ja) * 1990-07-27 1992-03-17 Nippon Light Metal Co Ltd 電子機器用筺体
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
JPH0944269A (ja) * 1995-07-25 1997-02-14 Fujitsu Ltd 電子機器および電子機器用筐体並びに筐体の製造方法
FR2810845B1 (fr) * 2000-06-23 2002-08-23 Alstom Module de puissance a composants electroniques de puissance et procede de fabrication d'un tel module
JP2002344178A (ja) * 2001-05-17 2002-11-29 Denso Corp 電子装置
JP3910112B2 (ja) * 2002-06-21 2007-04-25 シャープ株式会社 カメラ付携帯電話機
JP2004140031A (ja) * 2002-10-15 2004-05-13 Matsushita Electric Works Ltd 電子回路モジュール
JP2004200199A (ja) * 2002-12-16 2004-07-15 Oki Electric Ind Co Ltd 放熱シート
JP4044003B2 (ja) * 2003-06-19 2008-02-06 株式会社東芝 携帯用情報機器
JP2005317742A (ja) * 2004-04-28 2005-11-10 Ceramission Kk 密閉構造体用放熱装置
JP4237723B2 (ja) * 2005-03-30 2009-03-11 株式会社東芝 燃料電池を用いた通信端末及びその電源管理システム並びに燃料貯蔵器購入の課金方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103380533A (zh) * 2011-02-16 2013-10-30 日产自动车株式会社 电池外壳及电池外壳的安装结构
CN106462203A (zh) * 2014-05-19 2017-02-22 微软技术许可有限责任公司 具有光谱选择性辐射发散设备的计算设备
US10248172B2 (en) 2014-05-19 2019-04-02 Microsoft Technology Licensing, Llc Spectrally selective radiation emission device
WO2018218798A1 (zh) * 2017-05-27 2018-12-06 深圳市光峰光电技术有限公司 一种投影设备

Also Published As

Publication number Publication date
JP2009152631A (ja) 2009-07-09
JP2008130729A (ja) 2008-06-05
JP4315187B2 (ja) 2009-08-19
JP4894873B2 (ja) 2012-03-14
US20080117599A1 (en) 2008-05-22

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20080528