CN101164141A - 清洁基材边缘的方法及设备 - Google Patents

清洁基材边缘的方法及设备 Download PDF

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Publication number
CN101164141A
CN101164141A CNA2006800137756A CN200680013775A CN101164141A CN 101164141 A CN101164141 A CN 101164141A CN A2006800137756 A CNA2006800137756 A CN A2006800137756A CN 200680013775 A CN200680013775 A CN 200680013775A CN 101164141 A CN101164141 A CN 101164141A
Authority
CN
China
Prior art keywords
substrate
rollers
diameter
edge
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800137756A
Other languages
English (en)
Chinese (zh)
Inventor
W·Y·苏
多纳德·J·K·欧盖杜
H·S·辛
L·Y·陈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN101164141A publication Critical patent/CN101164141A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
CNA2006800137756A 2005-04-25 2006-04-24 清洁基材边缘的方法及设备 Pending CN101164141A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67491005P 2005-04-25 2005-04-25
US60/674,910 2005-04-25

Publications (1)

Publication Number Publication Date
CN101164141A true CN101164141A (zh) 2008-04-16

Family

ID=36694310

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800137756A Pending CN101164141A (zh) 2005-04-25 2006-04-24 清洁基材边缘的方法及设备

Country Status (6)

Country Link
US (3) US20060243304A1 (https=)
JP (1) JP2008539594A (https=)
KR (1) KR20080005974A (https=)
CN (1) CN101164141A (https=)
TW (1) TWI362064B (https=)
WO (1) WO2006116263A1 (https=)

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CN108723972A (zh) * 2017-04-20 2018-11-02 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
CN113253567A (zh) * 2020-05-28 2021-08-13 台湾积体电路制造股份有限公司 用于光掩模的清洁方法及其装置
CN116153803A (zh) * 2023-04-23 2023-05-23 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

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US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
JP2009532210A (ja) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド 基板の縁部を研摩するための方法及び装置
US20080156360A1 (en) * 2006-12-26 2008-07-03 Applied Materials, Inc. Horizontal megasonic module for cleaning substrates
US7823241B2 (en) 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
US8142260B2 (en) 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
US20080293336A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus to control substrate bevel and edge polishing profiles of films
US20080293337A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate by substrate vibration
JP2008288600A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の縁部除外領域の大きさを制御する方法及び装置
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
WO2009065757A1 (en) * 2007-11-23 2009-05-28 Sez Ag Device and process for wet treating a peripheral area of a wafer-shaped article
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
JP5302781B2 (ja) * 2009-06-04 2013-10-02 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
GB2480875B (en) * 2010-06-04 2014-09-03 Plastic Logic Ltd Production of electronic switching devices
JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
US20130111678A1 (en) * 2011-11-08 2013-05-09 Applied Materials, Inc. Brush box module for chemical mechanical polishing cleaner
KR20130090209A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
KR101415983B1 (ko) * 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치
US9613845B2 (en) 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
JP6461748B2 (ja) * 2015-08-25 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US11551940B2 (en) * 2018-12-25 2023-01-10 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Roller for cleaning wafer and cleaning apparatus having the same
CN109571232B (zh) * 2018-12-28 2020-05-19 西安奕斯伟硅片技术有限公司 晶圆研磨方法及其研磨系统
US12519020B2 (en) * 2022-06-17 2026-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation

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JP2002177911A (ja) * 2000-12-14 2002-06-25 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
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JP2004241658A (ja) * 2003-02-06 2004-08-26 Nippei Toyama Corp 半導体デバイスのエッジ部の研削方法及び研削装置
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US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP2009532210A (ja) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド 基板の縁部を研摩するための方法及び装置
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108723972A (zh) * 2017-04-20 2018-11-02 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
CN108723972B (zh) * 2017-04-20 2020-09-22 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
CN113253567A (zh) * 2020-05-28 2021-08-13 台湾积体电路制造股份有限公司 用于光掩模的清洁方法及其装置
US12259649B2 (en) 2020-05-28 2025-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning method for photo masks and apparatus therefor
CN116153803A (zh) * 2023-04-23 2023-05-23 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

Also Published As

Publication number Publication date
KR20080005974A (ko) 2008-01-15
TWI362064B (en) 2012-04-11
JP2008539594A (ja) 2008-11-13
TW200731367A (en) 2007-08-16
WO2006116263A1 (en) 2006-11-02
US20090038642A1 (en) 2009-02-12
US20080216867A1 (en) 2008-09-11
US20060243304A1 (en) 2006-11-02

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