CN101154564A - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN101154564A CN101154564A CNA2007101543560A CN200710154356A CN101154564A CN 101154564 A CN101154564 A CN 101154564A CN A2007101543560 A CNA2007101543560 A CN A2007101543560A CN 200710154356 A CN200710154356 A CN 200710154356A CN 101154564 A CN101154564 A CN 101154564A
- Authority
- CN
- China
- Prior art keywords
- substrate
- treatment
- treatment trough
- alcohol
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
Landscapes
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006260195 | 2006-09-26 | ||
JP2006260195 | 2006-09-26 | ||
JP2006-260195 | 2006-09-26 | ||
JP2007199027 | 2007-07-31 | ||
JP2007199027A JP5248058B2 (ja) | 2006-09-26 | 2007-07-31 | 基板処理装置 |
JP2007-199027 | 2007-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101154564A true CN101154564A (zh) | 2008-04-02 |
CN101154564B CN101154564B (zh) | 2013-01-30 |
Family
ID=39223616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101543560A Active CN101154564B (zh) | 2006-09-26 | 2007-09-26 | 基板处理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080072931A1 (zh) |
JP (1) | JP5248058B2 (zh) |
KR (1) | KR100922664B1 (zh) |
CN (1) | CN101154564B (zh) |
TW (1) | TWI345808B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101780460A (zh) * | 2010-03-19 | 2010-07-21 | 上海集成电路研发中心有限公司 | 高效率的硅片清洗水槽和清洗方法 |
CN102986003A (zh) * | 2010-07-23 | 2013-03-20 | 东京毅力科创株式会社 | 液处理装置和液处理方法 |
CN103426722A (zh) * | 2012-05-23 | 2013-12-04 | 联华电子股份有限公司 | 基板的处理方法 |
CN105161399A (zh) * | 2015-08-06 | 2015-12-16 | 浙江德西瑞光电科技有限公司 | 高效彩色多晶太阳能电池片的处理方法及其处理装置 |
CN105161400A (zh) * | 2015-08-06 | 2015-12-16 | 浙江德西瑞光电科技有限公司 | 多晶四阻栅新型高效电池片的处理方法及其处理装置 |
CN112582501A (zh) * | 2020-12-14 | 2021-03-30 | 张家港博佑光电科技有限公司 | 一种硅太阳能电池rena多晶制绒加工方法 |
CN114721231A (zh) * | 2022-04-17 | 2022-07-08 | 江苏晟驰微电子有限公司 | 一种用于光刻版清洗的工装夹具 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884180B2 (ja) * | 2006-11-21 | 2012-02-29 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US20080236639A1 (en) * | 2007-03-27 | 2008-10-02 | Masahiro Kimura | Substrate treating apparatus |
JP5234985B2 (ja) * | 2009-03-31 | 2013-07-10 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
JP5497607B2 (ja) * | 2010-10-01 | 2014-05-21 | ファインマシーンカタオカ株式会社 | カプセル型の洗浄機 |
EP2868398A1 (en) * | 2013-10-29 | 2015-05-06 | Cliris SA | Device and Method for Ultrasonic Cleaning |
JP6342343B2 (ja) | 2014-03-13 | 2018-06-13 | 東京エレクトロン株式会社 | 基板処理装置 |
US11938524B2 (en) * | 2019-08-29 | 2024-03-26 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5772784A (en) * | 1994-11-14 | 1998-06-30 | Yieldup International | Ultra-low particle semiconductor cleaner |
JP3333830B2 (ja) * | 1995-07-27 | 2002-10-15 | 株式会社タクマ | 基板のリンス及び乾燥の方法及び装置 |
US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
US6413355B1 (en) * | 1996-09-27 | 2002-07-02 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
JP3916717B2 (ja) * | 1997-01-14 | 2007-05-23 | 三井・デュポンフロロケミカル株式会社 | 洗浄方法 |
JP3171807B2 (ja) * | 1997-01-24 | 2001-06-04 | 東京エレクトロン株式会社 | 洗浄装置及び洗浄方法 |
JP3756321B2 (ja) | 1998-05-28 | 2006-03-15 | 富士通ヴィエルエスアイ株式会社 | 基板処理装置および方法 |
JP2001144065A (ja) * | 1999-11-16 | 2001-05-25 | Tokyo Electron Ltd | 洗浄・乾燥処理方法および装置 |
JP2002252201A (ja) * | 2001-02-26 | 2002-09-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4219799B2 (ja) * | 2003-02-26 | 2009-02-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2005175037A (ja) | 2003-12-09 | 2005-06-30 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2005191472A (ja) * | 2003-12-26 | 2005-07-14 | Semiconductor Leading Edge Technologies Inc | 半導体装置の製造方法 |
KR100830485B1 (ko) * | 2004-04-02 | 2008-05-20 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
-
2007
- 2007-07-31 JP JP2007199027A patent/JP5248058B2/ja active Active
- 2007-09-11 TW TW096133920A patent/TWI345808B/zh active
- 2007-09-17 KR KR1020070094029A patent/KR100922664B1/ko active IP Right Grant
- 2007-09-19 US US11/857,659 patent/US20080072931A1/en not_active Abandoned
- 2007-09-26 CN CN2007101543560A patent/CN101154564B/zh active Active
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101780460A (zh) * | 2010-03-19 | 2010-07-21 | 上海集成电路研发中心有限公司 | 高效率的硅片清洗水槽和清洗方法 |
CN101780460B (zh) * | 2010-03-19 | 2015-04-29 | 上海集成电路研发中心有限公司 | 硅片清洗水槽和清洗方法 |
CN102986003A (zh) * | 2010-07-23 | 2013-03-20 | 东京毅力科创株式会社 | 液处理装置和液处理方法 |
CN102986003B (zh) * | 2010-07-23 | 2015-10-14 | 东京毅力科创株式会社 | 液处理装置和液处理方法 |
CN103426722A (zh) * | 2012-05-23 | 2013-12-04 | 联华电子股份有限公司 | 基板的处理方法 |
CN105161399A (zh) * | 2015-08-06 | 2015-12-16 | 浙江德西瑞光电科技有限公司 | 高效彩色多晶太阳能电池片的处理方法及其处理装置 |
CN105161400A (zh) * | 2015-08-06 | 2015-12-16 | 浙江德西瑞光电科技有限公司 | 多晶四阻栅新型高效电池片的处理方法及其处理装置 |
CN105161400B (zh) * | 2015-08-06 | 2018-07-17 | 浙江德西瑞新能源科技股份有限公司 | 多晶四阻栅电池片的处理方法及其处理装置 |
CN105161399B (zh) * | 2015-08-06 | 2018-07-17 | 浙江德西瑞新能源科技股份有限公司 | 彩色多晶太阳能电池片的处理方法及其处理装置 |
CN112582501A (zh) * | 2020-12-14 | 2021-03-30 | 张家港博佑光电科技有限公司 | 一种硅太阳能电池rena多晶制绒加工方法 |
CN114721231A (zh) * | 2022-04-17 | 2022-07-08 | 江苏晟驰微电子有限公司 | 一种用于光刻版清洗的工装夹具 |
Also Published As
Publication number | Publication date |
---|---|
JP5248058B2 (ja) | 2013-07-31 |
KR20080028284A (ko) | 2008-03-31 |
JP2008109086A (ja) | 2008-05-08 |
CN101154564B (zh) | 2013-01-30 |
TWI345808B (en) | 2011-07-21 |
TW200834695A (en) | 2008-08-16 |
KR100922664B1 (ko) | 2009-10-19 |
US20080072931A1 (en) | 2008-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101154564B (zh) | 基板处理装置 | |
KR100390545B1 (ko) | 기판세정건조장치,기판세정방법및기판세정장치 | |
US6745494B2 (en) | Method and apparatus for processing wafers under pressure | |
US20110000512A1 (en) | Substrate processing apparatus and substrate processing method | |
US9415356B1 (en) | Chemical-liquid mixing method and chemical-liquid mixing apparatus | |
KR20100044096A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
CN101399182B (zh) | 基板处理装置及基板处理方法 | |
CN100536067C (zh) | 基板处理装置 | |
US10458010B2 (en) | Substrate liquid processing apparatus, substrate liquid processing method, and storage medium | |
JP5330793B2 (ja) | 基板処理装置及び基板処理方法 | |
JP2023115235A (ja) | フィルタ洗浄システム、フィルタ洗浄方法および減圧機構 | |
US7562663B2 (en) | High-pressure processing apparatus and high-pressure processing method | |
JP2010103190A (ja) | 基板処理装置及び基板処理方法 | |
JP5226452B2 (ja) | チャンバ洗浄方法 | |
JP2005166847A (ja) | 基板処理法及び基板処理装置 | |
KR20220156137A (ko) | 기판 처리 장치 | |
JP2008032263A (ja) | 蒸気発生装置及びこれを備えた基板乾燥装置 | |
JP5561137B2 (ja) | 液処理装置、液処理方法及び記憶媒体 | |
JP2023133102A (ja) | 基板処理方法および基板処理装置 | |
CN115966487A (zh) | 用于处理基板的设备和用于测量浓度的设备 | |
KR100481157B1 (ko) | 기판 건조 방법 및 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |