CN101142222B - 有机基三硅氧烷、制备以及在可固化的树脂组合物中的应用 - Google Patents

有机基三硅氧烷、制备以及在可固化的树脂组合物中的应用 Download PDF

Info

Publication number
CN101142222B
CN101142222B CN2006800082679A CN200680008267A CN101142222B CN 101142222 B CN101142222 B CN 101142222B CN 2006800082679 A CN2006800082679 A CN 2006800082679A CN 200680008267 A CN200680008267 A CN 200680008267A CN 101142222 B CN101142222 B CN 101142222B
Authority
CN
China
Prior art keywords
group
curable resin
general formula
trisiloxanes
methyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800082679A
Other languages
English (en)
Chinese (zh)
Other versions
CN101142222A (zh
Inventor
植木浩
一色实
森田好次
加藤智子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN101142222A publication Critical patent/CN101142222A/zh
Application granted granted Critical
Publication of CN101142222B publication Critical patent/CN101142222B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
CN2006800082679A 2005-03-15 2006-03-15 有机基三硅氧烷、制备以及在可固化的树脂组合物中的应用 Expired - Fee Related CN101142222B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005072394A JP4875312B2 (ja) 2005-03-15 2005-03-15 オルガノトリシロキサン、その製造方法、それを含む硬化性樹脂組成物、およびその硬化物
JP072394/2005 2005-03-15
PCT/JP2006/305637 WO2006098491A1 (en) 2005-03-15 2006-03-15 Organotrisiloxane, preparation and use in curable resin composition

Publications (2)

Publication Number Publication Date
CN101142222A CN101142222A (zh) 2008-03-12
CN101142222B true CN101142222B (zh) 2011-03-30

Family

ID=36579087

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800082679A Expired - Fee Related CN101142222B (zh) 2005-03-15 2006-03-15 有机基三硅氧烷、制备以及在可固化的树脂组合物中的应用

Country Status (7)

Country Link
US (1) US20090234078A1 (enExample)
EP (1) EP1858905B1 (enExample)
JP (1) JP4875312B2 (enExample)
KR (1) KR101261252B1 (enExample)
CN (1) CN101142222B (enExample)
TW (1) TW200635937A (enExample)
WO (1) WO2006098491A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100328895A1 (en) * 2007-09-11 2010-12-30 Dorab Bhagwagar Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use
KR20100069667A (ko) * 2007-09-11 2010-06-24 다우 코닝 코포레이션 열계면재료, 열계면재료를 포함하는 전자장치, 그리고 이들의 제조방법 및 용도
US8497338B2 (en) * 2011-10-31 2013-07-30 Momentive Performance Materials Inc. Process of manufacturing organosilicon products with improved quality using heterogeneous precious metal catalysts
TWI881059B (zh) * 2020-03-17 2025-04-21 日商信越化學工業股份有限公司 聚矽氧塗佈劑組成物及物品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4430235A (en) * 1981-07-17 1984-02-07 Union Carbide Corporation Polymeric antioxidants

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117682A (ja) * 1988-10-27 1990-05-02 Sumitomo Bakelite Co Ltd １，３−ビス（ヒドロキシフェニル）ジシロキサン誘導体の製造法
JPH0320324A (ja) * 1989-02-03 1991-01-29 Sumitomo Durez Co Ltd シリコーン変性エポキシ樹脂
US5206312A (en) * 1989-11-20 1993-04-27 The Dow Chemical Company Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof
JP3059776B2 (ja) * 1991-05-27 2000-07-04 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム粉状物の製造方法
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JP3318408B2 (ja) * 1993-10-06 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 粉状シリコーン硬化物およびその製造方法
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
TW296400B (enExample) * 1994-11-17 1997-01-21 Shinetsu Chem Ind Co
JPH09151253A (ja) * 1995-11-29 1997-06-10 Toray Dow Corning Silicone Co Ltd オルガノポリシロキサン用耐熱剤および耐熱性オルガノポリシロキサン組成物
US5604039A (en) * 1996-01-22 1997-02-18 Eastman Kodak Company Thermally stable release agents
US5859127A (en) * 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
US7169859B2 (en) * 1999-05-18 2007-01-30 General Electric Company Weatherable, thermostable polymers having improved flow composition
US6861482B2 (en) * 1999-05-18 2005-03-01 General Electric Company Weatherable, thermostable polymers having improved flow composition
JP2002020719A (ja) * 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
US6709756B2 (en) * 2001-05-21 2004-03-23 Shin-Etsu Chemical Co., Ltd. Optical device-related adhesive and optical device
US6630525B2 (en) * 2001-10-09 2003-10-07 General Electric Company Polycarbonate-siloxane copolymers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4430235A (en) * 1981-07-17 1984-02-07 Union Carbide Corporation Polymeric antioxidants

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Graham J. Knight.A comparison of the thermal stabilities of a siloxane substituted polycarbonate with a standard polycarbonate and a polydimethylsiloxane..The British Polymer Journal.1978,Vol. 10187-190. *
侯庆普等.Modification of epoxy resins with phenolic hydroxyl-terminated polysiloxane..Chinese Journal of Polymer Science.1995,Vol. 13(No. 3),235-243. *
侯庆普等.Modificationofepoxyresinswithphenolichydroxyl-terminatedpolysiloxane..ChineseJournalofPolymerScience.1995 Vol. 13(No. 3)

Also Published As

Publication number Publication date
TW200635937A (en) 2006-10-16
CN101142222A (zh) 2008-03-12
EP1858905B1 (en) 2011-05-18
WO2006098491A1 (en) 2006-09-21
JP4875312B2 (ja) 2012-02-15
EP1858905A1 (en) 2007-11-28
KR20070112388A (ko) 2007-11-23
KR101261252B1 (ko) 2013-05-07
JP2006256970A (ja) 2006-09-28
US20090234078A1 (en) 2009-09-17

Similar Documents

Publication Publication Date Title
US9644124B2 (en) Silicon-containing compound having alkoxysilyl-ethylene group at its terminal, room temperature-curable organopolysiloxane composition, and molded product obtained by curing the composition
EP2201068B1 (en) Curable silicone composition and cured product thereof
JP4799848B2 (ja) 硬化性シリコーン組成物およびその硬化物
EP1874869B1 (en) Curable silicone composition and cured product therefrom
JP3339910B2 (ja) 硬化性樹脂組成物
JP5248012B2 (ja) 硬化性シリコーン組成物
JP4931366B2 (ja) 硬化性シリコーン組成物および電子部品
JP2008156474A (ja) 硬化性シリコーン組成物および電子部品
CN113015775B (zh) 粘接性聚有机硅氧烷组合物
CN101517004B (zh) 可固化的硅氧烷组合物及其固化体
CN101142222B (zh) 有机基三硅氧烷、制备以及在可固化的树脂组合物中的应用
JP6191571B2 (ja) プライマー組成物
JP5285838B2 (ja) 硬化性シリコーン組成物およびその硬化物
JPH04311765A (ja) 硬化性オルガノポリシロキサン組成物
KR102702853B1 (ko) 오가노폴리실록산 조성물, 및 유기 규소 화합물 및 그 제조 방법
CN106795182A (zh) 新的有机钛化合物、该有机钛化合物的制造方法以及室温固化性树脂组合物
WO2025018067A1 (ja) ダイボンディング用有機変性シリコーン樹脂組成物、その硬化物、及び光半導体素子

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110330

Termination date: 20160315