TW200635937A - Organotrisiloxane, method of manufacturing thereof, curable resin composition that contains the organotrisiloxane, and a cured product - Google Patents

Organotrisiloxane, method of manufacturing thereof, curable resin composition that contains the organotrisiloxane, and a cured product

Info

Publication number
TW200635937A
TW200635937A TW095106725A TW95106725A TW200635937A TW 200635937 A TW200635937 A TW 200635937A TW 095106725 A TW095106725 A TW 095106725A TW 95106725 A TW95106725 A TW 95106725A TW 200635937 A TW200635937 A TW 200635937A
Authority
TW
Taiwan
Prior art keywords
organotrisiloxane
manufacturing
resin composition
curable resin
cured product
Prior art date
Application number
TW095106725A
Other languages
English (en)
Inventor
Hiroshi Ueki
Minoru Isshiki
Yoshitsugu Morita
Tomoko Kato
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of TW200635937A publication Critical patent/TW200635937A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
TW095106725A 2005-03-15 2006-03-01 Organotrisiloxane, method of manufacturing thereof, curable resin composition that contains the organotrisiloxane, and a cured product TW200635937A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005072394A JP4875312B2 (ja) 2005-03-15 2005-03-15 オルガノトリシロキサン、その製造方法、それを含む硬化性樹脂組成物、およびその硬化物

Publications (1)

Publication Number Publication Date
TW200635937A true TW200635937A (en) 2006-10-16

Family

ID=36579087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106725A TW200635937A (en) 2005-03-15 2006-03-01 Organotrisiloxane, method of manufacturing thereof, curable resin composition that contains the organotrisiloxane, and a cured product

Country Status (7)

Country Link
US (1) US20090234078A1 (zh)
EP (1) EP1858905B1 (zh)
JP (1) JP4875312B2 (zh)
KR (1) KR101261252B1 (zh)
CN (1) CN101142222B (zh)
TW (1) TW200635937A (zh)
WO (1) WO2006098491A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
US8334592B2 (en) * 2007-09-11 2012-12-18 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
US8497338B2 (en) * 2011-10-31 2013-07-30 Momentive Performance Materials Inc. Process of manufacturing organosilicon products with improved quality using heterogeneous precious metal catalysts
TW202140702A (zh) * 2020-03-17 2021-11-01 日商信越化學工業股份有限公司 聚矽氧塗佈劑組成物及物品

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4430235A (en) * 1981-07-17 1984-02-07 Union Carbide Corporation Polymeric antioxidants
JPH02117682A (ja) * 1988-10-27 1990-05-02 Sumitomo Bakelite Co Ltd １，３−ビス（ヒドロキシフェニル）ジシロキサン誘導体の製造法
JPH0320324A (ja) * 1989-02-03 1991-01-29 Sumitomo Durez Co Ltd シリコーン変性エポキシ樹脂
US5206312A (en) * 1989-11-20 1993-04-27 The Dow Chemical Company Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof
JP3059776B2 (ja) * 1991-05-27 2000-07-04 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム粉状物の製造方法
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JP3318408B2 (ja) * 1993-10-06 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 粉状シリコーン硬化物およびその製造方法
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
TW296400B (zh) * 1994-11-17 1997-01-21 Shinetsu Chem Ind Co
JPH09151253A (ja) * 1995-11-29 1997-06-10 Toray Dow Corning Silicone Co Ltd オルガノポリシロキサン用耐熱剤および耐熱性オルガノポリシロキサン組成物
US5604039A (en) * 1996-01-22 1997-02-18 Eastman Kodak Company Thermally stable release agents
US5859127A (en) * 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
US6861482B2 (en) * 1999-05-18 2005-03-01 General Electric Company Weatherable, thermostable polymers having improved flow composition
US7169859B2 (en) * 1999-05-18 2007-01-30 General Electric Company Weatherable, thermostable polymers having improved flow composition
JP2002020719A (ja) * 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
US6709756B2 (en) * 2001-05-21 2004-03-23 Shin-Etsu Chemical Co., Ltd. Optical device-related adhesive and optical device
US6630525B2 (en) * 2001-10-09 2003-10-07 General Electric Company Polycarbonate-siloxane copolymers

Also Published As

Publication number Publication date
US20090234078A1 (en) 2009-09-17
WO2006098491A1 (en) 2006-09-21
EP1858905B1 (en) 2011-05-18
KR20070112388A (ko) 2007-11-23
JP4875312B2 (ja) 2012-02-15
CN101142222B (zh) 2011-03-30
JP2006256970A (ja) 2006-09-28
KR101261252B1 (ko) 2013-05-07
EP1858905A1 (en) 2007-11-28
CN101142222A (zh) 2008-03-12

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