Classifications

• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
  • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
  • C07F7/02—Silicon compounds
  • C07F7/08—Compounds having one or more C—Si linkages
  • C07F7/0834—Compounds having one or more O-Si linkage
  • C07F7/0838—Compounds with one or more Si-O-Si sequences
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
  • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
  • C07F7/02—Silicon compounds
  • C07F7/08—Compounds having one or more C—Si linkages
  • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
  • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
  • C07F7/02—Silicon compounds
  • C07F7/08—Compounds having one or more C—Si linkages
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds

Definitions

• the present invention relates to a novel organotrisiloxane that contains an organic group with a phenolic hydroxyl group, and an aryl group.
• the invention also relates to a method of manufacturing the aforementioned organotrisiloxane, a curable resin composition that contains the aforementioned organotrisiloxane, and a product obtained by curing the above composition.
• Japanese Unexamined Patent Application Publication No. (hereinafter referred to as "Kokai") S63-199220, Kokai H9-151253, and U.S. Patent No. 4,430,235 disclose a linear-chain organopolysiloxane that contains an organic group with a phenolic hydroxyl group.
• the linear-chain organopolysiloxane that contains an organic group with a phenolic hydroxyl group has low reactivity and poor compatibility with curable resins, such as epoxy resins.
• the disiloxane that contains an organic group with a phenolic hydroxyl group has excellent reactivity, and when it is compounded with a curable resin, such as an epoxy resin, a problem occurs in view of high rigidity of the obtained cured body and low adhesion thereof to a substrate.
• the invention also relates to a method of manufacturing the aforementioned organotrisiloxane, and to a curable resin composition that contains the aforementioned organotrisiloxane, and to a cured product obtained from the above composition. Disclosure of Invention
• organotrisiloxane of the present invention is represented by the following general formula:
• R 1 and R 2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R or R is an aryl group, and R designates an organic group that contains a phenolic hydroxyl group).
• the method of the invention for manufacturing an organotrisiloxane of the invention is characterized by carrying out a hydrosilylation reaction between a phenolic compound that contains an aliphatically unsaturated hydrocarbon group and an organotrisiloxane represented by the following general formula:
• R 1 and R 2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R or R is an aryl group).
• the curable resin composition of the invention is characterized by comprising: a curable resin and the aforementioned organotrisiloxane.
• the cured product of the invention is characterized by being obtained as a result of curing the aforementioned curable resin composition.
• the organotrisiloxane of the present invention is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.
• the method of the invention can be used- for efficient production of such novel compounds, and since the composition of the invention contains the aforementioned novel compound, it demonstrates good curability and adhesion to substrates, while a cured body obtained from the composition of the invention also demonstrates good adhesion to various substrates.
• Fig. 1 is a 13 C-NMR spectral chart of organotrisiloxane prepared in Application Example 1.
• Fig. 2 is a 29 Si-NMR spectral chart of organotrisiloxane prepared in Application Example 1.
• Fig. 3 is a C-NMR spectral chart of organotrisiloxane prepared in Application Example 2.
• Fig. 4 is a Si-NMR spectral chart of organotrisiloxane prepared in Application Example 2.
• organotrisiloxane of the present invention is characterized by the following general formula:
• R 1 and R 2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds.
• the following are specific examples of such univalent hydrocarbon groups: methyl, ethyl, propyl, butyl, pentyl, hexyl, or similar alkyl groups; phenyl, tolyl, xylyl, or similar aryl groups; benzyl, phenethyl, or similar aralkyl groups; 3-chloropropyl, 3,3,3-trifluoropropyl, or similar halogenated alkyl groups.
• R 1 or R 2 is an aryl group, and preferably, that R 1 is an alkyl group and R 2 is an aryl group. It is especially preferable that R 1 is a methyl group and R is a phenyl group. It is recommended that R in the above formula is an organic group having a phenolic hydroxyl group. More specifically, there are no special restrictions with regard to the aforementioned organic group, provided that this group has a hydroxyl group bonded to an aromatic ring, but it is recommended that this group is expressed by the following formula:
• R 4 is an alkylene group, more specifically, an ethylene, propylene, methylethylene, or a butylene group, preferably a propylene group.
• R 5 is an alkyl group or an alkoxy group
• I as an alkyl group can be exemplified by a methyl, ethyl, propyl, butyl, pentyl, or hexyl group.
• R 5 as an alkoxy group can be exemplified by a methoxy, ethoxy, propoxy, or butoxy group.
• "n" is 0 or 1.
• the manufacturing method of the present invention is characterized by carrying out a hydrosilylation reaction between a phenolic compound that contains an aliphatically unsaturated hydrocarbon group and an organotrisiloxane represented by the following general formula:
• R 1 and R 2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds. At least one of R 1 or R 2 should be an aryl group. Preferably, R 1 should be an alkyl group and R 2 a phenyl group.
• R 5 is an alkyl or alkoxy group. These groups may be the same as exemplified above.
• R 6 designate an alkenyl group. Specific examples of the alkenyl group are vinyl groups, allyl groups, and butenyl groups, of which allyl groups are preferable.
• "n" is 0 or 1
• a preferable phenolic group is arylphenol or eugenol.
• the hydrosilylation reaction between the aforementioned organotrisiloxane and the phenolic group with an unsaturated aliphatic hydrocarbon group may be carried out with the use of a hydrosilylation catalyst.
• a hydrosilylation catalyst may be exemplified by a platinum-type catalyst, rhodium-type catalyst, or a palladium-type catalyst, of which the platinum-type catalyst is preferable.
• platinum-type catalysts platinum black, chloroplatinic acid, alcohol-modified chloroplatinic acid, platinum-olef ⁇ n complex, platinum-alkenylsiloxane complex, or a platinum-carbonyl complex.
• the hydrosilylation reaction can be carried out at room temperature but for acceleration of the process the reaction can be carried out with heating.
• proportions in which the organotrisiloxane and phenolic compound can be used it may be recommend that a mole ratio of silicon- bonded hydrogen atoms contained in the organotrisiloxane to unsaturated aliphatic hydrocarbon groups contained in the phenolic compound be within the range of (1 :1) to (1:10), preferably (1 :1) to (1:3).
• the target organotrisiloxane will be produced with a low yield, and if, on the other hand, the mole ratio exceeds the upper recommended limit, the product will contain a large amount of an unreacted phenolic compound, and, in some cases, this may lead to decrease in purity of the obtained organotrisiloxane.
• An organic solvent suitable for the hydrosilylation reaction may be hexane, octane, or a similar aliphatic hydrocarbon; toluene, xylene, or a similar aromatic hydrocarbon; butyl acetate, ethyl acetate, or a similar ester; diethyl ether, dibutyl ether, dioxane, or a similar ether; acetone, methylethylketone, methylisobutylketone, cyclohexanone, or a similar ketone.
• the curable resin composition of the invention is characterized by comprising: a curable resin and the aforementioned organotrisiloxane.
• curable resin that constitutes one of the main components of the composition of the invention.
• the following are specific examples of such resins: an epoxy resin, phenolic resin, formaldehyde resin, xylene resin, xylene-formaldehyde resin, ketone-formaldehyde resin, furane resin, urea resin, imide resin, melamine resin, alkyd resin, unsaturated polyester resin, aniline resin, sulfonamide resin, or their copolymerizable organic resin; silicone-modified organic resins with organosilyl groups or organosiloxy groups partially bonded to the aforementioned curable organic resins; or a mixture of two or more of the aforementioned organic resins.
• the resins can be cured by heating, radiation with ultraviolet rays, radiation with high-energy rays, or by holding in a humid air. Curing by heating is most preferable.
• the above-described curable resins can be combined with some arbitrary components, such as curing agents, curing accelerators, etc.
• the curing agents may be exemplified by carboxylic acids, sulfonic acids, or a similar organic acids, hydrates of the aforementioned acids, an organic hydroxyl compounds, organic silicon compounds that contain silanol groups, halogen groups, or the like, primary or secondary amino compounds, silicone resins that contain silanol groups, silicone oils that contain silanol groups, or combinations of two or more of the above compounds.
• the curing accelerators may be represented by tertiary amino compounds, organic metal salts, such as organic salts of aluminum, zirconium, etc., phosphines such as organic phosphates, heterocyclic amino compounds, complex boron compounds, organic ammonium salts, organic sulfonium salts, organic peroxides, hydrosilation catalysts, etc.
• the above-described organotrisiloxane is a component that is used for protecting the composition of the invention from the loss of. flowability prior to curing, as well as for improving tightness of contact and adhesion with respect to various substrates after curing.
• the amount in which the organotrisiloxane can be added It is recommended, however, to add it in an amount of 0.01 to 100 parts by weight, preferably 0.1 to 50 parts by weight per 100 parts by weight of the curable resin that constitutes the main component.
• the composition of the invention may be compounded with various arbitrary components such as sensitizers, metal salts of higher fatty acids, ester-type waxes, plasticizers, flexibilizer, fillers, silane coupling agents, etc.
• the flexibility imparters can be represented by silicone oils and silicone rubbers.
• the fillers may be comprised of glass fibers, aluminum fibers, ceramic fibers having alumina and silica as their components, boron fibers, zirconia fibers, silicon carbide fibers, metal fibers, polyester fibers, aramid fibers, Nylon fibers, phenol fibers, natural animal and vegetable fibers, or other fibrous fillers, as well as powders of fused silica, precipitated silica, fumed silica, baked silica, zinc oxide, baked clay, carbon black, glass beads, alumina, talc, calcium carbonate, clay, aluminum hydroxide, barium sulfate, titanium dioxide, aluminum nitride, silicon carbide, magnesium oxide, beryllium oxide, kaolin, mica, zirconia, etc.
• Silane coupling agents can be represented by vinyltrimethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, 3-glycidoxypropyl- trimethoxysilane, 3 -methacryloxypropyl-trimethoxysilane, 3 -amonopropyl-triethoxysilane, and N-(2-aminoethyl)-3 -aminopropyl-trimethoxysilane.
• composition of the invention is prepared by uniformly mixing the aforementioned curable resin, organotrisiloxane, and, if necessary, other arbitrary components.
• the components can be mixed with the use of a single or biaxial mixer, two-roll mill, Ross mixer, or a kneader-mixer.
• a cured product of the invention is obtained by curing the curable resin composition described above. Since the obtained cured product has excellent adhesive properties, it can be used as a sealer, adhesive agent, or a coating material for parts of electronic and electrical devices. Examples
• organotrisiloxane of the invention the method of manufacturing thereof, the curable resin composition of the invention, and the cured product will be further described in detail with reference to application and comparative examples.
• the appearance and viscosity of the curable resin composition, as well as the composite modulus of elasticity and adhesive properties of the cured product were evaluated by the methods described below.
• a curable resin composition was prepared without fine silica powder and curing accelerator (amine-type catalyst), and the appearance of the composition was visually observed after vacuum defoaming.
• Viscosity of the curable resin composition at 25°C was measured with the use of an E-type viscometer (the product of Tokimec, Inc., digital viscometer, Model DV-U-E
• the curable resin composition was defoamed at 70 mmHg, it was loaded into a mold having a 10 mm- wide, 50 mm-long, and 2 mm-deep cavity, and after pressure curing for 60 min. under conditions of 150°C and 2.5 MPa was completed, the obtained cured specimen was subjected to secondary heat treatment in an oven for 2 hours at 180°C.
• the composite modulus of elasticity of the obtained specimen at 25 0 C was measured with the use of the ARES viscoelasticity tester (the product of Rheometric Scientific Co. , Model RDA 700). Measurement was carried out under the following conditions: twist 0.5%; frequency 1 Hz.
• the curable resin composition was applied in an amount of about 1 cm 3 onto adherends ⁇ a glass plate (a float glass plate, the product of Paltec Co., Ltd.); an aluminum plate (Al 050P, the product of Paltec Co., Ltd.); a nickel plate (SPCC-SB, the product of Paltec Co., Ltd.); a copper plate (Cl 10OP, the product of Paltec Co., Ltd.); a gold-plated plate (C2801P, the product of Nippon Test Panel Co., Ltd.); a polyimide film (Upilex, the product of Ube Industries Co., Ltd., thickness 125 ⁇ m) ⁇ .
• the units were heated in an oven for 2 hours at 125 0 C and then in an oven for another 2 hours at 180°C.
• specimens for evaluating adhesive properties were produced.
• the cured coatings were separated from the specimens by mean of a dental spatula, and the separation conditions were designated as follows:
• TCF separation with a thin residual layer left on the interface
• AF complete separation through interface
• a four-neck flask equipped with a stirrer was filled with 81.3 g (0.24 mol) of l,l,5,5-tetramethyl-3,3-diphenyltrisiloxane, 100 g of toluene, and 0.025 g of a platinum- l,3-divinyl-l,l,3,3-tetramethyldisiloxane complex (concentration of metal platinum was 4 wt.%).
• the contents were heated to 8O 0 C, and 79.1 g (0.59 mol) of 2-allylphenol were added dropwise. A reaction was carried out for 2 hours at 12O 0 C.
• a four-neck flask equipped with a stirrer was filled with 287.4 g (0.86 mol) of l,l,5 5 5-tetramethyl-3,3-diphenyltrisiloxane, 160 g of toluene, and 0.06 g of a platinum- 1,3- divinyl-l,l,3,3-tetramethyldisiloxane complex (concentration of metal platinum was 4 wt.%).
• the contents were heated to 80°C, and 312.6 g (1.90 mol) of eugenol were added dropwise.
• a reaction was carried out for 2 hours at 120 0 C.
• the organotrisiloxane of the present invention demonstrated good dispersibility in curable resins, imparted low viscosity to curable resin compositions, and made it possible to produce a cured product with good composite modulus of elasticity and high adhesive strength to various substrates.
• the organotrisiloxane of the present invention possesses good reactivity and excellent dispersibility and compatibility with respect to epoxy resins or similar curable resins, it can be used as an agent for improving properties of curable epoxy or similar curable resins.
• the composition of the invention demonstrates good curability and tight adherence to substrates. Therefore, the composition is suitable for use as a sealing, adhesive, or coating agent for parts of electronic and electrical devices.

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Epoxy Resins (AREA)
• Silicon Polymers (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=36579087

Family Applications (1)

Country Status (7)

Families Citing this family (4)

Citations (1)

Family Cites Families (16)

• 2005
  • 2005-03-15 JP JP2005072394A patent/JP4875312B2/ja not_active Expired - Fee Related
• 2006
  • 2006-03-01 TW TW095106725A patent/TW200635937A/zh unknown
  • 2006-03-15 KR KR1020077021083A patent/KR101261252B1/ko not_active Expired - Fee Related
  • 2006-03-15 WO PCT/JP2006/305637 patent/WO2006098491A1/en not_active Ceased
  • 2006-03-15 EP EP06729604A patent/EP1858905B1/en not_active Not-in-force
  • 2006-03-15 US US11/908,587 patent/US20090234078A1/en not_active Abandoned
  • 2006-03-15 CN CN2006800082679A patent/CN101142222B/zh not_active Expired - Fee Related

Patent Citations (1)

Non-Patent Citations (4)

Also Published As

Similar Documents

Legal Events