CN101090995A - 成膜装置、成膜方法以及有机电发光元件的制造方法 - Google Patents

成膜装置、成膜方法以及有机电发光元件的制造方法 Download PDF

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Publication number
CN101090995A
CN101090995A CNA2006800015797A CN200680001579A CN101090995A CN 101090995 A CN101090995 A CN 101090995A CN A2006800015797 A CNA2006800015797 A CN A2006800015797A CN 200680001579 A CN200680001579 A CN 200680001579A CN 101090995 A CN101090995 A CN 101090995A
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Prior art keywords
mask
substrate
magnet
film
magnetic force
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English (en)
Chinese (zh)
Inventor
片冈达哉
长尾兼次
齐藤谦一
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VIEETECH JAPAN CO Ltd
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Japan Microtop Technology Co ltd
Mitsui Engineering and Shipbuilding Co Ltd
Choshu Industry Co Ltd
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Application filed by Japan Microtop Technology Co ltd, Mitsui Engineering and Shipbuilding Co Ltd, Choshu Industry Co Ltd filed Critical Japan Microtop Technology Co ltd
Publication of CN101090995A publication Critical patent/CN101090995A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02678—Beam shaping, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CNA2006800015797A 2005-03-24 2006-02-22 成膜装置、成膜方法以及有机电发光元件的制造方法 Pending CN101090995A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005086687A JP4609759B2 (ja) 2005-03-24 2005-03-24 成膜装置
JP086687/2005 2005-03-24

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Publications (1)

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CN101090995A true CN101090995A (zh) 2007-12-19

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CNA2006800015797A Pending CN101090995A (zh) 2005-03-24 2006-02-22 成膜装置、成膜方法以及有机电发光元件的制造方法

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JP (1) JP4609759B2 (enExample)
KR (1) KR100925362B1 (enExample)
CN (2) CN103820755A (enExample)
TW (1) TW200637930A (enExample)
WO (1) WO2006100867A1 (enExample)

Cited By (12)

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CN103820753A (zh) * 2012-11-15 2014-05-28 三星显示有限公司 薄膜蒸镀用掩膜组件及其制造方法
CN104183796A (zh) * 2013-05-27 2014-12-03 三星显示有限公司 基底移动单元、沉积装置和制造有机发光显示装置的方法
CN106399936A (zh) * 2016-12-09 2017-02-15 京东方科技集团股份有限公司 一种蒸镀设备及蒸镀方法
CN106978585A (zh) * 2017-04-25 2017-07-25 昆山国显光电有限公司 固定装置以及蒸镀装置
CN107132597A (zh) * 2016-02-29 2017-09-05 富士施乐株式会社 光学装置的制造方法、基板装置、光学装置及光学装置的制造装置
CN107557730A (zh) * 2016-07-01 2018-01-09 佳能特机株式会社 掩模吸附装置
CN107686960A (zh) * 2017-07-25 2018-02-13 武汉华星光电半导体显示技术有限公司 一种成膜装置
CN109837509A (zh) * 2019-04-04 2019-06-04 江苏集萃有机光电技术研究所有限公司 一种基片样品架、镀膜设备及控制方法
CN109913842A (zh) * 2017-12-13 2019-06-21 佳能特机株式会社 静电吸盘装置、掩模安装装置、成膜装置、成膜方法及电子设备的制造方法
CN111621741A (zh) * 2019-02-27 2020-09-04 佳能特机株式会社 对准装置及方法、成膜装置及方法、电子器件的制造方法、记录介质及程序
CN113106387A (zh) * 2019-12-24 2021-07-13 佳能特机株式会社 成膜装置及电子器件的制造方法
CN114946024A (zh) * 2019-12-26 2022-08-26 Lg电子株式会社 利用发光元件的显示器的制造装置及其制造方法

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US20100273387A1 (en) * 2007-12-27 2010-10-28 Canon Anelva Corporation Processing Apparatus and Method of Manufacturing Electron Emission Element and Organic EL Display
KR101107181B1 (ko) * 2010-01-04 2012-01-25 삼성모바일디스플레이주식회사 마스크 흡착용 자석 조립체
KR101084185B1 (ko) 2010-01-12 2011-11-17 삼성모바일디스플레이주식회사 패턴 형성 방법 및 유기 발광 소자의 제조방법
TWI475736B (zh) * 2011-07-26 2015-03-01 Innolux Corp 電激發光顯示裝置的製作方法以及鍍膜機台
KR101203171B1 (ko) 2012-05-22 2012-11-21 주식회사 아이.엠.텍 글래스 기판 합착을 위한 얼라인 장치
KR101951029B1 (ko) * 2012-06-13 2019-04-26 삼성디스플레이 주식회사 증착용 마스크 및 이를 이용한 유기 발광 표시장치의 제조방법
KR102270080B1 (ko) * 2013-10-30 2021-06-29 삼성디스플레이 주식회사 박막 증착 장치
KR102273050B1 (ko) 2014-09-17 2021-07-06 삼성디스플레이 주식회사 증착용 마스크 어셈블를 포함하는 증착 장치 및 증착 방법
KR102250047B1 (ko) 2014-10-31 2021-05-11 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR102280269B1 (ko) 2014-11-05 2021-07-22 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조 방법
US10947616B2 (en) 2015-04-17 2021-03-16 Dai Nippon Printing Co., Ltd. Method for forming vapor deposition pattern, pressing-plate-integrated type pressing member, vapor deposition apparatus, and method for producing organic semiconductor element
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JP6298138B2 (ja) * 2015-11-25 2018-03-20 キヤノントッキ株式会社 成膜システム、磁性体部及び膜の製造方法
CN105428552B (zh) * 2015-12-31 2017-06-09 昆山国显光电有限公司 Oled器件发光层形成方法
CN105568224B (zh) * 2016-01-28 2018-09-21 京东方科技集团股份有限公司 蒸镀用遮挡装置以及蒸镀设备
KR102505877B1 (ko) 2016-01-29 2023-03-06 삼성디스플레이 주식회사 마스크 프레임 조립체 및 이를 이용한 디스플레이 장치의 제조방법
JP6605759B2 (ja) * 2016-05-18 2019-11-13 アプライド マテリアルズ インコーポレイテッド 堆積源を搬送するための装置及び方法
CN106048536A (zh) * 2016-06-06 2016-10-26 京东方科技集团股份有限公司 一种蒸镀装置及待蒸镀基板加工方法
KR102544244B1 (ko) 2016-07-19 2023-06-19 삼성디스플레이 주식회사 마스크 프레임 조립체
KR101952521B1 (ko) * 2017-10-31 2019-02-26 캐논 톡키 가부시키가이샤 성막장치, 성막방법, 및 전자 디바이스 제조방법
KR101993532B1 (ko) * 2017-11-29 2019-06-26 캐논 톡키 가부시키가이샤 성막장치, 성막방법, 및 전자 디바이스 제조방법
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JP7118864B2 (ja) * 2018-11-07 2022-08-16 キヤノントッキ株式会社 成膜装置、製造システム、有機ｅｌパネルの製造システム
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JP7420496B2 (ja) * 2019-07-05 2024-01-23 キヤノントッキ株式会社 マスク保持機構、蒸着装置、および電子デバイスの製造装置
JP7606319B2 (ja) * 2020-10-19 2024-12-25 株式会社ジャパンディスプレイ 蒸着マスクの製造方法
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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516346B2 (ja) * 1992-09-08 2004-04-05 大日本印刷株式会社 スパッタ用治具
JP3539125B2 (ja) 1996-04-18 2004-07-07 東レ株式会社 有機電界発光素子の製造方法
JP2001049422A (ja) * 1999-08-09 2001-02-20 Hitachi Ltd メタルマスクの基板への保持固定構造、保持固定治具、その補助具、及びトレイ
JP3879093B2 (ja) * 2000-07-13 2007-02-07 独立行政法人科学技術振興機構 コンビナトリアルデバイス作製装置
JP2002075638A (ja) * 2000-08-29 2002-03-15 Nec Corp マスク蒸着方法及び蒸着装置
KR100422487B1 (ko) * 2001-12-10 2004-03-11 에이엔 에스 주식회사 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
JP2005187874A (ja) * 2003-12-25 2005-07-14 Seiko Epson Corp 蒸着装置、蒸着方法、有機ｅｌ装置、および電子機器

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CN103820753A (zh) * 2012-11-15 2014-05-28 三星显示有限公司 薄膜蒸镀用掩膜组件及其制造方法
CN103820753B (zh) * 2012-11-15 2017-11-17 三星显示有限公司 薄膜蒸镀用掩膜组件及其制造方法
CN104183796B (zh) * 2013-05-27 2018-06-01 三星显示有限公司 基底移动单元、沉积装置和制造有机发光显示装置的方法
CN104183796A (zh) * 2013-05-27 2014-12-03 三星显示有限公司 基底移动单元、沉积装置和制造有机发光显示装置的方法
CN107132597B (zh) * 2016-02-29 2019-11-05 富士施乐株式会社 光学装置的制造方法、基板装置、光学装置及光学装置的制造装置
CN107132597A (zh) * 2016-02-29 2017-09-05 富士施乐株式会社 光学装置的制造方法、基板装置、光学装置及光学装置的制造装置
CN107557730A (zh) * 2016-07-01 2018-01-09 佳能特机株式会社 掩模吸附装置
CN106399936B (zh) * 2016-12-09 2018-12-21 京东方科技集团股份有限公司 一种蒸镀设备及蒸镀方法
CN106399936A (zh) * 2016-12-09 2017-02-15 京东方科技集团股份有限公司 一种蒸镀设备及蒸镀方法
CN106978585A (zh) * 2017-04-25 2017-07-25 昆山国显光电有限公司 固定装置以及蒸镀装置
CN107686960A (zh) * 2017-07-25 2018-02-13 武汉华星光电半导体显示技术有限公司 一种成膜装置
CN107686960B (zh) * 2017-07-25 2019-12-17 武汉华星光电半导体显示技术有限公司 一种成膜装置
CN109913842B (zh) * 2017-12-13 2022-03-29 佳能特机株式会社 静电吸盘装置、掩模安装装置、成膜装置、成膜方法及电子设备的制造方法
CN109913842A (zh) * 2017-12-13 2019-06-21 佳能特机株式会社 静电吸盘装置、掩模安装装置、成膜装置、成膜方法及电子设备的制造方法
CN111621741A (zh) * 2019-02-27 2020-09-04 佳能特机株式会社 对准装置及方法、成膜装置及方法、电子器件的制造方法、记录介质及程序
CN109837509A (zh) * 2019-04-04 2019-06-04 江苏集萃有机光电技术研究所有限公司 一种基片样品架、镀膜设备及控制方法
CN109837509B (zh) * 2019-04-04 2024-03-01 江苏集萃有机光电技术研究所有限公司 一种基片样品架、镀膜设备及控制方法
CN113106387A (zh) * 2019-12-24 2021-07-13 佳能特机株式会社 成膜装置及电子器件的制造方法
CN113106387B (zh) * 2019-12-24 2023-05-19 佳能特机株式会社 成膜装置及电子器件的制造方法
CN114946024A (zh) * 2019-12-26 2022-08-26 Lg电子株式会社 利用发光元件的显示器的制造装置及其制造方法
US12489092B2 (en) 2019-12-26 2025-12-02 Lg Electronics Inc. Apparatus and method of manufacturing display using light emitting element

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