JP4609759B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP4609759B2
JP4609759B2 JP2005086687A JP2005086687A JP4609759B2 JP 4609759 B2 JP4609759 B2 JP 4609759B2 JP 2005086687 A JP2005086687 A JP 2005086687A JP 2005086687 A JP2005086687 A JP 2005086687A JP 4609759 B2 JP4609759 B2 JP 4609759B2
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JP
Japan
Prior art keywords
mask
substrate
magnet
film forming
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005086687A
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English (en)
Japanese (ja)
Other versions
JP2006265650A (ja
Inventor
達哉 片岡
兼次 長尾
謙一 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Engineering and Shipbuilding Co Ltd
Choshu Industry Co Ltd
Mitsui E&S Co Ltd
Original Assignee
Mitsui Engineering and Shipbuilding Co Ltd
Choshu Industry Co Ltd
Mitsui E&S Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Engineering and Shipbuilding Co Ltd, Choshu Industry Co Ltd, Mitsui E&S Holdings Co Ltd filed Critical Mitsui Engineering and Shipbuilding Co Ltd
Priority to JP2005086687A priority Critical patent/JP4609759B2/ja
Priority to TW095105911A priority patent/TW200637930A/zh
Priority to CNA2006800015797A priority patent/CN101090995A/zh
Priority to PCT/JP2006/303187 priority patent/WO2006100867A1/ja
Priority to KR1020077016158A priority patent/KR100925362B1/ko
Priority to CN201410065916.5A priority patent/CN103820755A/zh
Publication of JP2006265650A publication Critical patent/JP2006265650A/ja
Application granted granted Critical
Publication of JP4609759B2 publication Critical patent/JP4609759B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02678—Beam shaping, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2005086687A 2005-03-24 2005-03-24 成膜装置 Expired - Fee Related JP4609759B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005086687A JP4609759B2 (ja) 2005-03-24 2005-03-24 成膜装置
TW095105911A TW200637930A (en) 2005-03-24 2006-02-22 Film forming device, film forming method, and method of producing organic el element
CNA2006800015797A CN101090995A (zh) 2005-03-24 2006-02-22 成膜装置、成膜方法以及有机电发光元件的制造方法
PCT/JP2006/303187 WO2006100867A1 (ja) 2005-03-24 2006-02-22 成膜装置、成膜方法および有機ｅｌ素子の製造方法
KR1020077016158A KR100925362B1 (ko) 2005-03-24 2006-02-22 성막 장치, 성막 방법 및 유기 ｅｌ 소자의 제조 방법
CN201410065916.5A CN103820755A (zh) 2005-03-24 2006-02-22 成膜装置、成膜方法以及有机电发光元件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005086687A JP4609759B2 (ja) 2005-03-24 2005-03-24 成膜装置

Publications (2)

Publication Number Publication Date
JP2006265650A JP2006265650A (ja) 2006-10-05
JP4609759B2 true JP4609759B2 (ja) 2011-01-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005086687A Expired - Fee Related JP4609759B2 (ja) 2005-03-24 2005-03-24 成膜装置

Country Status (5)

Country Link
JP (1) JP4609759B2 (enExample)
KR (1) KR100925362B1 (enExample)
CN (2) CN101090995A (enExample)
TW (1) TW200637930A (enExample)
WO (1) WO2006100867A1 (enExample)

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CN101970707A (zh) * 2007-12-27 2011-02-09 佳能安内华股份有限公司 处理装置及电子发射元件和有机el显示器的生产方法
KR101107181B1 (ko) * 2010-01-04 2012-01-25 삼성모바일디스플레이주식회사 마스크 흡착용 자석 조립체
KR101084185B1 (ko) 2010-01-12 2011-11-17 삼성모바일디스플레이주식회사 패턴 형성 방법 및 유기 발광 소자의 제조방법
TWI475736B (zh) * 2011-07-26 2015-03-01 Innolux Corp 電激發光顯示裝置的製作方法以及鍍膜機台
KR101203171B1 (ko) 2012-05-22 2012-11-21 주식회사 아이.엠.텍 글래스 기판 합착을 위한 얼라인 장치
KR101951029B1 (ko) * 2012-06-13 2019-04-26 삼성디스플레이 주식회사 증착용 마스크 및 이를 이용한 유기 발광 표시장치의 제조방법
KR102000718B1 (ko) * 2012-11-15 2019-07-19 삼성디스플레이 주식회사 박막 증착용 마스크 조립체 및 이의 제조 방법
KR102081282B1 (ko) * 2013-05-27 2020-02-26 삼성디스플레이 주식회사 증착용 기판이동부, 이를 포함하는 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치
KR102270080B1 (ko) * 2013-10-30 2021-06-29 삼성디스플레이 주식회사 박막 증착 장치
KR102273050B1 (ko) 2014-09-17 2021-07-06 삼성디스플레이 주식회사 증착용 마스크 어셈블를 포함하는 증착 장치 및 증착 방법
KR102250047B1 (ko) 2014-10-31 2021-05-11 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR102280269B1 (ko) 2014-11-05 2021-07-22 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조 방법
JP6163586B2 (ja) * 2015-04-17 2017-07-12 大日本印刷株式会社 蒸着パターンの形成方法、押さえ板一体型の押し込み部材、蒸着装置及び有機半導体素子の製造方法
KR102404576B1 (ko) 2015-04-24 2022-06-03 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 표시 장치의 제조 방법
JP6298138B2 (ja) * 2015-11-25 2018-03-20 キヤノントッキ株式会社 成膜システム、磁性体部及び膜の製造方法
CN105428552B (zh) * 2015-12-31 2017-06-09 昆山国显光电有限公司 Oled器件发光层形成方法
CN105568224B (zh) * 2016-01-28 2018-09-21 京东方科技集团股份有限公司 蒸镀用遮挡装置以及蒸镀设备
KR102505877B1 (ko) 2016-01-29 2023-03-06 삼성디스플레이 주식회사 마스크 프레임 조립체 및 이를 이용한 디스플레이 장치의 제조방법
JP6662102B2 (ja) * 2016-02-29 2020-03-11 富士ゼロックス株式会社 光学装置の製造方法、基板装置、光学装置及び光学装置の製造装置
KR102152890B1 (ko) * 2016-05-18 2020-10-26 어플라이드 머티어리얼스, 인코포레이티드 증착 소스의 운송을 위한 장치 및 방법
CN106048536A (zh) * 2016-06-06 2016-10-26 京东方科技集团股份有限公司 一种蒸镀装置及待蒸镀基板加工方法
JP6309048B2 (ja) * 2016-07-01 2018-04-11 キヤノントッキ株式会社 マスク吸着装置
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CN106399936B (zh) * 2016-12-09 2018-12-21 京东方科技集团股份有限公司 一种蒸镀设备及蒸镀方法
CN106978585A (zh) * 2017-04-25 2017-07-25 昆山国显光电有限公司 固定装置以及蒸镀装置
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KR101952521B1 (ko) * 2017-10-31 2019-02-26 캐논 톡키 가부시키가이샤 성막장치, 성막방법, 및 전자 디바이스 제조방법
KR101993532B1 (ko) * 2017-11-29 2019-06-26 캐논 톡키 가부시키가이샤 성막장치, 성막방법, 및 전자 디바이스 제조방법
KR101953038B1 (ko) * 2017-12-13 2019-02-27 캐논 톡키 가부시키가이샤 정전척 장치, 마스크 부착장치, 성막장치, 성막방법, 및 전자 디바이스의 제조 방법
JP7188973B2 (ja) * 2018-10-15 2022-12-13 キヤノントッキ株式会社 成膜装置、製造システム、有機ｅｌパネルの製造システム、成膜方法、及び有機ｅｌ素子の製造方法
JP7118864B2 (ja) * 2018-11-07 2022-08-16 キヤノントッキ株式会社 成膜装置、製造システム、有機ｅｌパネルの製造システム
JP7224165B2 (ja) * 2018-12-14 2023-02-17 キヤノントッキ株式会社 アライメント装置、蒸着装置、および、電子デバイスの製造装置
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JP7420496B2 (ja) * 2019-07-05 2024-01-23 キヤノントッキ株式会社 マスク保持機構、蒸着装置、および電子デバイスの製造装置
KR102876182B1 (ko) * 2019-12-24 2025-10-23 캐논 톡키 가부시키가이샤 성막장치 및 이를 사용하여 전자 디바이스를 제조하는 방법
KR102815011B1 (ko) * 2019-12-26 2025-05-30 엘지전자 주식회사 발광 소자를 이용한 디스플레이의 제조 장치 및 그 제조 방법
JP7606319B2 (ja) * 2020-10-19 2024-12-25 株式会社ジャパンディスプレイ 蒸着マスクの製造方法
KR102464025B1 (ko) * 2021-02-03 2022-11-07 파인원 주식회사 마그넷 플레이트 조립체
KR102757484B1 (ko) * 2021-11-30 2025-01-21 주식회사 코닉에스티 증착 장치 및 외부전극 형성방법
KR102794853B1 (ko) * 2021-12-30 2025-04-16 주식회사 선익시스템 인라인 증착 시스템 및 인라인 증착 시스템의 기판 얼라인 방법
KR102732022B1 (ko) * 2021-12-30 2024-11-19 주식회사 선익시스템 인라인 증착 시스템
CN116083856A (zh) * 2023-01-07 2023-05-09 唐山斯腾光电科技有限公司 一种红外窗片加工用蒸发镀膜装置

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JP2002075638A (ja) * 2000-08-29 2002-03-15 Nec Corp マスク蒸着方法及び蒸着装置
KR100422487B1 (ko) * 2001-12-10 2004-03-11 에이엔 에스 주식회사 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
JP2005187874A (ja) * 2003-12-25 2005-07-14 Seiko Epson Corp 蒸着装置、蒸着方法、有機ｅｌ装置、および電子機器

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KR20070090018A (ko) 2007-09-04
CN103820755A (zh) 2014-05-28
WO2006100867A1 (ja) 2006-09-28
CN101090995A (zh) 2007-12-19
JP2006265650A (ja) 2006-10-05
TWI327175B (enExample) 2010-07-11
KR100925362B1 (ko) 2009-11-09

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