JP4609755B2 - マスク保持機構および成膜装置 - Google Patents
マスク保持機構および成膜装置 Download PDFInfo
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- JP4609755B2 JP4609755B2 JP2005047813A JP2005047813A JP4609755B2 JP 4609755 B2 JP4609755 B2 JP 4609755B2 JP 2005047813 A JP2005047813 A JP 2005047813A JP 2005047813 A JP2005047813 A JP 2005047813A JP 4609755 B2 JP4609755 B2 JP 4609755B2
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- Japan
- Prior art keywords
- mask
- chuck
- substrate
- glass substrate
- magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000007246 mechanism Effects 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 93
- 230000002093 peripheral effect Effects 0.000 claims description 32
- 238000001704 evaporation Methods 0.000 claims description 11
- 230000008020 evaporation Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 239000000696 magnetic material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 58
- 238000007740 vapor deposition Methods 0.000 description 11
- 238000001771 vacuum deposition Methods 0.000 description 9
- 239000011368 organic material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Description
またマスク保持機構を備えた成膜装置を提供することを目的とする。
また前記磁石は、格子を形成する格子点に配設されたことを特徴としている。
また前記チャックの中央部に配設された磁石の大きさは、前記チャックの周縁部に比べて小さいことを特徴としている。
またチャックの中央部に配設される磁石の磁力と、チャックの周縁部に配設される磁石の磁力とを変えることによって、マスクの中央部に作用する磁力を周縁部に比べて弱くすることができる。
Claims (4)
- 成膜装置のチャックに装着保持されている基板に被せられるマスクのマスク保持機構であって、
前記マスクは、磁性体で形成されてなり、
前記チャックの前記基板を保持するチャック面と反対側に、磁石を点状に配設し、
前記チャックの中央部に配設された前記磁石の磁力は、前記チャックの周縁部に比べて弱くしてなる、
ことを特徴とするマスク保持機構。 - 成膜装置のチャックに装着保持されている基板に被せられるマスクのマスク保持機構であって、
前記マスクは、磁性体で形成されてなり、
前記チャックの前記基板を保持するチャック面と反対側に、磁石を点状に配設し、
前記チャックの中央部に配設された磁石の大きさは、前記チャックの周縁部に比べて小さくしてなる、
ことを特徴とするマスク保持機構。 - 成膜材料の蒸発源と、
前記蒸発源に対向して配設され、基板を装着保持するチャックと、
前記チャックの前記基板を保持するチャック面と反対側に、格子状の格子点に配設された磁石と、
前記基板に被せられるマスクと、
を備え、
前記チャックの中央部に配設された前記磁石の磁力は、前記チャックの周縁部に比べて弱くしてなる、
ことを特徴とする成膜装置。 - 成膜材料の蒸発源と、
前記蒸発源に対向して配設され、基板を装着保持するチャックと、
前記チャックの前記基板を保持するチャック面と反対側に、格子状の格子点に配設された磁石と、
前記基板に被せられるマスクと、
を備え、
前記チャックの中央部に配設された磁石の大きさは、前記チャックの周縁部に比べて小さくしてなる、
ことを特徴とする成膜装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005047813A JP4609755B2 (ja) | 2005-02-23 | 2005-02-23 | マスク保持機構および成膜装置 |
CN2006800015782A CN101090994B (zh) | 2005-02-23 | 2006-02-22 | 掩模保持机构以及成膜装置 |
KR1020077016155A KR100884029B1 (ko) | 2005-02-23 | 2006-02-22 | 마스크 유지 기구 및 성막 장치 |
PCT/JP2006/303189 WO2006090747A1 (ja) | 2005-02-23 | 2006-02-22 | マスク保持機構および成膜装置 |
TW095105913A TW200639592A (en) | 2005-02-23 | 2006-02-22 | Mask holding mechanism, and film deposition apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005047813A JP4609755B2 (ja) | 2005-02-23 | 2005-02-23 | マスク保持機構および成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006233257A JP2006233257A (ja) | 2006-09-07 |
JP4609755B2 true JP4609755B2 (ja) | 2011-01-12 |
Family
ID=36927385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005047813A Expired - Fee Related JP4609755B2 (ja) | 2005-02-23 | 2005-02-23 | マスク保持機構および成膜装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4609755B2 (ja) |
KR (1) | KR100884029B1 (ja) |
CN (1) | CN101090994B (ja) |
TW (1) | TW200639592A (ja) |
WO (1) | WO2006090747A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5297046B2 (ja) * | 2008-01-16 | 2013-09-25 | キヤノントッキ株式会社 | 成膜装置 |
CN101790597A (zh) * | 2008-03-28 | 2010-07-28 | 佳能安内华股份有限公司 | 真空处理设备、使用该真空处理设备制造图像显示设备的方法以及由该真空处理设备制造的电子装置 |
WO2009125802A1 (ja) * | 2008-04-09 | 2009-10-15 | 株式会社 アルバック | 蒸発源及び成膜装置 |
KR101049804B1 (ko) * | 2009-02-19 | 2011-07-15 | 삼성모바일디스플레이주식회사 | 증착 장치용 마스크 밀착 수단 및 이를 이용한 증착 장치 |
JP2011195907A (ja) * | 2010-03-19 | 2011-10-06 | Tokyo Electron Ltd | マスク保持装置及び薄膜形成装置 |
JP2011233510A (ja) * | 2010-04-05 | 2011-11-17 | Canon Inc | 蒸着装置 |
JP4857407B1 (ja) * | 2011-02-28 | 2012-01-18 | 信越エンジニアリング株式会社 | 薄板状ワークの粘着保持方法及び薄板状ワークの粘着保持装置並びに製造システム |
KR101347546B1 (ko) * | 2011-03-14 | 2014-01-03 | 엘아이지에이디피 주식회사 | 기판 척킹장치 및 이를 가지는 박막증착장비 |
KR102311586B1 (ko) * | 2014-12-26 | 2021-10-12 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 장치 내 기판 정렬 방법 |
KR102373326B1 (ko) * | 2014-12-26 | 2022-03-11 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 장치 내 기판 정렬 방법 |
JP6298110B2 (ja) * | 2016-07-08 | 2018-03-20 | キヤノントッキ株式会社 | マスク支持体、成膜装置及び成膜方法 |
CN106399936B (zh) * | 2016-12-09 | 2018-12-21 | 京东方科技集团股份有限公司 | 一种蒸镀设备及蒸镀方法 |
JP6448067B2 (ja) * | 2017-05-22 | 2019-01-09 | キヤノントッキ株式会社 | 基板載置方法、基板載置機構、成膜方法、成膜装置及び電子デバイスの製造方法 |
JP7202168B2 (ja) * | 2018-12-13 | 2023-01-11 | キヤノントッキ株式会社 | 成膜装置、有機elパネルの製造システム、及び成膜方法 |
KR102257008B1 (ko) * | 2019-01-11 | 2021-05-26 | 캐논 톡키 가부시키가이샤 | 성막 장치, 성막 방법 및 전자 디바이스 제조방법 |
KR20210091557A (ko) * | 2020-01-14 | 2021-07-22 | 한국알박(주) | 트레이용 마그넷 클램프 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0688206A (ja) * | 1992-09-08 | 1994-03-29 | Dainippon Printing Co Ltd | スパッタ用治具 |
JP2004183044A (ja) * | 2002-12-03 | 2004-07-02 | Seiko Epson Corp | マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3539125B2 (ja) * | 1996-04-18 | 2004-07-07 | 東レ株式会社 | 有機電界発光素子の製造方法 |
JP3891805B2 (ja) * | 2001-08-29 | 2007-03-14 | 株式会社Hitzハイテクノロジー | 真空蒸着装置 |
KR100422487B1 (ko) * | 2001-12-10 | 2004-03-11 | 에이엔 에스 주식회사 | 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법 |
-
2005
- 2005-02-23 JP JP2005047813A patent/JP4609755B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-22 KR KR1020077016155A patent/KR100884029B1/ko not_active IP Right Cessation
- 2006-02-22 CN CN2006800015782A patent/CN101090994B/zh not_active Expired - Fee Related
- 2006-02-22 WO PCT/JP2006/303189 patent/WO2006090747A1/ja active Application Filing
- 2006-02-22 TW TW095105913A patent/TW200639592A/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0688206A (ja) * | 1992-09-08 | 1994-03-29 | Dainippon Printing Co Ltd | スパッタ用治具 |
JP2004183044A (ja) * | 2002-12-03 | 2004-07-02 | Seiko Epson Corp | マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器 |
Also Published As
Publication number | Publication date |
---|---|
KR20070089856A (ko) | 2007-09-03 |
TWI323291B (ja) | 2010-04-11 |
CN101090994B (zh) | 2010-05-19 |
JP2006233257A (ja) | 2006-09-07 |
TW200639592A (en) | 2006-11-16 |
CN101090994A (zh) | 2007-12-19 |
KR100884029B1 (ko) | 2009-02-17 |
WO2006090747A1 (ja) | 2006-08-31 |
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