JP6298110B2 - マスク支持体、成膜装置及び成膜方法 - Google Patents
マスク支持体、成膜装置及び成膜方法 Download PDFInfo
- Publication number
- JP6298110B2 JP6298110B2 JP2016136252A JP2016136252A JP6298110B2 JP 6298110 B2 JP6298110 B2 JP 6298110B2 JP 2016136252 A JP2016136252 A JP 2016136252A JP 2016136252 A JP2016136252 A JP 2016136252A JP 6298110 B2 JP6298110 B2 JP 6298110B2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- support
- film
- film forming
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 20
- 238000000151 deposition Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims 1
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
2 マスク支持体
3 第一部材
4 第二部材
5 高さ調整具
6 成膜源(蒸発源)
7 基板
8 基板支持体
9 真空槽
Claims (6)
- 成膜用のマスクを支持するマスク支持体であって、第一部材と、前記第一部材上に設けられた、複数の部材から構成された第二部材と、前記第一部材及び前記第二部材の間に設けられた高さ調整具とを有し、前記高さ調整具により、前記第二部材を構成する複数の部材間での高さが調整されており、前記第二部材を構成する複数の部材の表面で前記マスクを支持することを特徴とするマスク支持体。
- 成膜用のマスクを支持するマスク支持体であって、複数の部材から構成された第一部材と、前記第一部材上に設けられた第二部材と、前記第一部材及び前記第二部材の間に設けられた高さ調整具とを有し、前記高さ調整具により、前記第二部材の高さが調整されており、前記第二部材の表面で前記マスクを支持することを特徴とするマスク支持体。
- 成膜用のマスクを支持するマスク支持体であって、複数の部材から構成された第一部材と、前記第一部材上に設けられた、複数の部材から構成された第二部材と、前記第一部材及び前記第二部材の間に設けられた高さ調整具とを有し、前記高さ調整具により、前記第二部材を構成する複数の部材間での高さが調整されており、前記第二部材を構成する複数の部材の表面で前記マスクを支持することを特徴とするマスク支持体。
- 成膜材料が収容される成膜源と、基板を支持する基板支持体と、マスクを支持するマスク支持体とを有し、前記基板上に、成膜源から放出された成膜材料をマスクを介して堆積することで成膜する成膜装置であって、前記マスク支持体として請求項1〜3のいずれか1項に記載のマスク支持体を採用したことを特徴とする成膜装置。
- 前記マスク支持体は真空槽内に設けられていることを特徴とする請求項4に記載の成膜装置。
- 基板上に、成膜源から放出された成膜材料をマスクを介して堆積することで成膜する成膜方法であって、
基板を基板支持体に支持する第1の支持工程と、
マスクをマスク支持体に支持する第2の支持工程とを有し、
前記第2の支持工程は、請求項1〜3のいずれか1項に記載のマスク支持体を用いて行い、
この第2の支持工程には、前記高さ調整具により前記マスクを支持する前記第二部材の表面の高さを調整する高さ調整工程を含むことを特徴とする成膜方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016136252A JP6298110B2 (ja) | 2016-07-08 | 2016-07-08 | マスク支持体、成膜装置及び成膜方法 |
KR1020170081440A KR102006066B1 (ko) | 2016-07-08 | 2017-06-27 | 마스크 지지체, 성막 장치 및 성막 방법 |
CN201710549221.8A CN107587105B (zh) | 2016-07-08 | 2017-07-07 | 成膜装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016136252A JP6298110B2 (ja) | 2016-07-08 | 2016-07-08 | マスク支持体、成膜装置及び成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018003144A JP2018003144A (ja) | 2018-01-11 |
JP6298110B2 true JP6298110B2 (ja) | 2018-03-20 |
Family
ID=60948543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016136252A Active JP6298110B2 (ja) | 2016-07-08 | 2016-07-08 | マスク支持体、成膜装置及び成膜方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6298110B2 (ja) |
KR (1) | KR102006066B1 (ja) |
CN (1) | CN107587105B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102405438B1 (ko) * | 2018-06-25 | 2022-06-03 | 캐논 톡키 가부시키가이샤 | 마스크 위치조정장치, 성막장치, 마스크 위치조정방법, 성막방법, 및 전자디바이스의 제조방법 |
CN111690896B (zh) * | 2020-06-24 | 2022-12-13 | 京东方科技集团股份有限公司 | 一种掩膜板支撑装置 |
JP7361671B2 (ja) * | 2020-09-30 | 2023-10-16 | キヤノントッキ株式会社 | 成膜装置、調整装置、調整方法、及び電子デバイスの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005281745A (ja) * | 2004-03-29 | 2005-10-13 | Seiko Epson Corp | 膜形成装置、蒸着装置 |
JP4609755B2 (ja) * | 2005-02-23 | 2011-01-12 | 三井造船株式会社 | マスク保持機構および成膜装置 |
JP4662808B2 (ja) * | 2005-05-17 | 2011-03-30 | 大日本印刷株式会社 | メタルマスク用フレーム及びその製造方法 |
KR20060118849A (ko) * | 2005-05-17 | 2006-11-24 | 엘지전자 주식회사 | 조립 가능한 마스크 프레임 |
JP4285456B2 (ja) * | 2005-07-20 | 2009-06-24 | セイコーエプソン株式会社 | マスク、マスクの製造方法、成膜方法及び電気光学装置の製造方法 |
KR101348174B1 (ko) * | 2005-12-08 | 2014-01-10 | 주성엔지니어링(주) | 기판과 마스크 정렬 장치 |
JP5783811B2 (ja) | 2010-07-06 | 2015-09-24 | キヤノン株式会社 | 成膜装置 |
JPWO2013150699A1 (ja) * | 2012-04-05 | 2015-12-17 | ソニー株式会社 | マスク調整ユニット、マスク装置及びマスクの製造装置及び製造方法 |
KR102100446B1 (ko) * | 2012-12-10 | 2020-04-14 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 조립체 및 이의 제조 방법 |
KR102106331B1 (ko) * | 2013-07-08 | 2020-05-06 | 삼성디스플레이 주식회사 | 마스크 조립체 및 이의 제조 방법 |
KR101570072B1 (ko) * | 2013-08-30 | 2015-11-19 | 주식회사 에스에프에이 | 박막 증착장치 |
CN105200370A (zh) * | 2015-10-27 | 2015-12-30 | 唐军 | 可循环使用的掩模板板框及具有它的掩模板 |
JP6876244B2 (ja) * | 2016-03-25 | 2021-05-26 | 日新電機株式会社 | マスクフレーム及び真空処理装置 |
-
2016
- 2016-07-08 JP JP2016136252A patent/JP6298110B2/ja active Active
-
2017
- 2017-06-27 KR KR1020170081440A patent/KR102006066B1/ko active IP Right Grant
- 2017-07-07 CN CN201710549221.8A patent/CN107587105B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR102006066B1 (ko) | 2019-07-31 |
JP2018003144A (ja) | 2018-01-11 |
CN107587105A (zh) | 2018-01-16 |
KR20180006301A (ko) | 2018-01-17 |
CN107587105B (zh) | 2022-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6298110B2 (ja) | マスク支持体、成膜装置及び成膜方法 | |
KR102311586B1 (ko) | 증착 장치 및 증착 장치 내 기판 정렬 방법 | |
KR102245762B1 (ko) | 홀더, 홀더를 갖는 캐리어, 및 기판을 고정시키기 위한 방법 | |
JP2009058956A (ja) | ペリクル付着装置及びそれを利用したペリクル付着方法 | |
JP6093091B2 (ja) | Xyステージ、アライメント装置、蒸着装置 | |
KR102373326B1 (ko) | 증착 장치 및 증착 장치 내 기판 정렬 방법 | |
KR20120007022A (ko) | 재료 증착 장치에서 기판을 홀딩하는 장치 | |
JP2013102137A (ja) | インプリント装置、それを用いた物品の製造方法 | |
JP6340693B2 (ja) | 基板の保持装置及び密着露光装置並びに近接露光装置 | |
KR102201107B1 (ko) | 증착 장치 및 이를 이용한 마스크 조립체의 정렬 방법 | |
KR20120122955A (ko) | 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 | |
WO2017163878A1 (ja) | マスクフレーム及び真空処理装置 | |
JP6262811B2 (ja) | 真空成膜装置 | |
JP2013209697A6 (ja) | 成膜装置および成膜方法 | |
JP2013209697A (ja) | 成膜装置および成膜方法 | |
KR102378672B1 (ko) | 고정밀 섀도 마스크 증착 시스템 및 그 방법 | |
JP2011214051A (ja) | 蒸着用メタルマスク及び蒸着装置 | |
JP5184808B2 (ja) | 露光方法及び露光装置 | |
TW201635419A (zh) | 基板處理裝置的水平調整裝置以及使用該裝置的水平調整方法 | |
KR100776634B1 (ko) | 기판 스테이지 | |
US9773638B2 (en) | Specimen preparation device | |
JP2009229258A (ja) | 基板搬送装置及び基板検査装置 | |
JP4447497B2 (ja) | 基板保持具 | |
JP2007283442A (ja) | プレーナー型アクチュエータ | |
JP2017005035A (ja) | インプリント装置および物品の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20171030 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171109 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180129 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180222 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6298110 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |