CN101083875B - 印刷电路布线板用穿孔装置及基准孔穿孔方法 - Google Patents
印刷电路布线板用穿孔装置及基准孔穿孔方法 Download PDFInfo
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- CN101083875B CN101083875B CN2007101058457A CN200710105845A CN101083875B CN 101083875 B CN101083875 B CN 101083875B CN 2007101058457 A CN2007101058457 A CN 2007101058457A CN 200710105845 A CN200710105845 A CN 200710105845A CN 101083875 B CN101083875 B CN 101083875B
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006150707A JP4210692B2 (ja) | 2006-05-30 | 2006-05-30 | 穿孔装置 |
JP2006150707 | 2006-05-30 | ||
JP2006-150707 | 2006-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101083875A CN101083875A (zh) | 2007-12-05 |
CN101083875B true CN101083875B (zh) | 2010-06-02 |
Family
ID=38853173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101058457A Expired - Fee Related CN101083875B (zh) | 2006-05-30 | 2007-05-30 | 印刷电路布线板用穿孔装置及基准孔穿孔方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4210692B2 (enrdf_load_html_response) |
CN (1) | CN101083875B (enrdf_load_html_response) |
TW (1) | TW200810634A (enrdf_load_html_response) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102343507A (zh) * | 2010-07-30 | 2012-02-08 | 信义汽车玻璃(深圳)有限公司 | 汽车玻璃附件安装定位方法 |
CN103228107B (zh) * | 2012-01-31 | 2016-03-23 | 王锦燕 | 位置校正装置及使用该位置校正装置的位置校正方法 |
JP5952052B2 (ja) * | 2012-03-29 | 2016-07-13 | セイコープレシジョン株式会社 | 穴開け装置 |
JP5952053B2 (ja) * | 2012-03-29 | 2016-07-13 | セイコープレシジョン株式会社 | 穴開け装置 |
CN103557793A (zh) * | 2013-11-14 | 2014-02-05 | 成都金大立科技有限公司 | 一种pcb孔位、孔径检测系统及检测方法 |
CN103752882B (zh) * | 2013-12-27 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | 线路板的钻孔方法 |
TW201605315A (zh) * | 2014-02-21 | 2016-02-01 | 維亞機械股份有限公司 | 背鑽加工方法以及背鑽加工裝置 |
KR101846385B1 (ko) * | 2016-07-12 | 2018-04-06 | 주식회사 에이치비테크놀러지 | 양단지지보 구조의 초고속 리뷰 검사장치 |
CN107803878B (zh) * | 2017-11-28 | 2023-12-15 | 江苏华神电子有限公司 | 用以加工菲林定位孔的ccd钻靶机 |
JP7575360B2 (ja) | 2021-08-20 | 2024-10-29 | ビアメカニクス株式会社 | 多層プリント配線基板の加工方法 |
TWI772188B (zh) * | 2021-09-24 | 2022-07-21 | 健鼎科技股份有限公司 | 多層電路板的穿孔成形方法、多層電路板製造方法、多層電路板及多層電路板製造系統 |
CN116100791A (zh) * | 2023-02-23 | 2023-05-12 | 飞尔德航空器材制造(上海)有限公司 | 螺栓安装结构航空透明件的热压装置 |
CN116690714A (zh) * | 2023-06-25 | 2023-09-05 | 盐城市金铢电子有限公司 | 一种印制电路板的冲孔装置及冲孔方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1151676A (zh) * | 1995-09-22 | 1997-06-11 | 精工精密株式会社 | 印刷电路板的穿孔设备及方法 |
JP3011101B2 (ja) * | 1996-07-18 | 2000-02-21 | 皆見電子工業株式会社 | 基板の前処理システム |
JP3248092B2 (ja) * | 1996-03-29 | 2002-01-21 | セイコープレシジョン株式会社 | プリント基板の方向性判別方法及び穴明け方法及びその装置 |
JP3569548B2 (ja) * | 1994-05-25 | 2004-09-22 | セイコープレシジョン株式会社 | 板状ワークの多軸穴明け装置 |
-
2006
- 2006-05-30 JP JP2006150707A patent/JP4210692B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-12 TW TW96108432A patent/TW200810634A/zh not_active IP Right Cessation
- 2007-05-30 CN CN2007101058457A patent/CN101083875B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3569548B2 (ja) * | 1994-05-25 | 2004-09-22 | セイコープレシジョン株式会社 | 板状ワークの多軸穴明け装置 |
CN1151676A (zh) * | 1995-09-22 | 1997-06-11 | 精工精密株式会社 | 印刷电路板的穿孔设备及方法 |
JP3248092B2 (ja) * | 1996-03-29 | 2002-01-21 | セイコープレシジョン株式会社 | プリント基板の方向性判別方法及び穴明け方法及びその装置 |
JP3011101B2 (ja) * | 1996-07-18 | 2000-02-21 | 皆見電子工業株式会社 | 基板の前処理システム |
Non-Patent Citations (3)
Title |
---|
JP特许3011101B2 2000.02.21 |
JP特许3248092B2 2002.01.21 |
JP特许3569548B2 2004.09.22 |
Also Published As
Publication number | Publication date |
---|---|
JP4210692B2 (ja) | 2009-01-21 |
TW200810634A (en) | 2008-02-16 |
JP2007319956A (ja) | 2007-12-13 |
TWI323145B (enrdf_load_html_response) | 2010-04-01 |
CN101083875A (zh) | 2007-12-05 |
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Effective date of registration: 20180126 Address after: Tokyo, Japan Patentee after: Seiko Timing System Co.,Ltd. Address before: Chiba County, Japan Patentee before: SEIKO Precision Inc. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Seiko Chuangshi Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Timing System Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20100602 |