CN101083875B - 印刷电路布线板用穿孔装置及基准孔穿孔方法 - Google Patents

印刷电路布线板用穿孔装置及基准孔穿孔方法 Download PDF

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Publication number
CN101083875B
CN101083875B CN2007101058457A CN200710105845A CN101083875B CN 101083875 B CN101083875 B CN 101083875B CN 2007101058457 A CN2007101058457 A CN 2007101058457A CN 200710105845 A CN200710105845 A CN 200710105845A CN 101083875 B CN101083875 B CN 101083875B
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China
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mentioned
datum hole
back side
positive back
location
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Expired - Fee Related
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CN2007101058457A
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English (en)
Chinese (zh)
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CN101083875A (zh
Inventor
齐藤努
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Seiko Chuangshi Co ltd
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Seiko Precision Inc
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  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
CN2007101058457A 2006-05-30 2007-05-30 印刷电路布线板用穿孔装置及基准孔穿孔方法 Expired - Fee Related CN101083875B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006150707A JP4210692B2 (ja) 2006-05-30 2006-05-30 穿孔装置
JP2006150707 2006-05-30
JP2006-150707 2006-05-30

Publications (2)

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CN101083875A CN101083875A (zh) 2007-12-05
CN101083875B true CN101083875B (zh) 2010-06-02

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CN2007101058457A Expired - Fee Related CN101083875B (zh) 2006-05-30 2007-05-30 印刷电路布线板用穿孔装置及基准孔穿孔方法

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JP (1) JP4210692B2 (enrdf_load_html_response)
CN (1) CN101083875B (enrdf_load_html_response)
TW (1) TW200810634A (enrdf_load_html_response)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343507A (zh) * 2010-07-30 2012-02-08 信义汽车玻璃(深圳)有限公司 汽车玻璃附件安装定位方法
CN103228107B (zh) * 2012-01-31 2016-03-23 王锦燕 位置校正装置及使用该位置校正装置的位置校正方法
JP5952052B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
JP5952053B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
CN103557793A (zh) * 2013-11-14 2014-02-05 成都金大立科技有限公司 一种pcb孔位、孔径检测系统及检测方法
CN103752882B (zh) * 2013-12-27 2016-09-21 广州兴森快捷电路科技有限公司 线路板的钻孔方法
TW201605315A (zh) * 2014-02-21 2016-02-01 維亞機械股份有限公司 背鑽加工方法以及背鑽加工裝置
KR101846385B1 (ko) * 2016-07-12 2018-04-06 주식회사 에이치비테크놀러지 양단지지보 구조의 초고속 리뷰 검사장치
CN107803878B (zh) * 2017-11-28 2023-12-15 江苏华神电子有限公司 用以加工菲林定位孔的ccd钻靶机
JP7575360B2 (ja) 2021-08-20 2024-10-29 ビアメカニクス株式会社 多層プリント配線基板の加工方法
TWI772188B (zh) * 2021-09-24 2022-07-21 健鼎科技股份有限公司 多層電路板的穿孔成形方法、多層電路板製造方法、多層電路板及多層電路板製造系統
CN116100791A (zh) * 2023-02-23 2023-05-12 飞尔德航空器材制造(上海)有限公司 螺栓安装结构航空透明件的热压装置
CN116690714A (zh) * 2023-06-25 2023-09-05 盐城市金铢电子有限公司 一种印制电路板的冲孔装置及冲孔方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1151676A (zh) * 1995-09-22 1997-06-11 精工精密株式会社 印刷电路板的穿孔设备及方法
JP3011101B2 (ja) * 1996-07-18 2000-02-21 皆見電子工業株式会社 基板の前処理システム
JP3248092B2 (ja) * 1996-03-29 2002-01-21 セイコープレシジョン株式会社 プリント基板の方向性判別方法及び穴明け方法及びその装置
JP3569548B2 (ja) * 1994-05-25 2004-09-22 セイコープレシジョン株式会社 板状ワークの多軸穴明け装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3569548B2 (ja) * 1994-05-25 2004-09-22 セイコープレシジョン株式会社 板状ワークの多軸穴明け装置
CN1151676A (zh) * 1995-09-22 1997-06-11 精工精密株式会社 印刷电路板的穿孔设备及方法
JP3248092B2 (ja) * 1996-03-29 2002-01-21 セイコープレシジョン株式会社 プリント基板の方向性判別方法及び穴明け方法及びその装置
JP3011101B2 (ja) * 1996-07-18 2000-02-21 皆見電子工業株式会社 基板の前処理システム

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特许3011101B2 2000.02.21
JP特许3248092B2 2002.01.21
JP特许3569548B2 2004.09.22

Also Published As

Publication number Publication date
JP4210692B2 (ja) 2009-01-21
TW200810634A (en) 2008-02-16
JP2007319956A (ja) 2007-12-13
TWI323145B (enrdf_load_html_response) 2010-04-01
CN101083875A (zh) 2007-12-05

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Effective date of registration: 20180126

Address after: Tokyo, Japan

Patentee after: Seiko Timing System Co.,Ltd.

Address before: Chiba County, Japan

Patentee before: SEIKO Precision Inc.

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CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: Seiko Chuangshi Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Seiko Timing System Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100602