CN101071810B - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN101071810B
CN101071810B CN2007101022794A CN200710102279A CN101071810B CN 101071810 B CN101071810 B CN 101071810B CN 2007101022794 A CN2007101022794 A CN 2007101022794A CN 200710102279 A CN200710102279 A CN 200710102279A CN 101071810 B CN101071810 B CN 101071810B
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Prior art keywords
semiconductor chip
electrode pads
wires
module substrate
bonding wires
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CN2007101022794A
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Chinese (zh)
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CN101071810A (zh
Inventor
黑田宏
桥诘胜彦
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Renesas Electronics Corp
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Renesas Electronics Corp
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
CN2007101022794A 2006-05-12 2007-05-09 半导体器件 Active CN101071810B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006133680A JP4942020B2 (ja) 2006-05-12 2006-05-12 半導体装置
JP133680/2006 2006-05-12

Publications (2)

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CN101071810A CN101071810A (zh) 2007-11-14
CN101071810B true CN101071810B (zh) 2010-12-22

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US20070262431A1 (en) 2007-11-15
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