CN101061761B - 基板的输送装置及输送方法 - Google Patents

基板的输送装置及输送方法 Download PDF

Info

Publication number
CN101061761B
CN101061761B CN2004800444420A CN200480044442A CN101061761B CN 101061761 B CN101061761 B CN 101061761B CN 2004800444420 A CN2004800444420 A CN 2004800444420A CN 200480044442 A CN200480044442 A CN 200480044442A CN 101061761 B CN101061761 B CN 101061761B
Authority
CN
China
Prior art keywords
substrate
angle
mentioned
roller
aforesaid substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2004800444420A
Other languages
English (en)
Other versions
CN101061761A (zh
Inventor
广濑治道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN101061761A publication Critical patent/CN101061761A/zh
Application granted granted Critical
Publication of CN101061761B publication Critical patent/CN101061761B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1527—Obliquely held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1554—Rotating or turning the PCB in a continuous manner

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明的处理基板的处理装置具备：输送机构(28)，将基板以立位状态输送；处理部(4)，对由该输送机构以立位状态输送的基板进行规定的处理；装载部(2)，将基板交接给该处理部；以及卸载部(3)，接受由上述处理部处理后的基板。上述装载部和上述卸载部的至少一个具备：交接体(6)，可旋转地设置，具有供给载置上述基板的支撑面(5)；以及马达(11)，旋转驱动该交接体，以规定的倾斜角度定位该交接体的支撑面。

Description

基板的输送装置及输送方法
技术领域
本发明涉及适合用于将基板用处理液处理后干燥处理的情况的基板的处理装置、输送装置及处理方法。 
背景技术
在液晶显示装置中使用的玻璃制基板上形成有电路图案。为了在基板上形成电路图案，采用光刻工艺。光刻工艺如总所周知，将抗蚀剂涂布在上述基板上，隔着形成有电路图案的掩模对该抗蚀剂照射光。 
接着，通过重复进行将抗蚀剂的没有被照射光的部分或照射了光的部分除去、将基板的除去了抗蚀剂的部分蚀刻、在蚀刻后除去抗蚀剂等一系列的工序，在上述基板上形成电路图案。 
在这样的光刻工艺中，有利用显影液对上述基板上的抗蚀剂进行显影后、利用蚀刻液对基板进行蚀刻处理、在蚀刻后用剥离液除去抗蚀剂等的利用药液处理基板的工序。 
在药液的处理后，有将基板用浓度比上述蚀刻液低的蚀刻液进行蚀刻清洗、接着利用纯水进行漂洗等、利用作为处理液的清洗液清洗的工序，在清洗后有将附着残留在基板上的清洗液干燥除去的干燥工序。 
以往，在对基板进行上述的一系列处理的情况下，上述基板通过使轴线水平配置的输送辊，在水平的状态下依次输送到各个处理室中，在那里通过处理液处理、或喷射压缩气体来进行干燥处理。 
最近，在液晶显示装置中使用的玻璃制基板有大型化及薄型化的趋势。因此，如果将基板水平输送，则输送辊间的基板的弯曲变大，所以产生各处理室中的处理不能遍及基板的整个版面均匀地进行的问题。 
如果基板大型化，则设有用于输送该基板的输送辊的输送轴长尺寸化。并且，通过基板大型化，供给到基板上的处理液增大，对应于基板上的处理液的量，施加在上述输送轴上的负荷变大，所以因为这些，输送轴的弯曲增大。因此，有时会在基板上与输送轴一起产生弯曲，不能进行均匀的处理。 
发明内容
本发明的目的是提供一种能够使在基板上产生的弯曲变少而输送基板的基板的处理装置、输送装置及处理方法。 
本发明提供一种基板的输送装置，将基板以规定的角度倾斜来输送，其特征在于，具备：支撑上述基板的下端、并且通过被旋转驱动而将上述基板在规定方向上输送的驱动辊；多个承接辊，沿着上述基板的输送方向可旋转地设置，支撑以规定的角度倾斜的上述基板的板面的上下方向的多个部位；上述多个承接辊中对上述基板的高度方向的中间部分进行支撑的承接辊被配置在比以上述规定的倾斜角度支撑上述基板的位置更靠倾斜方向后方退避的位置上，以便将上述基板向倾斜方向凸出地弯曲来进行支撑。 
本发明的基板的输送方法，用多个承接辊支撑基板来输送，其特征在于，在将基板倾斜规定的倾斜角度来输送时，该基板被上述承接辊支撑为以比上述规定的倾斜角度更大的角度向倾斜方向凸出地弯曲来输送。 
附图说明
图1是表示有关本发明的一实施方式的处理装置的概略结构的立体图。 
图2是表示上述处理装置的处理部的立体图。 
图3是表示蚀刻清洗部与纯水清洗部的立体图。 
图4是蚀刻清洗部与纯水清洗部的纵剖视图。 
图5是将基板的形成有图案的面清洗处理时的说明图。 
图6是使基板向倾斜方向凸出地弯曲来支撑的状态的侧视图。 
图7A是使装载部及卸载部的交接体的支撑面水平的状态的侧视图。 
图7B是使上述支撑面倾斜的状态的侧视图。 
具体实施方式
以下，参照附图说明本发明的一实施方式。 
图1表示有关本发明的一实施方式的处理装置。该处理装置具备基台1。在该基台1的上表面的长度方向一端部设有装载部2，在另一端部设有卸载部3，在这些装载部2与卸载部3之间设有处理部4。 
上述装载部2与卸载部3具备交接体6，该交接体6具有矩形状的支撑面5。在该交接体6的宽度方向中央部分设有支轴7。该支轴7可旋转地被支撑在立设于上述基台1的上表面上的支撑体8上。在支轴7的从上述支撑体8突出的端部嵌装有从动滑轮9。在该从动滑轮9和嵌装在马达11的旋转轴上的驱动滑轮12之间，设有同步带13。由上述从动滑轮9、马达11、驱动滑轮12及同步带13形成本发明的驱动机构。 
如果通过上述马达11驱动同步带13，则能够将上述交接体6的支撑面5改变为图1中用点划线表示的水平的状态及由实线表示的以规定的角度倾斜的倾斜状态。 
在上述支撑面5上矩阵状地设有多个承接辊15，该多个承接辊15的旋转轴线沿着相对于基台1的长度方向正交的方向可旋转。上述各承接辊15如图7A、图7B所示，可旋转地安装在立设于上述支 撑面5上的支撑片16上。 
在上述支撑面5的宽度方向一端部，沿着与宽度方向交叉的方向以规定间隔设有作为第1驱动辊的多个驱动辊17，该多个驱动辊17的轴线相对于支撑面5正交，并且如图7A、图8A所示，该多个驱动辊17可通过驱动马达18旋转驱动。在各驱动辊17的外周面上形成有承接槽19。 
另外，在图1中，虽然没有图示卸载部3的驱动机构，但是为与装载部2的驱动机构相同的结构，能够将交接体6的支撑面5设定为水平状态及规定的倾斜角度。 
对于上述装载部2，从处理装置的前工序以水平状态供给在液晶显示装置中使用的矩形状的基板W。即，基板W从前工序的装置通过未图示的机器人等输送机构以大致水平的状态输送到上述装载部2。在装载部2接受基板W时，上述交接体6被马达11控制旋转角度，以使支撑面5成为大致水平。 
如图7A中点划线所示，支撑基板W的机器人的一对的臂21在支撑面5上前进，下降到规定的位置后后退。由此，基板W的设在与设备面相反侧的面被设在支撑面5上的多个承接辊15支撑。 
如果基板W被供给到支撑面5上，则交接体6在马达11的作用下旋转，如图7B所示，从垂直的状态起立为以角度θ1向规定方向倾斜的倾斜角度。θ1优选为5～20度，因而，基板W的起立角度优选为70～85度。 
如果交接体6被向起立方向驱动，则基板W向起立方向下方滑动，下端被以一列设置在交接体6的宽度方向一端部上的驱动辊18的承接槽19所支撑。在此状态下，如果使驱动马达18动作而旋转驱动各驱动辊18，则能够将基板W以角度θ1的倾斜状态从装载部2向处理部4输送。 
上述处理部4被盖23覆盖。在该盖23的长度方向一端面和另一 端面上，分别开口形成有以与基板W的倾斜角度θ1对应的角度倾斜的缝隙状的送入口24及送出口(未图示)。因而，由上述装载部2的驱动辊17输送的基板W被从上述送入口24向处理部4送入。 
上述处理部4如图2所示，沿着基台1的长度方向一列地配置有第1台25、第2台26。各台25、26具有规定厚度的矩形状的基础部件27，在各基础部件27的板面上设有将上述基板W以角度θ1的倾斜角度输送的输送机构28。 
上述输送机构28具有作为第2驱动辊的多个驱动辊29，该多个驱动辊29沿着基台1的长度方向以规定间隔设在各台25、26的下端部。如图6所示，各驱动辊29在外周面上形成有承接槽29a，并且由设在上述基础部件27上的驱动马达30旋转驱动。 
在各驱动辊29的上方，分别沿着上下方向以规定间隔设有多个、在该实施方式中设有3个承接辊31a～31c。如图6所示，各承接辊31a～31c分别在承接部件32a～32c的前端部上表面上，使轴线垂直于该上端部上表面、并可旋转地支持，该承接部件32a～32c突设于上述基础部件27的板面上。 
从上述装载部2供给到输送机构28的基板W使下端卡合在驱动辊29的承接槽29a中，使与设备面相反侧的面即背面支撑在上述承接辊31a～31c上来进行输送。 
下端被驱动辊29支撑、背面被3个承接辊31a～31c支撑的基板W中，连结下部与上部的、图6中用点划线表示的线相对于垂线以规定的角度θ1向背面侧倾斜，并且高度方向的中途部向作为倾斜方向的背面侧凸出地弯曲。即，高度方向中途部的承接辊31b设在比以由点划线表示的倾斜角度θ1支撑基板W的位置更向倾斜方向后方退避规定尺寸的位置。 
通过不仅以倾斜角度θ1使基板W倾斜而支撑，还使高度方向中途部向倾斜方向凸出地弯曲来支撑，能够防止上述基板W向与倾斜 方向相反方向压曲。 
即，基板W通常较薄为0.7mm左右，并且在最近大型化为2m边长左右的大小。因此，如果输送时的基板W的倾斜角度θ1相对于垂直的状态很小、即倾斜角度θ1较小，则基板W的自重有可能超过压曲负荷，如上所述向与倾斜方向相反方向、即图6中箭头X所示的方向压曲。 
但是，通过将基板W如上述那样弯曲以使高度方向中途部向倾斜方向凸出，即使基板W大型化或薄型化，也能够防止向与倾斜方向相反方向压曲。 
如图2中点划线所示，在上述处理部4的第1台25上，沿着基板W的输送方向依次配置有一对刷清洗部34、蚀刻清洗部35及纯水清洗部36，在第2台26上配置有干燥处理部37。 
虽然没有详细图示，但上述刷清洗部34具有沿着由输送机构28以立位状态输送的基板W的高度方向被环状驱动的一对刷带，通过将上述基板W输送到一对刷带之间，将其设备面和背面进行刷清洗。 
由上述刷清洗部34刷清洗后的基板W被蚀刻清洗部35清洗后由纯水清洗部36漂洗处理。蚀刻清洗部35与纯水清洗部36如图3和图4所示，具有主体部41。该主体部41的一对带板部件42隔着设在周缘部上的衬垫43层叠。由此，在一对带板部件42之间形成上述基板W能够通过的间隙部44。间隙部44的尺寸优选为尽可能窄，在该实施方式中例如设定为上述基板W的厚度尺寸的几倍左右。 
在上述一对带状部件42上，沿上下方向以规定间隔形成有多个缝隙45，该多个缝隙45朝向输送的基板W的高度方向上方以规定的角度倾斜。该缝隙45使一端在上述间隙部44上开口，使另一端在上述带状部件42的外表面开口。缝隙45的长度尺寸被设定为比上述带状部件42的宽度尺寸稍小。 
在一对带状部件42的外表面上分别设有盖部件46。在该盖部件 46的内表面上利用凹部形成有腔室47。在上述带状部件42的外表面上开口的上述多个缝隙45连通到该腔室47。 
在上述盖部件46上，沿着上下方向以规定间隔形成有将处理液向上述腔室47内供给的多个给液口48。在图4中仅表示形成在下端部的1个给液口48。 
在各供给口48上连接着在图3中用点划线表示的处理液的供给管49。从供给管49供给的处理液流入到上述腔室47中，从该腔室47通过上述缝隙45朝向形成于上述带状部件42间的间隙部44喷射。基板W通过上述间隙部44。由此，将清洗液从基板W的设备面和背面的下方朝向上方喷射，所以该基板W的两侧面被清洗。 
作为处理液，对蚀刻处理部37供给蚀刻液，对纯水清洗部36供给纯水。基板W的两面在被蚀刻清洗部37蚀刻清洗后，由纯水清洗部36进行将蚀刻液从基板W的板面清洗除去的漂洗处理。 
在基板W的设备面上，如图5所示形成有电路图案P。在蚀刻清洗部37中，将蚀刻液如该图中用箭头表示那样从下方朝向上方对在间隙部44中输送的基板W的两侧面喷射。 
在基板W的设备面上，如果将蚀刻液朝向基板W的高度方向上方喷射，则图案P的下端缘d被蚀刻液可靠地蚀刻清洗。图案P的上端缘u被沿着基板W的版面向下方流动的蚀刻液蚀刻处理。因此，即使将基板W以立位状态输送，也能够将形成在该设备面上的图案P的下端缘d可靠地蚀刻处理。 
在纯水清洗部36中，与蚀刻清洗部35同样，将纯水相对于基板W的板面的高度方向从下方朝向上方喷射。因此，附着在图案P的上端缘u上的蚀刻液被沿着板面向下方流动的纯水漂洗处理，附着在下端缘d上的蚀刻液被从下方朝向上方喷射的纯水可靠地漂洗处理。 
如图3所示，上述蚀刻清洗部35与纯水清洗部36的主体部41，向基板W的输送方向后方以θ2的角度倾斜地配设。θ2优选为5～ 30度，也可以是其以上的角度。 
因此，从位于蚀刻清洗部35和纯水清洗部36的上部的缝隙45分别向基板W的板面喷射的蚀刻液及纯水，从间隙部44向倾斜方向后方即垂直方向流出落下。因而，防止了从位于主体部41的上方的缝隙45喷射的蚀刻液及清洗液与从位于下方的缝隙45喷射的蚀刻液及清洗液干涉，所以能够使蚀刻液及清洗液分别以规定的吐出力可靠地从各缝隙45朝向基板W的板面喷射。 
另外，在蚀刻清洗部35及纯水清洗部36中，使蚀刻液及纯水对基板W的两面从下方朝向上方喷射，但只要对至少基板W的设备面使蚀刻液及纯水从下方朝向上方喷射就可以，对于背面沿水平方向或从上方朝向下方喷射都可以。 
被上述纯水清洗部36漂洗处理后的基板W由设在第2台26上的干燥处理部37干燥处理。干燥处理部37虽然详细情况没有图示，但与纯水处理部36同样，具有基板W通过的间隙部，对于在该间隙部中输送的基板W的板面将清洁空气等的气体从缝隙朝向基板W的输送方向后方喷射。由此，能够将附着在基板W的板面上的清洗液干燥除去。 
被干燥处理部37干燥处理后的基板W被交接给上述卸载部3。即，卸载部3的交接体6使其支撑面5以对应于从处理部4送出的基板W的倾斜角度θ1对应的角度倾斜而待机。 
被干燥处理的基板W被从形成在覆盖处理部4的盖23上的未图示的送出口送出。被送出的基板W使下端卡合在设于上述交接体6上的驱动辊17上，所以通过旋转驱动驱动辊17，能够将基板W输送定位在与支撑面5对置的位置上。 
如果基板W被定位在与交接体6的支撑面5对置的位置上，则将驱动辊17停止而使驱动机构的马达11动作，使交接体6旋转以使支撑面5大致成为水平。即，将基板W的状态从以角度θ1倾斜的 立位状态变换为大致水平的状态。由此，能够通过未图示的机器人等，将支撑在交接体6上的基板W交接给下个工序。 
这样，如果使基板W的起立角度为70～85度、即相对于垂直的状态以5～20度的角度倾斜而支撑，则能够不向与倾斜方向相反方向倾倒而在稳定的状态下输送。并且，大幅降低了基板W在被水平输送那样的情况下因自重而弯曲的状况。 
在上述装载部2和卸载部3上设置被旋转驱动的交接体6，能够控制该交接体6的支撑面5的倾斜角度。因此，即使基板W在前工序中在水平的状态下被处理，也能够通过上述交接体6的支撑面5水平地承接基板W后，使其以规定的角度倾斜而交接给处理部4。 
同样，在上述卸载部3中，能够将在处理部4中以规定的倾斜角度处理后的基板W在由交接体6的支撑面5承接后，变换为水平状态而交接给下个工序。 
因而，通过具有上述结构的装载部2和卸载部3，即使在处理装置的前工序和后工序中以水平或倾斜的状态处理基板W，也能够与该处理状态无关地将基板W供给到处理部4、或从处理部4交接给下个工序。 
在蚀刻清洗部35与纯水清洗部36中，使蚀刻液及纯水从基板W的高度方向下方朝向上方喷射。因此，如图5所示，在蚀刻清洗部35中，能够从缝隙45向形成在基板W的设备面上的图案P的高度方向下端缘d可靠地喷射蚀刻液而进行蚀刻清洗，在纯水清洗部36中同样能够对图案P的下端缘d可靠地喷射纯水而进行漂洗处理。图案P的上端缘u被从基板W的上方朝向下方流动的蚀刻液及纯水处理。 
因此，即使将基板W在立位状态下输送，也能够没有不均匀地、可靠地用蚀刻液或纯水清洗处理形成在其设备面上的图案P。 
使以角度θ1倾斜而以立位状态被支撑输送的基板W如图6所示 那样向倾斜方向凸出地弯曲。因此，即使基板W的尺寸大型化，也能够防止因自重而使基板W向与倾斜方向相反方向压曲。 
即，如图6中点划线所示，如果将基板W仅以θ1的倾斜角度支撑，则基板W有可能因自重而向由箭头X所示的与倾斜方向相反方向压曲。但是，如果使基板W向倾斜方向凸出地弯曲，则能够防止向与倾斜方向相反方向压曲。另外，基板W由于被承接辊31a～31c以规定的倾斜角度支撑，所以不会向倾斜方向压曲。 
本发明并不限于上述一实施方式，在不脱离本发明的主旨的范围内能够进行各种变形。例如，可以在装载部与卸载部两者上设置交接体来改变支撑面的角度，但如果处理部的前工序或后工序的任一个的基板的处理的角度是与处理部中的处理相同的角度，则只要仅在装载部和卸载部的任一个上设置可调节角度的交接体就可以。 
作为用来将交接体的支撑面设定为规定的角度的驱动机构，也可以不通过带方式，而通过使用连杆的连杆方式进行，该机构不受任何限定。 
在将基板在以规定的角度倾斜的立位状态下输送时，使基板向倾斜方向凸出地弯曲来输送，但这样的基板的输送并不是仅适用于上述一实施方式所示的处理装置，只要是输送容易压曲的基板的输送装置都能够适用。 
如上所述，本发明在将基板一边以立位状态输送一边通过处理机构处理的情况下，能够将上述基板的姿势变换为对应于处理机构的姿势，或将由处理机构处理后的基板变换为对应于下个工序中的处理的姿势。 
因此，即使通过处理机构以立位状态处理基板，也能够从前工序可靠地接受该基板、或可靠地交接给下个工序。 
本发明对以立位状态输送的基板的板面从下方朝向上方喷射处理液。 
因此，在基板的板面上形成有配线图案等的情况下，能够对该图案的下端可靠地喷射处理液来进行处理。 
本发明在使基板以规定的角度倾斜而输送的情况下，使其向倾斜方向凸出地弯曲来支撑。 
因此，即使基板大型化，也能够防止因自重而向与倾斜方向相反方向压曲。 

Claims (2)

1.一种基板的输送装置，将基板以规定的角度倾斜来输送，其特征在于，
具备：
支撑上述基板的下端、并且通过被旋转驱动而将上述基板在规定方向上输送的驱动辊；
多个承接辊，沿着上述基板的输送方向可旋转地设置，支撑以规定的角度倾斜的上述基板的板面的上下方向的多个部位；
上述多个承接辊中对上述基板的高度方向的中间部分进行支撑的承接辊被配置在比以上述规定的倾斜角度支撑上述基板的位置更靠倾斜方向后方退避的位置上，以便将上述基板向倾斜方向凸出地弯曲来进行支撑。
2.一种基板的输送方法，用多个承接辊支撑基板来输送其特征在于，
在将基板倾斜规定的倾斜角度来输送时，该基板被上述承接辊支撑为以比上述规定的倾斜角度更大的角度向倾斜方向凸出地弯曲来输送。
CN2004800444420A 2004-11-19 2004-11-19 基板的输送装置及输送方法 Expired - Fee Related CN101061761B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/017270 WO2006054354A1 (ja) 2004-11-19 2004-11-19 基板の処理装置、搬送装置及び処理方法

Publications (2)

Publication Number Publication Date
CN101061761A CN101061761A (zh) 2007-10-24
CN101061761B true CN101061761B (zh) 2012-10-10

Family

ID=36406902

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004800444420A Expired - Fee Related CN101061761B (zh) 2004-11-19 2004-11-19 基板的输送装置及输送方法

Country Status (3)

Country Link
KR (1) KR101149455B1 (zh)
CN (1) CN101061761B (zh)
WO (1) WO2006054354A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100919562B1 (ko) * 2007-12-20 2009-10-01 삼성전기주식회사 에칭장치
JP4892543B2 (ja) * 2008-12-22 2012-03-07 芝浦メカトロニクス株式会社 基板の処理装置
CN101806674B (zh) * 2009-02-13 2011-08-24 北京京东方光电科技有限公司 玻璃基板抽取装置
DE102012110916B4 (de) * 2012-11-13 2014-07-17 Hochschule Offenburg Verfahren und Vorrichtung zum Transport flacher Substrate
CN105448775B (zh) * 2014-09-29 2019-12-24 盛美半导体设备（上海）有限公司 双面气相刻蚀装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6021790A (en) * 1995-12-04 2000-02-08 Dainippon Screen Mfg. Co.,Ltd. Substrate treating apparatus and method for treating substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536658A (ja) * 1991-07-30 1993-02-12 Tokyo Electron Ltd 基板洗浄・乾燥装置
JPH05275404A (ja) * 1992-03-24 1993-10-22 Nippon Steel Corp 平面状基板の洗浄搬送装置及びその装置列
JPH0681174A (ja) * 1992-09-03 1994-03-22 Fujitsu Ltd 薄板基材のエッチング処理方法
JP3384666B2 (ja) * 1995-12-04 2003-03-10 大日本スクリーン製造株式会社 基板処理装置
JP3957419B2 (ja) * 1998-12-09 2007-08-15 大日本スクリーン製造株式会社 基板処理装置
JP2000277587A (ja) * 1999-03-29 2000-10-06 Kokusai Electric Co Ltd 基板搬送システム
JP2003104544A (ja) * 2001-09-28 2003-04-09 Speedfam Clean System Co Ltd 方形基板の湿式処理装置
JP2003218497A (ja) * 2002-01-28 2003-07-31 Tokyo Kakoki Kk 基板処理装置
JP4452033B2 (ja) * 2003-05-22 2010-04-21 芝浦メカトロニクス株式会社 基板の搬送装置及び搬送方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6021790A (en) * 1995-12-04 2000-02-08 Dainippon Screen Mfg. Co.,Ltd. Substrate treating apparatus and method for treating substrate

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2003-218497A 2003.07.31
JP特开平5-275404A 1993.10.22
JP特开平5-36658A 1993.02.12

Also Published As

Publication number Publication date
CN101061761A (zh) 2007-10-24
KR20070084294A (ko) 2007-08-24
WO2006054354A1 (ja) 2006-05-26
KR101149455B1 (ko) 2012-05-25

Similar Documents

Publication Publication Date Title
US6758938B1 (en) Delivery of dissolved ozone
KR102206730B1 (ko) 기판 처리 방법 및 기판 처리 장치
US5873947A (en) Ultra-low particle disk cleaner
TW315326B (zh)
KR100671251B1 (ko) 기판 처리 장치
CN100442448C (zh) 基片处理装置
KR20060120420A (ko) 기판 반송 장치
KR20210042380A (ko) 기판 처리 장치 및 기판 처리 방법
US6832616B2 (en) Substrate treating apparatus
JP2008029922A (ja) 基板の処理装置
TWI449098B (zh) 基板處理裝置
CN101061761B (zh) 基板的输送装置及输送方法
JP2008098227A (ja) 基板処理装置
KR20140046527A (ko) 기판처리장치 및 방법
CN112071784A (zh) 用于处理基板的装置及方法
WO2013187036A1 (ja) 薬液処理装置
JP2006131372A (ja) 基板処理装置及びローダ装置及びアンローダ装置
JP4476101B2 (ja) 基板処理装置及び平流し型基板搬送装置
KR101909475B1 (ko) 기판 처리 장치
KR20200045161A (ko) 가이드 핀 및 이를 구비하는 포토 마스크 지지 유닛과 포토 마스크 세정 장치
KR20080009833A (ko) 기판 세정 및 건조 방법
EP4297073A1 (en) Substrate treating apparatus
KR100921637B1 (ko) 버퍼유닛 및 기판처리방법
JP2006351805A (ja) 基板処理方法および基板処理装置
KR20020003850A (ko) 기판세정장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121010

Termination date: 20161119

CF01 Termination of patent right due to non-payment of annual fee