CN101044802A - 电子元件安装在载体、有利地是软载体上的方法以及由此获得的电子单元例如护照 - Google Patents

电子元件安装在载体、有利地是软载体上的方法以及由此获得的电子单元例如护照 Download PDF

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Publication number
CN101044802A
CN101044802A CNA200580036099XA CN200580036099A CN101044802A CN 101044802 A CN101044802 A CN 101044802A CN A200580036099X A CNA200580036099X A CN A200580036099XA CN 200580036099 A CN200580036099 A CN 200580036099A CN 101044802 A CN101044802 A CN 101044802A
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China
Prior art keywords
carrier
projection
insulating barrier
touches
contact
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Pending
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CNA200580036099XA
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English (en)
Inventor
G·埃努夫
X·博尔德
F·德迈迈
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Francois Charles Obertil Trust
Idemia France SAS
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Francois Charles Obertil Trust
Oberthur Card Systems SA France
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Application filed by Francois Charles Obertil Trust, Oberthur Card Systems SA France filed Critical Francois Charles Obertil Trust
Publication of CN101044802A publication Critical patent/CN101044802A/zh
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Abstract

为了将电子元件如一电子芯片安装在载体上：取一电子元件(40)，该电子元件具有联接触片，其中至少一预先确定的触片(41A)配设有一凸起(42)；取一载体(30)，该载体具有至少一触接端部(31)，所述触接端部有待于通过所述凸起与所述预先确定的触片进行电连接；将配设有所述凸起的该预先确定的触片与该触接端部面对面地置放，使该凸起和该触接端部接触，且在给定的温度和压力条件下将它们彼此固定。在使该凸起与该触接端部接触及固定之前，用一绝缘层(32)覆盖该触接端部的表面，该绝缘层由一材料制成，所述材料选择成：在所述温度和压力条件下，该材料被该凸起穿过。

Description

电子元件安装在载体、有利地是软载体上的方法以及由此获得的电子单元例如护照
技术领域
[01]  本发明涉及在电子芯片(puce)及其载体之间实施电连接，所述载体例如一软载体，如具有集成芯片的护照的载体。
背景技术
[02]  有人已经提出制作这样的护照，其中，一识别芯片集成在一页片例如封面上，且连接于内置在该页片厚度中的一天线，该芯片可借助于该天线与外部建立无接触通信(因此没有外露的触片，这确保极大的私密性)。
[03]  因此根据公知技术，护照借助一直接丝网印刷在封面上的天线(例如借助一导电银墨)制成。然后，一芯片按照称为“倒装法”的技术(即翻转后安装，比正常安装、盲装(en aveugle)具有更大的精确度)加以安装，从而使其触片中的某些预先确定的触片(英文称为“pad”)与天线的适当触接端部进行电连接。
[04]  实际上，这些预先确定的触片预先配设有凸起(有时英文称为“bump”)，其相对于这些触片和相邻于它们的触片的基面形成凸出部，尤其是在一芯片安装在一芯片式(因而是刚性载体式)卡的情况下，所述凸起原则上确保天线的触接端部不管其尺寸如何，都不与这些触片进行接触，这些触片相邻于那些应当有效连接的触片。
[05]  但事实证明，在挠性制品例如护照封面中，由于载体是软的(实际上是纸)，而且由于芯片的触片(plot)可能非常靠近，因此芯片和天线触接端部之间的连接工序会受到干扰。当芯片压靠在天线的触接端部上(因而压靠在软载体上)时，该载体仅可局部(通过凹陷)发生变形，以致于所述触接端部的非凹陷的侧面部分可能与芯片的相邻触片产生意外连接，尽管在所述相邻触片上不存在凸起。由此会发生短路的危险，而对连接操作的控制则完全可以令人满意。
[06]  这种情况示于图1，其中，载体10被一用导电墨制成的触接端部11局部地覆盖，当一芯片20朝下施压时，所述载体10发生弯曲，所述芯片20配设有触片21，其中左面的触片21配设有一凸起22：该凸起使载体和导电墨局部凹陷，而触接端部11的不太凹陷的一侧面部分则与右面的触片21进行接触。实际上，导电墨触接端部这里示出为具有一基本恒定的厚度，但应当指出，根据用于置放触接端部的技术，尤其是在采用丝网印刷的情况下，事实上可能形成小的侧面墨隆起部分(未示出)，所述隆起部分的高度约为凸起的高度，且因此也会发生与相邻触片意外接触的危险。
[07]  实际上，相邻两触片之间的距离可仅约为60微米，而它们的侧边约为80微米，而天线触接端部的面积可达到平方毫米的数量级，且其宽度通常至少等于150微米(在丝网印刷的情况下，尤其是使用的导电墨具有直径为80微米的导电银片)。实际上可考虑到，每当出现触片的距离(中心至中心)降至250微米以下的情况，就有存在前述问题的危险。
[08]  可以考虑缩小触接端部的尺寸，但这意味着要非常严重地增大定位的限制条件，以致于影响任何的实际批量生产。这里，提请注意一种采用翻转选择方案(“倒装法”的情形)的芯片布置机器，例如DATACON公司制造的芯片布置机器(其成本约为300000欧元)，其具有一自动识别系统，该系统自动识别芯片上的触片和载体(在所述的实施例中是护照)上的对准标记。机器取回芯片(实际上是在一直径约为300 mm的盘件内部，该盘件由多个同类的芯片形成)，使之翻转，且根据检测到的位置将其布置在载体上。鉴于这种生产线在这种运行选择方案中生产速度比较缓慢(其每小时不超过1000件)，因此看来会严重影响到生产，进一步增大定位的限制条件。
[09]  应当指出，当希望使用软材料制成的触片或触接端部时，甚至当载体的构成材料不是特别软时，又或者当触接端部的成形技术甚至会在刚性载体上出现很多的侧面隆起部分时，可能会存在同类的问题。此外，所述触接端部可能连接于不同于天线的一个或多个其它电路，例如另一处理器、一显示屏等；同样，所述连接不仅可能涉及一芯片的触片，而且可能涉及例如前述的任何其它电子元件。
发明内容
[10]  本发明的目的旨在弥补前述缺陷，并涉及电子元件尤其是电子芯片安装在一载体上的安装方法，该方法允许最大限度地减小电子元件的触片与触接端部发生意外连接的危险，甚至当所述载体是软的时，或者当触接端部的成形技术可能导致出现侧面隆起部分时，也是如此，并且允许令人满意的批量生产进度，而不会增大通常的元件面对载体的定位限制条件，甚至会减少这些限制条件。本发明还涉及一电子单元(entité électronique)，其包括安装在一载体上的一电子元件例如电子芯片，该电子单元尤其是但并不限于识别证件例如护照，其中，电子元件的触片安全可靠地连接于在所述载体上形成的触接端部，而这种触接端部和另一触片之间也不会发生意外的连接，甚至当所述载体是软的时或者当所述触接端部具有侧面隆起部分时，及甚至当所述触接端部尺寸大时，也是如此。
[11]  为此，本发明提出电子元件安装在载体上的安装方法，其中：
[12]  —取一电子元件，该电子元件具有联接触片，其中至少一预先确定的触片配设有一凸起，
[13]  —取一载体，该载体具有至少一触接端部，所述触接端部有待于通过所述凸起与所述预先确定的触片进行电连接，
[14]  —将配设有所述凸起的该预先确定的触片与该触接端部面对面地置放，使该凸起和该触接端部接触，且在给定的温度和压力条件下将它们彼此固定，
[15]  其特征在于，在使该凸起与该触接端部接触及固定之前，用一绝缘层覆盖该触接端部的表面，该绝缘层由一材料制成，所述材料选择成：
在所述温度和压力条件下，该材料被该凸起穿过。
[16]  因此，触接端部和应当与该触接端部连接的触片之间的电连接，通过该触片所配设有的一凸起予以建立，并且当电子元件触靠上所述载体时，所述凸起穿过绝缘层；因此所述绝缘层在其它部位也遍布四处，且保持该触接端部和设计不与之连接的任何其它触片(因而所述触片未配设有凸起)之间的电绝缘。
[17]  本发明尤其适用于所述电子元件是一电子芯片的情形。
[18]  本发明的优越性体现于多种情形的载体中，尤其是刚性的载体内：在这种情况下，绝缘层的存在可允许减少对通过凸起使触片与触接端部接触和固定条件的限制；此后，所述凸起与所述触接端部的固定比起公知的解决方案，其更少可能造成该触接端部与另一触片之间的意外电连接，尤其当所述触接端部的成形可能导致出现侧面隆起部分时，往往会造成这种意外的电连接。但在载体使用能够在给定的温度和压力条件下进行挤压的材料制成的情形下，本发明也是相当有利的，因为正是这种类型的载体对于制作护照而言可能会出现上述的缺陷。
[19]  该软载体概念(也可以说是一这样的载体是可压缩的)可涵盖大范围的材料，其首先包括用纤维材料制成的载体的情形，这对应于大范围的低成本载体；其中尤其是基于纸张的材料，它们易于通过低成本得以实现。可能是软的材料的另一有利的例子(如果选择一足够小的厚度)，是塑料材料，例如聚氯乙烯。关于软载体，可以指出：在某些情况下，它们也可以具有被局部穿透的能力，如同绝缘层(因而所述触接端部)被凸起穿过那样，这可能获得与该触接端部的良好电接触。
[20]  易于理解的是，所述方法可应用于页片式载体，且有利的是适用于制作识别证件(不仅护照，可能还有出入证件、身份证等)。
[21]  只要在进行接触和固定时施加的温度和压力条件下，绝缘层能够被凸起穿过，则所述凸起原则上可具有任何形状，其中包括只要在一触片上留有一简单的增厚部(surépaisseur)的形状。但是，优选地，为便于凸起穿透绝缘层，有利的是，所述凸起具有一在触片对面缩窄的形状。
[22]  尤其是，本发明得益于本领域公知的凸起(英文有时称为“studbump”)，所述凸起通过可熔导线端部的熔融而获得，且具有一般的球珠体形状(或多或少不规则的)，所述球珠体配设有一楔形部分、甚至一尖端部分，直至现在，该球珠体一般被视为一缺陷。优选地，不计楔形部分的凸起的厚度为20微米至50微米。作为变型，凸起可具有角锥形部分或角柱形部分。易于理解的是，凸起的几何形状越尖，所述凸起穿过绝缘层越类似于穿透该绝缘层，该凸起可继续直至穿到触接端部的、甚至载体的构成材料内。
[23]  即使可以考虑使用其它材料例如铜合金来制成凸起，但一般来说，凸起采用金或金的合金制成。
[24]  优选地，载体具有至少两个触接端部。
[25]  触接端部可借助于导电墨采用丝网印刷法(甚至用印章压印法(tampographie)、即橡胶版轮转印刷术(flexographie))制成。作为变型，导电墨可通过照相凹版印刷、胶版印刷等方法布置；也可以例如通过电解增加金属或合金(例如铜合金)而获得；实际上，触接端部可与它们构成其端部的导电轨、例如一天线同时形成。应当指出，对于多数挠性载体来说，也可通过传统的照相制版术成形触接端部。
[26]  鉴于触接端部相对于未配设有凸起的触片具有良好的绝缘性，本发明因而可使这些触接端部具有一大的表面积，所述表面积因此可达到载体面对电子芯片的表面的66％至95％。因此在实施接触时，这会显著减小定位的限制条件。优选地，这些触接端部具有一大于平方毫米的单个表面积。
[27]  对绝缘层的表面积不再存在限制，这完全有利于最大限度地减少意外连接。因此，绝缘层可在电子元件应该安装的区域内覆盖载体所具有的触接端部。在实施接触工序时，绝缘层甚至可以至少在处于电子元件对面的载体表面的大部分上延伸。该绝缘层可以是连续的或不连续的(尤其是，有利地在该绝缘层相应地覆盖触接端部的部分之间具有一间隔)。
[28]  在特别有利的情况下，触接端部属于一在载体上形成的天线的一部分(这样允许无需接触电子元件即可与外部交换信息)，且绝缘层覆盖该天线的至少大部分，在这种情况下，该绝缘层在电子元件附近具有绝缘功能，而且对所述天线及其载体(尤其是如果其是纤维质的)还具有保护功能例如机械保护功能或者具有防潮功能。
[29]  绝缘层可以用各种材料制成。
[30]  实际上，无需通过具体说明加以限制，绝缘层被穿过的能力(这基本上取决于其构成材料)可以是一种在凸起的推动下通过一种蠕变进行侧向地疏散的能力，或者是一种根据凸起的几何形状被穿孔的能力。
[31]  因此较好的是，绝缘层用绝缘漆制成，这对应于一类公知的材料。优选地，该绝缘漆选择成其所具有的聚合能量小于1000mJ/cm2，有利地是约为500mJ/cm2，这样赋予一较小的收缩率，且事实上在干燥和/或冷却之后不会导致载体形成任何的波浪形皱褶。
[32]  但是，绝缘层也可以是一种非导电墨。
[33]  无论绝缘层是漆制成还是绝缘墨制成，该绝缘层尤其可用丝网印刷法加以布置。该绝缘层可被利用作为一横向导线(brin conducteur)的支承体，该横向导线在两个待串联的天线导电轨之间形成电桥(参见例如文献FR-2787609)。
[34]  但是，绝缘层也可以是一纤维材料，例如一薄的纸页(例如厚度为15微米)。
[35]  实际上，不管绝缘层的构成材料如何，其厚度有利地为5微米至25微米，优选地为10微米至15微米。
[36]  根据芯片式卡(carteàpuce)制作中已公知的有利特征，在接触工序之后，在配设有其触接端部和所述绝缘层的载体与电子芯片之间的空隙中填满一充填树脂，和/或使电子芯片埋置于一保护树脂中。
[37]  采用本发明的方法制成的电子单元在于，电子单元具有一电子元件如一电子芯片，该电子元件位于一载体上，该载体具有至少一触接端部，并且该电子元件具有触片，其中至少一预先确定的触片配设有一凸起，所述凸起将该触片与该触接端部进行电连接，其特征在于，该触接端部被一绝缘层覆盖，而该绝缘层被所述凸起穿过。
[38]  有利的是，采用本发明的方法制成的这种电子单元具有的特征在于，所述触接端部还延伸到一与所选触片相邻的触片的对面，该相邻的触片未配设有凸起，且至少通过所述绝缘层与所述触接端部隔开。
[39]  该电子单元的其它有利特征相应于上述的关于本发明的方法的有利特征。
附图说明
[40]  下面参照附图和作为非限制性实施例给出的说明，本发明的目的、特征和优越性将得到更好的理解，附图如下：
[41]  —图1是根据现有技术的芯片触片和埋置的触接端部之间的连接区域的剖面细部图；
[42]  —图2是本发明方法的第一道工序中一载体的一细部的剖面图；
[43]  —图3是根据本发明的要与图2所示载体相连接的一芯片的一细部的剖面图；
[44]  —图4类似于图1，是根据本发明的使图3所示的电子芯片在翻转后安装在图2所示载体上的安装结果的细部剖面图；
[45]  —图5是根据本发明一实施变型的电子单元的剖面示意图；
[46]  —图6是根据另一实施变型的另一电子单元的剖面示意图；
[47]  —图7是图6所示的电子单元置于载体上表面的平面中的仰视图；以及
[48]  —图8是一护照的透视示意图，其中，一页片具有一芯片，所述芯片安装在如图5所示的一载体上。
具体实施方式
[49]  图3示出一电子元件40，这里其为一电子芯片，根据本发明，其用于安装在图2所示的载体30上。
[50]  载体30带有一触接端部31(其连接于也由所述载体承载的一未示出的电路，例如一天线，参见下面)。根据本发明，在安装芯片之前，用一绝缘层32覆盖该触接端部的表面。
[51]  至于芯片40，它具有联接触片，其中有触片41A和41B，所述触片其中之一，这里即触片41A，用于连接于触接端部31；该触片配设有一凸起42。
[52]  芯片在载体上的安装在于：将配设有其凸起的触片41A(通过将所述芯片相对于其图3所示的构型翻转之后)置于所述载体的触接端部32对面，然后在预先确定的温度和压力条件下，使该凸起与该触接端部接触，且使它们固定，绝缘层的构成材料是这样的：在所述温度和压力条件下，所述凸起穿过绝缘层，且建立所述触片与所述触接端部的连接，然而同时不会使所述触接端部的其余表面裸露出来。因此，尽管载体在凸起42施压的部位略呈凹陷，但是，与图1所示的情况不同的是，绝缘层32阻止该触接端部31的左侧部分与触片41B接触。
[53]  在所述的实施例中，实际上，载体有利地采用能够在所述温度和压力条件下进行挤压的材料制成，也就是说，本发明可应用于软性的材料，例如纤维材料，有利地是其呈页片的形式。因此，载体尤其可以是纸张。例如，FIBER MARK公司销售的商品名为SECURALIN的纸张。作为变型，也可以是合成纤维纸等类型的纤维材料。
[54]  作为变型，该载体是塑料页片，例如聚氯乙烯塑料页片，其厚度有利地小于200微米。
[55]  如后文将要看到的，从纸张或塑料材料的选用来看，本发明尤其可应用于识别证件。
[56]  待连接触片配设有的凸起可以是任何形状的凸起，例如总体上呈平行六面体的凸起(例如通过电解生成(croissanceélectrolytique)而获得)，但有利地是，该凸起具有一在所述触片对面缩窄的形状，以便在实施接触/固定工序时，使该凸起易于穿过绝缘层。
[57]  因此，该形状可以是一呈球状或扁平状的球珠状。
[58]  但是优选地，该凸起具有一个楔形部分(例如一角柱形部分或角锥体部分)，甚至具有一尖端部分。正因为此，所述凸起有利地是“柱形凸起(英文称为“stud bump”)”类型的，也就是说，它通过熔融一可熔导线的端部而获得，该凸起由此具有一包括一尖端部分的球珠形状。这种凸起的获得如图3所示，该图示出一导线100，将从该导线分离出一形成凸起42的小质量部。该凸起可通过超声波焊接机获得，其具体操作如下：
开始时将导线置于一毛细管中；通过放电使导线尾端熔融，而形成一球珠体，并且然后将该球珠体挤压在触片上。毛细管的形状使得：当所述毛细管升高时能形成一小的尾端，并且导线在其与球珠体的接合处断裂。这种凸起的直径通常为25微米或32微米，视操作条件或导线而定。
[59]  图3所示的凸起不计楔形部分(即前述的尾端)，其厚度通常约为20微米至50微米，例如约为40微米。
[60]  应当指出，在图4上，不仅凸起穿过绝缘层，而且它还穿过形成触接端部的层，且进入到载体本身中，这确保了非常良好的电接触，并使该连接具有非常良好的机械性能。
[61]  凸起有利地采用金或金的合金制成，但显然可以使用其它的导电材料。
[62]  图5示出采用所述方法制成的一电子单元，但是其也有其它的实施变型。
[63]  该图5示出载体50，一芯片60安装在该载体上。如图所示，该载体具有两个触接端部51，所述触接端部51通过一导电轨(pisteconductrice)55向右和向左进行延伸。
[64]  这里，这些触接端部两者均由绝缘层52加以覆盖。但是，所述绝缘层这里是不连续的，其不连续指的是：它没有在这两个触接端部之间的载体表面上延伸；但是，该绝缘层这里在载体的面对芯片的至少大部分表面(被触接端部覆盖或未覆盖)上延伸；这里，它还在导电轨部分55上延伸，其中这些触接端部是在所述导电轨部分55的延伸部分。
[65]  在凸起62与触接端部51接触之前或之后(触片未示出)，有利地置放有一充填树脂63，以便填满配设有其触接端部和绝缘层的载体与电子芯片之间的空隙；该充填树脂63有时称为“填料(英文称为“underfill”)”。此外，还使芯片埋置在一保护树脂64中。在芯片式卡的领域中，这种充填和/或保护树脂的存在本身是公知的，这里不予详述。
[66]  图6和7示出图5所示的电子单元的一实施变型。图6和7中与图5所示单元的构件相类似的单元构件，用相同的标号但加一“撇”予以标示。
[67]  应当注意，触接端部51′的尺寸大于图5上的触接端部，以致于它覆盖面对着电子芯片的载体表面的66％至95％(显然，在触接端部之间仍保留有一空隙，以免它们彼此间发生任何的短路)。这些触接端部的表面积可超过平方毫米。
[68]  另外，绝缘层52′如同图5所示的绝缘层52那样，延伸在载体面对着芯片的差不多整个表面上，并且延伸在通达这些触接端部51的导电轨部分55上，这里，在绝缘层各自的覆盖触接端部的部分之间也留有空隙。相反地，充填树脂63′这里还在整个载体块中延伸在触接端部之间，以致于在载体中形成一锚固件(ancrage)63′A。显然，该锚固件的深度在图中以相当夸张的方式示出，且该锚固件尤其仅可与这样一载体形成在一起，其中该载体能够被该充填树脂渗透。
[69]  为了达到保护或任何其它的目的，绝缘层可延伸在希望尽可能大的表面上。
[70]  因此，在图8上，图5所示的载体52是一识别证件、这里是护照的封面例如纸质封面的形式，所述芯片(在保护树脂64的质量块中看不出来)通过触接端部连接于也由该载体承载的一电路，这里是一天线55。绝缘层不仅延伸在芯片和触接端部之间(除了它被凸起穿过的部位之外)，而且还延伸在整个天线上。
[71]  绝缘层可以有不同的特性。因此，绝缘层可由绝缘漆形成，这相当于一种容易布置的材料类型；已知能够采用很好控制的技术对该材料进行布置和干燥。该漆有利地选择成：其所具有的聚合能量小于1000mJ/cm2，优选地约为500mJ/cm2，这赋予该绝缘漆较小的收缩率，且因此在芯片安装和固定之后，最大限度地减少会影响页片的波浪形皱褶现象(phénomène d′ondulation)的出现。该漆例如是名称为ACHESON PF455的一种漆。
[72]  在未示出的变型中，绝缘层也可以借助于非导电墨制成。
[73]  该绝缘层可用丝网印刷法布置。作为变型，可用喷镀法实施。
[74]  但是，该绝缘层也可用纤维材料制成，例如用纸张制成(例如厚度为15微米的薄纸页)。
[75]  不管其成分如何，该绝缘层的厚度通常为5微米至25微米，优选地为10微米至15微米，这实现一种良好的兼容状态，以便于凸起穿过并另外保持良好的电绝缘。
[76]  在使用漆的情况下，安装芯片时应用的温度和压力条件可以是构成该漆的树脂的聚合条件，例如：加热头(tête chauffante)温度在180℃，压力为370克，时间为8秒。但是，较好的是，对形成载体的页片加以支承的工作台的温度降低到约45℃(达到60℃的温度原则上可补偿损耗，但是可能显得太高，而不能避免漆软化，而这会影响所述凸起的穿行)。
[77]  可看到根据本发明：
[78]  —仅连接应当连接的触片，
[79]  —对触接端部的尺寸没有强制性规定，
[80]  —芯片的定位限制条件非常适中，通常为+/-0.5 mm，
[81]  —甚至可盲装地布置芯片(机器不再需要懂得识别芯片上的触片)，
[82]  —不再需要精确定位所述的具有“倒装法”选择方案的机器(只须定位处于已翻转构型的芯片即可)，这样既可使用比能够执行这种翻转的高精度机器成本低的机器，又可提高生产效率，例如每小时约5000个芯片，
[83]  —同一材料(绝缘层的材料)既允许在芯片附近具有良好的绝缘性，又允许对电路——所述触接端部连接至该电路——具有良好的保护作用。

Claims (47)

1.将电子元件安装在载体上的安装方法，根据该方法：
-取一电子元件(40，60，60′)，该电子元件具有联接触片，其中至少一预先确定的触片(41A)配设有一凸起(42，62，62′)，
-取一载体(30，50，50′)，该载体具有至少一触接端部(31，51，51′)，所述触接端部有待于通过所述凸起与所述预先确定的触片进行电连接，
-将配设有所述凸起的该预先确定的触片与该触接端部面对面地置放，使该凸起和该触接端部接触，且在给定的温度和压力条件下将它们彼此固定，
其特征在于，在使该凸起与该触接端部接触及固定之前，用一绝缘层(32，52，52′)覆盖该触接端部的表面，该绝缘层由一材料制成，所述材料选择成：在所述温度和压力条件下，该材料被该凸起穿过。
2.根据权利要求1所述的方法，其特征在于，所述电子元件是一电子芯片。
3.根据权利要求1或2所述的方法，其特征在于，所述载体用一种能够在所述温度和压力条件下进行挤压的材料制成。
4.根据权利要求1至3中任一项所述的方法，其特征在于，所述载体用纤维材料制成。
5.根据权利要求4所述的方法，其特征在于，所述载体用一种基于纸的材料制成。
6.根据权利要求1至3中任一项所述的方法，其特征在于，所述载体用塑料材料制成。
7.根据权利要求1至6中任一项所述的方法，其特征在于，所述载体是一识别证件的构成部分。
8.根据权利要求1至7中任一项所述的方法，其特征在于，所述电子元件的预先确定触片的所述凸起具有一在所述触片对面缩窄的形状，以便在实施接触工序时方便穿过所述绝缘层。
9.根据权利要求8所述的方法，其特征在于，所述凸起通过熔融一可熔导线的端部而形成，该凸起由此具有一球珠体的形状，所述球珠体包括一楔形部分。
10.根据权利要求9所述的方法，其特征在于，不计所述楔形部分的所述凸起的厚度为20微米至50微米。
11.根据权利要求8至10中任一项所述的方法，其特征在于，使所述凸起穿过所述绝缘层和所述触接端部，直至进入到所述载体中。
12.根据权利要求1至11中任一项所述的方法，其特征在于，所述凸起用金或用金的合金制成。
13.根据权利要求1至12中任一项所述的方法，其特征在于，所述载体具有至少两个触接端部。
14.根据权利要求13所述的方法，其特征在于，这些触接端部覆盖位于所述电子元件对面的所述载体表面的66％至95％。
15.根据权利要求13或14所述的方法，其特征在于，连续的或非连续的所述绝缘层覆盖这些触接端部。
16.根据权利要求15所述的方法，其特征在于，在实施接触工序时，所述绝缘层至少在处于所述电子元件对面的所述载体表面的大部分上延伸。
17.根据权利要求13至16中任一项所述的方法，其特征在于，所述触接端部属于一在所述载体上形成的天线的一部分，且所述绝缘层覆盖该天线的至少大部分。
18.根据权利要求1至17中任一项所述的方法，其特征在于，所述绝缘层用绝缘漆实施而成。
19.根据权利要求18所述的方法，其特征在于，该绝缘漆选择成：它所具有的聚合能量小于1000mJ/cm2，这赋予一较小的收缩率。
20.根据权利要求19所述的方法，其特征在于，所述绝缘漆具有一约500mJ/cm2的聚合能量。
21.根据权利要求1至20中任一项所述的方法，其特征在于，通过丝网印刷法设置该绝缘层。
22.根据权利要求1至21中任一项所述的方法，其特征在于，所述绝缘层的厚度为5微米至25微米，优选地为10微米至15微米。
23.根据权利要求1至22中任一项所述的方法，其特征在于，在实施接触工序之前或之后，置放一充填树脂，以填满所述载体与所述电子元件之间的空隙，其中该载体配设有其触接端部和所述绝缘层。
24.电子单元，其具有一电子元件，该电子元件位于一载体上，该载体(30，50，50′)具有至少一触接端部(31，51，51′)，并且该电子元件(40，60，60′)具有触片，其中至少一预先确定的触片(41A)配设有一凸起(42，62，62′)，所述凸起将该触片与该触接端部进行电连接，其特征在于，该触接端部被一绝缘层(32，52，52′)覆盖，而所述绝缘层被所述凸起穿过。
25.根据权利要求24所述的电子单元，其特征在于，所述电子元件是一电子芯片。
26.根据权利要求24或25所述的电子单元，其特征在于，所述触接端部还延伸到一与所选触片相邻的触片的对面，该相邻的触片未配设有凸起，且至少通过所述绝缘层与所述触接端部隔开。
27.根据权利要求24至26中任一项所述的电子单元，其特征在于，所述载体用纤维材料制成。
28.根据权利要求27所述的电子单元，其特征在于，所述载体用一种基于纸的材料制成。
29.根据权利要求24至26中任一项所述的电子单元，其特征在于，所述载体用塑料材料制成。
30.根据权利要求24至29中任一项所述的电子单元，其特征在于，所述载体构成一识别证件的一部分。
31.根据权利要求30所述的电子单元，其特征在于，所述载体构成护照封面的一部分。
32.根据权利要求24至31中任一项所述的电子单元，其特征在于，所述凸起具有一在所述触片对面缩窄的形状。
33.根据权利要求32所述的电子单元，其特征在于，所述凸起具有一球珠体的形状，所述球珠体包括一楔形部分。
34.根据权利要求33所述的电子单元，其特征在于，不计所述楔形部分的所述凸起的厚度为20微米至50微米。
35.根据权利要求32至34中任一项所述的电子单元，其特征在于，所述凸起穿过所述绝缘层和所述触接端部，直至进入到所述载体中。
36.根据权利要求24至35中任一项所述的电子单元，其特征在于，所述凸起用金或用金的合金制成。
37.根据权利要求24至36中任一项所述的电子单元，其特征在于，所述载体具有至少两个触接端部。
38.根据权利要求37所述的电子单元，其特征在于，这些触接端部覆盖面对所述电子元件的所述载体表面的66％至95％。
39.根据权利要求37或38所述的电子单元，其特征在于，连续的或非连续的所述绝缘层覆盖这些触接端部。
40.根据权利要求39所述的电子单元，其特征在于，所述绝缘层至少在面对所述电子元件的所述载体表面的大部分上延伸。
41.根据权利要求37至40中任一项所述的电子单元，其特征在于，所述触接端部构成一在所述载体上形成的天线的一部分，且所述绝缘层覆盖该天线的至少大部分。
42.根据权利要求24至41中任一项所述的电子单元，其特征在于，所述绝缘层采用绝缘漆实施而成。
43.根据权利要求42所述的电子单元，其特征在于，该绝缘漆具有小于1000mJ/cm2的聚合能量。
44.根据权利要求43所述的电子单元，其特征在于，所述绝缘漆具有约500mJ/cm2的聚合能量。
45.根据权利要求24至44中任一项所述的电子单元，其特征在于，通过丝网印刷法设置该绝缘层。
46.根据权利要求24至45中任一项所述的电子单元，其特征在于，所述绝缘层的厚度为5微米至25微米，优选地为10微米至15微米。
47.根据权利要求24至46中任一项所述的电子单元，其特征在于，所述载体与所述电子元件之间的空隙被一充填树脂填满，其中所述载体配设有其触接端部和所述绝缘层。
CNA200580036099XA 2004-09-24 2005-09-13 电子元件安装在载体、有利地是软载体上的方法以及由此获得的电子单元例如护照 Pending CN101044802A (zh)

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EP1792528A2 (fr) 2007-06-06
JP2008515178A (ja) 2008-05-08
FR2875995B1 (fr) 2014-10-24
US20090200064A1 (en) 2009-08-13
EP1792528B8 (fr) 2014-08-20
US7948764B2 (en) 2011-05-24

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