JP2008515178A - 好ましくは軟質の支持体上に電子コンポーネントを組立てる方法及びかくして得られたパスポートといった電子物品 - Google Patents
好ましくは軟質の支持体上に電子コンポーネントを組立てる方法及びかくして得られたパスポートといった電子物品 Download PDFInfo
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- JP2008515178A JP2008515178A JP2007532919A JP2007532919A JP2008515178A JP 2008515178 A JP2008515178 A JP 2008515178A JP 2007532919 A JP2007532919 A JP 2007532919A JP 2007532919 A JP2007532919 A JP 2007532919A JP 2008515178 A JP2008515178 A JP 2008515178A
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- support
- insulating layer
- bump
- electronic
- terminal
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
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- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Credit Cards Or The Like (AREA)
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Abstract
Description
− 予め定められた少なくとも1つのパッドに1つのバンプ(凸部)が備わっている、複数の接続用パッドを有す電子コンポーネント(構成要素)を提供する手順と、
− 前記バンプ(凸部)を介して前記予め定められたパッドに電気的に接続すべき少なくとも1つの端子を有する支持体を提供する手順と、
− バンプが備わったこの予め定められたパッド(当て物)とこの端子を対面させて置き、このバンプとこの端子を接触させ、既定の温度及び圧力条件下でこれらを互いに固定する手順と、
を具備するプロセス(方法)において、このバンプとこの端子を接触させ固定する前に、この端子の表面を絶縁層で被覆し、この絶縁層は、前記の温度及び圧力条件下でこのバンプが横断できるように選択された材料でできていることを特徴とするプロセス(方法)を提案する。
− 接続すべきパッドのみを接続する;
− 端子のサイズに絶対的な条件は無い;
− チップの位置決め制約条件はきわめて穏やかであり、標準的に+/−0.5mmである;
− チップをブラインド(盲カバー)で被着させることさえ可能である(機械はもはやチップ上のパッドを認識できる必要はない;
− もはや「フリップチップ」のオプションをもつ機械の位置決め精度を有する必要はなく(チップを反転済みの構成で位置決めするだけでよい)、このため、かかる反転を実施する能力をもつ高精度の機械よりも低コストの機械を利用できると同時に、例えば一時間に約5000チップといった高い速度を達成することが可能である;
− 同じ材料(絶縁層のもの)により、チップの近くで優れた絶縁が可能になると同時に、端子に接続される回路の優れた保護が可能となる。
Claims (47)
- 支持体上での電子コンポーネントの組立て方法であって、
− 予め定められた少なくとも1つのパッド(41A)に1つのバンプ(42、62、62”)が備わっている、複数の接続用パッドを有する電子コンポーネント(40、60、60’)を提供する手順と、
− 前記バンプを介して前記予め定められたパッドに電気的に接続すべき少なくとも1つの端子(31、51、51’)を有する支持体(30、50、50’)を提供する手順と、
− バンプが備わったこの予め定められたパッドとこの端子を対面させて置き、このバンプとこの端子を接触させ、既定の温度及び圧力条件下でこれらを互いに固定する手順と、
を具備する方法において、
前記バンプとこの端子を接触させ固定する前に、前記端子の表面を絶縁層(32、52、52’)で被覆し、前記絶縁層は、前記温度及び圧力条件下で前記バンプが横断できるように選択された材料でできていることを特徴とする方法。 - 前記コンポーネントが電子チップであることを特徴とする請求項1に記載の方法。
- 前記支持体が前記温度及び圧力条件下で圧壊可能な材料でできていることを特徴とする請求項1又は2に記載の方法。
- 前記支持体が繊維質材料で作られていることを特徴とする請求項1〜3のいずれか1項に記載の方法。
- 前記支持体が紙ベースの材料で作られていることを特徴とする請求項4に記載の方法。
- 前記支持体がプラスチック材料で作られていることを特徴とする請求項1〜3のいずれか1項に記載の方法。
- 前記支持体が身分証明書の一部を成すことを特徴とする請求項1〜6のいずれか1項に記載の方法。
- 前記電子コンポーネントの前記予め定められたパッドの前記バンプが、接触段階に際し前記絶縁層を容易に横断できるように、前記パッドの反対側で狭窄する形状を有することを特徴とする請求項1〜7のいずれか1項に記載の方法。
- 前記バンプが、ヒューズワイヤの端部の溶融によって形成されており、これにより、前記バンプはくさび状部分をもつボールの形をしていることを特徴とする請求項8に記載の方法。
- 前記くさび状部分を除く前記バンプの厚みが、20〜50ミクロンの間に含まれることを特徴とする請求項9に記載の方法。
- 前記バンプが、前記支持体内に貫入するまで前記絶縁層及び前記端子を横断できるようにすることを特徴とする請求項8〜10のいずれか1項に記載の方法。
- 前記バンプが、金又は金合金でできていることを特徴とする請求項1〜11のいずれか1項に記載の方法。
- 前記支持体が少なくとも2つの端子を有することを特徴とする請求項1〜12のいずれか1項に記載の方法。
- 前記これらの端子が、前記電子コンポーネントと対面している前記支持体の前記表面の66%〜95%を被覆していることを特徴とする請求項13に記載の方法。
- 連続する又は不連続な前記絶縁層が前記の端子を被覆することを特徴とする請求項13又は14のいずれか1項に記載の方法。
- 前記絶縁層が、接触段階の際に前記電子コンポーネントに対面している前記支持体の前記表面の少なくとも大部分にわたり拡がっていることを特徴とする請求項15に記載の方法。
- 前記端子が前記支持体上に形成されたアンテナの一部を成し、前記絶縁層がこのアンテナの少なくとも大部分を網羅することを特徴とする請求項13〜16のいずれか1項に記載の方法。
- 前記絶縁層が絶縁性ワニスでできていることを特徴とする請求項1〜17のいずれか1項に記載の方法。
- この絶縁ワニスが、わずかな収縮しか付与しない1000mJ/cm2未満の重合エネルギーを有するように選択されていることを特徴とする請求項18に記載の方法。
- 前記絶縁ワニスが、約500mJ/cm2の重合エネルギーを有することを特徴とする請求項19に記載の方法。
- 前記絶縁層をシルクスクリーン印刷によって被着させることを特徴とする請求項1〜20のいずれか1項に記載の方法。
- 前記絶縁層の前記厚みが、5〜25ミクロンの間、好ましくは10〜15ミクロンの間に含まれていることを特徴とする請求項1〜21のいずれか1項に記載の方法。
- 前記接触段階の前又は後に、その端子及び前記絶縁層の備わった前記支持体と前記電子コンポーネントの間に含まれる前記空間を充填するように充填用樹脂を被着させることを特徴とする請求項1〜22のいずれか1項に記載の方法。
- 1つの支持体上に1つの電子コンポーネントを有する電子物品において、
前記支持体(30、50、50’)が少なくとも1つの端子(31、51、51’)を有し、前記電子コンポーネント(40、60、60’)は、予め定められた少なくとも1つのパッド(41A)を前記端子に電気的に接続するバンプ(42、62、62’)が備わっている複数のパッドを有しており、前記端子は、前記バンプが横断する絶縁層(32、52,52’)で被覆されていることを特徴とする電子物品。 - 前記電子コンポーネントが電子チップであることを特徴とする請求項24に記載の電子物品。
- 前記端子がさらに、選択されたパッドに隣接するパッドと対面して拡がっており、この隣接するパッドがバンプを備えておらず、少なくとも前記絶縁層により前記端子から分離されていることを特徴とする請求項24又は25に記載の電子物品。
- 前記支持体が繊維質材料で作られていることを特徴とする請求項24〜26のいずれか1項に記載の電子物品。
- 前記支持体が紙ベースの材料で作られていることを特徴とする請求項27に記載の電子物品。
- 前記支持体がプラスチック材料で作られていることを特徴とする請求項24〜26のいずれか1項に記載の電子物品。
- 前記支持体が身分証明書の一部を成すことを特徴とする請求項24〜29のいずれか1項に記載の電子物品。
- 前記支持体がパスポートのカバーの一部を成すことを特徴とする請求項30に記載の電子物品。
- 前記パッドの反対側で狭窄する形状を有することを特徴とする請求項24〜31のいずれか1項に記載の電子物品。
- 前記バンプが、くさび状部分をもつボールの形をしていることを特徴とする請求項32に記載の電子物品。
- 前記くさび状部分を除く前記バンプの厚みが20〜50ミクロンの間に含まれることを特徴とする請求項33に記載の電子物品。
- 前記バンプが、前記支持体内に貫入するまで前記絶縁層及び前記端子を横断することを特徴とする請求項32〜34のいずれか1項に記載の電子物品。
- 前記バンプが金又は金合金でできていることを特徴とする請求項24〜35のいずれか1項に記載の電子物品。
- 前記支持体が少なくとも2つの端子を有することを特徴とする請求項24〜36のいずれか1項に記載の電子物品。
- これらの端子が、前記電子コンポーネントと対面する前記支持体の前記表面の66%〜95%を被覆していることを特徴とする請求項37に記載の電子物品。
- 連続する又は不連続な前記絶縁層がこれらの端子を被覆することを特徴とする請求項37又は38のいずれか1項に記載の電子物品。
- 前記絶縁層が、前記電子コンポーネントに対面している前記支持体の前記表面の少なくとも大部分にわたり拡がっていることを特徴とする請求項39に記載の電子物品。
- 前記端子が前記支持体上に形成されたアンテナの一部を成し、前記絶縁層がこのアンテナの少なくとも大部分を網羅することを特徴とする請求項37〜40のいずれか1項に記載の電子物品。
- 前記絶縁層が絶縁性ワニスでできていることを特徴とする請求項24〜41のいずれか1項に記載の電子物品。
- この絶縁ワニスが、1000mJ/cm2未満の重合エネルギーを有することを特徴とする請求項42に記載の電子物品。
- 前記絶縁ワニスが、約500mJ/cm2の重合エネルギーを有することを特徴とする請求項43に記載の電子物品。
- この絶縁層がシルクスクリーン印刷によって被着されることを特徴とする請求項24〜44のいずれか1項に記載の電子物品。
- 前記絶縁層の前記厚みが5〜25ミクロンの間、好ましくは10〜15ミクロンの間に含まれていることを特徴とする請求項24〜45のいずれか1項に記載の電子物品。
- その端子及び前記絶縁層の備わった前記支持体と前記電子コンポーネントの間に含まれる前記空間が充填用樹脂によって充填されていることを特徴とする請求項24〜46のいずれか1項に記載の電子物品。
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PCT/FR2005/002266 WO2006035128A2 (fr) | 2004-09-24 | 2005-09-13 | Procede de montage d’un composant electronique sur un support de preference mou, et entite electronique ainsi obtenue, telle qu’un passeport |
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2004
- 2004-09-24 FR FR0410146A patent/FR2875995B1/fr not_active Expired - Fee Related
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2005
- 2005-09-13 EP EP05802474.6A patent/EP1792528B8/fr not_active Not-in-force
- 2005-09-13 CN CNA200580036099XA patent/CN101044802A/zh active Pending
- 2005-09-13 JP JP2007532919A patent/JP2008515178A/ja active Pending
- 2005-09-13 US US11/663,555 patent/US7948764B2/en active Active
- 2005-09-13 WO PCT/FR2005/002266 patent/WO2006035128A2/fr active Application Filing
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JPH11328355A (ja) * | 1998-05-20 | 1999-11-30 | Dainippon Printing Co Ltd | Icカード用icモジュール |
JP2000315705A (ja) * | 1999-04-30 | 2000-11-14 | Toppan Forms Co Ltd | Icベアチップの実装方法 |
JP2001175829A (ja) * | 1999-10-08 | 2001-06-29 | Dainippon Printing Co Ltd | 非接触式データキャリアおよびicチップ |
JP2002083832A (ja) * | 2000-09-08 | 2002-03-22 | Toppan Forms Co Ltd | Icチップの固定方法 |
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JP2004094522A (ja) * | 2002-08-30 | 2004-03-25 | Oji Paper Co Ltd | Icチップ実装体 |
Also Published As
Publication number | Publication date |
---|---|
EP1792528B1 (fr) | 2014-07-16 |
WO2006035128A3 (fr) | 2006-06-01 |
US7948764B2 (en) | 2011-05-24 |
EP1792528A2 (fr) | 2007-06-06 |
FR2875995B1 (fr) | 2014-10-24 |
CN101044802A (zh) | 2007-09-26 |
EP1792528B8 (fr) | 2014-08-20 |
WO2006035128A2 (fr) | 2006-04-06 |
FR2875995A1 (fr) | 2006-03-31 |
US20090200064A1 (en) | 2009-08-13 |
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