CN101043014A - 基板支承构件 - Google Patents

基板支承构件 Download PDF

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Publication number
CN101043014A
CN101043014A CNA2007100875094A CN200710087509A CN101043014A CN 101043014 A CN101043014 A CN 101043014A CN A2007100875094 A CNA2007100875094 A CN A2007100875094A CN 200710087509 A CN200710087509 A CN 200710087509A CN 101043014 A CN101043014 A CN 101043014A
Authority
CN
China
Prior art keywords
substrate
supporting member
mounting table
hole
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007100875094A
Other languages
English (en)
Chinese (zh)
Inventor
和田武人
杉山真也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN101043014A publication Critical patent/CN101043014A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
CNA2007100875094A 2006-03-20 2007-03-16 基板支承构件 Pending CN101043014A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006075841A JP4906375B2 (ja) 2006-03-20 2006-03-20 基板支持部材
JP2006075841 2006-03-20

Publications (1)

Publication Number Publication Date
CN101043014A true CN101043014A (zh) 2007-09-26

Family

ID=38595009

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100875094A Pending CN101043014A (zh) 2006-03-20 2007-03-16 基板支承构件

Country Status (4)

Country Link
JP (1) JP4906375B2 (https=)
KR (1) KR100948759B1 (https=)
CN (1) CN101043014A (https=)
TW (1) TW200802683A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101712023A (zh) * 2008-10-01 2010-05-26 东丽工程株式会社 提升销
CN101713924B (zh) * 2008-10-01 2012-09-26 东丽工程株式会社 基板处理装置及基板载置方法
CN111312653A (zh) * 2020-03-16 2020-06-19 北京北方华创微电子装备有限公司 晶片承载装置及半导体加工设备
CN114792615A (zh) * 2021-01-25 2022-07-26 东京毅力科创株式会社 基片载置台和基片处理方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100968814B1 (ko) 2008-05-14 2010-07-08 세메스 주식회사 리프트 핀 구조체 및 이를 구비하는 기판 처리 장치
KR101715147B1 (ko) * 2015-07-24 2017-03-14 주식회사 선익시스템 글라스기판처짐보완장치를 포함하는 버퍼챔버
JP6512182B2 (ja) * 2016-06-27 2019-05-15 日亜化学工業株式会社 半導体装置の製造方法
CN106311525A (zh) * 2016-08-23 2017-01-11 豪威光电子科技（上海）有限公司 涂胶工艺
US10784142B2 (en) * 2018-01-09 2020-09-22 Varian Semiconductor Equipment Associates, Inc. Lift pin system for wafer handling
JP7819003B2 (ja) * 2022-03-18 2026-02-24 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
JP3343012B2 (ja) * 1995-12-25 2002-11-11 大日本スクリーン製造株式会社 回転式基板処理装置
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
KR100493011B1 (ko) * 1998-10-13 2005-08-01 삼성전자주식회사 디스크 사이트에 결합되어 있는 슬라이드 핀을 갖춘 웨이퍼 핸들러 시스템
JP2000237983A (ja) * 1999-02-22 2000-09-05 Hitachi Electronics Eng Co Ltd 基板チャック装置
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP2002093890A (ja) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd リフトピン及びステージ装置
JP2004059116A (ja) * 2002-07-31 2004-02-26 Sharp Corp ディスプレイ用基板収納用トレイ及びディスプレイ用基板の取り出し機構並びにディスプレイ用基板の取り出し方法
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101712023A (zh) * 2008-10-01 2010-05-26 东丽工程株式会社 提升销
CN101713924B (zh) * 2008-10-01 2012-09-26 东丽工程株式会社 基板处理装置及基板载置方法
CN111312653A (zh) * 2020-03-16 2020-06-19 北京北方华创微电子装备有限公司 晶片承载装置及半导体加工设备
CN111312653B (zh) * 2020-03-16 2023-08-18 北京北方华创微电子装备有限公司 晶片承载装置及半导体加工设备
CN114792615A (zh) * 2021-01-25 2022-07-26 东京毅力科创株式会社 基片载置台和基片处理方法

Also Published As

Publication number Publication date
TWI364811B (https=) 2012-05-21
JP2007251073A (ja) 2007-09-27
KR20070095197A (ko) 2007-09-28
JP4906375B2 (ja) 2012-03-28
TW200802683A (en) 2008-01-01
KR100948759B1 (ko) 2010-03-23

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