JP4906375B2 - 基板支持部材 - Google Patents

基板支持部材 Download PDF

Info

Publication number
JP4906375B2
JP4906375B2 JP2006075841A JP2006075841A JP4906375B2 JP 4906375 B2 JP4906375 B2 JP 4906375B2 JP 2006075841 A JP2006075841 A JP 2006075841A JP 2006075841 A JP2006075841 A JP 2006075841A JP 4906375 B2 JP4906375 B2 JP 4906375B2
Authority
JP
Japan
Prior art keywords
substrate
tip
support member
substrate support
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006075841A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007251073A (ja
Inventor
武人 和田
真也 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006075841A priority Critical patent/JP4906375B2/ja
Priority to TW096107558A priority patent/TW200802683A/zh
Priority to KR1020070024790A priority patent/KR100948759B1/ko
Priority to CNA2007100875094A priority patent/CN101043014A/zh
Publication of JP2007251073A publication Critical patent/JP2007251073A/ja
Application granted granted Critical
Publication of JP4906375B2 publication Critical patent/JP4906375B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
JP2006075841A 2006-03-20 2006-03-20 基板支持部材 Expired - Lifetime JP4906375B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006075841A JP4906375B2 (ja) 2006-03-20 2006-03-20 基板支持部材
TW096107558A TW200802683A (en) 2006-03-20 2007-03-05 Member for supporting substrate
KR1020070024790A KR100948759B1 (ko) 2006-03-20 2007-03-14 기판 지지부재
CNA2007100875094A CN101043014A (zh) 2006-03-20 2007-03-16 基板支承构件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006075841A JP4906375B2 (ja) 2006-03-20 2006-03-20 基板支持部材

Publications (2)

Publication Number Publication Date
JP2007251073A JP2007251073A (ja) 2007-09-27
JP4906375B2 true JP4906375B2 (ja) 2012-03-28

Family

ID=38595009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006075841A Expired - Lifetime JP4906375B2 (ja) 2006-03-20 2006-03-20 基板支持部材

Country Status (4)

Country Link
JP (1) JP4906375B2 (https=)
KR (1) KR100948759B1 (https=)
CN (1) CN101043014A (https=)
TW (1) TW200802683A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018006362A (ja) * 2016-06-27 2018-01-11 日亜化学工業株式会社 半導体装置の製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100968814B1 (ko) 2008-05-14 2010-07-08 세메스 주식회사 리프트 핀 구조체 및 이를 구비하는 기판 처리 장치
JP2010087342A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd リフトピン
JP2010087343A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd 基板処理装置及び基板載置方法
KR101715147B1 (ko) * 2015-07-24 2017-03-14 주식회사 선익시스템 글라스기판처짐보완장치를 포함하는 버퍼챔버
CN106311525A (zh) * 2016-08-23 2017-01-11 豪威光电子科技（上海）有限公司 涂胶工艺
US10784142B2 (en) * 2018-01-09 2020-09-22 Varian Semiconductor Equipment Associates, Inc. Lift pin system for wafer handling
CN111312653B (zh) * 2020-03-16 2023-08-18 北京北方华创微电子装备有限公司 晶片承载装置及半导体加工设备
JP7585812B2 (ja) * 2021-01-25 2024-11-19 東京エレクトロン株式会社 基板載置台及び基板処理方法。
JP7819003B2 (ja) * 2022-03-18 2026-02-24 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
JP3343012B2 (ja) * 1995-12-25 2002-11-11 大日本スクリーン製造株式会社 回転式基板処理装置
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
KR100493011B1 (ko) * 1998-10-13 2005-08-01 삼성전자주식회사 디스크 사이트에 결합되어 있는 슬라이드 핀을 갖춘 웨이퍼 핸들러 시스템
JP2000237983A (ja) * 1999-02-22 2000-09-05 Hitachi Electronics Eng Co Ltd 基板チャック装置
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP2002093890A (ja) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd リフトピン及びステージ装置
JP2004059116A (ja) * 2002-07-31 2004-02-26 Sharp Corp ディスプレイ用基板収納用トレイ及びディスプレイ用基板の取り出し機構並びにディスプレイ用基板の取り出し方法
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018006362A (ja) * 2016-06-27 2018-01-11 日亜化学工業株式会社 半導体装置の製造方法
US10263167B2 (en) 2016-06-27 2019-04-16 Nichia Corporation Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
TWI364811B (https=) 2012-05-21
JP2007251073A (ja) 2007-09-27
KR20070095197A (ko) 2007-09-28
CN101043014A (zh) 2007-09-26
TW200802683A (en) 2008-01-01
KR100948759B1 (ko) 2010-03-23

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