KR100948759B1 - 기판 지지부재 - Google Patents

기판 지지부재 Download PDF

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Publication number
KR100948759B1
KR100948759B1 KR1020070024790A KR20070024790A KR100948759B1 KR 100948759 B1 KR100948759 B1 KR 100948759B1 KR 1020070024790 A KR1020070024790 A KR 1020070024790A KR 20070024790 A KR20070024790 A KR 20070024790A KR 100948759 B1 KR100948759 B1 KR 100948759B1
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KR
South Korea
Prior art keywords
substrate
board
tip
supporting member
support member
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KR1020070024790A
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English (en)
Korean (ko)
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KR20070095197A (ko
Inventor
다케히토 와다
신야 스기야마
Original Assignee
도쿄 오카 고교 가부시키가이샤
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Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20070095197A publication Critical patent/KR20070095197A/ko
Application granted granted Critical
Publication of KR100948759B1 publication Critical patent/KR100948759B1/ko
Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도쿄 오카 고교 가부시키가이샤
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
KR1020070024790A 2006-03-20 2007-03-14 기판 지지부재 Active KR100948759B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006075841A JP4906375B2 (ja) 2006-03-20 2006-03-20 基板支持部材
JPJP-P-2006-00075841 2006-03-20

Publications (2)

Publication Number Publication Date
KR20070095197A KR20070095197A (ko) 2007-09-28
KR100948759B1 true KR100948759B1 (ko) 2010-03-23

Family

ID=38595009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070024790A Active KR100948759B1 (ko) 2006-03-20 2007-03-14 기판 지지부재

Country Status (4)

Country Link
JP (1) JP4906375B2 (https=)
KR (1) KR100948759B1 (https=)
CN (1) CN101043014A (https=)
TW (1) TW200802683A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100968814B1 (ko) 2008-05-14 2010-07-08 세메스 주식회사 리프트 핀 구조체 및 이를 구비하는 기판 처리 장치
JP2010087342A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd リフトピン
JP2010087343A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd 基板処理装置及び基板載置方法
KR101715147B1 (ko) * 2015-07-24 2017-03-14 주식회사 선익시스템 글라스기판처짐보완장치를 포함하는 버퍼챔버
JP6512182B2 (ja) * 2016-06-27 2019-05-15 日亜化学工業株式会社 半導体装置の製造方法
CN106311525A (zh) * 2016-08-23 2017-01-11 豪威光电子科技（上海）有限公司 涂胶工艺
US10784142B2 (en) * 2018-01-09 2020-09-22 Varian Semiconductor Equipment Associates, Inc. Lift pin system for wafer handling
CN111312653B (zh) * 2020-03-16 2023-08-18 北京北方华创微电子装备有限公司 晶片承载装置及半导体加工设备
JP7585812B2 (ja) * 2021-01-25 2024-11-19 東京エレクトロン株式会社 基板載置台及び基板処理方法。
JP7819003B2 (ja) * 2022-03-18 2026-02-24 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173945A (ja) * 1995-12-25 1997-07-08 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
KR100244727B1 (ko) * 1995-05-12 2000-02-15 히가시 데쓰로 열처리장치
KR20040012517A (ko) * 2002-07-31 2004-02-11 샤프 가부시키가이샤 디스플레이용 기판 수납용 트레이, 및 그 디스플레이용기판을 제거하는 장치 및 방법
KR100493011B1 (ko) * 1998-10-13 2005-08-01 삼성전자주식회사 디스크 사이트에 결합되어 있는 슬라이드 핀을 갖춘 웨이퍼 핸들러 시스템
KR20050081839A (ko) * 2004-02-12 2005-08-19 어플라이드 머티어리얼스, 인코포레이티드 기판 지지 부재

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
JP2000237983A (ja) * 1999-02-22 2000-09-05 Hitachi Electronics Eng Co Ltd 基板チャック装置
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP2002093890A (ja) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd リフトピン及びステージ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100244727B1 (ko) * 1995-05-12 2000-02-15 히가시 데쓰로 열처리장치
JPH09173945A (ja) * 1995-12-25 1997-07-08 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
KR100493011B1 (ko) * 1998-10-13 2005-08-01 삼성전자주식회사 디스크 사이트에 결합되어 있는 슬라이드 핀을 갖춘 웨이퍼 핸들러 시스템
KR20040012517A (ko) * 2002-07-31 2004-02-11 샤프 가부시키가이샤 디스플레이용 기판 수납용 트레이, 및 그 디스플레이용기판을 제거하는 장치 및 방법
KR20050081839A (ko) * 2004-02-12 2005-08-19 어플라이드 머티어리얼스, 인코포레이티드 기판 지지 부재

Also Published As

Publication number Publication date
TWI364811B (https=) 2012-05-21
JP2007251073A (ja) 2007-09-27
KR20070095197A (ko) 2007-09-28
JP4906375B2 (ja) 2012-03-28
CN101043014A (zh) 2007-09-26
TW200802683A (en) 2008-01-01

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