CN101043014A - Supporting member for substrate - Google Patents
Supporting member for substrate Download PDFInfo
- Publication number
- CN101043014A CN101043014A CNA2007100875094A CN200710087509A CN101043014A CN 101043014 A CN101043014 A CN 101043014A CN A2007100875094 A CNA2007100875094 A CN A2007100875094A CN 200710087509 A CN200710087509 A CN 200710087509A CN 101043014 A CN101043014 A CN 101043014A
- Authority
- CN
- China
- Prior art keywords
- substrate
- supporting member
- leading section
- end portion
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Abstract
The invention provides a base plate support component which would not leave pin traces due to an uneven temperature on a base plate. A structure of the invention is that, in order to support the base plate (W) at a carrier table (1), a front end portion (8) of a support pin (7) can enter in or exit from a via hole (5) formed on the carrier table (1), the front end portion (8) of a support pin (7) is supported by a spiral spring (12) passing through a front end portion (11a) of a rod, when being in a state that the base plate (W) is not carried, a front end of the front end portion (8) is projected from the carrier table in about 1-2mm, the front end portion (8) of the support pin (7) is shrinked by using the weight of the base plate (W), and a front end plane portion of the front end portion (8) is in a same level with the carrier table (1).
Description
Technical field
The present invention relates to the supporting member for substrate of substrates such as a kind of supporting glass substrate or semiconductor wafer.
Background technology
In the past, in the middle of the manufacturing process of liquid crystal indicator (LCD), when on glass substrate, forming in etchant resist or the colour filter, with the glass substrate mounting on substrate-placing platform, under this state to the upper surface coated film material (coating liquid) of glass substrate.In addition, in substrate-placing platform handing-over glass substrate, on substrate-placing platform, be formed with the through hole of above-below direction, and in this through hole, can be provided with the supporting member for substrate of pin shape with freely coming in and going out, make supporting member for substrate more outstanding than substrate-placing platform upper surface, under this state to the upper end of supporting member for substrate handing-over glass substrate, again by the decline of supporting member for substrate, just can be on substrate-placing platform with the glass substrate mounting.
Wherein, in patent documentation 1 and patent documentation 2, the evolutionary approach of supporting member for substrate has been proposed.
Following a kind of substrate heating equipment is disclosed in patent documentation 1, promptly, the formed spacer pin of polyimide resin (proximity pin) of the Kapton (registered trade mark) that use is produced by company of toray Du Pont (TDC) (registered trade mark) etc. is heat-treated substrate-placing on spacer pin.
In addition, following base plate keeping device is disclosed in patent documentation 2, promptly, in the base station that is arranged at the carrying suspension rod, pass through to use the supporting member for substrate that forms by fibrous material as supporting material, the heat of accumulating on substrate is conducted heat dispersedly from supporting member for substrate, make the transfer printing vestige of the supporting member for substrate that remains on the substrate fuzzyyer than in the past, and inconspicuous.
[patent documentation 1] TOHKEMY 2003-218003 communique
[patent documentation 2] TOHKEMY 2000-012655 communique
Yet, as patent documentation 1,, employing cuts apart in the pin of polyimide resin system of front end of quadrangle etc. when having semicircular shape, rectangular shape, four, have good thermal endurance.In addition,, make the part that fiber is formed panniform or ball top shape in the lower surface of substrate contacts, having the advantage that can not be detained heat in this contact portion as patent documentation 2.But, under the situation of structure shown in two documents, be difficult to prevent and the contact portion of pin or fibre base plate and noncontact part between occurrence temperature inhomogeneous.
Moreover for example about other structures, in the middle of the handing-over of substrate action, when the mounting table upper surface, substrate and supporting member for substrate are in contactless state with substrate-placing.Promptly make under the state of its decline, the leading section of supporting member for substrate is positioned at than mounting table upper surface also near the position of below, can form the gap of through hole between the upper end of supporting member for substrate and base lower surface.The space segment that this through hole of reason forms is with to compare its temperature on every side lower, so occurrence temperature is inhomogeneous on corresponding to the substrate of this part.
Summary of the invention
In view of this, the invention provides a kind of with substrate-placing under the state on the substrate-placing platform, between itself and substrate back, can not form the supporting member for substrate in gap.
The supporting member for substrate that the present invention relates to, at substrate-placing member upper support substrate, it can be come in and gone out from the through hole that forms at the substrate-placing member, and supporting member for substrate is a structure of utilizing the deadweight of substrate to shrink.
According to the supporting member for substrate that the present invention relates to, because supporting member for substrate is a structure of utilizing the deadweight of substrate to shrink, thereby when substrate-placing on the substrate-placing member time, is utilized the deadweight contraction of substrate self.Like this, shrink in the deadweight that utilizes substrate, with substrate-placing under the state on the substrate-placing member, in the through hole of substrate-placing member, do not form the gap between the leading section of supporting member and the substrate back, for example, the situation of substrate-placing on mounting table compared, can suppress the uneven generation of said temperature thereby the supporting member main body is descended with as the structure of in the past supporting member for substrate.
In the middle of the aforesaid substrate supporting member, its leading section also can be formed by aluminium or resin.By such structure, can improve the durability of supporting member for substrate.
In addition, in the middle of the aforesaid substrate supporting member, also its leading section can be formed the inverted cone shape.At this moment, because it is a circular flat with the contact-making surface of substrate back, becomes bigger with the contact area of substrate, so reduced non-uniform temperature.Moreover, by forming the inverted cone shape, for example the situation of itself and cylindrical shape relatively, owing to be formed with the position in the inwall that can local obtain through hole significantly and the gap of supporting member for substrate, so the danger that contacts with inwall can reduce more in the through hole that supporting member for substrate is accommodated in the substrate-placing member time.
In addition, in the middle of the aforesaid substrate supporting member, also its leading section can be formed cone shape.At this moment, because it is a circular flat with the contact-making surface of substrate back, this moment is identical with the situation of inverted cone shape, its with the contact area change of substrate greatly, the non-uniform temperature of substrate surface tails off.
According to supporting member for substrate of the present invention, substrate by mounting under the state on the substrate-placing member, can not form the gap between itself and the substrate back.Therefore, can realize can be with the supporting member for substrate that the influence of filming on the substrate is suppressed in the Min..
Description of drawings
Fig. 1 is the figure that expression is installed on the supporting member for substrate that the present invention relates to the situation of conveyer and lowering or hoisting gear.
Fig. 2 is the cutaway view of an execution mode of expression supporting member for substrate.
Fig. 3 (a) is the figure of the position of the supporting member for substrate before the expression mounting substrate, (b) is the figure of the position of expression mounting substrate supporting member for substrate afterwards.
Fig. 4 is the cutaway view of another execution mode of expression supporting member for substrate.
Symbol description: 1... mounting table; 2... conveyer; 3... lowering or hoisting gear; 4... suspension rod; 5... through hole; 6... periphery supporting member for substrate; 7... supporting member for substrate; 8... leading section; 10... socket; 11... bar; 11a... the leading section of bar; 12... helical spring; W... substrate.
Embodiment
To describe being used to implement preferred forms of the present invention based on accompanying drawing below.Wherein, in the middle of the following description, the member that will have identical function is made as identical symbol, and omits the explanation of its repetition.
Illustrate conveyer 2 in Fig. 1, it receives substrate W to substrate-placing member (mounting table) 1 handing-over glass substrate W or from mounting table 1; With lowering or hoisting gear 3, it lifts substrate W from mounting table 1.
Inside upper surface place at the suspension rod 4 of conveyer 2 is equipped with periphery supporting member for substrate 6.With respect to main part this periphery supporting member for substrate 6 is installed replaceably, the leading section upper surface of periphery supporting member for substrate 6 is formed circular flat.
Be formed with through hole 5 at mounting table 1 upper edge thickness direction, logically in this through hole 5 be inserted with the supporting member for substrate 7 that the present embodiment that is arranged at lowering or hoisting gear 3 and is the pin shape relates to.
As shown in Figure 2, with fulcrum post 7 installing by adjusting the mode of changing at the interval between mounting table 1 and the chuck 9 in the lower end of socket 10.In socket 10, be inserted with bar 11, and the leading section 11a of bar 11 is the thinner bar of diameter.In addition, helical spring 12 is installed, the leading section 8 that can utilize helical spring 12 liftings is installed on the leading section 11a of bar in the bottom of the leading section 11a of bar.
In addition, under state shown in Figure 2, helical spring 12 is shunk, the lower end of leading section 8 is stuck in the upper end of socket 10, though not shown, expression is with the state of substrate W mounting on mounting table 1.And,, be the state that the lower end of helical spring 12 elongation and leading section 8 breaks away from from the upper end of socket with the state that substrate W takes off from mounting table 1.
The diameter of the leading section 8 of fulcrum post 7 (diameter of the face that contacts with the substrate W back side) is formed the internal diameter that is slightly less than through hole 5, and with regard to area, the leading section surface area of fulcrum post 7 is slightly less than the leading section surface area of through hole 5.That is, the diameter dimension that makes fulcrum post 7 is in the scope that does not hinder fulcrum post 7 sliding capability vertically, as much as possible near the internal diameter of through hole 5.Thus, because the space that forms between the side of the side of the leading section 8 of fulcrum post 7 and the through hole 5 of mounting table 1 is minimum, the gap smaller of the reason that reduces as temperature, so can suppress the situation that non-uniform temperature is transferred to substrate.
Mounting action to the substrate W reality of having used this kind fulcrum post 7 describes based on Fig. 3 (a) and (b).Fig. 3 (a) illustrates the state of substrate W mounting before fulcrum post 7, and Fig. 3 (b) illustrates the state after the substrate W mounting.Before mounting, in the through hole 5 of mounting table 1, the leading section 8 of fulcrum post 7 is from the upper surface of mounting table 1 outstanding (for example 1～2mm).
Under this state, for example by not shown automatics with in substrate W mounting is on mounting table 1, the deadweight of substrate W is delivered to the leading section 8 of the helical spring 12 of fulcrum post 7, because of both sides' weight helical spring 12 sinks.At this moment, the front end of leading section 8 contacts with the back side of substrate W, and the front end of leading section 8 is the state of flushing with the upper surface of mounting table 1.And, owing to set the helical spring constant of the degree of the power that pushes away substrate W on not having, so helical spring 12 can not pushed to substrate W once more.
Like this, fulcrum post 7 according to present embodiment, front end face by the leading section 8 of helical spring 12 supporting contact with the back side of substrate W (with the flush state of mounting table 1 under), for example make fulcrum post self vertically lifting come the situation of mounting substrate such, between the leading section of fulcrum post and the substrate W back side, do not form the gap.Therefore, for example with the corresponding substrate W of the gap portion that forms by fulcrum post and substrate W on, neither can occurrence temperature inhomogeneous, can also suppress to apply uneven generation.
About the fulcrum post 7 of above-mentioned execution mode, its leading section 8 can be made of aluminium or resin.Thus, can improve the durability of fulcrum post 7 self.
About the fulcrum post 7 of above-mentioned execution mode, the shape of its leading section 8 is formed cylindrical shape, but in addition, also can be made as inverted cone shape as shown in Figure 4.At this moment, be all circular flat mutually, can obtain the effect identical with the situation of cylindrical shape with the situation of the face of substrate W back side contact and above-mentioned cylindrical shape.
Moreover, under the situation of inverted cone shape, for example to compare with the situation of cylindrical shape, all diameters on its length direction are not isometrical (diameter shortens gradually along its length), thereby between leading section 8 sides of the sidewall (inwall) of through hole 5 and fulcrum post 7, be formed with the gap partly.Thus, in the time of in the through hole 5 that fulcrum post 7 is accommodated in mounting table 1, can reduce the danger that contacts with the sidewall of through hole 5.
Moreover the present invention is not limited to above-mentioned execution mode, in the scope that does not break away from purport of the present invention, can adopt other various structures.
Utilizability on the industry:
Along with the large-scale semi-conductive demands such as semiconductor memory increase, the pressure to reduce price of relative price Also very severe, in the middle of the problem of semi-conductive wafer maximization and raising yield rate, by using Supporting member for substrate of the present invention can expect to improve the inhomogeneous situation of coated film, even therefore In the situation of using large-scale wafer, also can expect to improve yield rate.
Claims (4)
1. supporting member for substrate, at substrate-placing member upper support substrate, it can be come in and gone out from the through hole that forms at aforesaid substrate mounting member, it is characterized in that: the aforesaid substrate supporting member is a structure of utilizing the deadweight of aforesaid substrate to shrink.
2. supporting member for substrate according to claim 1 is characterized in that: the front end of aforesaid substrate supporting member is formed by aluminium or resin.
3. supporting member for substrate according to claim 1 is characterized in that: the leading section of aforesaid substrate supporting member is a cylindrical shape.
4. supporting member for substrate according to claim 1 is characterized in that: the leading section of aforesaid substrate supporting member is the inverted cone shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006075841 | 2006-03-20 | ||
| JP2006075841A JP4906375B2 (en) | 2006-03-20 | 2006-03-20 | Substrate support member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101043014A true CN101043014A (en) | 2007-09-26 |
Family
ID=38595009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100875094A Pending CN101043014A (en) | 2006-03-20 | 2007-03-16 | Supporting member for substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4906375B2 (en) |
| KR (1) | KR100948759B1 (en) |
| CN (1) | CN101043014A (en) |
| TW (1) | TW200802683A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101712023A (en) * | 2008-10-01 | 2010-05-26 | 东丽工程株式会社 | Lift pin |
| CN101713924B (en) * | 2008-10-01 | 2012-09-26 | 东丽工程株式会社 | A device for treating substrate and a method of cardinal plate loading |
| CN111312653A (en) * | 2020-03-16 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor processing equipment |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100968814B1 (en) | 2008-05-14 | 2010-07-08 | 세메스 주식회사 | Lift pin structure and substrate processing apparatus having the same |
| KR101715147B1 (en) * | 2015-07-24 | 2017-03-14 | 주식회사 선익시스템 | Buffer Chamber Including Correction Apparatus for Glass Deflection |
| JP6512182B2 (en) * | 2016-06-27 | 2019-05-15 | 日亜化学工業株式会社 | Semiconductor device manufacturing method |
| CN106311525A (en) * | 2016-08-23 | 2017-01-11 | 豪威光电子科技（上海）有限公司 | Glue coating process |
| US10784142B2 (en) * | 2018-01-09 | 2020-09-22 | Varian Semiconductor Equipment Associates, Inc. | Lift pin system for wafer handling |
| JP7585812B2 (en) * | 2021-01-25 | 2024-11-19 | 東京エレクトロン株式会社 | Substrate mounting table and substrate processing method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3028462B2 (en) * | 1995-05-12 | 2000-04-04 | 東京エレクトロン株式会社 | Heat treatment equipment |
| JP3343012B2 (en) * | 1995-12-25 | 2002-11-11 | 大日本スクリーン製造株式会社 | Rotary substrate processing equipment |
| JP3881062B2 (en) * | 1996-08-14 | 2007-02-14 | 大日本スクリーン製造株式会社 | Substrate holding mechanism and substrate processing apparatus |
| KR100493011B1 (en) * | 1998-10-13 | 2005-08-01 | 삼성전자주식회사 | Wafer handler system with slide pin coupled to the disk site |
| JP2000237983A (en) * | 1999-02-22 | 2000-09-05 | Hitachi Electronics Eng Co Ltd | Board chuck device |
| EP1174910A3 (en) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Method and apparatus for dechucking a substrate |
| JP2002093890A (en) * | 2000-09-19 | 2002-03-29 | Olympus Optical Co Ltd | Lift pin and stage device |
| JP2004059116A (en) * | 2002-07-31 | 2004-02-26 | Sharp Corp | Tray for storing substrate for display, taking out mechanism for the substrate for display, and method for taking out the substrate for display |
| US8033245B2 (en) * | 2004-02-12 | 2011-10-11 | Applied Materials, Inc. | Substrate support bushing |
-
2006
- 2006-03-20 JP JP2006075841A patent/JP4906375B2/en active Active
-
2007
- 2007-03-05 TW TW096107558A patent/TW200802683A/en unknown
- 2007-03-14 KR KR1020070024790A patent/KR100948759B1/en active IP Right Grant
- 2007-03-16 CN CNA2007100875094A patent/CN101043014A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101712023A (en) * | 2008-10-01 | 2010-05-26 | 东丽工程株式会社 | Lift pin |
| CN101713924B (en) * | 2008-10-01 | 2012-09-26 | 东丽工程株式会社 | A device for treating substrate and a method of cardinal plate loading |
| CN111312653A (en) * | 2020-03-16 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor processing equipment |
| CN111312653B (en) * | 2020-03-16 | 2023-08-18 | 北京北方华创微电子装备有限公司 | Wafer carrying device and semiconductor processing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100948759B1 (en) | 2010-03-23 |
| KR20070095197A (en) | 2007-09-28 |
| JP4906375B2 (en) | 2012-03-28 |
| TW200802683A (en) | 2008-01-01 |
| JP2007251073A (en) | 2007-09-27 |
| TWI364811B (en) | 2012-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |