JP2002093890A - Lift pin and stage device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being scarred or damaged, without affecting inspection processes, even if the semiconductor wafer interferes at its delivery. SOLUTION: A lift pin 10 comprises a cylindrical pin body 13 and a pin tip piece 14, placed on the tip of the pin body 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a substrate surface of a flat display such as a semiconductor wafer or a liquid crystal display. The present invention relates to a lift pin for pushing up and a stage device using the lift pin.

[0002]

2. Description of the Related Art For example, in a semiconductor manufacturing process, inspection for scratches, dust, unevenness, etc. on a semiconductor wafer surface is performed. In this inspection, a semiconductor wafer is placed on a stage, and macroscopic observation by visual observation or microscopic observation using a microscope is performed.

At the time of this inspection, a semiconductor wafer is delivered on a stage. FIG. 9 is a configuration diagram of the stage device. The stage main body 1 is provided with a plurality of lift pins (for example, three lift pins) 2. These lift pins 2 are formed in a columnar shape as shown in FIG. 10 (a), and penetrate through the stage main body 1 to rise and fall.

When transferring a semiconductor wafer onto the stage body 1 by a transfer robot or the like, first, each lift pin 2
Rises above the upper surface of the stage body 1, and the semiconductor wafer is transported above the stage body 1 by the transport arm. Next, the transfer arm is lowered, and the semiconductor wafer is placed on each lift pin 2. Thereafter, the transfer arm is retracted from between the semiconductor wafer mounted on each lift pin 2 and the stage main body 1, and the semiconductor wafer is mounted on the stage main body 1 as each lift pin 2 descends.

[0005]

However, the semiconductor wafer is transferred in a state where the lift pins 2 are raised due to some trouble or the stage main body 1 is not moved to a predetermined transfer position of the semiconductor wafer. Then, the semiconductor wafer or the transfer arm may interfere with the lift pins 2. When the semiconductor wafer or the transfer arm interferes with the lift pins 2 in this manner, the semiconductor wafer may be damaged or damaged.

Accordingly, the present invention provides a lift pin and a stage device which do not damage or damage the semiconductor wafer even if the semiconductor wafer interferes with the transfer of the semiconductor wafer, and which does not affect the inspection process. The purpose is to do.

[0007]

According to a first aspect of the present invention, there is provided an apparatus for supporting a mounted body when transferring the mounted body on a stage, comprising a pin body and a tip of the pin body. And a pin tip piece removably mounted by being pressed from the lateral direction.

According to a second aspect of the present invention, in the lift pin according to the first aspect, detection means for detecting that the pin tip piece has come off from the tip end of the pin body is provided.

According to a third aspect of the present invention, in the lift pin according to the second aspect, the detecting means sucks the pin tip piece through an internal hole of the pin body, and the pin tip piece is changed by a change in the suction force. Is detected to be off.

According to a fourth aspect of the present invention, in the lift pin according to the second aspect, the detecting means is configured to detect the pin by a magnetic, electric or optical change between the pin body and the pin tip. It is characterized by detecting that the tip piece has come off.

According to a fifth aspect of the present invention, the object to be mounted is supported when the object to be mounted is transferred on a stage, and a pin body and a distal end of the pin body are pressed laterally. A lift pin comprising: a pin tip piece provided so as to be capable of tilting according to (1); and a spring member for returning the pin tip piece.

According to a sixth aspect of the present invention, there is provided a stage body for mounting a body to be mounted, and a plurality of stages provided on the stage body for transferring the body to the stage body. A plurality of lift pins for supporting the object to be mounted, the plurality of lift pins including a pin body, and a pin tip piece provided at a tip of the pin body so as to be detachable or tiltable by lateral pressing. A stage device, comprising: a lifting mechanism that raises and lowers each of the lift pins with respect to the stage main body when transferring a body.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a configuration diagram of a stage device to which a lift pin according to the present invention is applied. A plurality of lift pins, for example, three lift pins 10 are provided on the stage main body 1 so as to be able to move up and down through the stage main body 1. These lift pins 10 are inserted into holes 11 for lift of each lift pin 10 formed at three places of the stage main body 1. These three points are points that form the most stable triangle for supporting the semiconductor wafer 12.

The three lift pins 10 are, as shown in FIG. 2A, a columnar pin body 13 attached to a lifting mechanism.
And a pin tip piece 14 mounted on the tip of the pin main body 13 so as to be detachable by pressing in the lateral direction. These pin tip pieces 14 are made of a plastic-based resin that is hardly stained and slippery on the semiconductor wafer 12,
For example, it is formed of PEEK (polyethylene ether ketone). The pin body 13 has a vacuum suction hole (hereinafter referred to as a suction hole) 15 formed therein. The tip of the pin body 13 has a circular shallow groove 1
6 are formed. Further, the pin tip piece 14 is formed in a columnar shape having the same radius as the pin body 13, and a projection 17 having a shape to be fitted into the groove 16 of the pin body 13 is formed below the pin tip piece 14. Chamfers 18 and 19 are formed on the edge of the convex portion 17 and the edge of the bottom of the pin body 13 so that the chamfers 18 and 19 can be easily separated from the groove 16 when pressed from the lateral direction.

The lift pins 10 are not limited to the structure shown in FIG. 2A, but may have the structure shown in FIGS. 2B and 2C. The lift pins 10 shown in FIG. 4B are the same as the lift pins 10 shown in FIG.
The portion (pin head) that comes into contact with 2 is formed in a hemispherical shape 14a. By forming the pin head of the pin tip piece 14 into a hemispherical shape 14a in this manner, the portion in contact with the semiconductor wafer 12 is reduced, and contamination on the semiconductor wafer 12 is further reduced.

The lift pin 10 shown in FIG. 2C is, like the lift pin 10 shown in FIG. 2A, mounted on a columnar pin body 13 and detachably mounted on the tip of the pin body 13. And a pin tip piece 14. A conical groove 20 is formed at the tip of the pin body 13. The pin tip piece 14 has the pin body 1
A conical convex portion 21 having a shape to be fitted in the third groove 20 is formed.

As shown in FIG. 3, the lift pins 10 are connected to a vacuum sensor 25 via suction tubes 22 to 24, respectively, and further connected to a vacuum suction device 27 via a suction tube 26. Therefore, each lift pin 10 is in a state where the pin tip piece 14 is sucked and fixed to the tip of the pin body 13 by the vacuum suction operation of the vacuum suction device 27. Note that the vacuum suction force by the vacuum suction device 27 is a suction force that can be held to such an extent that the pin tip pieces 14 are not loose when the substrate is transferred by a transfer robot or the like.

The vacuum sensor 25 includes three lift pins 10
Of the vacuum pressure in the normal state in which the pin tip pieces 14 are respectively mounted on the tip ends of the pin body 13, and the pressure when the pin tip pieces 14 come off from the tip of the pin body 13 in at least one lift pin 10, for example. It has a function as a detecting means for detecting a difference and detecting that the pin tip piece 14 has come off from the tip of the pin body 13.

The vacuum sensor 25 has a function of, when detecting that the pin tip piece 14 has come off from the tip of the pin main body 13, displaying the fact, for example, or notifying by a buzzer or the like.

The lifting mechanism 28 raises the three lift pins 10 when transferring the semiconductor wafer 12 onto the stage body 1 by the transfer robot. In this state, the semiconductor wafer 12 is moved by the transfer arm or the like to the stage body 1. The semiconductor wafer 12 is transported upward, then the transport arm is lowered, and after the semiconductor wafer 12 is placed on the three lift pins 10 and the transport arm is retracted, the semiconductor wafer 12 is lowered by lowering the three lift pins 10. It has a function of being placed on the stage main body 1.

Next, the lift pin 1 constructed as described above is used.
The operation of the stage device provided with 0 will be described with reference to FIG.

In a standby state for transferring the semiconductor wafer onto the stage body 1, the three lift pins 10
As shown in (a), it is lowered by the elevating mechanism 28 and is lowered below the stage main body 1.

When the semiconductor wafer is transferred onto the stage main body 1, the three lift pins 10 are raised by the elevating mechanism 28 as shown in FIG.

Next, the semiconductor wafer 12 is held on the transfer arm 29 and transferred above the stage body 1 as shown in FIG.

Next, the transfer arm 29 is lowered, and the semiconductor wafer 12 is placed on the three lift pins 10. Thereafter, the transfer arm 29 is retracted from between the semiconductor wafer 12 mounted on the three lift pins 10 and the stage body 1.

Thereafter, the three lift pins 10 are moved down by the elevating mechanism 28, whereby the semiconductor wafer 12
Is mounted on the stage body 1.

On the other hand, when the semiconductor wafer 12 is unloaded from the stage main body 1, the operation for mounting the semiconductor wafer 12 on the stage main body 1 is reversed. First, the three lift pins 10 are The semiconductor wafer 12 is lifted by the lifting mechanism 28 as shown in c). In this state, the transfer arm 29 is inserted between the semiconductor wafer 12 mounted on the three lift pins 10 and the stage main body 1.

Next, the transfer arm 29 moves up, holds the semiconductor wafer 12 placed on the three lift pins 10, and transfers the semiconductor wafer 12 to a predetermined place in this state.

Next, the three lift pins 10 are
As shown in (a), it is lowered by the lifting mechanism 28.

By the way, the semiconductor wafer 12 as described above
At the time of transfer to the stage main body 1, the lift pin 10 is in a state of being raised due to some trouble,
Alternatively, if the semiconductor wafer 12 is delivered while the stage main body 1 is not moved to the predetermined delivery position of the semiconductor wafer 12, the semiconductor wafer 12 or the transfer arm 29 may interfere with the lift pins 10.

When the semiconductor wafer 12 or the transfer arm 29 interferes with the lift pins 10 as described above, the pin tip pieces 14 come off from the tips of the pin bodies 13 of at least one lift pin 10 as shown in FIG. At this time, the semiconductor wafer 12 or the transfer arm 29 is
Does not damage the semiconductor wafer 12 because the pin tip pieces 14 come off.

The vacuum sensor 25 includes three lift pins 10
Of the vacuum pressure in the normal state in which the pin tip pieces 14 are respectively mounted on the tip ends of the pin body 13, and the pressure when the pin tip pieces 14 come off from the tip of the pin body 13 in at least one lift pin 10, for example. The difference is detected, and it is detected that the pin tip piece 14 has come off from the tip of the pin body 13. Then, the vacuum sensor 25 displays the fact or notifies the user with a buzzer or the like.

Therefore, the inspector of the semiconductor wafer 12 recognizes that the pin tip piece 14 has come off even if the semiconductor wafer 12 or the transfer arm 29 interferes with the lift pins 10, and picks up the detached pin tip piece 14. The inspection can be continued simply by placing the lift pin 10 on the tip of the pin body 13.

As described above, in the first embodiment, the lift pin 10 is constituted by the cylindrical pin body 13 and the pin tip piece 14 detachably mounted on the tip of the pin body 13. Even if the semiconductor wafer 12 or the transfer arm 29 interferes with the lift pins 10 due to some kind of trouble, the pin tip pieces 14 come off from the tip of the pin main body 13 by being pressed from the side, so that the semiconductor wafer 12 is not damaged. I will not give.

The semiconductor wafer 12 or the transfer arm 29
The pin tip piece 14 which has come off due to the interference with the lift pin 10 can be immediately returned as the lift pin 10 simply by being placed on the tip of the pin body 13 of the lift pin 10, and the inspection of the semiconductor wafer 12 can be started immediately.

Further, the vacuum pressure in the normal state in which the pin tip pieces 14 are mounted on the tips of the pin bodies 13 of the three lift pins 10 by the vacuum sensor 25, for example, the pressure of the pin body 13 in at least one lift pin 10 Since it is detected that the pin tip piece 14 has come off from the tip of the pin body 13 based on the difference between the pressure when the pin tip piece 14 comes off from the tip, the normal state is distinguished from the error state in which the pin tip piece 14 has come off. Can be detected immediately when the pin tip 14 comes off from the tip of the pin body 13, and the pin tip 14 of the vacuum suction force by the vacuum suction device 27 can be held, so that the pin tip 14 comes off. Does not affect the semiconductor wafer 12 by the vacuum suction force.

(2) Next, a second embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 6 is a configuration diagram of a stage device to which the lift pin of the present invention is applied. This stage device is different from the first embodiment in that a detecting means for detecting that the pin tip piece 14 has come off from the tip of the pin main body 13 of the lift pin 10 has a different configuration. This detecting means scans the area of the pin tip piece 14 placed on the tip end of the pin body 13 with laser light and detects that the pin tip piece 14 has come off. Specifically, it is composed of a laser sensor 30 and a mirror 31 arranged at a position facing the laser sensor 30 via the stage body 1. The laser sensor 30 and the mirror 31 integrally scan the stage body 1 in the x direction, for example. The laser sensor 30 has a function of outputting a laser beam, receiving the reflected laser beam from the mirror 31, and detecting the presence or absence of the pin tip piece 14 based on the amount of the reflected laser beam received.

Incidentally, a laser oscillator may be provided in place of the laser sensor 30, and a light receiver may be provided in place of the mirror 31. In this case, the laser light output from the laser oscillator is received by the optical receiver, and the presence or absence of the pin tip 14 is detected from the amount of the received laser light.

With such a configuration, the stage body 1
When transferring the semiconductor wafer upward, the three lift pins 10 are raised by the lifting mechanism 28 and protrude from the holes 11 of the stage body 1. Next, the semiconductor wafer 1
2 is held on the transfer arm 29 and transferred above the stage body 1.

At this time, if the semiconductor wafer 12 or the transfer arm 29 interferes with the lift pins 10 due to some problem, the pin tip piece 14 comes off from the tip of the pin body 13 of at least one lift pin 10.

The laser sensor 30 and the mirror 31 output laser light from the laser sensor 30 while scanning the stage body 1 integrally in, for example, the x direction, receive reflected laser light from the mirror 31 and reflect the reflected laser light. The presence or absence of the pin tip piece 14 is detected from the amount of laser light received.

For example, when the three lift pins 10 are in a normal state, the laser beam is shielded by the pin tip pieces 14 at three places by one scanning of the laser sensor 30 and the mirror 31, and the amount of received light is reduced.

However, at least one lift pin 1
If the pin tip piece 14 at 0 is off, there is one less pin tip piece 14 for blocking the laser beam, so that the laser beam is blocked and received at two locations by one scan of the laser sensor 30 and the mirror 31. The amount is reduced.

Accordingly, it can be detected that the pin tip piece 14 has come off the tip of the pin body 13 at the number of places where the laser beam is blocked. Also, the pin tip 14 is determined based on the three positions where the laser light is shielded in the normal state and the two positions where the laser light is shielded by removing one pin tip 14, for example.
The position of the lift pin 10 from which has been removed can be seen.

According to the second embodiment, it goes without saying that the same effects as those of the first embodiment can be obtained.

(3) Next, a third embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 7 is a configuration diagram of a stage device to which the lift pin of the present invention is applied. This stage device is different from the first embodiment in that the structure of the lift pins 40 is changed. The lift pin 40 is composed of a pin body 41 and a pin tip piece 42 that is provided so as to be capable of falling and rising with respect to the tip of the pin body 41. A rotation shaft 43 is provided between the pin body 41 and the pin tip piece 42.
Thus, the transfer arm is connected rotatably in the insertion direction of the transfer arm (the direction of arrow A). Also, the pin body 41 and the pin tip piece 42
The pin body 41 and the pin tip piece 42
Is provided through the spring member 44. Therefore, even if the pin tip piece 42 falls down around the rotation shaft 43 with respect to the pin main body 41 in response to the pressing in the direction of the arrow A, the spring member 44 is released when the pressure applied to the pin tip piece 42 is removed.
It comes to get up by the return power of.

The lift pins 40 are connected to the transfer arm 29
The direction in which the pin tip piece 42 rotates coincides with the direction in which the pin tip piece 42 enters and retracts on the stage main body 1.

With such a configuration, the stage body 1
When the semiconductor wafer is transferred upward, the three lift pins 40 are raised by the lifting mechanism 28 and protrude from the holes 11 of the stage main body 1. Next, the semiconductor wafer 1
2 is held on the transfer arm 29 and transferred above the stage body 1.

At this time, if the semiconductor wafer 12 or the transfer arm 29 interferes with the lift pins 40 due to some problem, the pin tip pieces 42 of at least one lift pin 40 fall around the rotation shaft 43. Even if the pin tip piece 42 falls down, the pin tip piece 42 is raised by the return force of the spring member 44. Thus, the pin tip pieces 42 rise up on the bottom surface of the semiconductor wafer 12 and can support the semiconductor wafer 12.

According to the third embodiment, it goes without saying that the same effect as the first embodiment can be obtained.

The present invention is not limited to the above-described first to third embodiments, and various modifications can be made in the implementation stage without departing from the scope of the invention.

Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent features. For example, even if some components are deleted from all the components shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the problem described in the column of the effect of the invention can be solved. In the case where a certain effect can be obtained, a configuration from which this configuration requirement is deleted can be extracted as an invention. For example, as a sensor for detecting the detachment or tilting state of the pin tip piece, a magnetic sensor for detecting a magnetic change such as a magnetic switch, a reflected light receiving electric sensor for detecting light reflected from the pin tip piece, a lift pin body and a pin An electric sensor such as a microswitch that detects electric contact with the tip piece or a reed switch can also be used.

[0056]

As described above in detail, according to the present invention, even if the semiconductor wafer interferes with the transfer of the semiconductor wafer, the semiconductor wafer is not damaged or damaged, and does not affect the inspection process. And a lift device and a stage device that do not provide the same.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of a stage device to which a lift pin according to the present invention is applied.

FIG. 2 is a structural diagram of a lift pin in the first embodiment of the stage device to which the lift pin according to the present invention is applied.

FIG. 3 is a diagram showing connection of a vacuum suction device to the lift pins in the first embodiment of the stage device to which the lift pins according to the present invention are applied.

FIG. 4 is a view showing a semiconductor wafer transfer operation in the first embodiment of the stage device to which the lift pins according to the present invention are applied.

FIG. 5 is a view showing an operation of the lift pins when a semiconductor wafer or a transfer arm interferes in the first embodiment of the stage device to which the lift pins according to the present invention are applied.

FIG. 6 is a configuration diagram showing a second embodiment of a stage device to which a lift pin according to the present invention is applied.

FIG. 7 is a configuration diagram showing a third embodiment of a stage device to which a lift pin according to the present invention is applied.

FIG. 8 is a configuration diagram of a lift pin in a second embodiment of a stage device to which the lift pin according to the present invention is applied.

FIG. 9 is a configuration diagram of a conventional stage device.

[Explanation of symbols]

 1: Stage main body 10: Lift pin 11: Hole 12: Semiconductor wafer 13: Pin main body 14: Pin tip piece 15: Suction hole 16: Groove 17: Convex portion 18, 19: Chamfer 20: Groove 21: Convex portion 22 to 24, 26: Suction tube 25: Vacuum sensor 27: Vacuum suction device 28: Elevating mechanism 29: Transfer arm 30: Laser sensor 31: Mirror 40: Lift pin 41: Pin body 42: Pin tip 43: Rotating shaft 44: Spring member

Claims (6)

[Claims] 1. A device for supporting an object to be mounted when the object to be mounted is transferred on a stage, and is mounted on a pin main body and a tip of the pin main body so as to be detachable by a lateral pressing. A lift pin comprising a pin tip piece. 2. The lift pin according to claim 1, further comprising detection means for detecting that the pin tip piece has come off the tip of the pin body. 3. The pin detecting device according to claim 2, wherein said detecting means sucks said pin tip piece through an internal hole of said pin body, and detects that said pin tip piece has come off due to a change in said suction force. Lift pin as described. 4. The apparatus according to claim 1, wherein said detecting means detects that the pin tip has come off due to a magnetic, electrical or optical change between the pin body and the pin tip. Item 4. The lift pin according to Item 2. 5. A pin body for supporting the object when the object is transferred on a stage, and is provided at a tip of the pin body so as to be tiltable by a lateral pressing. A lift pin comprising a pin tip piece and a spring member for returning the pin tip piece. 6. A stage main body for mounting a mounted body, and provided at a plurality of positions on the stage main body, and supporting the mounted body when transferring the mounted body on the stage main body. A plurality of lift pins each including a pin body, and a pin tip piece that is detachably or tiltably provided at a tip of the pin body by pressing in a lateral direction; and A stage device comprising: a lifting mechanism that raises and lowers each lift pin with respect to the stage main body.