WO2012157638A1 - Substrate placing base and substrate processing device - Google Patents

Substrate placing base and substrate processing device Download PDF

Info

Publication number
WO2012157638A1
WO2012157638A1 PCT/JP2012/062398 JP2012062398W WO2012157638A1 WO 2012157638 A1 WO2012157638 A1 WO 2012157638A1 JP 2012062398 W JP2012062398 W JP 2012062398W WO 2012157638 A1 WO2012157638 A1 WO 2012157638A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
lifter pin
mounting table
hole
lifter
Prior art date
Application number
PCT/JP2012/062398
Other languages
French (fr)
Japanese (ja)
Inventor
洋生 西山
杉本　修
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012157638A1 publication Critical patent/WO2012157638A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • the present invention relates to a substrate mounting table and a substrate processing apparatus, and more particularly to a substrate mounting table including lifter pins and a substrate processing apparatus including the same.
  • a substrate mounting table provided in a substrate processing chamber for receiving a substrate is conventionally known.
  • Such a substrate mounting table is described in, for example, Japanese Patent Laid-Open No. 2007-235116 (Patent Document 1).
  • a lifter pin for receiving a substrate has a main body and a head portion having a larger diameter than the main body.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate mounting table capable of suppressing substrate damage and particle generation, and a substrate processing apparatus including the same. It is to provide.
  • the substrate mounting table according to the present invention extends along the first direction, and is inserted through the hole, the main body having a mounting surface on which the substrate is mounted, and a hole opening on the mounting surface. And a lifter pin capable of moving back and forth along a second direction intersecting the first direction.
  • the lifter pin includes an action force reducing unit that reduces a force acting on the substrate by contacting the substrate and the lifter pin when the substrate is placed.
  • the acting force reduction unit includes a first part that absorbs a force in the first direction and a second part that absorbs a force in the second direction.
  • the first portion of the acting force reduction unit includes a rotating member that rotates about an axis parallel to the first direction.
  • the first portion of the acting force reducing portion includes a curved surface member having a low resistance portion in which a curved surface is formed at a portion facing the substrate and a frictional resistance against the substrate is low with respect to the other portions.
  • the second portion of the acting force reduction unit includes an elastic member that can expand and contract along the second direction.
  • the lifter pin includes a rotating member that rotates about an axis parallel to the first direction and an elastic member that can expand and contract along the second direction.
  • the lifter pin has a curved surface formed in a portion facing the substrate, a curved member having a low resistance portion with low frictional resistance against the substrate relative to the other portion, and along the second direction. And an elastic member that can be expanded and contracted.
  • a substrate processing apparatus includes a substrate processing chamber for processing a substrate and the above-described substrate mounting table housed in the substrate processing chamber.
  • the present invention it is possible to suppress damage to the substrate and generation of particles when the substrate is placed on the substrate placing table.
  • FIG. 1 is a diagram showing a substrate mounting table and a substrate processing apparatus including the same according to Embodiments 1 to 4 of the present invention.
  • FIG. It is a figure which shows an example of arrangement
  • FIG. It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention.
  • FIG. It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 2 of this invention.
  • FIG. 1 It is a figure which shows the lifter pin which concerns on the comparative example 1. It is a figure which shows the lifter pin which concerns on the comparative example 2. It is a graph which shows the defect generation rate at the time of using the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention, and the lifter pin which concerns on the comparative examples 1 and 2.
  • FIG. 1 shows the defect generation rate at the time of using the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention, and the lifter pin which concerns on the comparative examples 1 and 2.
  • FIG. 1 is a view showing a substrate mounting table and a substrate processing apparatus including the same according to Embodiments 1 to 4 described later.
  • FIG. 2 is a diagram showing an example of the arrangement of lifter pins in the substrate mounting table shown in FIG.
  • the substrate mounting table includes a main body 100 and lifter pins 200.
  • the main body 100 and the lifter pins 200 are accommodated in the substrate processing chamber 300. Thereby, a substrate processing apparatus is configured.
  • the substrate processing apparatus performs various processes on the substrate S placed on the substrate mounting table.
  • the “various treatments” referred to here include heat treatment, film formation treatment, etching, ashing, and the like on the substrate, and the scope of the present invention is not limited by the contents of this treatment.
  • the main body 100 has a placement surface 100A on which the substrate S is placed, and a hole 100B that opens on the placement surface 100A.
  • the hole 100B extends in a direction (typically, a direction orthogonal to) the direction in which the placement surface 100A extends (the horizontal direction in FIG. 1 and the direction perpendicular to the paper surface).
  • the lifter pin 200 is inserted through the hole 100B and can move forward and backward along the extending direction of the hole 100B.
  • the lifter pin 200 is driven back and forth by driving means (not shown).
  • a plurality of lifter pins 200 are provided on the mounting surface 100 ⁇ / b> A of the main body 100.
  • the lifter pins 200 are arranged in a lattice shape so that a plurality of lifter pins 200 are arranged in the vertical and horizontal directions.
  • the arrangement of the lifter pins 200 is not limited to that shown in FIG.
  • the procedure for processing the substrate S by the substrate processing apparatus is as follows. First, the substrate S is carried into the substrate processing chamber 300 from the state where the substrate S is not placed on the main body 100. At this time, the substrate S is held by a holding device (not shown).
  • the lifter pin 200 is driven upward to cause the lifter pin 200 to protrude upward from the mounting surface 100A of the main body 100.
  • the lifter pin 200 may be driven upward before the substrate S is carried into the substrate processing chamber 300.
  • the substrate S is placed on the lifter pins 200 in a state where the lifter pins 200 protrude upward from the placement surface 100A of the main body 100 (the state of the two-dot chain line in FIG. 1). Thereafter, the lifter pin 200 is driven downward to house the lifter pin 200 in the hole 100B (solid line state in FIG. 1). At this time, the upper end of the lifter pin 200 may be located at the same height as the placement surface 100A, or may be located at a height lower than the placement surface 100A.
  • the substrate S is placed on the placement surface 100A of the main body 100 by the above-described operation.
  • the above-described “various processes” are performed on the substrate S.
  • the substrate S that has been subjected to the predetermined processing is lifted again by the lifter pins 200 and separated from the placement surface 100A (in the state of the two-dot chain line in FIG. 1).
  • the substrate S is again gripped by the above-described gripping device (not shown) and carried out of the substrate processing chamber 300. Thereafter, an unprocessed substrate S (next substrate) is carried into the substrate processing chamber 300, and predetermined processing is performed in the above-described procedure. In this way, predetermined processing is continuously performed on the plurality of substrates S.
  • the lifter pins 200 shown in the first to fourth embodiments have a structure that reduces the forces in the vertical and horizontal directions and suppresses damage to the substrate S when coming into contact with the substrate S. It is what you have. The specific structure of each embodiment will be described later.
  • FIG. 3 is a diagram illustrating a configuration of lifter pins in the substrate mounting table according to the first embodiment.
  • the lifter pin 200 according to the present embodiment includes a rotating member 210, an elastic member 220, and a cylindrical member 230.
  • Rotating member 210 is provided at the tip of lifter pin 210 and contacts the back surface of substrate S.
  • the rotation member 210 can rotate in the direction of the arrow DR210.
  • the rotating member 210 may be roller-shaped or spherical.
  • the rotating member 210 has a roller shape, it is possible to absorb the lateral force in FIG. 3 by rotating the rotating member 210 in the direction of the arrow DR210. In this case, it is possible to absorb forces in two different directions by using a plurality of lift pins 200 having different directions in which the rotating member 210 rotates (for example, alternately arranged).
  • the rotating member 210 is spherical, the rotating member 210 is provided so as to be rotatable in the direction of a plane perpendicular to the paper surface in addition to the direction of the arrow DR210. In addition to the direction, it is possible to absorb a force in a direction perpendicular to the paper surface.
  • the elastic member 220 is constituted by a coil spring.
  • the elastic member 220 can be expanded and contracted in the direction of the arrow DR220. Therefore, it is possible to absorb the force in the vertical direction in FIG.
  • the cylindrical member 230 is provided so as to surround the outer periphery of the elastic member 220.
  • the cylindrical member 230 defines the expansion / contraction direction of the elastic member 220 (the direction of the arrow DR220).
  • the rotation of the rotation member 210 can absorb the force in the horizontal direction in FIG.
  • the vertical force in FIG. 3 can be absorbed. Therefore, even if the substrate S hanging from the deflection and the lifter pin 200 come into contact with each other, the force due to the contact can be absorbed and the force acting on the substrate S can be reduced. As a result, damage to the substrate S and generation of particles are suppressed, and the defect occurrence rate of the substrate S can be reduced.
  • FIG. 9 shows the defect occurrence rate of the substrate S when the lifter pin 200A according to FIG. 7 (Comparative Example 1) and FIG. 8 (Comparative Example 2) and the lifter pin 200 according to the present embodiment (the present invention) are used. It is a graph which shows the result of comparison.
  • the substrate S a large substrate (liquid crystal panel) that is easily bent is used.
  • the substrate S is defective with a considerably high probability (80% or more probability).
  • the probability of occurrence of defects is low (probability of 5% or less).
  • the defect occurrence rate is markedly higher than when the lifter pin 200A according to Comparative Examples 1 and 2 is used. It can be reduced.
  • FIG. 4 is a diagram showing a configuration of lifter pins in the substrate mounting table according to the second embodiment.
  • the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first embodiment, and is characterized in that the cylindrical member 230 is not provided.
  • the cylindrical member 230 in the first embodiment defines the expansion / contraction direction of the elastic member 220 (the direction of the arrow DR220), but the lifter pin 200 is the hole 100B of the main body 100 (see FIG. 1). Therefore, even if the cylindrical member 230 is not provided, the expansion / contraction direction of the elastic member 220 is defined to some extent by the inner peripheral surface of the hole 100B. It is possible to do.
  • lifter pins 200 according to the present embodiment it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S in which bending is likely to occur, similarly to the lifter pins 200 according to the first embodiment.
  • FIG. 5 is a diagram illustrating a configuration of lifter pins in the substrate mounting table according to the third embodiment.
  • the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first and second embodiments, and instead of the elastic member 220 formed of a coil spring, a rod-shaped elastic member 221 is used. It is characterized by providing.
  • lifter pins 200 according to the present embodiment it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S in which bending is likely to occur, similarly to the lifter pins 200 according to the first and second embodiments.
  • FIG. 6 is a diagram showing a configuration of lifter pins in the substrate mounting table according to the fourth embodiment.
  • the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first to third embodiments, and is provided with a curved member 211 that does not rotate instead of the rotating member 210. It is characterized by that.
  • the rod-shaped elastic member 221 is shown in FIG. 6, it may replace with this and may use the elastic member 220 which consists of a coil spring.
  • the curved surface member 211 has a low resistance portion 211A having a low frictional resistance against the back surface of the substrate S relative to other portions of the curved surface member 211 at a position where the back surface of the substrate S can come into contact. Thereby, even when the board
  • lifter pins 200 according to the present embodiment it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S where bending is likely to occur, similarly to the lifter pins 200 according to the first to third embodiments.
  • the present invention can be used for a substrate mounting table and a substrate processing apparatus.
  • 100 body 100A mounting surface, 100B hole, 200 lifter pin, 210 rotating member, 211 curved member, 211A low resistance portion, 220, 221 elastic member, 230 cylindrical member.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate placing base is provided with a main body (100) having a placing surface (100A) on which a substrate is placed and a hole section (100B) opened to the placing surface (100A), and a lifterpin (200) which is inserted into the hole section (100B) and can be moved forward and backward along the extending direction of the hole section (100B), wherein the lifterpin (200) includes a rotating member (210) which rotates around an axis in parallel with the extending direction of the placing surface (100A) and an elastic member (220) which is extendable and contractable in the extending direction of the hole section (100B).

Description

基板載置台および基板処理装置Substrate mounting table and substrate processing apparatus
　本発明は、基板載置台および基板処理装置に関し、特に、リフタピンを含む基板載置台およびそれを備えた基板処理装置に関する。 The present invention relates to a substrate mounting table and a substrate processing apparatus, and more particularly to a substrate mounting table including lifter pins and a substrate processing apparatus including the same.
　基板処理室内に設けられた基板載置台であって、基板を受けるための基板載置台が従来から知られている。このような基板載置台は、たとえば、特開２００７－２３５１１６号公報（特許文献１）に記載されている。 A substrate mounting table provided in a substrate processing chamber for receiving a substrate is conventionally known. Such a substrate mounting table is described in, for example, Japanese Patent Laid-Open No. 2007-235116 (Patent Document 1).
　特許文献１に記載の基板載置台においては、基板を受けるためのリフタピンが、本体と、本体よりも大径のヘッド部とを有している。 In the substrate mounting table described in Patent Document 1, a lifter pin for receiving a substrate has a main body and a head portion having a larger diameter than the main body.
特開２００７－２３５１１６号公報JP 2007-235116 A
　大型の基板を持ち上げると、基板にたわみが生じる。このような大型の基板を基板載置台に載置しようとすると、リフタピンが基板を受けるときに、リフタピンのヘッド部が基板のたわみにより垂れ下がった部分に擦れ、これが基板裏面の損傷やパーティクルの発生に繋がることが懸念される。 When a large substrate is lifted, the substrate will bend. When trying to place such a large substrate on the substrate mounting table, when the lifter pin receives the substrate, the head portion of the lifter pin rubs against the sagging portion due to the deflection of the substrate, which causes damage to the back surface of the substrate and generation of particles. There is concern about being connected.
　本発明は、上記のような問題に鑑みてなされたものであり、本発明の目的は、基板の損傷やパーティクルの発生を抑制することが可能な基板載置台およびそれを備えた基板処理装置を提供することにある。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate mounting table capable of suppressing substrate damage and particle generation, and a substrate processing apparatus including the same. It is to provide.
　本発明に係る基板載置台は、第１方向に沿って延在し、基板が載置される載置面と、載置面上に開口する穴部とを有する本体と、穴部に挿通され、第１方向に対して交差する第２方向に沿って進退移動可能なリフタピンとを備えるものである。 The substrate mounting table according to the present invention extends along the first direction, and is inserted through the hole, the main body having a mounting surface on which the substrate is mounted, and a hole opening on the mounting surface. And a lifter pin capable of moving back and forth along a second direction intersecting the first direction.
　本発明における１つの局面では、上記リフタピンは、基板を載置する時に基板とリフタピンとが接触することにより基板に作用する力を低減する作用力低減部を含む。 In one aspect of the present invention, the lifter pin includes an action force reducing unit that reduces a force acting on the substrate by contacting the substrate and the lifter pin when the substrate is placed.
　１つの実施態様では、作用力低減部は、第１方向の力を吸収する第１部分と、第２方向の力を吸収する第２部分とを有する。 In one embodiment, the acting force reduction unit includes a first part that absorbs a force in the first direction and a second part that absorbs a force in the second direction.
　１つの実施態様では、作用力低減部の第１部分は、第１方向に平行な軸まわりに回動する回動部材を有する。 In one embodiment, the first portion of the acting force reduction unit includes a rotating member that rotates about an axis parallel to the first direction.
　１つの実施態様では、作用力低減部の第１部分は、基板と対向する部分に曲面が形成され、他の部分に対して基板に対する摩擦抵抗が低い低抵抗部分を有する曲面部材を有する。 In one embodiment, the first portion of the acting force reducing portion includes a curved surface member having a low resistance portion in which a curved surface is formed at a portion facing the substrate and a frictional resistance against the substrate is low with respect to the other portions.
　１つの実施態様では、作用力低減部の第２部分は、第２方向に沿って伸縮可能な弾性部材を有する。 In one embodiment, the second portion of the acting force reduction unit includes an elastic member that can expand and contract along the second direction.
　本発明における他の局面では、上記リフタピンは、第１方向に平行な軸まわりに回動する回動部材と、第２方向に沿って伸縮可能な弾性部材とを含む。 In another aspect of the present invention, the lifter pin includes a rotating member that rotates about an axis parallel to the first direction and an elastic member that can expand and contract along the second direction.
　本発明におけるさらに他の局面では、上記リフタピンは、基板と対向する部分に曲面が形成され、他の部分に対して基板に対する摩擦抵抗が低い低抵抗部分を有する曲面部材と、第２方向に沿って伸縮可能な弾性部材とを含む。 In yet another aspect of the present invention, the lifter pin has a curved surface formed in a portion facing the substrate, a curved member having a low resistance portion with low frictional resistance against the substrate relative to the other portion, and along the second direction. And an elastic member that can be expanded and contracted.
　本発明に係る基板処理装置は、基板に処理を施すための基板処理室と、基板処理室中に収納された、上述した基板載置台とを備えるものである。 A substrate processing apparatus according to the present invention includes a substrate processing chamber for processing a substrate and the above-described substrate mounting table housed in the substrate processing chamber.
　本発明によれば、基板載置台に基板を載置する際の基板の損傷やパーティクルの発生を抑制することができる。 According to the present invention, it is possible to suppress damage to the substrate and generation of particles when the substrate is placed on the substrate placing table.
本発明の実施の形態１～４に係る基板載置台およびそれを備えた基板処理装置を示す図である。1 is a diagram showing a substrate mounting table and a substrate processing apparatus including the same according to Embodiments 1 to 4 of the present invention. FIG. 図１に示す基板載置台におけるリフタピンの配置の一例を示す図である。It is a figure which shows an example of arrangement | positioning of the lifter pin in the substrate mounting base shown in FIG. 本発明の実施の形態１に係る基板載置台におけるリフタピンの構成を示す図である。It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係る基板載置台におけるリフタピンの構成を示す図である。It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 2 of this invention. 本発明の実施の形態３に係る基板載置台におけるリフタピンの構成を示す図である。It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係る基板載置台におけるリフタピンの構成を示す図である。It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 4 of this invention. 比較例１に係るリフタピンを示す図である。It is a figure which shows the lifter pin which concerns on the comparative example 1. 比較例２に係るリフタピンを示す図である。It is a figure which shows the lifter pin which concerns on the comparative example 2. 本発明の実施の形態１に係る基板載置台におけるリフタピンと、比較例１，２に係るリフタピンとを用いた場合の不良発生率を示すグラフである。It is a graph which shows the defect generation rate at the time of using the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention, and the lifter pin which concerns on the comparative examples 1 and 2. FIG.
　以下に、本発明の実施の形態について説明する。なお、同一または相当する部分に同一の参照符号を付し、その説明を繰返さない場合がある。 Hereinafter, embodiments of the present invention will be described. Note that the same or corresponding portions are denoted by the same reference numerals, and the description thereof may not be repeated.
　なお、以下に説明する実施の形態において、個数、量などに言及する場合、特に記載がある場合を除き、本発明の範囲は必ずしもその個数、量などに限定されない。また、以下の実施の形態において、各々の構成要素は、特に記載がある場合を除き、本発明にとって必ずしも必須のものではない。 In the embodiment described below, when referring to the number, amount, etc., the scope of the present invention is not necessarily limited to the number, amount, etc. unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.
　図１は、後述する実施の形態１～４に係る基板載置台およびそれを備えた基板処理装置を示す図である。また、図２は、図１に示す基板載置台におけるリフタピンの配置の一例を示す図である。 FIG. 1 is a view showing a substrate mounting table and a substrate processing apparatus including the same according to Embodiments 1 to 4 described later. FIG. 2 is a diagram showing an example of the arrangement of lifter pins in the substrate mounting table shown in FIG.
　図１に示すように、実施の形態１～４に係る基板載置台は、本体１００と、リフタピン２００とを含む。本体１００およびリフタピン２００は、基板処理室３００内に収納される。これにより、基板処理装置が構成される。 As shown in FIG. 1, the substrate mounting table according to the first to fourth embodiments includes a main body 100 and lifter pins 200. The main body 100 and the lifter pins 200 are accommodated in the substrate processing chamber 300. Thereby, a substrate processing apparatus is configured.
　基板処理装置は、基板載置台上に載置された基板Ｓに対して種々の処理を施すものである。ここで言う「種々の処理」とは、基板に対する加熱処理、成膜処理、エッチング、アッシング等を含み、本発明の範囲は、この処理の内容により限定されない。 The substrate processing apparatus performs various processes on the substrate S placed on the substrate mounting table. The “various treatments” referred to here include heat treatment, film formation treatment, etching, ashing, and the like on the substrate, and the scope of the present invention is not limited by the contents of this treatment.
　本体１００は、基板Ｓが載置される載置面１００Ａと、載置面１００Ａ上に開口する穴部１００Ｂとを有する。穴部１００Ｂは、載置面１００Ａの延在方向（図１における左右方向および紙面に垂直な方向）に対して交差する方向（典型的には直交する方向）に延びる。 The main body 100 has a placement surface 100A on which the substrate S is placed, and a hole 100B that opens on the placement surface 100A. The hole 100B extends in a direction (typically, a direction orthogonal to) the direction in which the placement surface 100A extends (the horizontal direction in FIG. 1 and the direction perpendicular to the paper surface).
　リフタピン２００は、穴部１００Ｂに挿通され、穴部１００Ｂの延在方向に沿って進退移動することが可能である。リフタピン２００は、図示しない駆動手段により進退駆動される。リフタピン２００は、図２に示すように、本体１００の載置面１００Ａ上において複数設けられる。図２の例では、リフタピン２００は、縦横方向にそれぞれ複数並ぶように、格子状に配置されている。なお、リフタピン２００の配置は、図２に示すものに限定されない。 The lifter pin 200 is inserted through the hole 100B and can move forward and backward along the extending direction of the hole 100B. The lifter pin 200 is driven back and forth by driving means (not shown). As shown in FIG. 2, a plurality of lifter pins 200 are provided on the mounting surface 100 </ b> A of the main body 100. In the example of FIG. 2, the lifter pins 200 are arranged in a lattice shape so that a plurality of lifter pins 200 are arranged in the vertical and horizontal directions. The arrangement of the lifter pins 200 is not limited to that shown in FIG.
　基板処理装置によって基板Ｓに処理を施す手順は、次のとおりである。まず、本体１００上に基板Ｓが載置されていない状態から、基板処理室３００内に基板Ｓを搬入する。この時、基板Ｓは、図示しない把持装置により把持されている。 The procedure for processing the substrate S by the substrate processing apparatus is as follows. First, the substrate S is carried into the substrate processing chamber 300 from the state where the substrate S is not placed on the main body 100. At this time, the substrate S is held by a holding device (not shown).
　次に、リフタピン２００を上方に駆動して、リフタピン２００を本体１００の載置面１００Ａから上方に突出させる。なお、基板処理室３００内に基板Ｓを搬入する前に、リフタピン２００を上方に駆動しておいてもよい。 Next, the lifter pin 200 is driven upward to cause the lifter pin 200 to protrude upward from the mounting surface 100A of the main body 100. Note that the lifter pin 200 may be driven upward before the substrate S is carried into the substrate processing chamber 300.
　リフタピン２００を本体１００の載置面１００Ａから上方に突出させた状態で、リフタピン２００上に基板Ｓを載置する（図１における二点鎖線の状態）。その後、リフタピン２００を下方に駆動して、リフタピン２００を穴部１００Ｂ内に収納する（図１における実線の状態）。このとき、リフタピン２００の上端は、載置面１００Ａと同じ高さに位置していてもよいし、載置面１００Ａよりも低い高さに位置していてもよい。 The substrate S is placed on the lifter pins 200 in a state where the lifter pins 200 protrude upward from the placement surface 100A of the main body 100 (the state of the two-dot chain line in FIG. 1). Thereafter, the lifter pin 200 is driven downward to house the lifter pin 200 in the hole 100B (solid line state in FIG. 1). At this time, the upper end of the lifter pin 200 may be located at the same height as the placement surface 100A, or may be located at a height lower than the placement surface 100A.
　上述の動作により、基板Ｓが本体１００の載置面１００Ａ上に載置される。基板Ｓが本体１００の載置面１００Ａに載置された状態で、基板Ｓに対して、上述の「種々の処理」が施される。所定の処理が施された基板Ｓは、リフタピン２００により再び持ち上げられ、載置面１００Ａから離間する（図１における二点鎖線の状態）。 The substrate S is placed on the placement surface 100A of the main body 100 by the above-described operation. In the state where the substrate S is placed on the placement surface 100 </ b> A of the main body 100, the above-described “various processes” are performed on the substrate S. The substrate S that has been subjected to the predetermined processing is lifted again by the lifter pins 200 and separated from the placement surface 100A (in the state of the two-dot chain line in FIG. 1).
　基板Ｓが載置面１００Ａから離間した状態で、基板Ｓは、上述した把持装置（図示せず）により再び把持され、基板処理室３００の外部へと搬出される。その後、未処理の基板Ｓ（次の基板）が基板処理室３００内に搬入され、上述した手順で所定の処理が施される。このようにして、複数の基板Ｓに対して連続的に所定の処理が施される。 In a state where the substrate S is separated from the placement surface 100A, the substrate S is again gripped by the above-described gripping device (not shown) and carried out of the substrate processing chamber 300. Thereafter, an unprocessed substrate S (next substrate) is carried into the substrate processing chamber 300, and predetermined processing is performed in the above-described procedure. In this way, predetermined processing is continuously performed on the plurality of substrates S.
　近年、たとえば液晶表示装置の大型化などにより、大型の基板（液晶パネル）を取り扱うことが増えている。基板Ｓが大型化すると、基板Ｓを把持したときに、該基板に生じるたわみ量が大きくなる傾向にある。この結果、図７、図８に示すように、基板Ｓをリフタピン（図７、図８上のリフタピン２００Ａ）上に載置する時、たわみにより垂れ下がった部分がリフタピンの先端に接触しやすい。この接触による衝撃が大きいと、基板Ｓが損傷したり、意図しないパーティクルが発生して、当該パーティクルが基板Ｓ上に付着するなどして、不良が発生する確率が高まることが懸念される。したがって、仮に、垂れ下がった基板Ｓとリフタピンとが接触しても、その接触により基板Ｓに作用する力を低減することが重要である。 In recent years, for example, due to the increase in size of liquid crystal display devices, handling of large substrates (liquid crystal panels) is increasing. When the size of the substrate S increases, the amount of deflection generated in the substrate S tends to increase when the substrate S is gripped. As a result, as shown in FIGS. 7 and 8, when the substrate S is placed on the lifter pin (the lifter pin 200A in FIGS. 7 and 8), the portion that hangs down due to deflection tends to come into contact with the tip of the lifter pin. If the impact due to this contact is great, the substrate S may be damaged, or unintended particles may be generated and the particles may adhere to the substrate S, thereby increasing the probability of occurrence of a defect. Therefore, even if the suspended substrate S and the lifter pins come into contact with each other, it is important to reduce the force acting on the substrate S due to the contact.
　実施の形態１～４に示すリフタピン２００は、上記のような課題を解決するために、基板Ｓと接触したときに、上下左右方向の力を低減し、基板Ｓの損傷等を抑制する構造を有するものである。各実施の形態の具体的な構造については、後述する。 In order to solve the above-described problems, the lifter pins 200 shown in the first to fourth embodiments have a structure that reduces the forces in the vertical and horizontal directions and suppresses damage to the substrate S when coming into contact with the substrate S. It is what you have. The specific structure of each embodiment will be described later.
　（実施の形態１）
　図３は、実施の形態１に係る基板載置台におけるリフタピンの構成を示す図である。図３に示すように、本実施の形態に係るリフタピン２００は、回動部材２１０と、弾性部材２２０と、筒状部材２３０とを含む。 (Embodiment 1)
FIG. 3 is a diagram illustrating a configuration of lifter pins in the substrate mounting table according to the first embodiment. As shown in FIG. 3, the lifter pin 200 according to the present embodiment includes a rotating member 210, an elastic member 220, and a cylindrical member 230.
　回動部材２１０は、リフタピン２１０の先端に設けられており、基板Ｓの裏面に接触するものである。回動部材２１０は、矢印ＤＲ２１０方向に回動可能である。回動部材２１０は、ころ状のものであってもよいし、球状のものであってもよい。たとえば、回動部材２１０がころ状のものであれば、回動部材２１０が矢印ＤＲ２１０方向に回動することで、図３における左右方向の力を吸収することが可能である。この場合、回動部材２１０が回動する方向が異なる複数のリフトピン２００を組み合わせて用いる（たとえば交互に並べる）ことにより、異なる二方向の力を吸収することが可能である。 Rotating member 210 is provided at the tip of lifter pin 210 and contacts the back surface of substrate S. The rotation member 210 can rotate in the direction of the arrow DR210. The rotating member 210 may be roller-shaped or spherical. For example, if the rotating member 210 has a roller shape, it is possible to absorb the lateral force in FIG. 3 by rotating the rotating member 210 in the direction of the arrow DR210. In this case, it is possible to absorb forces in two different directions by using a plurality of lift pins 200 having different directions in which the rotating member 210 rotates (for example, alternately arranged).
　たとえば、回動部材２１０が球状のものであれば、回動部材２１０は、矢印ＤＲ２１０方向に加えて、紙面に垂直な平面の方向にも回動可能に設けられ、この結果、図３における左右方向に加えて、紙面に垂直な方向の力を吸収することが可能である。 For example, if the rotating member 210 is spherical, the rotating member 210 is provided so as to be rotatable in the direction of a plane perpendicular to the paper surface in addition to the direction of the arrow DR210. In addition to the direction, it is possible to absorb a force in a direction perpendicular to the paper surface.
　図２の例では、弾性部材２２０は、コイルばねにより構成されている。弾性部材２２０は、矢印ＤＲ２２０方向に伸縮可能である。したがって、弾性部材２２０の伸縮により、図３における上下方向の力を吸収することが可能である。 In the example of FIG. 2, the elastic member 220 is constituted by a coil spring. The elastic member 220 can be expanded and contracted in the direction of the arrow DR220. Therefore, it is possible to absorb the force in the vertical direction in FIG.
　筒状部材２３０は、弾性部材２２０の外周を取り囲むように設けられる。筒状部材２３０は、弾性部材２２０の伸縮方向（矢印ＤＲ２２０方向）を規定する。 The cylindrical member 230 is provided so as to surround the outer periphery of the elastic member 220. The cylindrical member 230 defines the expansion / contraction direction of the elastic member 220 (the direction of the arrow DR220).
　本実施の形態に係るリフタピン２００によれば、上述のとおり、回動部材２１０の回動により、図３における左右方向および紙面に垂直な方向の力を吸収することができ、弾性部材２２０の伸縮により、図３における上下方向の力を吸収することができる。したがって、、仮に、たわみにより垂れ下がった基板Ｓとリフタピン２００とが接触しても、その接触による力を吸収して、基板Ｓに作用する力を低減させることが可能である。この結果、基板Ｓの損傷やパーティクルの発生が抑制され、基板Ｓの不良発生率を低減することが可能である。 According to the lifter pin 200 according to the present embodiment, as described above, the rotation of the rotation member 210 can absorb the force in the horizontal direction in FIG. Thus, the vertical force in FIG. 3 can be absorbed. Therefore, even if the substrate S hanging from the deflection and the lifter pin 200 come into contact with each other, the force due to the contact can be absorbed and the force acting on the substrate S can be reduced. As a result, damage to the substrate S and generation of particles are suppressed, and the defect occurrence rate of the substrate S can be reduced.
　図９は、図７（比較例１）、図８（比較例２）に係るリフタピン２００Ａと、本実施の形態に係るリフタピン２００（本発明）とを用いた場合の基板Ｓの不良発生率を比較した結果を示すグラフである。基板Ｓとしては、たわみが発生しやすい大型基板（液晶パネル）を用いた。 9 shows the defect occurrence rate of the substrate S when the lifter pin 200A according to FIG. 7 (Comparative Example 1) and FIG. 8 (Comparative Example 2) and the lifter pin 200 according to the present embodiment (the present invention) are used. It is a graph which shows the result of comparison. As the substrate S, a large substrate (liquid crystal panel) that is easily bent is used.
　図９に示すように、比較例１，２に係るリフタピン２００Ａを用いた場合、相当程度高い確率（８０％以上の確率）で基板Ｓの不良が発生しているのに対し、本実施の形態に係るリフタピン２００を用いた場合は、不良発生率が低い確率（５％以下の確率）に抑制されている。このように、本実施の形態に係るリフタピン２００によれば、たわみが発生しやすい大型基板Ｓの処理において、比較例１，２に係るリフタピン２００Ａを用いた場合に対して不良発生率を格段に低下させることが可能である。 As shown in FIG. 9, when the lifter pins 200A according to Comparative Examples 1 and 2 are used, the substrate S is defective with a considerably high probability (80% or more probability). When the lifter pin 200 according to the above is used, the probability of occurrence of defects is low (probability of 5% or less). As described above, according to the lifter pin 200 according to the present embodiment, in the processing of the large substrate S that is likely to bend, the defect occurrence rate is markedly higher than when the lifter pin 200A according to Comparative Examples 1 and 2 is used. It can be reduced.
　（実施の形態２）
　図４は、実施の形態２に係る基板載置台におけるリフタピンの構成を示す図である。図４に示すように、本実施の形態に係るリフタピン２００は、実施の形態１に係るリフタピン２００の変形例であって、筒状部材２３０を設けないことを特徴とする。 (Embodiment 2)
FIG. 4 is a diagram showing a configuration of lifter pins in the substrate mounting table according to the second embodiment. As shown in FIG. 4, the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first embodiment, and is characterized in that the cylindrical member 230 is not provided.
　上述のように、実施の形態１における筒状部材２３０は、弾性部材２２０の伸縮方向（矢印ＤＲ２２０方向）を規定するものであるが、リフタピン２００は、本体１００の穴部１００Ｂ（図１参照）に挿入され、穴部１００Ｂの延在方向に沿って駆動されるものであるから、筒状部材２３０を設けない場合も、穴部１００Ｂの内周面により、弾性部材２２０の伸縮方向をある程度規定することは可能である。 As described above, the cylindrical member 230 in the first embodiment defines the expansion / contraction direction of the elastic member 220 (the direction of the arrow DR220), but the lifter pin 200 is the hole 100B of the main body 100 (see FIG. 1). Therefore, even if the cylindrical member 230 is not provided, the expansion / contraction direction of the elastic member 220 is defined to some extent by the inner peripheral surface of the hole 100B. It is possible to do.
　本実施の形態に係るリフタピン２００によっても、実施の形態１に係るリフタピン２００と同様に、たわみが発生しやすい大型基板Ｓの処理において、不良発生率を低下させることが可能である。 Also with the lifter pins 200 according to the present embodiment, it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S in which bending is likely to occur, similarly to the lifter pins 200 according to the first embodiment.
　なお、上記以外の事項は、上述した実施の形態１と同様であるため、詳細な説明は繰り返さない。 Since matters other than those described above are the same as those in the first embodiment described above, detailed description will not be repeated.
　（実施の形態３）
　図５は、実施の形態３に係る基板載置台におけるリフタピンの構成を示す図である。図５に示すように、本実施の形態に係るリフタピン２００は、実施の形態１，２に係るリフタピン２００の変形例であって、コイルばねからなる弾性部材２２０に代えて、棒状の弾性部材２２１を設けることを特徴とする。 (Embodiment 3)
FIG. 5 is a diagram illustrating a configuration of lifter pins in the substrate mounting table according to the third embodiment. As shown in FIG. 5, the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first and second embodiments, and instead of the elastic member 220 formed of a coil spring, a rod-shaped elastic member 221 is used. It is characterized by providing.
　本実施の形態に係るリフタピン２００によっても、実施の形態１，２に係るリフタピン２００と同様に、たわみが発生しやすい大型基板Ｓの処理において、不良発生率を低下させることが可能である。 Also with the lifter pins 200 according to the present embodiment, it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S in which bending is likely to occur, similarly to the lifter pins 200 according to the first and second embodiments.
　なお、上記以外の事項は、上述した実施の形態１，２と同様であるため、詳細な説明は繰り返さない。 Since matters other than the above are the same as in the first and second embodiments, detailed description will not be repeated.
　（実施の形態４）
　図６は、実施の形態４に係る基板載置台におけるリフタピンの構成を示す図である。図６に示すように、本実施の形態に係るリフタピン２００は、実施の形態１～３に係るリフタピン２００の変形例であって、回動部材２１０に代えて、回動しない曲面部材２１１を設けることを特徴とする。なお、図６では棒状の弾性部材２２１を示しているが、これに代えて、コイルばねからなる弾性部材２２０を用いてもよい。 (Embodiment 4)
FIG. 6 is a diagram showing a configuration of lifter pins in the substrate mounting table according to the fourth embodiment. As shown in FIG. 6, the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first to third embodiments, and is provided with a curved member 211 that does not rotate instead of the rotating member 210. It is characterized by that. In addition, although the rod-shaped elastic member 221 is shown in FIG. 6, it may replace with this and may use the elastic member 220 which consists of a coil spring.
　曲面部材２１１は、基板Ｓの裏面が接触し得る位置に、曲面部材２１１の他の部分に対して基板Ｓの裏面に対する摩擦抵抗が低い低抵抗部分２１１Ａを有する。これにより、曲面部材２１１に基板Ｓが接触した場合でも、抵抗により基板Ｓに作用する力を低減することが可能である。 The curved surface member 211 has a low resistance portion 211A having a low frictional resistance against the back surface of the substrate S relative to other portions of the curved surface member 211 at a position where the back surface of the substrate S can come into contact. Thereby, even when the board | substrate S contacts the curved surface member 211, it is possible to reduce the force which acts on the board | substrate S by resistance.
　本実施の形態に係るリフタピン２００によっても、実施の形態１～３に係るリフタピン２００と同様に、たわみが発生しやすい大型基板Ｓの処理において、不良発生率を低下させることが可能である。 Also with the lifter pins 200 according to the present embodiment, it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S where bending is likely to occur, similarly to the lifter pins 200 according to the first to third embodiments.
　なお、上記以外の事項は、上述した実施の形態１～３と同様であるため、詳細な説明は繰り返さない。 Since matters other than those described above are the same as in the first to third embodiments described above, detailed description will not be repeated.
　以上、本発明の実施の形態について説明したが、今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　本発明は、基板載置台および基板処理装置に利用可能である。 The present invention can be used for a substrate mounting table and a substrate processing apparatus.
　１００　本体、１００Ａ　載置面、１００Ｂ　穴部、２００　リフタピン、２１０　回動部材、２１１　曲面部材、２１１Ａ　低抵抗部分、２２０，２２１　弾性部材、２３０　筒状部材。 100 body, 100A mounting surface, 100B hole, 200 lifter pin, 210 rotating member, 211 curved member, 211A low resistance portion, 220, 221 elastic member, 230 cylindrical member.

Claims (8)

  1. 　第１方向に沿って延在し、基板が載置される載置面（１００Ａ）と、前記載置面（１００Ａ）上に開口する穴部（１００Ｂ）とを有する本体（１００）と、
    　前記穴部（１００Ｂ）に挿通され、前記第１方向に対して交差する第２方向に沿って進退移動可能なリフタピン（２００）とを備え、
    　前記リフタピン（２００）は、前記基板を載置する時に前記基板と前記リフタピン（２００）とが接触することにより前記基板に作用する力を低減する作用力低減部を含む、基板載置台。     A main body (100) extending along the first direction and having a placement surface (100A) on which the substrate is placed and a hole (100B) opened on the placement surface (100A);
    A lifter pin (200) that is inserted through the hole (100B) and is movable back and forth along a second direction intersecting the first direction;
    The lifter pin (200) includes a working force reducing unit that reduces a force acting on the substrate when the substrate and the lifter pin (200) come into contact with each other when the substrate is placed.
  2. 　前記作用力低減部は、前記第１方向の力を吸収する第１部分と、前記第２方向の力を吸収する第２部分とを有する、請求項１に記載の基板載置台。 2. The substrate mounting table according to claim 1, wherein the acting force reduction unit includes a first part that absorbs the force in the first direction and a second part that absorbs the force in the second direction.
  3. 　前記作用力低減部の前記第１部分は、前記第１方向に平行な軸まわりに回動する回動部材（２１０）を有する、請求項２に記載の基板載置台。 3. The substrate mounting table according to claim 2, wherein the first portion of the acting force reducing unit includes a rotating member (210) that rotates about an axis parallel to the first direction.
  4. 　前記作用力低減部の前記第１部分は、前記基板と対向する部分に曲面が形成され、他の部分に対して前記基板に対する摩擦抵抗が低い低抵抗部分（２１１Ａ）を有する曲面部材（２１１）を有する、請求項２に記載の基板載置台。 The curved surface member (211) having a low resistance portion (211A) in which the first portion of the acting force reducing portion has a curved surface formed at a portion facing the substrate and has a low frictional resistance against the substrate relative to the other portions The substrate mounting table according to claim 2, comprising:
  5. 　前記作用力低減部の前記第２部分は、前記第２方向に沿って伸縮可能な弾性部材（２２０，２２１）を有する、請求項２から請求項４のいずれかに記載の基板載置台。 The substrate mounting table according to any one of claims 2 to 4, wherein the second portion of the acting force reducing unit includes an elastic member (220, 221) that can expand and contract along the second direction.
  6. 　第１方向に沿って延在し、基板が載置される載置面（１００Ａ）と、前記載置面（１００Ａ）上に開口する穴部（１００Ｂ）とを有する本体（１００）と、
    　前記穴部（１００Ｂ）に挿通され、前記第１方向に対して交差する第２方向に沿って進退移動可能なリフタピン（２００）とを備え、
    　前記リフタピン（２００）は、前記第１方向に平行な軸まわりに回動する回動部材（２１０）と、前記第２方向に沿って伸縮可能な弾性部材（２２０，２２１）とを含む、基板載置台。     A main body (100) extending along the first direction and having a placement surface (100A) on which the substrate is placed and a hole (100B) opened on the placement surface (100A);
    A lifter pin (200) that is inserted through the hole (100B) and is movable back and forth along a second direction intersecting the first direction;
    The lifter pin (200) includes a rotation member (210) that rotates about an axis parallel to the first direction, and an elastic member (220, 221) that can expand and contract along the second direction. Mounting table.
  7. 　第１方向に沿って延在し、基板が載置される載置面（１００Ａ）と、前記載置面（１００Ａ）上に開口する穴部（１００Ｂ）とを有する本体（１００）と、
    　前記穴部（１００Ｂ）に挿通され、前記第１方向に対して交差する第２方向に沿って進退移動可能なリフタピン（２００）とを備え、
    　前記リフタピン（２００）は、前記基板と対向する部分に曲面が形成され、他の部分に対して前記基板に対する摩擦抵抗が低い低抵抗部分（２１１Ａ）を有する曲面部材（２１１）と、前記第２方向に沿って伸縮可能な弾性部材（２２０，２２１）とを含む、基板載置台。     A main body (100) extending along the first direction and having a placement surface (100A) on which the substrate is placed and a hole (100B) opened on the placement surface (100A);
    A lifter pin (200) that is inserted through the hole (100B) and is movable back and forth along a second direction intersecting the first direction;
    The lifter pin (200) has a curved surface member (211) having a low resistance portion (211A) having a curved surface formed at a portion facing the substrate and having a low frictional resistance against the substrate relative to the other portion, and the second A substrate mounting table including elastic members (220, 221) that can expand and contract along a direction.
  8. 　基板に処理を施すための基板処理室（３００）と、
    　前記基板処理室中に収納された、請求項１から請求項７のいずれかに記載の基板載置台（１００，２００）とを備えた、基板処理装置。     A substrate processing chamber (300) for processing the substrate;
    The substrate processing apparatus provided with the substrate mounting base (100, 200) in any one of Claims 1-7 accommodated in the said substrate processing chamber.
PCT/JP2012/062398 2011-05-19 2012-05-15 Substrate placing base and substrate processing device WO2012157638A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011112506 2011-05-19
JP2011-112506 2011-05-19

Publications (1)

Publication Number Publication Date
WO2012157638A1 true WO2012157638A1 (en) 2012-11-22

Family

ID=47176955

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/062398 WO2012157638A1 (en) 2011-05-19 2012-05-15 Substrate placing base and substrate processing device

Country Status (1)

Country Link
WO (1) WO2012157638A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104658959A (en) * 2015-03-17 2015-05-27 合肥京东方光电科技有限公司 Substrate supporting needle, substrate supporting device and substrate picking and placing system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173945A (en) * 1995-12-25 1997-07-08 Dainippon Screen Mfg Co Ltd Rotary type substrate treating device
JPH1064982A (en) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd Substrate support mechanism and substrate treatment unit
JPH1092916A (en) * 1996-07-24 1998-04-10 Applied Materials Inc Lift pin and support pin apparatus for process chamber
JP2002093890A (en) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd Lift pin and stage device
JP2008500709A (en) * 2004-05-28 2008-01-10 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト Lift pin with roller glide to reduce friction
JP2009206315A (en) * 2008-02-28 2009-09-10 Chugai Ro Co Ltd Substrate mounting device to table

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173945A (en) * 1995-12-25 1997-07-08 Dainippon Screen Mfg Co Ltd Rotary type substrate treating device
JPH1092916A (en) * 1996-07-24 1998-04-10 Applied Materials Inc Lift pin and support pin apparatus for process chamber
JPH1064982A (en) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd Substrate support mechanism and substrate treatment unit
JP2002093890A (en) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd Lift pin and stage device
JP2008500709A (en) * 2004-05-28 2008-01-10 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト Lift pin with roller glide to reduce friction
JP2009206315A (en) * 2008-02-28 2009-09-10 Chugai Ro Co Ltd Substrate mounting device to table

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104658959A (en) * 2015-03-17 2015-05-27 合肥京东方光电科技有限公司 Substrate supporting needle, substrate supporting device and substrate picking and placing system
WO2016145806A1 (en) * 2015-03-17 2016-09-22 京东方科技集团股份有限公司 Substrate support pin, substrate support device and substrate picking and placing system

Similar Documents

Publication Publication Date Title
US9616577B2 (en) Robot having end effector and method of operating the same
KR20150102720A (en) Suction pad, robot hand and robot
JP6335103B2 (en) Substrate holding device
TWI524413B (en) Method of cleaning and drying semiconductor wafer
JP2008172160A (en) Device and method for processing substrate
JP5327144B2 (en) Processing apparatus and processing method
JP2015013359A (en) Suction structure, robot hand, and robot
KR102120535B1 (en) Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method
TW201608671A (en) Substrate transfer robot end effector
JP2012238758A (en) Substrate loading apparatus and substrate loading method
JP2010040804A (en) Sample carrying mechanism
JP2011074487A (en) Vacuum processing apparatus and substrate transfer method
JP5756032B2 (en) Robot system
CN106571284B (en) Block disc system, reaction chamber and semiconductor processing equipment
WO2012157638A1 (en) Substrate placing base and substrate processing device
JP2012522386A (en) Vacuum gripper assembly stabilized by a spring
TWI519373B (en) Substrate supporting module
US10515844B2 (en) Substrate supporting and transferring apparatus, method of supporting and transferring substrate, and manufacturing method of display apparatus using the same
JP5214421B2 (en) Peeling apparatus and peeling method
JP2007281254A (en) Substrate support and substrate transfer mechanism
JP2013151034A (en) Robot system
KR101694198B1 (en) Glass handling apparatus
JP2000100920A (en) Wafer holding device
KR102517909B1 (en) Lift Module and Substrate Transfer Robot Hand Using Thereof
JP2009032790A (en) Method and apparatus for peeling substrate

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12785195

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12785195

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP