WO2012157638A1 - Base de montage de substrat et dispositif de traitement de substrat - Google Patents

Base de montage de substrat et dispositif de traitement de substrat Download PDF

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Publication number
WO2012157638A1
WO2012157638A1 PCT/JP2012/062398 JP2012062398W WO2012157638A1 WO 2012157638 A1 WO2012157638 A1 WO 2012157638A1 JP 2012062398 W JP2012062398 W JP 2012062398W WO 2012157638 A1 WO2012157638 A1 WO 2012157638A1
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WO
WIPO (PCT)
Prior art keywords
substrate
lifter pin
mounting table
hole
lifter
Prior art date
Application number
PCT/JP2012/062398
Other languages
English (en)
Japanese (ja)
Inventor
洋生 西山
杉本　修
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012157638A1 publication Critical patent/WO2012157638A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • the present invention relates to a substrate mounting table and a substrate processing apparatus, and more particularly to a substrate mounting table including lifter pins and a substrate processing apparatus including the same.
  • a substrate mounting table provided in a substrate processing chamber for receiving a substrate is conventionally known.
  • Such a substrate mounting table is described in, for example, Japanese Patent Laid-Open No. 2007-235116 (Patent Document 1).
  • a lifter pin for receiving a substrate has a main body and a head portion having a larger diameter than the main body.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate mounting table capable of suppressing substrate damage and particle generation, and a substrate processing apparatus including the same. It is to provide.
  • the substrate mounting table according to the present invention extends along the first direction, and is inserted through the hole, the main body having a mounting surface on which the substrate is mounted, and a hole opening on the mounting surface. And a lifter pin capable of moving back and forth along a second direction intersecting the first direction.
  • the lifter pin includes an action force reducing unit that reduces a force acting on the substrate by contacting the substrate and the lifter pin when the substrate is placed.
  • the acting force reduction unit includes a first part that absorbs a force in the first direction and a second part that absorbs a force in the second direction.
  • the first portion of the acting force reduction unit includes a rotating member that rotates about an axis parallel to the first direction.
  • the first portion of the acting force reducing portion includes a curved surface member having a low resistance portion in which a curved surface is formed at a portion facing the substrate and a frictional resistance against the substrate is low with respect to the other portions.
  • the second portion of the acting force reduction unit includes an elastic member that can expand and contract along the second direction.
  • the lifter pin includes a rotating member that rotates about an axis parallel to the first direction and an elastic member that can expand and contract along the second direction.
  • the lifter pin has a curved surface formed in a portion facing the substrate, a curved member having a low resistance portion with low frictional resistance against the substrate relative to the other portion, and along the second direction. And an elastic member that can be expanded and contracted.
  • a substrate processing apparatus includes a substrate processing chamber for processing a substrate and the above-described substrate mounting table housed in the substrate processing chamber.
  • the present invention it is possible to suppress damage to the substrate and generation of particles when the substrate is placed on the substrate placing table.
  • FIG. 1 is a diagram showing a substrate mounting table and a substrate processing apparatus including the same according to Embodiments 1 to 4 of the present invention.
  • FIG. It is a figure which shows an example of arrangement
  • FIG. It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention.
  • FIG. It is a figure which shows the structure of the lifter pin in the substrate mounting base which concerns on Embodiment 2 of this invention.
  • FIG. 1 It is a figure which shows the lifter pin which concerns on the comparative example 1. It is a figure which shows the lifter pin which concerns on the comparative example 2. It is a graph which shows the defect generation rate at the time of using the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention, and the lifter pin which concerns on the comparative examples 1 and 2.
  • FIG. 1 shows the defect generation rate at the time of using the lifter pin in the substrate mounting base which concerns on Embodiment 1 of this invention, and the lifter pin which concerns on the comparative examples 1 and 2.
  • FIG. 1 is a view showing a substrate mounting table and a substrate processing apparatus including the same according to Embodiments 1 to 4 described later.
  • FIG. 2 is a diagram showing an example of the arrangement of lifter pins in the substrate mounting table shown in FIG.
  • the substrate mounting table includes a main body 100 and lifter pins 200.
  • the main body 100 and the lifter pins 200 are accommodated in the substrate processing chamber 300. Thereby, a substrate processing apparatus is configured.
  • the substrate processing apparatus performs various processes on the substrate S placed on the substrate mounting table.
  • the “various treatments” referred to here include heat treatment, film formation treatment, etching, ashing, and the like on the substrate, and the scope of the present invention is not limited by the contents of this treatment.
  • the main body 100 has a placement surface 100A on which the substrate S is placed, and a hole 100B that opens on the placement surface 100A.
  • the hole 100B extends in a direction (typically, a direction orthogonal to) the direction in which the placement surface 100A extends (the horizontal direction in FIG. 1 and the direction perpendicular to the paper surface).
  • the lifter pin 200 is inserted through the hole 100B and can move forward and backward along the extending direction of the hole 100B.
  • the lifter pin 200 is driven back and forth by driving means (not shown).
  • a plurality of lifter pins 200 are provided on the mounting surface 100 ⁇ / b> A of the main body 100.
  • the lifter pins 200 are arranged in a lattice shape so that a plurality of lifter pins 200 are arranged in the vertical and horizontal directions.
  • the arrangement of the lifter pins 200 is not limited to that shown in FIG.
  • the procedure for processing the substrate S by the substrate processing apparatus is as follows. First, the substrate S is carried into the substrate processing chamber 300 from the state where the substrate S is not placed on the main body 100. At this time, the substrate S is held by a holding device (not shown).
  • the lifter pin 200 is driven upward to cause the lifter pin 200 to protrude upward from the mounting surface 100A of the main body 100.
  • the lifter pin 200 may be driven upward before the substrate S is carried into the substrate processing chamber 300.
  • the substrate S is placed on the lifter pins 200 in a state where the lifter pins 200 protrude upward from the placement surface 100A of the main body 100 (the state of the two-dot chain line in FIG. 1). Thereafter, the lifter pin 200 is driven downward to house the lifter pin 200 in the hole 100B (solid line state in FIG. 1). At this time, the upper end of the lifter pin 200 may be located at the same height as the placement surface 100A, or may be located at a height lower than the placement surface 100A.
  • the substrate S is placed on the placement surface 100A of the main body 100 by the above-described operation.
  • the above-described “various processes” are performed on the substrate S.
  • the substrate S that has been subjected to the predetermined processing is lifted again by the lifter pins 200 and separated from the placement surface 100A (in the state of the two-dot chain line in FIG. 1).
  • the substrate S is again gripped by the above-described gripping device (not shown) and carried out of the substrate processing chamber 300. Thereafter, an unprocessed substrate S (next substrate) is carried into the substrate processing chamber 300, and predetermined processing is performed in the above-described procedure. In this way, predetermined processing is continuously performed on the plurality of substrates S.
  • the lifter pins 200 shown in the first to fourth embodiments have a structure that reduces the forces in the vertical and horizontal directions and suppresses damage to the substrate S when coming into contact with the substrate S. It is what you have. The specific structure of each embodiment will be described later.
  • FIG. 3 is a diagram illustrating a configuration of lifter pins in the substrate mounting table according to the first embodiment.
  • the lifter pin 200 according to the present embodiment includes a rotating member 210, an elastic member 220, and a cylindrical member 230.
  • Rotating member 210 is provided at the tip of lifter pin 210 and contacts the back surface of substrate S.
  • the rotation member 210 can rotate in the direction of the arrow DR210.
  • the rotating member 210 may be roller-shaped or spherical.
  • the rotating member 210 has a roller shape, it is possible to absorb the lateral force in FIG. 3 by rotating the rotating member 210 in the direction of the arrow DR210. In this case, it is possible to absorb forces in two different directions by using a plurality of lift pins 200 having different directions in which the rotating member 210 rotates (for example, alternately arranged).
  • the rotating member 210 is spherical, the rotating member 210 is provided so as to be rotatable in the direction of a plane perpendicular to the paper surface in addition to the direction of the arrow DR210. In addition to the direction, it is possible to absorb a force in a direction perpendicular to the paper surface.
  • the elastic member 220 is constituted by a coil spring.
  • the elastic member 220 can be expanded and contracted in the direction of the arrow DR220. Therefore, it is possible to absorb the force in the vertical direction in FIG.
  • the cylindrical member 230 is provided so as to surround the outer periphery of the elastic member 220.
  • the cylindrical member 230 defines the expansion / contraction direction of the elastic member 220 (the direction of the arrow DR220).
  • the rotation of the rotation member 210 can absorb the force in the horizontal direction in FIG.
  • the vertical force in FIG. 3 can be absorbed. Therefore, even if the substrate S hanging from the deflection and the lifter pin 200 come into contact with each other, the force due to the contact can be absorbed and the force acting on the substrate S can be reduced. As a result, damage to the substrate S and generation of particles are suppressed, and the defect occurrence rate of the substrate S can be reduced.
  • FIG. 9 shows the defect occurrence rate of the substrate S when the lifter pin 200A according to FIG. 7 (Comparative Example 1) and FIG. 8 (Comparative Example 2) and the lifter pin 200 according to the present embodiment (the present invention) are used. It is a graph which shows the result of comparison.
  • the substrate S a large substrate (liquid crystal panel) that is easily bent is used.
  • the substrate S is defective with a considerably high probability (80% or more probability).
  • the probability of occurrence of defects is low (probability of 5% or less).
  • the defect occurrence rate is markedly higher than when the lifter pin 200A according to Comparative Examples 1 and 2 is used. It can be reduced.
  • FIG. 4 is a diagram showing a configuration of lifter pins in the substrate mounting table according to the second embodiment.
  • the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first embodiment, and is characterized in that the cylindrical member 230 is not provided.
  • the cylindrical member 230 in the first embodiment defines the expansion / contraction direction of the elastic member 220 (the direction of the arrow DR220), but the lifter pin 200 is the hole 100B of the main body 100 (see FIG. 1). Therefore, even if the cylindrical member 230 is not provided, the expansion / contraction direction of the elastic member 220 is defined to some extent by the inner peripheral surface of the hole 100B. It is possible to do.
  • lifter pins 200 according to the present embodiment it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S in which bending is likely to occur, similarly to the lifter pins 200 according to the first embodiment.
  • FIG. 5 is a diagram illustrating a configuration of lifter pins in the substrate mounting table according to the third embodiment.
  • the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first and second embodiments, and instead of the elastic member 220 formed of a coil spring, a rod-shaped elastic member 221 is used. It is characterized by providing.
  • lifter pins 200 according to the present embodiment it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S in which bending is likely to occur, similarly to the lifter pins 200 according to the first and second embodiments.
  • FIG. 6 is a diagram showing a configuration of lifter pins in the substrate mounting table according to the fourth embodiment.
  • the lifter pin 200 according to the present embodiment is a modification of the lifter pin 200 according to the first to third embodiments, and is provided with a curved member 211 that does not rotate instead of the rotating member 210. It is characterized by that.
  • the rod-shaped elastic member 221 is shown in FIG. 6, it may replace with this and may use the elastic member 220 which consists of a coil spring.
  • the curved surface member 211 has a low resistance portion 211A having a low frictional resistance against the back surface of the substrate S relative to other portions of the curved surface member 211 at a position where the back surface of the substrate S can come into contact. Thereby, even when the board
  • lifter pins 200 according to the present embodiment it is possible to reduce the defect occurrence rate in the processing of the large-sized substrate S where bending is likely to occur, similarly to the lifter pins 200 according to the first to third embodiments.
  • the present invention can be used for a substrate mounting table and a substrate processing apparatus.
  • 100 body 100A mounting surface, 100B hole, 200 lifter pin, 210 rotating member, 211 curved member, 211A low resistance portion, 220, 221 elastic member, 230 cylindrical member.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention se rapporte à une base de montage de substrat qui est pourvue d'un corps principal (100) qui présente une surface de montage (100A) sur laquelle est placé un substrat, et une partie trou (100B) ouverte sur la surface de montage (100A), ainsi qu'une tige de levage (200) qui est insérée dans la partie trou (100B) et peut être déplacée vers l'avant et vers l'arrière le long de la direction d'extension de la partie trou (100B), la tige de levage (200) comprenant un élément rotatif (210) qui tourne autour d'un axe en parallèle avec la direction d'extension de la surface de montage (100A), et un élément élastique (220) qui peut s'étendre et se rétracter dans la direction d'extension de la partie trou (100B).
PCT/JP2012/062398 2011-05-19 2012-05-15 Base de montage de substrat et dispositif de traitement de substrat WO2012157638A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011112506 2011-05-19
JP2011-112506 2011-05-19

Publications (1)

Publication Number Publication Date
WO2012157638A1 true WO2012157638A1 (fr) 2012-11-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104658959A (zh) * 2015-03-17 2015-05-27 合肥京东方光电科技有限公司 基板支撑针、基板支撑装置和基板取放系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173945A (ja) * 1995-12-25 1997-07-08 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JPH1064982A (ja) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd 基板保持機構及び基板処理装置
JPH1092916A (ja) * 1996-07-24 1998-04-10 Applied Materials Inc 処理チャンバのリフトピン及びサポートピン装置
JP2002093890A (ja) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd リフトピン及びステージ装置
JP2008500709A (ja) * 2004-05-28 2008-01-10 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト 摩擦を減らすための、ローラグライドを備えたリフトピン
JP2009206315A (ja) * 2008-02-28 2009-09-10 Chugai Ro Co Ltd テーブルへの基板搭載装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173945A (ja) * 1995-12-25 1997-07-08 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JPH1092916A (ja) * 1996-07-24 1998-04-10 Applied Materials Inc 処理チャンバのリフトピン及びサポートピン装置
JPH1064982A (ja) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd 基板保持機構及び基板処理装置
JP2002093890A (ja) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd リフトピン及びステージ装置
JP2008500709A (ja) * 2004-05-28 2008-01-10 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト 摩擦を減らすための、ローラグライドを備えたリフトピン
JP2009206315A (ja) * 2008-02-28 2009-09-10 Chugai Ro Co Ltd テーブルへの基板搭載装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104658959A (zh) * 2015-03-17 2015-05-27 合肥京东方光电科技有限公司 基板支撑针、基板支撑装置和基板取放系统
WO2016145806A1 (fr) * 2015-03-17 2016-09-22 京东方科技集团股份有限公司 Broche de support de substrat, dispositif de support de substrat et système de prélèvement et de placement de substrat

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