JP2926682B2 - Board inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection apparatus for performing macro observation and micro observation of an inspection board housed in a carrier.

[0002]

2. Description of the Related Art A conventional wafer inspection apparatus is constructed by connecting a carrier for accommodating a wafer and a microscope apparatus for microscopic observation via a wafer transfer device. The wafer transfer device is configured to take out the wafer from the carrier and send it to the microscope stage in the first place, and efficiently return the wafer, which has been subjected to the microscope observation, to the carrier.

FIG. 9 is a perspective view showing a conventional wafer inspection apparatus, and FIG. 10 is a plan view showing a wafer transfer section of the apparatus. 1 is a carrier for storing the wafer 2 and 3 is a carrier 1
Elevator moves up and down to a predetermined position by moving the wafer 2 up and down at a storage pitch interval of the wafer 2, a wafer pushing member 4 for pushing the wafer 2 from the carrier 1, and a transporter 5 for pushing the pushed wafer 2 to a turntable described later. , Wafer 2 on the turntable
Is a conveyor belt that conveys.

[0006] Reference numerals 6 and 6 denote centering guides for aligning the wafer 2 conveyed by the conveyor belt 5 on a rotary table by reciprocating movement in the direction of the arrow. Reference numeral 7 denotes a rotary table for vacuum-sucking and rotating the wafer 2. An orientation flat sensor that is arranged so as to be located slightly inside the outer peripheral portion of the wafer 2 and detects the orientation flat position of the wafer 2.

[0005] The reference numeral 9 indicates that the wafer 2 is placed on the rotary table 7 by ascending and is rotated by 180 ° after being vacuum-sucked, then the vacuum-suck is released and lowered to transfer the wafer 2 to a holder described later,
An exchange arm for transferring the wafer 2 on the holder onto the turntable 7 by the same operation, a wafer pushing member 10 for pushing the wafer 2 conveyed by the conveyor belt 5 into the carrier 1, and a reference numeral 11 for the wafer 2 at that time This is a wafer detection sensor for detecting the presence or absence.

Reference numeral 12 denotes a microscope having an XY stage 12a. Reference numeral 13 denotes a microscope mounted on the stage 12a so as to be slidable in the X direction so as to be located in the middle of the vertical dead center of the exchange arm 9. Is a holder for receiving the wafer 2 and moving it to the microscope observation unit, or returning the wafer 2 already observed to the exchange arm 9.

Reference numeral 14 denotes a holder detection switch, and reference numeral 15 denotes a state in which all wafers 2 in the carrier 1 are transferred or a wafer No. A total number / drawing changeover switch that determines whether or not to transfer the wafer 2 specified by the specifying switch, 16 is an orientation flat position selection switch that determines the direction of orientation flat alignment, 17 is a cleaning switch, 18 is an error display LED, and 19 is the wafer to be extracted. No. No. to specify the wafer No. Designated switch, 20 is a start switch for inputting the start of operation, 2
1 is a reset switch for initializing the device on the way, 2
Reference numeral 2 denotes an emergency stop switch for urgently stopping the apparatus, and these switches are connected to the above members via a control circuit (not shown).

The conveyor belt 5, the rotary table 7, and the exchange arm 9 excluding the carrier 1 and the microscope 12 from the above members constitute a wafer transfer unit.

Next, the operation of the wafer transfer section will be described. First, when the carrier 1 is placed on the elevator 3 and the start switch 20 is turned on, the first wafer 2 of the elevator 3 (referred to as the first and second from the bottom of the carrier 1) coincides with the carry-in position of the belt conveyor 5. The first wafer 2 is pushed down onto the conveyor belt 5 by the wafer pushing member 4.

The wafer 2 is conveyed onto a turntable 7 by a conveyor belt 5 and is centered on the turntable 7 by centering guides 6 and 6. Thereafter, the turntable 7 rotates while the wafer 2 is vacuum-sucked. Subsequently, the orientation flat position of the wafer 2 is detected by the orientation flat sensor 8, and the wafer 2 is stopped at the orientation flat position set by the orientation flat position selection switch 16.

When the orientation flat alignment is completed, the exchange arm 9 which has been waiting below the mounting surface of the turntable 7 is lifted, and the wafer 2 is mounted on one end thereof and vacuum-adsorbed.
Rotate. Thereafter, the exchange arm 9 releases the vacuum suction and descends again. During the lowering of the exchange arm 9, the holder 13
Receives the wafer 2 and sends it to the microscope observation unit.

Subsequently, the second wafer 2 in the carrier 1
Is extruded onto the conveyor belt 5 by the wafer extruding member 4 and is aligned with the orientation flat in the same manner as described above.
It waits on the turntable 7.

When the micro inspection of the wafer 2 placed on the holder 13 by the microscope 12 is completed and the start switch 20 is turned on, the exchange arm 9 is lifted, and 1
The second wafers 2, 2 are vacuum-sucked. In this state, the exchange arm 9 is rotated by 180 ° and then lowered after releasing the vacuum suction, whereby the first wafer 2 and the second wafer 2 are exchanged.

First wafer 2 after micro inspection
Enters the original slot in the carrier 1 by the conveyor belt 5 and is completely pushed into the slot by the wafer pushing member 10.

Thereafter, the third wafer 2 is extruded onto the conveyor belt 5 by the wafer extruding member 4, aligned with the orientation flat in the same manner as described above, and waits on the turntable 7. Hereinafter, similarly, the wafers 2 are sequentially transferred to the holder 13 of the microscope 12, and the micro inspection of the last wafer 2 is completed. When all the wafers 2 are stored in the carrier 1, the elevator 3 is lifted and initialized. Return to position.

In the above operation, all the wafers 2 in the carrier 1 are conveyed by the total / extraction switching switch 15 (inspection of all wafers) or the wafer No. Whether only the wafer 2 designated by the designation switch 19 is carried (sampling inspection) can be set.

[0017]

However, in general, when performing microscopic observation with a microscope, a macro inspection for visually observing scratches, dirt, and dust on the wafer surface is performed as preprocessing. There is no conventional wafer inspection apparatus equipped with both a macro inspection apparatus and a micro inspection apparatus, and a microscope 12 for microscopic observation adjacent to a wafer transfer apparatus having a conveyor belt 5 as shown in FIG. Is arranged. When performing macro observation, place a macro inspection device and a micro inspection device adjacent to the conveyor belt type wafer transfer path, and deliver the wafer transferred by the conveyor belt to each inspection device using the suction arm. Is performed. In such a conventional wafer inspection apparatus, a conveyor belt is used as a means for transporting a wafer in the orientation flat aligning step, the macro observation step, or the micro observation step, so that friction between the back surface of the wafer and the conveyor belt is caused. Dust and the like from the belt may adhere to the back surface of the wafer and become dirty. When the wafer conveyed by this conveyor belt is stored at a predetermined interval in the carrier, dust or the like attached to the back surface of the wafer stored on the upper side falls on the surface of the wafer stored on the lower side, and the wafer Cause the problem of soiling the surface. Further, since only the surface of the wafer was inspected in the macro observation and the micro observation, it was not possible to cope with a problem that occurred after the wafer was stored. Furthermore, if the macro inspection device and the micro inspection device are separately arranged, the transfer path of the wafer becomes longer and the wafer cannot be transferred at high speed because the wafer is placed on the conveyor belt. It was difficult to do.

SUMMARY OF THE INVENTION In view of the above problems, the present invention eliminates a conveyor belt from a substrate transport path for transporting an inspection substrate such as a wafer from a carrier to each inspection unit, thereby preventing contamination due to transportation, and ensuring that inspection substrates can be safely and quickly operated. It is an object of the present invention to provide a substrate inspection apparatus capable of easily shortening an inspection process time by transporting the substrate.

[0019]

In order to achieve the above object, according to the present invention, there is provided a carrier for accommodating a plurality of test substrates at a predetermined pitch, a macro inspection section for macro observing a substrate selectively supplied from the carrier, A micro-inspection unit for micro-observing the substrate supplied via a macro-inspection unit, and sucking and holding a substrate selectively supplied from within the carrier and transporting the substrate to the macro-inspection unit, And a suction arm unit for transferring the substrate to the micro inspection unit, and all the substrate transfer paths from the carrier to the macro inspection unit and the micro inspection unit are constituted only by the suction arm unit. ADVANTAGE OF THE INVENTION According to this invention, the inspection board | substrate accommodated in the carrier can be stably and rapidly conveyed in the state which adsorb | sucked to the micro inspection part via the macro inspection part with the suction arm.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. Note that the same members as those of the above-described conventional technique are denoted by the same reference numerals, and description thereof will be omitted. FIG. 1 is a perspective view showing an overall configuration of a substrate inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the apparatus.

Reference numeral 23 denotes a drive mechanism which is driven by a drive mechanism which will be described later. The elevator 3 moves up and down to vacuum-suck the wafer 2 as an inspection substrate, and moves the carrier 2 horizontally from the carrier 1. And a first suction arm for returning the wafer 2 on the turntable 70 to the carrier 1. 24 is a joystick electrically or mechanically connected to a means for swinging the turntable 70, and 25 is an operation panel.

FIG. 3 is a plan view of a driving mechanism of the suction arm 23, FIG. 4 is a partially cutaway front view of the driving mechanism, and FIG.
FIG. 5 is a cross-sectional view taken along the line -V, and (I) and (I) in FIG.
I) and (III) show the positions of the suction arm 23 on the rotary table 7, the standby position before receiving the next wafer 2 after the wafer 2 is stored in the carrier 1, and the position where the wafer 2 is inserted into the carrier 1, respectively. .

Reference numeral 26 denotes a frame fixed to the main body of the transporting apparatus; 27, a pair of horizontal guide shafts spanned between left and right (front and rear in FIG. 2) walls of the frame 26;
The arm block 30 is slidably mounted on a horizontal guide shaft 27 via a linear bearing 31, a pair of support shafts slidably supported on an arm block 28 via a linear bearing 31 in the vertical direction, and 32 is a support shaft. A support arm 33 fixed to the upper end of the support shaft 30 and having the suction arm 23 fixed to the distal end and preventing the support shaft 30 from slipping downward. The support arm 33 is fixed to the lower end of the support shaft 30 and is located above the support shaft 30. An engagement piece that prevents the air cylinder from slipping out and that can be engaged with a piston rod of an air cylinder described later, a spring 34 that is fitted to the support shaft 30 and imparts upward movement behavior, and 35 is fixed to the support arm 32 When the arm block 28 moves in the vertical direction, the detected pieces 36 detected by the upper point sensor and the lower point sensor described later are fixed to the arm block 28, and the arm block 28 moves in the horizontal direction. Is the detected piece is detected by the position sensor to be described later at the time. 37 and 38 are pulleys pivotally mounted near the left and right ends of the frame 26, 39 is a belt hung between the pulleys 37 and 38 and connected to the arm block 28, and 40 is a forward / reverse rotatable motor for driving the pulley 37. These constitute an arm block horizontal drive mechanism.

Reference numerals 41, 42, and 43 denote the positions (I),
The arm block 2 is fixed to the frame 26 corresponding to (II) and (III), and detects the detection target piece 36, so that the arm block 2
8 is a position sensor for detecting a horizontal position of the reference numeral 8. 44 is fixed near the left end of the frame 26, and when the arm block 28 is at the position (I), the piston rod 44a
The air cylinders 45 and 46 are fixed to the left wall of the frame 26 and engage with the engagement piece 33 to lower the arm block 28. When the arm block 28 is at the position (I), the detected piece 35 An upper point sensor that detects the vertical position of the arm block 28 by detecting
This is a lower point sensor.

FIG. 6 is a front view of the operation panel 25. 4
Reference numeral 7 denotes an automatic / manual changeover switch. In the automatic mode, all the wafers 2 are continuously transferred only by pressing the start switch 20 once, and in the manual mode, one every time the start switch 20 is pressed. One wafer 2 is transferred. Reference numeral 48 denotes a sequence setting switch, which is a microscope observation (micro observation) when the holder transfer switch is ON.
The wafer 2 is transported to the holder 13 and the orientation flat alignment is performed on the rotary table 70 when the orientation flat alignment switch is ON. When the swing macro switch is ON, the rotary table 70 is used for swing macro observation. The rotary shaft 70a is tilted and swung in accordance with the operation of the joystick 24 in a state where the wafer 2 which is vacuum-adsorbed is raised, and when the horizontal macro switch is ON, the rotary table 70 is used for horizontal macro observation.
The rotating shaft 70a is rotated in a state where the wafer 2 that has been vacuum-sucked thereon is stopped at the initial position where the wafer 2 is not lifted. When the macro rotation switch is ON, the rotating shaft 70a is rotated using the joystick 24 in the same manner as in the swing macro observation. The rotating shaft 70a can be rotated with the 70a inclined at a desired angle.

Reference numeral 49 denotes a rotation speed setting switch for setting the rotation speed of the turntable 70, and 50 denotes a stop time setting switch. In the macro observation sequence, the turntable 7 for the wafer 2 is used.
A stop time on the holder 0 is set, and a stop time of the wafer 2 on the holder 13 is set in the holder transfer sequence (however, in the automatic mode). Reference numeral 51 denotes a temporary stop switch. When this switch is ON, the stop time setting switch 50 is invalidated to perform continuous stop. 52 is the No. of the wafer 2 being processed. Or, a wafer No. for displaying an error code. / Error code display area, 5
No. 3 is No. A / code display LED, 54 is an automatic / manual display LED, and 55 is a total / extraction display LED.

Next, the operation of the embodiment of the present invention will be described. Wafer transfer: (a) Holder transfer and orientation flat alignment sequence in automatic mode First, the carrier 1 is placed on the elevator 3 and the start switch 20 is pressed, and the elevator 3 descends to the position where the first wafer 2 is taken out. . Next, the first suction arm 23 waiting at the position (II) is inserted below the first wafer 2 by the horizontal drive mechanism as shown by the dashed line in FIG. 7 (position (III)). By slightly lowering the elevator 3 in this state, the wafer 2 is placed on the suction arm 23 and is suctioned by vacuum. Thereafter, the suction arm 23 is directly moved by the horizontal drive mechanism as shown by a solid line in FIG.
Then, the wafer 2 is horizontally moved to above the position 0 (position (I)), the vacuum suction is released, and the wafer 2 is lowered by the air cylinder 44 to place the wafer 2 on the turntable 70.

Next, the wafer 2 is centered on the turntable 70 by the reciprocating movement of the pair of centering guides 6 (in the direction of the arrow in FIG. 2), and then the wafer 2 is vacuum-adsorbed on the turntable 70 and rotated. Next, the orientation flat of the wafer 2 is detected by the orientation flat sensor 8, and the wafer 2 is stopped at the orientation flat position set by the orientation flat position selection switch 16.

Next, the exchange arm 9 (second suction arm), which has been waiting at a position below the turntable 70, rises, places the wafer 2 on the arm 9, vacuum-adsorbs it, and rotates by 180 °. Subsequently, the exchange arm 9 releases the vacuum suction and descends again, and the holder 13 moves the wafer 2 while the exchange arm 9 descends.
Receive. After the lowering of the exchange arm 9, the second wafer 2 in the carrier 1 is transferred onto the turntable 7 by the suction arm 23 and aligned with the orientation flat.

Next, after the stop time set by the stop time setting switch 50, the exchange arm 9 is raised and the holder 1
3 and the first and second wafers 2, 2 on the turntable 70.
Is vacuum-adsorbed and rotated 180 °. Subsequently, the exchange arm 9 is lowered after the vacuum suction is released, and the exchange of the first and second wafers 2 is completed. The stop time is determined by the time when the holder 13 is set on the microscope side.
Is detected by the holder detection switch 14, that is, the time when the microscope observation is completed and the return of the holder 13 is detected. Thereafter, the first wafer 2 is returned to the original slot in the carrier 1 by the suction arm 23, and then the third wafer 2 is moved by the suction arm 9 to the turntable 70.
The sheet is transported upward, is again aligned with the orientation flat, and waits.

Similarly, the wafers 2 are successively transferred to the holder 13, but when the last wafer 2 is stored in the holder 13, the elevator 3 and the suction arm 23 return to the initial positions and are stopped.

(B) When the orientation flat alignment sequence is not set The orientation flat alignment is omitted. (C) In the case of the manual mode The operation is not controlled by the stop time and the start switch 2
Control by 0 is performed.

Macro observation: (a) When the swing macro sequence is set in the automatic mode First, the carrier 1 is placed on the elevator 3 and the start switch 20 is pressed. After the second wafer 2 is transferred onto the turntable 70, it is centered on the turntable 70 by the centering guides 6, 6.
Next, the wafer 2 is vacuum-sucked on the turntable 70 and raised together with the turntable 70. Next, the turntable 70 is tilted in all directions as indicated by a in FIG. 8 by operating the joystick 24 except at the time of lowering, and the swing macro observation of the wafer 2 is performed in this state.

When the macro rotation sequence is set, the turntable 70 is rotated at the speed set by the rotation speed setting switch 49, and the macro rotation observation of the wafer 2 is performed in this state. Next, after the turntable 70 maintains the up state for the time set by the stop time setting switch 50, the turntable 70 lowers again. Then, the suction arm 23 returns the first wafer 2 into the carrier 1 and conveys the second wafer 2 to the swing detection position in the same manner as the first wafer. The above repetition is performed, and the last wafer 2
Is stored in the carrier 1, the suction arm 23 and the elevator 3 return to the initial position and stop.

(B) When the horizontal macro sequence is set The basic operation is the same as that of the swing macro sequence, but the turntable 70 does not rise and the wafer 2 is kept in a horizontal state as shown by b in FIG. Horizontal macro observation is performed. When the macro rotation sequence is set, it is the same as the case of the swing macro observation.

(C) When all of the sequence setting switches 48 are not set: Only the operation of extracting and storing the wafer 2 with respect to the carrier 1 by the suction arm 23 is performed, and the observation position is the position c in FIG.

(D) In the case of the manual mode This operation is performed by pressing the start switch 20 for each wafer, and the suction arm 23 takes out the next wafer 2 after storing the wafer 2 in the carrier 1 and is in a ready state. Waits for the operation of the start switch 20. When the orientation flat alignment sequence is set in the swing macro or horizontal macro sequence setting, orientation flat alignment is performed during conveyance or storage.

(E) Sequence change during the sequence The sequence can be changed for each wafer. For example, when performing microscopic observation with the microscope 12 in more detail during the inspection in the state of the horizontal macro sequence, first, the temporary stop switch 51 is pressed to invalidate the stop time setting switch 50, and the holder is transported. When the sequence setting switch of (align) is pressed, the corresponding wafer 2 is transferred to the holder 13.

As described above, according to the embodiment of the present invention, various operations and observations can be freely adapted in the inspection process, so that the operability is good and the adaptation to the variety of inspections is possible. Is easy. Specifically, (1) it is possible to cope with a plurality of types of macro observation, (2) it is possible to cope with switching between macro observation and microscope observation with one touch, (3) the above observation can be changed for each wafer, 4) In the case of an inspection without rotation in a horizontal state without rotation, the rotation and rotation can be eliminated, so that there is an advantage that the transport time can be shortened. In addition, by transporting the wafer between the carrier, the macro inspection section and the micro inspection section by the suction arm and eliminating the conveyor belt, contamination and scratches on the back side of the wafer due to rubbing with the back side of the wafer are unlikely to occur as in the belt transfer method. As a result, the defect of the wafer can be almost eliminated, and the inspection unit can be improved in cleanliness with almost no generation of dust due to abrasion or the like like a belt.
In addition, since the wafer is transported by being sucked by the suction pad,
The wafer can be transferred stably and at high speed. Furthermore,
By arranging the macro inspection unit and the micro inspection unit on the same line, the transfer process of the wafer can be shortened, and the inspection time can be shortened.

[0040]

According to the present invention described above, the carrier conveyance path between the macro inspection section and the micro inspection section is constituted entirely by suction arms, and the conveyor belt is eliminated, so that the belt conveyance method is used. Contamination due to friction with the back surface of the inspection substrate, which has been a problem, can be prevented, and the inspection substrate can be transported stably and at high speed by sucking and transporting the inspection substrate by the suction arm.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an entire wafer inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the same device.

FIG. 3 is a plan view of a driving mechanism of a suction arm of the apparatus.

FIG. 4 is a partially cutaway front view of a driving mechanism of a suction arm of the apparatus.

FIG. 5 is a sectional view taken along the line VV of FIG. 4;

FIG. 6 is a front view of an operation panel of the apparatus.

FIG. 7 is a view showing the operation of a suction arm of the device.

FIG. 8 is a diagram showing the operation of the turntable of the same device.

FIG. 9 is a perspective view showing the configuration of the entire conventional wafer inspection apparatus.

FIG. 10 is a plan view of the conventional device.

[Explanation of symbols]

 Reference Signs List 1 carrier 2 wafer 3 elevator 6 centering guide 7 turntable 8 orientation flat sensor 9 replacement arm 11 wafer detection sensor 12 microscope 13 holder 14 holder detection switch 23 first suction arm 26 frame 27 horizontal guide shaft 28 arm block 29, 31 linear Bearing 30 Support shaft 32 Support arm 33 Engagement piece 34 Spring 35, 36 Detected piece 37, 38 Pulley 39 Belt 40 Motor 41, 42, 43 Position sensor 44 Air cylinder 45 Upper point sensor 46 Lower point sensor 70 Turntable

──────────────────────────────────────────────────続 き Continuing on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/68 H01L 21/68 A (72) Inventor Tatsuo Nui 2-43-2 Hatagaya, Shibuya-ku, Tokyo Orimpus Optical Industry Co., Ltd. In-company (72) Inventor Hidefumi Ibaraki 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industrial Co., Ltd. Examiner Osamu Kawabata (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 21 / 66

Claims (2)

(57) [Claims] A carrier for accommodating a plurality of inspection substrates at a predetermined pitch; a macro inspection unit for macro observation of a substrate selectively supplied from the carrier; and a micro observation for the substrate supplied via the macro inspection unit. And a suction arm means for sucking and holding a substrate selectively supplied from within the carrier, transferring the substrate to the macro inspection unit, and transferring the substrate to the micro inspection unit. A substrate inspection apparatus, wherein all the substrate transport paths from the carrier to the macro inspection section and the micro inspection section are constituted only by the suction arm means. 2. The apparatus according to claim 1, wherein said suction arm means includes a direct-acting arm mechanism for transferring a substrate between said carrier and said macro inspection section, and wherein said macro inspection section is provided between said macro inspection section and said micro inspection section. 2. The substrate inspection apparatus according to claim 1, further comprising: a rotary arm mechanism for exchanging the substrate waiting at step (c) and the substrate inspected by the micro inspection unit.