KR101476061B1 - Semiconductor wafers OCR sorter - Google Patents
Semiconductor wafers OCR sorter Download PDFInfo
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- KR101476061B1 KR101476061B1 KR1020130142638A KR20130142638A KR101476061B1 KR 101476061 B1 KR101476061 B1 KR 101476061B1 KR 1020130142638 A KR1020130142638 A KR 1020130142638A KR 20130142638 A KR20130142638 A KR 20130142638A KR 101476061 B1 KR101476061 B1 KR 101476061B1
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- semiconductor wafer
- ocr
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 216
- 239000004065 semiconductor Substances 0.000 title claims abstract description 119
- 230000003287 optical Effects 0.000 claims abstract description 20
- 238000007689 inspection Methods 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims description 27
- 230000003028 elevating Effects 0.000 claims description 20
- 230000000875 corresponding Effects 0.000 claims description 5
- 230000002708 enhancing Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 3
- 238000006011 modification reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 1
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
The present invention relates to a semiconductor wafer OCR sorter, and more particularly to a semiconductor wafer OCR sorter for stably performing optical inspection on semiconductor thin wafers of different specifications, for example, 70 to 300 micrometer wafers.
Generally, a semiconductor element is manufactured by forming a fine element pattern on a semiconductor wafer. In the manufacturing process of a semiconductor device, when contaminants are adhered to a device pattern on a semiconductor wafer or a pattern defect occurs, the yield is lowered, which is discarded.
In order to monitor the process during the process of semiconductor manufacturing equipment, dummy wafers are inserted one by one and the process proceeds. When the process is completed, the film thickness and particle detection for the dummy wafer are proceeded. At this time, And the sorter equipment is used for each process. However, when a contact type probe is used in an actual lot, a process problem due to damage on the surface of the semiconductor wafer occurs during measurement.
Vacuum type or edge grip type chucks are widely used as a technology for a conventional OCR (Optical Character Reader) sorter. It is difficult to sort semiconductor wafers for different standards, Such a semiconductor wafer thin wafer handkerchief or edge grip chuck for 70 to 300 micrometers had a difficulty in handling.
In order to solve the problems of the prior art as described above, the present invention makes it possible to perform optical inspection of semiconductor wafers with different standards, to efficiently perform optical classification work on semiconductor wafers or chips, and to facilitate maintenance There is a purpose. Other objects of the present invention will become readily apparent from the following description of the embodiments.
In order to achieve the above object, according to one aspect of the present invention, there is provided a wafer cassette of a different size, each of which is arranged in a plurality so that each of the wafer cassettes is seated thereon and on which semiconductor wafers of different diameters are respectively mounted, A cassette stage for sensing the number of slots of the wafer cassette by a slot detection sensor and mapping the semiconductor wafer by a mapping sensor; A first wafer chuck for chucking the semiconductor wafer is rotated for alignment on an aligned stage, and a second wafer chuck for chucking the semiconductor wafer is rotated for alignment on one side of the aligned stage An aligner in which an alignment sensor is installed to detect a flat or notch of the semiconductor wafer; A transfer robot having a second wafer chuck for transferring a semiconductor wafer between the wafer cassette of the cassette stage and the aligner, and chucking the semiconductor wafer; And an OCR stage in which an OCR reader for performing an optical inspection on a semiconductor wafer aligned by the aligner is fixed to the arm.
The cassette stage including a stage body for providing a seating surface for seating the wafer cassette; An elevating member installed on the stage body so as to be raised and lowered by driving of the elevation driving unit; A mounting detection sensor installed on the seating surface to detect mounting of wafer cassettes of the first and second standards; A first cassette detection sensor installed to sense the wafer cassette of the first standard on the seating surface; A first slot sensing sensor installed in the elevating member to detect the number of slots of the wafer cassette of the first standard; A second cassette sensor installed on the seating surface to sense the wafer cassette of the second standard; A second slot detection sensor installed to detect the number of slots of the wafer cassette of the second standard in the elevating member; And a mapping sensor installed to map a semiconductor wafer to the elevating member.
Wherein the cassette stage is provided with a sliding groove of a letter " C "on the side of the seating surface, the elevating member having a sectional shape corresponding to the shape of the sliding groove is slidably installed in the sliding groove, The first and second slot sensing sensors and the mapping sensors are installed on the inner side of the member, respectively, and the first and second slot sensing sensors and the mapping sensors are respectively installed on the opposite sides of the elevating members A light emitting element and a light receiving element, and light output from the light emitting element can pass through the wafer cassette and be received by the light receiving element to sense a slot of the wafer cassette or a semiconductor wafer.
Wherein the OCR stage is provided on one side of each of the aligners, and the plurality of covers constituting the side surfaces are divided into a frame so as to open and close the inside of the OCR stage, and the cassette stage and the aligner are arranged in a circular shape with the transfer robot And a control device and an electric device necessary for operation are installed in an inner space opened by the cover and a keyboard for input is housed inside by a keyboard tray, And a monitor for confirming an operation state and a result of the classification is installed on the post, and an ionizer can be installed on the upper side of the monitor in the post.
Each of the first and second wafer chucks may be a Bernoulli chuck.
Wherein the first wafer chuck is provided with a plurality of first cyclone pads for chucking the semiconductor wafer by sucking air while rotating the air on the first chuck main body on the alignment stage in a rotatable manner, And a second wafer chuck having a plurality of first support pads for supporting and supporting a cushion of the semiconductor wafer on the first chuck main body, wherein the second wafer chuck is mounted on the arm of the transfer robot, A plurality of second cyclone pads for chucking the semiconductor wafer by sucking air while swirling the air on the bottom surface of the chuck main body, and second support pads for supporting and supporting the cushion of the semiconductor wafer on the bottom surface of the second chuck main body And the semiconductor wafer may have a diameter of 150 mm, 200 mm, 300 mm, or 450 mm.
According to the semiconductor wafer OCR sorter according to the present invention, it is possible to perform optical inspection of a semiconductor wafer with a different standard, to make the efficiency of optical sorting work for the semiconductor wafer or chip excellent, So that the chucking for transferring is stably performed.
1 is a perspective view showing a semiconductor wafer OCR sorter according to an embodiment of the present invention,
2 is a plan view showing a semiconductor wafer OCR sorter according to one embodiment of the present invention,
3 is a front view showing a semiconductor wafer OCR sorter according to one embodiment of the present invention,
4 is a perspective view showing a cassette stage of a semiconductor wafer OCR sorter according to an embodiment of the present invention,
5 is a front view showing a state in which a sorter body is opened in a semiconductor wafer OCR sorter according to an embodiment of the present invention,
6 is a plan view showing a first wafer chuck of a semiconductor wafer OCR sorter according to an embodiment of the present invention,
7 is a bottom view showing a second wafer chuck of a semiconductor wafer OCR sorter according to one embodiment of the present invention.
The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in detail in the drawings. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but is to be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention, And the scope of the present invention is not limited to the following examples.
Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant explanations thereof will be omitted.
1 to 3 are a perspective view, a plan view, and a front view showing a semiconductor wafer OCR sorter according to an embodiment of the present invention.
1 to 3, a semiconductor wafer OCR sorter 100 according to one embodiment of the present invention includes a cassette stage 110, an aligner 120, a transfer robot 120, 130, and an Optical Character Reader stage 140, and can be used to visually identify and classify defects in a semiconductor wafer or chips formed thereon by optical inspection by OCR.
The cassette stage 110 is arranged in a number of, e.g., four, such that the wafer cassettes are each seated to detect the number of wafer cassettes and slots, and perform mapping to semiconductor wafers, and further to wafer cassettes of different sizes, So that the wafer cassettes of the first and second standards are mounted.
4, the cassette stage 110 senses wafer cassettes of different sizes on which semiconductor wafers of different diameters are mounted, respectively, by the cassette detection sensors 114 and 116, and detects the number of slots of the wafer cassette in the slots Is sensed by the sensing sensors 115a, 115b, 117a, 117b, and maps the semiconductor wafer by the mapping sensors 118a, 118b.
The cassette stage 110 includes a stage main body 111 for providing an upper surface with a seating surface 111a for placing a wafer cassette as in the present embodiment and a stage main body 111 for lifting and lowering the stage main body 111 by driving the elevation driving portion 112a A mount detection sensor 113 installed to detect mounting of first and second standard wafer cassettes different from each other on the seating face 111a; A first slot detection sensor 115a and 115b installed to detect the number of slots of the wafer cassette of the first size in the elevation member 112, A second cassette detection sensor 116 installed to detect a wafer cassette of a second standard on the wafer cassette 111a and a second slot detection sensor 116 installed to detect the number of slots of the wafer cassette of the second standard on the elevation member 112, (117a, 117b), and the elevating member (112) May include maemping sensors (118a, 118b) are provided so as to map the wipers.
The elevation driving section 112a converts the rotational force of the motor into linear motion using a gear, a lead screw, a ball screw, or the like, and supplies the driving force to the elevating member 112, the driving force of the cylinder to the elevating member 112, The elevating member 112 is raised and lowered by providing the driving force of various actuators to the elevating member 112 using a suitable transmitting member.
The cassette stage 110 is provided with a sliding groove 111b on the side of the seating surface 111a and an elevating member 112 having a sectional shape corresponding to the shape of the sliding groove 111b, And first and second slot sensing sensors 115a, 115b, 117a and 117b and mapping sensors 118a and 118b are installed on the inner surface of the elevating member 112. [
A guide member for guiding the wafer cassettes of the first and second standards to be seated at the predetermined positions may be provided on the seating surface 111a and the mounting sensors 113 may be provided on both sides of the wafer cassettes of the first and second standards And the first and second cassette detection sensors 114 are installed at positions for respectively sensing the wafer cassettes of the first and second specifications.
The elevating member 112 has a cross-sectional shape of "C" so as to surround a part of the front face and the side face of the wafer cassette, and a part of the rear face of the wafer cassette when lifted by the elevation driving unit 112a.
Each of the first and second slot detection sensors 115a, 115b, 117a and 117b and the mapping sensors 118a and 118b includes light emitting devices 115a and 117a provided on inner side surfaces of the elevation member 112, And light receiving elements 115b, 117b, and 118b may be formed of the light receiving elements 115a, 117a, and 118a. Light having a predetermined wavelength output from the light emitting elements 115a, 117a, and 118a may pass through the slots of the wafer cassette, So as to sense the slot of the wafer cassette or the semiconductor wafer mounted thereon, thereby detecting the number of slots or the number of semiconductor wafers mounted in the slot.
As shown in Figures 1-3, aligner 120 is arranged in multiple, e.g., two, together with cassette stage 110 to align semiconductor wafers loaded from a wafer cassette, respectively, The first wafer chuck 122 is rotated and moved for alignment on the alignment stage 121 and a flat or notch of the semiconductor wafer is formed on one side of the alignment stage 121 An alignment finger grip 123 is installed so as to sense the finger. The alignment stage 121 includes, for example, a rotation drive unit for rotating the rotation axis of the first wafer chuck 122 using a driving force of the motor, and a second wafer chuck 122 may be provided with a movement driving unit for moving the driving force of each of the motors in the X axis and the Y axis by converting the driving force of each of the motors into a linear motion, thereby performing the rotation and the XY stage.
The first wafer chuck 122 may be an electrostatic chuck for chucking a semiconductor wafer or a chuck having a clamp to perform a clamping or mechanical clamping, for example, a non-contact type or a contact type Bernoulli chuck. Here, the Bernoulli chuck is a chuck that is supplied with air, for example, CDA (Clean Dry Air), chucking a semiconductor wafer by generating a swirling flow of air from a cyclone pad as a Bernoulli tip, And is supported by the support pads to prevent rotation during transport.
6, when the first wafer chuck 122 is made of Bernoulli chuck, the first chuck main body 122a can be rotatably installed on the aligning stage 121, and the first chuck main body 122a A plurality of first cyclone pads 122b may be provided for chucking the semiconductor wafer by sucking air while rotating the air on the first chuck main body 122a, A plurality of pads 122c may be provided. The first cyclone pad 122b may be formed with a suction port for sucking air in a central portion connected to the air suction portion and may be provided with a guide portion for guiding the air sucked into the suction port. A plurality of jetting openings through which the air is jetted can be formed so that the air injected through the jetting ports can be sucked through the suction port before being brought into contact with the surface of the semiconductor wafer and the semiconductor wafer is chucked by the suction force of the swirling flow. The first support pad 122c supports the semiconductor wafer by a cushion and supports the first cyclone pad 122b so as to maintain the chucking action.
The alignment detection unit 123 may form a groove for allowing a part of the edge of the semiconductor wafer to pass therethrough. For detecting the flat or notch of the semiconductor wafer on the upper and lower sides of the groove, Element and a light receiving element receiving such light may be provided, and may be made of, for example, a laser sensor.
The transfer robot 130 transfers a semiconductor wafer between the wafer cassette and the aligner 120 placed on the cassette stage 110. For this purpose, for example, an arm A second wafer chuck 132 for chucking a semiconductor wafer is provided at an end of the arm 133 and an arm drive unit for rotating the arm 133 by a pneumatic force or a driving force of the motor is installed in the rotational coupling portion of the arm 133 And the overall rotation of the arm 133 and the unfolding or folding of the rotational engaging portion of the arm 133 cause the second wafer chuck 132 to move the semiconductor wafer from the slot of the wafer cassette to the first wafer chuck (Not shown), or unload the semiconductor wafer.
The second wafer chuck 132 may be an electrostatic chuck for chucking a semiconductor wafer, a chuck having a clamp to perform a clamping or a mechanical clamping, and may be made of a non-contact type or contact type Bernoulli chuck in this embodiment. Here, the Bernoulli chuck is a chuck that is supplied with air, for example, CDA (Clean Dry Air), chucking a semiconductor wafer by generating a swirling flow of air from a cyclone pad as a Bernoulli tip, And is supported by the support pads to prevent rotation during transport.
7, when the second wafer chuck 132 is made of a Bernoulli chuck, the second wafer chuck 132 is sucked while swirling the air on the bottom surface of the second chuck main body 132a installed on the arm 133 of the transfer robot 130, A plurality of second cyclone pads 132b may be provided for chucking the wafer and a plurality of second support pads 132c may be provided on the bottom surface of the second chuck main body 132a to support and support the semiconductor wafer . Here, the second cyclone pad 132b may include a suction port for sucking air in a central portion connected to the air suction portion, for example, and a guide portion for guiding air sucked into the suction port may be provided. A plurality of jetting openings through which the air is jetted can be formed so that the air injected through the jetting ports can be sucked through the suction port before being brought into contact with the surface of the semiconductor wafer and the semiconductor wafer is chucked by the suction force of the swirling flow. The second support pad 132c supports the semiconductor wafer by a cushion and supports the second cyclone pad 132b so as to maintain the chucking action.
The semiconductor wafer to be chucked to the first and second wafer chucks 122 and 132 may be 150 mm, 200 mm, 300 mm or 450 mm in diameter. Thus, the first and second wafer chucks 122 and 132 may have a structure and dimensions for chucking such a semiconductor wafer of such diameter.
The arm 133 ascends and descends by a driving force of a motor or a cylinder, thereby moving up and down to a position corresponding to each slot of the wafer cassette to load or unload the semiconductor wafer.
The OCR stage 140 may be configured such that an OCR reader 142 for performing an optical inspection of a semiconductor wafer aligned by the aligner 120 can be fixed to the arms 143, 144, 145, and the arms 143, 144, The transfer stage 141 can be provided on the stage 141 and the arms 143, 144 and 145 can be moved in the X and Y axis directions by the transfer drive unit provided on the transfer stage 141, ) Is moved in the X-axis and Y-axis directions, the optical inspection position can be changed. Here, the transfer driving unit can use the driving force of the motor or the driving force of the cylinder so that the transfer stage 141 is made of the X-Y stage. In addition, the arms 143, 144, and 145 may be hinged to each other so as to be rotatable with respect to each other, and may be provided with hinge engaging portions that are fixed at desired angles by tightening the bolts.
5, the cassette stage 110 and the aligner 120 are circularly arranged with the transfer robot 130 as the center, and the OCR stage 140 is provided on one side of each of the aligners 120, A sorter body 150 may be provided on the upper surface.
The cutter main body 150 is detachably fixed to the frame 154 so as to open and close the inside of the plurality of covers 153 forming the side surface and is provided with a control device necessary for operation in the internal space opened by the cover 153, For example, the main controller 190, the robot controller 210, the robot solenoid valve box 220, the pneumatic panel 230, and the like, and the electric device such as the electric panel 240, First and second switches 156 and 157 for operation control may be respectively installed and an alarm unit 155 for turning on and off the alarm lamp by a control signal of the main control unit 190 in case of an operation error may be installed vertically And a keyboard (not shown) for inputting signals and data necessary for the operation are slidably coupled to the keyboard tray 151. In this state, when the keyboard is received inward by the keyboard tray 151, As shown in Fig.
A post 160 is provided on the upper surface of the sorter body 150 so as to be perpendicular to the upper surface of the sorter body 150. A monitor 160 may be installed on the post 152 to check the operation status, An ionizer 180 for generating ions for preventing the generation of static electricity may be provided on the monitor 160.
The main control unit 190 is provided with a mounting detection sensor 113 of the cassette stage 110, first and second cassette detection sensors 114 and 116, first and second slot detection sensors 115a and 115b, 117a and 117b, Receiving the detection signals from the sensors 118a and 118b to confirm the loading of the wafer cassette, the specifications of the wafer cassette and the semiconductor wafer, the number of slots of the wafer cassette, and the number of semiconductor wafers mounted in the slots, The semiconductor wafer is moved between the wafer cassette on the cassette stage 110 and the first wafer chuck 122 of the aligner 120 under the control of the aligning sensor 123, And controls the rotation and movement of the first wafer chuck 122 by the alignment stage 121 and performs the optical inspection from the OCR reader 142 of the OCR stage 140 so that a chip formed on the semiconductor wafer or semiconductor wafer Of Depending on whether the amount may be to perform the classification task. This sorting operation can be performed according to a conventional general operation.
According to the semiconductor wafer OCR sorter of the present invention, it is possible to perform optical inspection of semiconductor wafers with different standards, to make the efficiency of optical sorting work for semiconductor wafers or chips excellent, It is possible to stably perform chucking for transferring not only 150 mm or 200 mm but also 300 mm and 450 mm semiconductor wafers.
In addition, the present invention is a wafer sorter device capable of handling semiconductor wafers having a thickness of 70 to 300 micrometers. In the conventional equipment, the chuck has been changed into a wafer bobbin type of 100 to 200 mm, a 300 mm edge grip type, and a 450 mm Bernoulli tube. The bellows type and the edge type chuck can be damaged by thinning the thin wafer by chucking with direct contact and air pushing. However, the Bernoulli type chuck of the present invention may be a wafer contact type or a noncontact type A single type of semiconductor wafer can be handled as noncontact, but when it is configured as a 150 / 200mm semiconductor wafer, silicon type support pads can be mounted beside the cyclone pad.
In addition, the pre-aligner and the OCR are separately manufactured and used in the past, but the present invention can be used together, and the semiconductor wafer can be handled without directly contacting the semiconductor wafer, the process progress is completed, A contact or non-contact type chuck can be used in combination with 150mm, 200mm, 300mm, and further 450mm in order to handle a completely-finished semiconductor wafer up to the end, thereby preventing damages or breakage of the finished semiconductor wafer.
Although the present invention has been described with reference to the accompanying drawings, it is to be understood that various changes and modifications may be made without departing from the spirit of the invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.
110: cassette stage 111: stage body
111a: seat surface 111b: sliding groove
112: elevating member 112a:
113: mounting detection sensor 114: first cassette detection sensor
115a, 115b: first slot detection sensor 116: second cassette detection sensor
117a, 117b: second slot detection sensor 118a, 118b: mapping sensor
120: aligner 121: alignment stage
122: first wafer chuck 122a: first chuck body
122b: first cyclone pad 122c: first support pad
123: Alliance portion 130: Transfer robot
131: robot main body 132: second wafer chuck
132a: second chuck main body 132b: second cyclone pad
132c: second support pad 133: arm
134: rotation driving part 140: OCR stage
141: Transfer stage 142: OCR reader
143, 144, 145: arm 150:
151: Keyboard tray 152: Post
153: cover 154: frame
155: alarm unit 156: first switch
157: second switch 160: monitor
180: ionizer 190: main controller
210: Robot controller 220: Robot solenoid valve box
230: Pneumatic panel 240: Overall panel
Claims (6)
A first wafer chuck for chucking the semiconductor wafer is rotated for alignment on an aligned stage, and a second wafer chuck for chucking the semiconductor wafer is rotated for alignment on one side of the aligned stage An aligner in which an alignment sensor is installed to detect a flat or notch of the semiconductor wafer;
A transfer robot having a second wafer chuck for transferring a semiconductor wafer between the wafer cassette of the cassette stage and the aligner, and chucking the semiconductor wafer; And
An OCR stage in which an OCR reader for performing an optical inspection on a semiconductor wafer aligned by the aligner is fixed to the arm,
The cassette stage includes:
A stage main body for providing a seating surface for seating the wafer cassette;
An elevating member installed on the stage body so as to be raised and lowered by driving of the elevation driving unit;
A mounting detection sensor installed on the seating surface to detect mounting of wafer cassettes of the first and second standards;
A first cassette detection sensor installed to sense the wafer cassette of the first standard on the seating surface;
A first slot sensing sensor installed in the elevating member to detect the number of slots of the wafer cassette of the first standard;
A second cassette sensor installed on the seating surface to sense the wafer cassette of the second standard;
A second slot detection sensor installed to detect the number of slots of the wafer cassette of the second standard in the elevating member; And
And a mapping sensor provided to map the semiconductor wafer to the elevating member.
The cassette stage includes:
Wherein the elevating member having a sectional shape corresponding to the shape of the sliding groove is provided so as to be slidable up and down in the sliding groove, The first and second slot sensing sensors and the mapping sensors are installed respectively in the first and second slot sensing sensors,
Wherein each of the first and second slot sensing sensors and the mapping sensors comprises:
Wherein light emitted from the light emitting element passes through the wafer cassette and is received by the light receiving element to form a slot in the wafer cassette or a semiconductor wafer Detecting, semiconductor wafer OCR sorter.
Wherein the OCR stage is provided on one side of each of the aligners, and the plurality of covers constituting the side surfaces are divided into a frame so as to open and close the inside of the OCR stage, and the cassette stage and the aligner are arranged in a circular shape with the transfer robot And a control device and an electric device necessary for operation are installed in an inner space opened by the cover and a keyboard for input is housed inside by a keyboard tray, Further included,
The main body includes:
Wherein a post is installed vertically upward and a monitor is provided on the post for confirming the operation state and classification result and an ionizer is provided on the upper side of the monitor in the post.
Wherein each of the first and second wafer chucks comprises:
A semiconductor wafer OCR sorter comprising a Bernoulli chuck.
Wherein the first wafer chuck comprises:
A plurality of first cyclone pads for chucking a semiconductor wafer by sucking air while rotating air on the first chuck main body are provided on the alignment stage in a rotatable manner, And a plurality of first support pads for supporting and supporting the semiconductor wafer with cushion,
Wherein the second wafer chuck comprises:
A plurality of second cyclone pads for chucking the semiconductor wafer by sucking the air while swirling air is provided on the bottom surface of the second chuck main body provided on the arm of the transfer robot, and a cushion is provided on the bottom surface of the second chuck main body And a plurality of second support pads for supporting and supporting the plurality of support pads,
The semiconductor wafer may include:
A semiconductor wafer OCR sorter having diameters of 150 mm, 200 mm, 300 mm, or 450 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130142638A KR101476061B1 (en) | 2013-11-22 | 2013-11-22 | Semiconductor wafers OCR sorter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130142638A KR101476061B1 (en) | 2013-11-22 | 2013-11-22 | Semiconductor wafers OCR sorter |
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| KR101476061B1 true KR101476061B1 (en) | 2014-12-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102281956B1 (en) * | 2021-03-24 | 2021-07-23 | 황해청 | Sorter system |
| KR102384032B1 (en) * | 2021-12-22 | 2022-04-11 | 주식회사 오토솔루션 | A Semiconductor Wafers Sorter System That Can Accurately Sort Various Types Of Semiconductor Wafers |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020072704A (en) * | 2001-03-12 | 2002-09-18 | 블루코드테크놀로지 주식회사 | Wafer sorting apparatus and method for the same |
| JP2006114640A (en) * | 2004-10-14 | 2006-04-27 | Lintec Corp | Non-contact suction holding apparatus |
| KR20070083832A (en) * | 2007-04-27 | 2007-08-24 | 가부시키가이샤 라이트세이사쿠쇼 | Load port and adaptor |
| KR20090030787A (en) * | 2007-09-21 | 2009-03-25 | 주식회사 실트론 | Apparatus and method for recognizing marking on wafer |
-
2013
- 2013-11-22 KR KR1020130142638A patent/KR101476061B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020072704A (en) * | 2001-03-12 | 2002-09-18 | 블루코드테크놀로지 주식회사 | Wafer sorting apparatus and method for the same |
| JP2006114640A (en) * | 2004-10-14 | 2006-04-27 | Lintec Corp | Non-contact suction holding apparatus |
| KR20070083832A (en) * | 2007-04-27 | 2007-08-24 | 가부시키가이샤 라이트세이사쿠쇼 | Load port and adaptor |
| KR20090030787A (en) * | 2007-09-21 | 2009-03-25 | 주식회사 실트론 | Apparatus and method for recognizing marking on wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102281956B1 (en) * | 2021-03-24 | 2021-07-23 | 황해청 | Sorter system |
| KR102384032B1 (en) * | 2021-12-22 | 2022-04-11 | 주식회사 오토솔루션 | A Semiconductor Wafers Sorter System That Can Accurately Sort Various Types Of Semiconductor Wafers |
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