CN101174548B - Apparatus and method for measuring chuck attachment force - Google Patents
Apparatus and method for measuring chuck attachment force Download PDFInfo
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- CN101174548B CN101174548B CN2007101812340A CN200710181234A CN101174548B CN 101174548 B CN101174548 B CN 101174548B CN 2007101812340 A CN2007101812340 A CN 2007101812340A CN 200710181234 A CN200710181234 A CN 200710181234A CN 101174548 B CN101174548 B CN 101174548B
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- lowering
- hoisting gear
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an apparatus and method for measuring a chuck attachment force. The apparatus is capable of measuring loads applied to a measurement substrate, while the measurement substrate is detached from a chuck, and precisely calculating necessary force through a process of comparing and analyzing values of the measured loads. This may prevent errors in the application of attachment force during a semiconductor manufacturing process. In the semiconductor manufacturing process, when the substrate is detached from a chuck, the substrate may be prevented from being deformed or cracked.
Description
Technical field
The invention discloses a kind of equipment and method of measuring chuck attachment force.
Background technology
Equipment and the method for measuring chuck attachment force are known.But these methods have various defectives.
Summary of the invention
The objective of the invention is to overcome defective of the prior art, thereby a kind of equipment and method of novel measurement chuck attachment force are provided.
For this reason, according to an aspect of the present invention, provide a kind of equipment of measuring chuck attachment force, it comprises:
Be configured to accept chuck with attachment substrate;
The separator that substrate is separated with chuck;
The variable load bringing device that links to each other with separator, described variable load bringing device is operated separator by changing its load; And
Controller, its measure when substrate be attached on the separator or during the contact separation device variable load bringing device load and when substrate separates with chuck the variable load bringing device load, calculate the difference between them and utilize this difference to determine chuck attachment force.
According to a further aspect in the invention, provide a kind of method of measuring chuck attachment force, it comprises:
Substrate is placed on the chuck;
Utilize adhesive force that substrate is attached on the chuck;
Measure the load of variable load bringing device when separator is attached on the substrate or contacts substrate;
By changing the load moving separating device of variable load bringing device, so that substrate separates with chuck;
Measure the load of variable load bringing device when substrate separates with chuck; And
Calculate the load of variable load bringing device when substrate separates with chuck and when separator is attached on the substrate or contacts substrate the difference between the load of variable load bringing device, and utilize this difference to determine chuck attachment force.
According to another aspect of the invention, provide a kind of equipment of measuring chuck attachment force, it comprises:
Be configured to accept chuck with attachment substrate;
Separator, it comprises makes substrate lowering or hoisting gear that separates with chuck and the drive unit of operating lowering or hoisting gear; And
Load measuring equipment, it measured lowering or hoisting gear before separator contact substrate first load, and measure second load of lowering or hoisting gear when substrate separates with chuck, described load measuring equipment utilizes the difference between first load and second load to calculate chuck attachment force.
In accordance with a further aspect of the present invention, provide a kind of method of measuring chuck attachment force, it comprises:
Substrate is placed on the chuck;
Utilize adhesive force that substrate is attached on the chuck;
Mobile lowering or hoisting gear so that substrate separate with chuck;
First load of before the lowering or hoisting gear contact is attached to the substrate on the chuck, measuring lowering or hoisting gear;
When separating with chuck, measures substrate second load of lowering or hoisting gear; And
The first and second load calculation chuck attachment forces that utilization records.
Description of drawings
Describe embodiment in detail hereinafter with reference to following accompanying drawing, in the accompanying drawings, identical Reference numeral is represented components identical, and wherein:
Fig. 1 is the schematic diagram according to the equipment of the measurement of electrostatic power of an embodiment;
Fig. 2 is the flow chart according to the method for the measurement of electrostatic power of an embodiment;
Fig. 3 is the schematic diagram according to the equipment of the measurement of electrostatic power of another embodiment;
Fig. 4 is the upward view of the electrostatic force measuring equipment of Fig. 3;
Fig. 5 and 6 is views that the operation of the electrostatic force measuring equipment among Fig. 3 is shown;
Fig. 7 is the flow chart according to the method for the measurement of electrostatic power of another embodiment;
Fig. 8 is the schematic diagram according to the equipment of the measurement of electrostatic power of another embodiment;
Fig. 9 is the block diagram of the load measuring device among Fig. 8;
Figure 10 and 11 is views that the operation of the electrostatic force measuring equipment among Fig. 8 is shown; And
Figure 12 is the flow chart according to the method for the measurement of electrostatic power of another embodiment.
Embodiment
The disclosed here embodiment of the present invention relates to equipment and the method for measuring chuck attachment force.The specific embodiment that uses electrostatic chuck and measurement of electrostatic power is disclosed.But described equipment and method also can be used with chuck, for example vacuum chuck of other types, to be used to measure the power of other types, for example vacuum power.In addition, for example based on required application, the feature of each in the disclosed embodiments also as required any feature in other embodiment use.
Usually, handle substrate (substrate) as semiconductor wafer, be used in the process of thin-film transistor (TFTs), glass substrate or similar device of flat-panel monitor, these substrates that are transported in the chamber are moved to the desired position, are positioned on the area supported, and are arranged subsequently.Recently, along with the integrated and lighting of circuit in the semiconductor applications, and along with the increase of the display area in the manufacturing field of flat panel, substrate arrangement and the importance that is positioned over the technology of the maintenance substrate on the desired location more and more are subjected to industry pay attention to.
As the exemplary of this substrate maintenance method, exist method, the method for using vacuum power of using clip and the method for using electrostatic chuck or electrostatic chuck (ESC).In the method for using clip, fix substrate by the edge that uses clip to clamp substrate.This clip can be made by pottery or other materials.In the method for using electrostatic chuck, the electrostatic force that electrostatic chuck uses the contact-making surface place between electrostatic chuck and substrate to produce adsorbs and keeps substrate.
Recently, in these substrate maintenance methods, the method that can improve the conforming use electrostatic chuck of manufacturing process has obtained using widely.Be called in the U.S. Patent No. 6,134,096 of " electrostatic chuck " open in name about an exemplary of the correlation technique of electrostatic chuck.In this patent, electrostatic chuck has the structure that comprises insulating barrier, electrode layer, dielectric layer, and be constructed such that by applying on the electrostatic chuck-1000V to the electric power of+1000V with substrate attached to electrostatic chuck on.Using electrostatic chuck to keep in the method for substrate, because by using electrostatic force absorption substrate, chuck is keeping substrate, can stably carry out various operations in semiconductor fabrication, therefore can prevent that substrate is damaged, and reduces the percent defective of product.
Use electrostatic force absorption and keep the electrostatic chuck of substrate to comprise the base plate made by pottery, can be arranged on the electrode on the base plate and can be supplied to the dielectric of electric energy by electrode.
In electrostatic chuck, when electric energy was applied on the electrode with the absorption substrate, the surface of substrate and electrode can be polarized.At this moment, on electrostatic chuck, produce electrostatic force, by this electrostatic force, electrostatic chuck absorption and maintenance substrate.
Recently, along with the area increase of flat-panel monitor, this electrostatic chuck can comprise a plurality of dielectrics that may be arranged on the base plate and adsorb substrate.A plurality of dielectrics of absorption and maintenance substrate must be guaranteed uniform electrostatic force.
Electrostatic force can be set according to the material and the thickness of substrate.If dielectric can not be guaranteed uniform electrostatic force, may produce the error of electrostatic force, thus when substrate separates (substrate is unloaded from electrostatic chuck) with electrostatic chuck, substrate can not correctly separate with electrostatic chuck, and may produce adherent phenomenon, in this adherent phenomenon, substrate may fast return to electrostatic chuck.In addition, substrate may produce distortion or crackle.Therefore, can produce the problem that reduces production efficiency.
As shown in Figure 1, can comprise according to the electrostatic force measuring equipment 10 of an embodiment and can lay the electrostatic chuck 100 of measuring substrate S on it, apply the electric supply installation 150 of voltage and make to electrostatic chuck 100 and measure the separator 120 that electrostatic chuck 100 that substrate S applies voltage on it separates.Electrostatic force measuring equipment 10 may further include variable load bringing device 110 and controller 160, and wherein variable load bringing device 110 can link to each other with separator 120, and operates separator 120 by the load that change is applied on the separator; Controller 160 is being measured the load of measuring variable load bringing device 110 when substrate S is attached on the separator 120, and when the measurement substrate S is separated with electrostatic chuck 100, measure the load of variable load bringing device 110, thereby utilize the load variations of variable load bringing device 110 to calculate electrostatic force.
When applying electric energy, utilize by the electrostatic force that polarization phenomena produced takes place on the surface of measuring between substrate S and the electrostatic chuck 300, substrate S is measured in electrostatic chuck 100 absorption.The glass substrate of semiconductor wafer that satisfies equivalent substrate (dummy substrate), for example thin-film transistor and the flat-panel monitor of similarity condition can be as measuring substrate S.In addition, though not shown in the drawings, can also be provided with independently chuck bogey and independently substrate supporting device, with mobile chuck 300 and substrate S.
Electrostatic chuck 100 can be by supporting arrangement 150 supportings.Supporting arrangement 150 can comprise support plate or workbench 151, supporting leg 153, and can be charged by the voltage that applies by electric supply installation 155.Support plate 151 can be used for keeping electrostatic chuck 100, can load the measurement substrate S thereon.When voltage when electric supply installation 155 is applied on the electrostatic chuck 100, contact-making surface place between electrostatic chuck 100 and measurement substrate S will respond to the opposite polarity electric charge that produces and be applied to the electric charge on the electrostatic chuck 100, therefore these charge inducings may produce induced electromotive force, measure substrate S like this and will be attached on the electrostatic chuck 100.
Electrostatic chuck 100 can and be measured between the substrate S at it has the dielectric ceramics coating.According to the thickness of dielectric ceramics coating, the adhesive force that the measurement substrate S can be clamped on the electrostatic chuck 100 can change.
In addition, one or more transducers 102 can be set on the surface of electrostatic chuck 100 contact measurement substrate S, its detection measurement substrate S is attached on the electrostatic chuck or with electrostatic chuck 100 separates.Transducer 102 can comprise the pressure sensor that detected pressures changes or detect the magnetic sensor of measuring the changes of magnetic field between substrate S and the electrostatic chuck 100.
Electric supply installation can comprise to electrostatic chuck 100 supplies with galvanic DC generator (not shown).Separator 120 can comprise that producing vacuum measures the vacuum plant 130 of substrate S and the transferring power drive unit 140 with mobile vacuum plant 130 with absorption.Vacuum plant 130 can comprise have absorption measure the vacuum suction apparatus 131a of the vacuum draw spare 131b of substrate S, the vacuum pump 132 by vacuum draw spare 131b suction air and can be connected vacuum draw spare 131b and vacuum pump 132 between vacuum tube 133.The vacuum draw pad that can be made by rubber or can be used as vacuum draw spare 131b by the vacuum draw pin that ceramics insulator is made is being measured the electrostatic force that produces between substrate S and the electrostatic chuck 100 to prevent vacuum draw spare 131b influence.
Vacuum pump 132 is by vacuum draw spare 131b suction air, be attached on the vacuum suction apparatus 131a will measure substrate S, thereby when the measurement substrate S is separated with electrostatic chuck 100, can be moved forward with vacuum suction apparatus 131a by in the vertical direction by the measurement substrate S of vacuum draw spare 131b absorption.As mentioned above, vacuum tube 133 can be used for vacuum suction apparatus 131a and vacuum pump 132 are connected with each other.
Drive unit 140 can comprise at least one or in the example of present embodiment be two wheels 141 and 142, can with wheel 141 and 142 and vacuum draw spare 131 connects power transmission part 143 with realization transmission of power (transmission) function.In this embodiment, wheel 141 and 142 comprises that the first round 141 and second takes turns 142.The first round 141 can be supported the power transmission part 143 that can link to each other with vacuum suction apparatus 131a, and power transmission part 143 can spur vacuum suction apparatus 131a and be applied to corresponding power absorption of tension force on the power transmission part 143 and the measurement substrate S that keeps by vacuum draw spare 131b utilization and by variable load bringing device 110 thus.
In addition, second takes turns 142 also can be used for supporting power transmission part 143 with the first round 141, variable load bringing device 110 applied forces can be delivered to attached to the measurement substrate S on the electrostatic chuck 100 by power transmission part 143 thus, and the direction of this power can be taken turns 141 and 142 by first and second and be changed.Fast pulley (as fixed pulley) or movable wheel (as movable pulley) can be used as first and second each of taking turns in 141 and 142.In addition, also can use a plurality of direction of transfer that change power of taking turns.
Power transmission part 143 can be taken turns vacuum suction apparatus 131a, the first round 141, second 142 and be interconnected with variable load bringing device 110, and will be delivered to vacuum suction apparatus 131a by the power that variable load bringing device 110 produces.The silk thread (cable wire) or the chain that can bear several tons of loads can be used as power transmission part 143.
In the separator 120 with said structure, vacuum plant 130 produces vacuum, thereby substrate S is measured in absorption, and drive unit 140 moves vacuum suction apparatus 131a, measures substrate S and separates with electrostatic chuck 100 thereby make.
Variable load bringing device 110 is regulated its load according to the static intensity of force that applies between measurement substrate S and electrostatic chuck 100.That is to say that the power and the static intensity of force that produce in the variable load bringing device 110 are proportional.The operation of the load variations of variable load bringing device 110 can by use one independently machine come to substitute the method for a weight or use vertical load cylinder to increase or the method for minimizing load is carried out with another weight.
Controller 160 can receive about measuring the information whether substrate S separates with electrostatic chuck 100 from transducer 102.And controller 160 can be regulated the load of variable load bringing device 110, till measuring substrate S and electrostatic chuck 100 separate, and when measuring the load of measuring variable load bringing device 110 when substrate S is separated with electrostatic chuck 100.In addition, controller 160 can be used to utilize the sensing lead of variable load bringing device 110 to calculate electrostatic force.
The operation according to the electrostatic force measuring equipment of the foregoing description with said structure will be described below.
As shown in Figure 2, in step S110, can be placed on the electrostatic chuck 100 by the measurement substrate S of vacuum draw spare 131b absorption.Then, when voltage when electric supply installation 155 is applied on the electrostatic chuck 100, electrostatic chuck 100 can be recharged, and produces electrostatic force measuring between substrate S and the electrostatic chuck 100.Then, in step S120, measuring substrate S can be attached on the electrostatic chuck 100 by electrostatic force.
After the measurement substrate S had been attached on the electrostatic chuck 100, in step S130, controller 160 can little by little increase the load of variable load bringing device 110, up to the measurement substrate S and till electrostatic chuck 100 separates.Then, the tensile force of the power transmission part 143 that can connect with variable load bringing device 110 can little by little increase, and pulling force can be applied on the vacuum draw spare 131b.The power that substrate S is measured in vacuum draw spare 131b absorption must just might make the measurement substrate S separate with electrostatic chuck 100 greater than the electrostatic force between electrostatic chuck 100 and the measurement substrate S.
The load of variable load bringing device 110 can increase, till measuring substrate S and electrostatic chuck 100 separates.In step S140, when measuring substrate S and separate, can be arranged at transducer 102 on the electrostatic chuck 100 and can detect and measure substrate S and separate with electrostatic chuck 100 with electrostatic chuck 100.In step S150, transducer 102 detected information can be transferred to controller 160, and therefore the load of variable load bringing device 110 can be determined when the measurement substrate S is separated with electrostatic chuck 100.
Subsequently, in step S160, difference between the load of measuring load that substrate S is attached to the variable load bringing device 110 of vacuum draw spare 131b when going up and variable load bringing device 110 when the measurement substrate S is separated with electrostatic chuck 100 can be calculated, and can determine the exact value of electrostatic force according to this difference.
In the method for above-mentioned electrostatic force measurement mechanism and measurement of electrostatic power, can determine the exact value of electrostatic force according to the difference between the load of measuring load that substrate S is attached to the variable load bringing device 110 of vacuum draw spare 131b when going up and variable load bringing device 110 when the measurement substrate S is separated with electrostatic chuck 100, thereby can prevent from semiconductor fabrication, to apply the error of electrostatic force, and prevent that in semiconductor fabrication substrate cracks or damages when substrate separates with electrostatic chuck.
Below, with reference to Fig. 3 and 7 being described in detail according to the device of the measurement of electrostatic power of other embodiment and the method for measurement of electrostatic power.
As shown in Figure 3, can place above can comprising according to the electrostatic force measuring equipment 20 of this embodiment the electrostatic chuck 200 of measuring substrate S, to electrostatic chuck 200 apply voltage electric supply installation 255, will measure the separator 220 that electrostatic chuck 200 that substrate S applies voltage on it separates.Electrostatic force measuring equipment 20 may further include variable load bringing device 210 and controller 260, and wherein variable load bringing device 210 can link to each other with separator 220, and operates separator 220 by the load that change is applied on the separator; Controller 260 is being measured the load of measuring variable load bringing device 210 when substrate S is attached on the separator 220, and when the measurement substrate S is separated with electrostatic chuck 200, measure the load of variable load bringing device 210, thereby utilize the load variations of variable load bringing device 210 to calculate electrostatic force.
When applying electric energy, utilize by on the surface of measuring between substrate S and the electrostatic chuck 200, producing the electrostatic force that polarization phenomena produced, substrate S is measured in electrostatic chuck 200 absorption.The glass substrate of semiconductor wafer that satisfies equivalent substrate, for example thin-film transistor and the flat-panel monitor of similarity condition can be as measuring substrate S.In addition, though not shown in the drawings, also can provide independently chuck bogey and independently substrate supporting device, with mobile chuck 200 and substrate S.
In addition, one or more transducers 202 can be installed on the surface of the electrostatic chuck 200 of contact measurement substrate S, measure substrate S and be attached on the electrostatic chuck or and separate with electrostatic chuck 200 to detect.When measuring substrate S and separate with electrostatic chuck 200, transducer 202 can detect and to controller 260 transmission signals.Transducer 202 can comprise pressure sensor or magnetic sensor.Electric supply installation 255 can comprise to electrostatic chuck 200 supplies with galvanic DC generator (not shown).
When voltage when electric supply installation 255 is applied on the electrostatic chuck 200, induction produces and the opposite polarity electric charge that is applied to the electric charge on the electrostatic chuck 200 on the surface of the measurement substrate S that contacts with electrostatic chuck 200.If used the lifter pin 231 that can make by conductor, then when lifter pin 231 contact measurement substrate S so that when measuring substrate S and separating with electrostatic chuck 200, the electric charge of measuring substrate S may be by lifter pin 231 discharges, so electrostatic force can not accurately be measured.Therefore, lifter pin 231 can be made by insulator, for example ceramic material, with the discharge of the electric charge that prevents to measure substrate S.In addition, in this embodiment, by to being in and lifter pin 231 applied thrusts of measuring under the substrate S state of contact, measure substrate S and can separate with electrostatic chuck 200, thus can measurement of electrostatic chuck 100 and measure attraction between the substrate S, i.e. electrostatic force between the two.Therefore, for accurate measurement of electrostatic power, can detect lifter pin 231 whether with measure the end that contacts with the measurement substrate S that contact-detection sensor 235 that substrate S contact can be arranged on lifter pin 231.
The power that lifter plate 232 can be used for coming from drive unit 240 is delivered to the measurement substrate S, and can vertically move along guide post 234.That is to say that lifter pin 23 1 can utilize moving upward of lifter plate 232 that power is delivered to the measurement substrate S, thereby measure substrate S and can separate with electrostatic chuck 100.Lifter pin 231 can be arranged on the upper surface of lifter plate 232, and lifting shaft 233 can connect by the lower surface with lifter plate 232 in the central portion office.Lifting shaft 233 can be used for the power of drive unit 240 is delivered to lifter plate 232, and keeps the level of lifter plate 232 along guide post 234.
For example, fast pulley can take turns 241 as each, and the cable wire or the chain that can bear several tons of loads can be used as each power transmission part 243.
As shown in Figure 4, in this embodiment, four power transmission parts 243 (wherein each power transmission part 243 can link to each other with lifting shaft 233) can be along four respective direction orientations, and can reel round being arranged at four respective wheel 241 on the corresponding supporting leg 253.In addition, four wheels 241 can be installed, keeping the balance of lowering or hoisting gear 230, and disperse to be applied to power on the lowering or hoisting gear 230.
Under four wheel situations of 241, if the load that produces in variable load bringing device 210 is equal to each other, the power on the lowering or hoisting gear 230 of then being applied to is to be applied to each to take turns four times of 241 power.Further, even the load that produces in variable load bringing device 210 differs from one another, the power on the lowering or hoisting gear 230 of being applied to also equals the load sum that produces in the variable load bringing device 210.
The load of variable load bringing device 210 can be by controller 260 controls.The vertical position of lowering or hoisting gear 230 can change according to the load variations of variable load bringing device 210.
When the load of the variable load bringing device 210 that can link to each other with corresponding power transmission part 243 increased, the power that moves up can be passed to the lifter plate 232 that connects with lifting shaft 233.Thereby lifter plate 232 can move up.As the modification of the method for vertical mobile lifter plate 232, can use lift cylinders here.Further, the operation of the load variations of variable load bringing device 210 can utilize balance weight (counterweight) or use vertical load cylinder to carry out.
Simultaneously, as shown in Figure 5, in the drive unit 240 that uses wheel 241, when the load of the variable load bringing device 210 that links to each other with first end of corresponding power transmission part 243 increased, the tensile force of power transmission part 243 also increased, thus pulling lifting shaft 233.Therefore, lifter plate 232 can move up.
But, if the distance of measuring between substrate S and the lowering or hoisting gear 230 is big relatively, when the measurement substrate S is separated with electrostatic chuck 200, may be also included within the calculating of variable load bringing device 210 loads because lowering or hoisting gear 230 is shifted to the required power of measurement substrate S, be difficult to accurately measurement of electrostatic power.Therefore, as shown in Figure 6, when lifter pin 231 moved to the contact-making surface of measuring substrate S, the load of lowering or hoisting gear 230 can be measured, and when the measurement substrate S was separated with electrostatic chuck 200, the load of lowering or hoisting gear 230 can be measured.Then, can utilize the difference between the above-mentioned load to calculate electrostatic force.So electrostatic force can be measured more accurately.
The operation according to the electrostatic force measuring equipment of present embodiment with said structure will be described below.
As shown in Figure 7, in step S210, measure substrate S and can be positioned on the electrostatic chuck 200.Then, when electric supply installation 255 during to electrostatic chuck 200 service voltages, electrostatic chuck 200 can be recharged, and produces electrostatic force measuring between substrate S and the electrostatic chuck 200.Then, in step S220, measuring substrate S can be attached on the electrostatic chuck 200 by electrostatic force.
After the measurement substrate S had been attached on the electrostatic chuck 200, controller 260 can little by little increase the load of variable load bringing device 210.Then, the tensile force of the power transmission part 243 that links to each other with corresponding variable load bringing device 210 little by little increases, so that can spur lifting shaft 233, lowering or hoisting gear 230 can move up lentamente thus.
For reducing the measure error of electrostatic force, lowering or hoisting gear 230 can at first move upward, up to lifter pin 231 with measure substrate S and contact till.When lifter pin 231 when measuring substrate S and contact, can be arranged at contact-detection sensor 235 in the lifter pin 231 and can detect between the two contact.At this moment, in step S230, controller 260 can be measured the load of variable load bringing device 210.Use one of them balance weight to substitute under the situation of method that another balance weight changes load at each variable load bringing device 210, because the gravity acceleration, load may be the resulting numerical value of the double in weight of balance weight.This numerical value can equate with the power on being applied to lowering or hoisting gear 230.
The load of variable load bringing device 210 can little by little increase.Then, lowering or hoisting gear 230 can move up further.At last, measuring substrate S separates with electrostatic chuck 200.Like this, in step S240, when the measurement substrate S was separated with electrostatic chuck 200, the transducer that is installed in the electrostatic chuck 200 can detect this separation.In step S250, the detection information of transducer 202 can be transferred to controller 260, and when the measurement substrate S was separated with electrostatic chuck 200, controller 260 can be measured the load of variable load bringing device 210.
Then, in step S260, difference between the load that utilizes variable load bringing device 210 when measuring substrate S and separate with electrostatic chuck 200 and the load of variable load bringing device 210 when lifter pin 235 contacts with the measurement substrate S can accurately be calculated electrostatic force.
In the method for above-mentioned electrostatic force measurement mechanism and measurement of electrostatic power, utilize the difference between the load of the load of lifter pin 235 variable load bringing device 210 when measuring the substrate S contact and variable load bringing device 210 when the measurement substrate S is separated with electrostatic chuck 200, can determine the exact value of electrostatic force, thereby avoid in semiconductor fabrication, applying the error of electrostatic force, and prevent that in semiconductor fabrication substrate cracks or damages when substrate separates with electrostatic chuck.
Below, describe in detail according to the device of the measurement of electrostatic power of other embodiment and the method for measurement of electrostatic power with reference to Fig. 8 and 12.
As shown in Figure 8, the electrostatic force measuring equipment 30 according to present embodiment can comprise the separator 320 that can place the electrostatic chuck 300 of measuring substrate S on it and the measurement substrate S is separated with electrostatic chuck 300.Electrostatic force measuring equipment 30 may further include load measuring equipment 310, and it measures the load when separator 320 contacts with the measurement substrate S, and measures the load when the measurement substrate S is separated with electrostatic chuck 300.
When applying voltage, electrostatic chuck 300 utilizes the polarization phenomena that take place and the electrostatic force that produces absorption measurement substrate S on the surface of measuring between substrate S and the electrostatic chuck 300.The equivalent substrate that the satisfies similarity condition for example thin-film transistor and the glass substrate of semiconductor wafer or flat-panel monitor can be used as the measurement substrate S.In addition, though not shown, can provide independently chuck bogey and independently substrate supporting device, with mobile electrostatic chuck 300 and substrate S.
In detail, electrostatic chuck 300 can be positioned on the upper surface of workbench 351.To be used for the electrode (not shown) that electric energy is applied on the electrostatic chuck 300 can be arranged on workbench 351.
Here, be parallel under the state that is attached to the substrate S on the electrostatic chuck 300 at lifter plate 332, under the guiding of guide post 334, lifter pin 33 1 and lifter plate 332 can vertically move.Therefore, the lifter pin 331 that can be supported by lifter plate 332 can be equably be attached to electrostatic chuck 300 on substrate S contact.Therefore, can reduce the measure error of the load measuring equipment 310 of sensing lead.
At least two guide posts 334 can be set on the respective opposite position below the periphery of workbench 351.Further, can be provided with on each lifter plate 332 can be along the vertically mobile connector 337 of corresponding guide post 334.Replacedly, can pass lifter plate 332 and form the through hole (not shown), vertically move along guide post 334 thereby make lifter plate 332 can pass through hole.
Simultaneously, one or more transducers 302 can be set in workbench 351, whether be placed on the electrostatic chuck 300 and whether lifter pin 331 contacts with substrate S to detect substrate S.Transducer 302 can link to each other with load measuring equipment 310, with will be about the message transmission that contacts between the placement of substrate S and lifter pin 331 and the substrate S to load measuring equipment 310.
In detail, when substrate S is placed on the electrostatic chuck 300, transducer 302 can with about the message transmission of the placement of substrate S to load measuring equipment 310.Load measuring equipment 310 can be measured the first load W1, and it can be lowering or hoisting gear 330 and promotes substrate S load before.Further, when lifter pin 331 contacts with substrate S, transducer 302 can with about the message transmission of the contact between lifter pin 331 and the substrate S to load measuring equipment 310.Load measuring equipment 310 can be measured the second load W2, and it can be the load of lowering or hoisting gear 330 when substrate S is separated with chuck 300.
Here, as shown in Figure 8, transducer 302 can comprise a pair of optical pickocff, and it can face with each other and be positioned at the opposition side of measuring substrate.Replacedly, though not shown in the drawings, can pressure sensor or magnetic sensor on the upper surface of the chuck 300 of placement mounted thereto measurement substrate can be used as transducer 302.
Power produces and transfer device 342 can comprise can having the edge perpendicular to the transmission of power screw rod 343 of the rotating shaft of the direction orientation of lifting screw 341, the bevel gear 344 that can be arranged on the place, junction surface between lifting screw 341 and the transmission of power screw rod 343 and the power source 345 of rotatable transmission of power screw rod 343.
As shown in Figure 9, load measuring equipment 310 can comprise that memory 312, the calculating of the load measuring device 311, the storage first load value W1 and the second load value W2 that measure the first load W1 and the second load W2 are stored in the first load value W1 and the arithmetic unit 313 of the difference between the second load value W2 and the display 314 that shows this difference in the memory 312.
Here, can be with the typical electronic scale as load measuring device 311.Produce internal pressure when replacedly, utilizing on mechanical force is applied to by the material of making as materials such as potteries and in material, respond to the piezoelectric transducer that produces electropolarized phenomenon and also can be used as load measuring device 311.
When lifting screw 341 moves up so that substrate S when separating with electrostatic chuck 300, the pressure of lifting screw 341 can be passed to load measuring equipment 310.Then, load measuring equipment 310 utilizes the pressure of lifting screw 341 lifter plate 332 that moves up, and the lifter pin 331 that can be bearing in like this on the lifter plate 332 can move up.
In this process, load measuring device 311 is measured being attached to substrate S on the chuck 300 and is applied to the pressure of the lifting screw 341 on the lowering or hoisting gear 330 and the pressure that is applied to the lifting screw 341 on the lowering or hoisting gear 330 when substrate S is separated with chuck 300 before being promoted by lifter pin 331.In other words, load measuring device 311 is measured the first load W1 and the second load W2, wherein this first load W1 is that lowering or hoisting gear promotes to be attached to the substrate S load of lowering or hoisting gear 330 before on the chuck 300, and this second load W2 is the load of lowering or hoisting gear 330 when substrate S is separated with chuck 300.
The operation according to the electrostatic force measuring equipment of present embodiment with said structure will be described below.
Shown in Figure 10 to 12, in step S310, electrostatic chuck 300 at first can be placed on the workbench 351 of supporting arrangement 350, and substrate S can be positioned on the upper surface of electrostatic chuck 300.Like this, when electrostatic chuck 300 is positioned on the workbench 351 of supporting arrangement 350 and substrate S when being positioned on the electrostatic chuck 300, in step S320, transducer 302 can detect the existence of substrate S, and this information is delivered to load measuring equipment 310.At this moment, in step S340, the load measuring device 311 of load measuring equipment 310 is measured the first load W1, and it can be the load that lowering or hoisting gear 330 promotes to be attached to lowering or hoisting gear 330 before the substrate S on the electrostatic chuck 300, and measured value is stored in the memory 312.
Then, in step S340, electric energy can be fed into the electrode (not shown) of workbench 351, to produce electrostatic force between substrate S and electrostatic chuck 300.The electric energy that can supply on the electrode of workbench 351 also can be applied on the electrostatic chuck 300.At this moment, can on the surface between electrostatic chuck 300 and the substrate S, induce the electric polarization phenomenon.Electrostatic chuck 300 can utilize the electrostatic force absorption substrate S that is produced by electric polarization.
Substrate S was attached on the electrostatic chuck 300 by electrostatic force after, the power of drive unit 340 produced and transfer device 342 can rotation and lifting screw rod 341, with the lifting screw 341 that moves up.When lifting screw 341 little by little moves up, can the pressure of lifting screw 341 can be delivered to lifter plate 332 with the load measuring equipment 310 that the lower surface of the lifter plate 332 of lowering or hoisting gear 330 connects.
Can under the guiding of guide post 334, move up by the lifter plate 332 that load measuring equipment 310 receives the pressure of lifting screw 341, and lifter pin 331 is moved up with the state that is parallel to substrate S.Then, lifter pin 331 can pass workbench 351 and contacts with chuck 300 and with substrate S.
At this moment, transducer 302 can detect the contact between lifter pin 331 and the substrate S, and this information is delivered to load measuring equipment 310.Next, in step S350, the load measuring device 311 of load measuring equipment 310 is measured the second load W2 (it can be the load of lowering or hoisting gear 330 when substrate S is separated with chuck 300), and measured value is stored in the memory 3 12.
Before substrate S is separated from electrostatic chuck 300, because keeping by absorption affinity, substrate S is attached to state on the electrostatic chuck 300, electrostatic force applies in the opposite direction along the side that moves up with lifter pin 331.Therefore, the second load W2 is the load that comprises the lowering or hoisting gear 330 of the load that comes from electrostatic force.
Further, the first load W1 and the second load W2 correspond respectively to the pressure that was applied to the lifting screw 341 on the lowering or hoisting gear 330 before lowering or hoisting gear 330 promotes to be attached to substrate S on the chuck 300 and be applied to the pressure of the lifting screw 341 on the lowering or hoisting gear 330 under electrostatic force are applied to state between substrate S and the chuck 300.
Therefore, electrostatic force can be calculated by following equation:
P＝W2-W1
Here, P represents the electrostatic force of electrostatic chuck 300, and W1 represents first load, and it can be the load that lowering or hoisting gear promotes to be attached to lowering or hoisting gear 330 before the substrate S on the electrostatic chuck 300; W2 represents second load, and it can be the load of lowering or hoisting gear 330 when substrate S is separated with electrostatic chuck 300.
Then, in step S360, the arithmetic unit 313 of load measuring equipment 310 can calculate the difference between the first load W1 and the second load W2, and the electrostatic force P of definite chuck 300.Display 314 can demonstrate electrostatic force P.
In the electrostatic force method of measurement according to present embodiment, substrate is attached to electrostatic force P required on the electrostatic chuck can accurately be measured, and therefore electrostatic force P can be applied on the electrostatic chuck equably in semiconductor fabrication.Like this, in method according to the electrostatic force measuring equipment of this embodiment and measurement of electrostatic power, be attached to first load of lowering or hoisting gear 330 before the substrate S on the electrostatic chuck 300 and second load difference between the two of lowering or hoisting gear 330 when substrate S is separated with electrostatic chuck 300 according to lowering or hoisting gear contact, can draw the exact value of electrostatic force.Therefore, in semiconductor fabrication, the exact value of electrostatic force can be applied on the electrostatic chuck, thereby can prevent that substrate cracks or damages in semiconductor fabrication, and improves the efficient of semiconductor fabrication.
As mentioned above, according to the equipment of the measurement of electrostatic power of embodiment disclosed herein with use in the method for this device measuring electrostatic force, measurement of electrostatic power accurately, thus can determine whether the electrostatic force value that records is to be fit to carry out the numerical value that semiconductor is made.Therefore, can avoid during semiconductor fabrication, applying the error of electrostatic force, thereby in semiconductor fabrication, when substrate separates with electrostatic chuck, can prevent substrate distortion or crack.
Embodiment disclosed herein provides a kind of and has come the equipment and the method for measurement of electrostatic power by calculating the power that is applied to substrate when substrate is not subjected to electrostatic force, it has avoided determining the generation of electrostatic force time error in semiconductor fabrication, and has prevented the damage of substrate.
An embodiment disclosed herein provides a kind of equipment of measurement of electrostatic power, it comprises power supply unit or the device that applies voltage to electrostatic chuck, make and be attached to the substrate of supplying with on the electrostatic chuck that voltage is arranged and separate the separative element or the device of (or separating) with electrostatic chuck, the variable load applying unit or the device that link to each other with separative element, and control unit or device, wherein this variable load applying unit is operated separative element by the load that changes this variable load applying unit, this control unit or device are used to measure the load of variable load applying unit when substrate is attached on the separative element and the load of variable load applying unit when measuring substrate and separate with electrostatic chuck, and calculate electrostatic force.Separative element can comprise vacuum unit or the device of generation vacuum with absorption measurement substrate, and transferring power is with the driver element or the device of mobile vacuum unit.
In addition, vacuum unit can comprise the vacuum pump that is used to adsorb the vacuum draw spare of substrate and passes through vacuum draw spare extracting air.Vacuum draw spare can comprise one that is selected from vacuum draw pad and the vacuum draw pin.
This equipment can further comprise sensing unit or the device that is arranged in the electrostatic chuck, to detect substrate attached to separating on the electrostatic chuck or with electrostatic chuck.Sensor unit can comprise one that is selected from pressure sensor and the magnetic sensor.Separative element can comprise lifting unit or the device that the measurement substrate that can be attached on the electrostatic chuck is separated with electrostatic chuck, and transmission of drive force is with the driver element or the device of mobile lifting unit.
In addition, lifting unit can comprise lifter pin, with the contact substrate, is applied to power on the substrate thereby transmit by driver element.Can in the part of the lifter pin that contacts substrate, contact-detection sensor be set, whether contact substrate to detect lifter pin.Driver element can comprise and the variable load applying unit can be linked to each other with lifting unit actuating force is delivered to the power transmission part of lifting unit.
Another embodiment disclosed herein provides a kind of equipment of measurement of electrostatic power, this equipment comprises on it the chuck of placing substrate, comprise the separative element that makes lifting unit that substrate separates with electrostatic chuck or device or device, driver element or the device and the load measuring device of operation lifting unit, second load that it was measured first load of lowering or hoisting gear and measured lowering or hoisting gear when substrate separates with chuck before separative element extruding substrate, load measuring device utilize the difference between first load and second load to calculate the electrostatic force of chuck.This equipment can further comprise bearing unit or the device that supports chuck, and it can have the scaffold of chuck workbench placed thereon and supporting table.
Lifting unit can comprise that passing chuck carries out a plurality of lifter pins that vertically move and the lifter plate that supports lifter pin.Transducer can be arranged in the bearing unit, is attached on the chuck to detect substrate, still separate with chuck, and whether lifter pin contacts with substrate.
In addition, on workbench, a guide post can be set, thereby make lifter plate connect with guide post slidably, thereby the guiding lifting unit carries out vertical motion.Drive unit can comprise the lifting screw that supports lifter plate and power generation and the transfer unit or the device of rotation and lifting screw rod, and wherein lifting screw is vertically moved.
Load measuring device can comprise the load measuring unit of measuring first load and second load or device, wherein store display unit or the device that the memory cell of first load value and second load value or device, calculating are stored in the arithmetic element of first load value in the memory cell and the difference between second load value or device and show difference.
Further, another embodiment disclosed herein provides a kind of method of measurement of electrostatic power, this method comprises substrate is positioned on the electrostatic chuck, voltage is applied on the electrostatic chuck so that electrostatic chuck is charged, and utilize the electrostatic force that produces by voltage that substrate is attached on the electrostatic chuck, make the load of variable load applying unit that substrate separates with electrostatic chuck or device move up vacuum unit or device by change, measure the load of variable load applying unit when substrate separates with electrostatic chuck by the variable load applying unit, and the difference between the load of the variable load applying unit of calculating the load of the variable load applying unit that when substrate separates with electrostatic chuck, records and when vacuum unit or device absorption and maintenance substrate, recording, and utilize this difference to determine electrostatic force.
Another embodiment disclosed herein provides a kind of method of measurement of electrostatic power, this method comprises substrate is positioned on the electrostatic chuck, voltage is applied on the electrostatic chuck so that electrostatic chuck is charged, and utilize the electrostatic force that produces by voltage that substrate is attached on the electrostatic chuck, lifting unit or device move up, so that substrate separates with electrostatic chuck, measure the load of when lifting unit contacts with substrate variable load applying unit or device, measure the load of variable load applying unit when substrate being separated with electrostatic chuck by moving upward of lifting unit, difference between the load of the variable load applying unit of calculating the load of the variable load applying unit that when lifting unit contact substrate, records and when substrate separates with electrostatic chuck, recording, and utilize this difference to determine electrostatic force.
Another embodiment disclosed herein provides a kind of method of measurement of electrostatic power, and this method is included in the lowering or hoisting gear extruding and is attached to second load that the substrate on the chuck is measured first load of lifting unit or device and measure lowering or hoisting gear when substrate is separated with chuck before.
This method utilizes the electrostatic force that is produced by the voltage of supplying with to chuck that substrate is attached on the chuck before can further being included in and carrying out measuring for the first time.In measuring for the second time, the difference between first load that can calculate lifting unit before the lifting unit extruding is attached to substrate on the chuck and second load of lowering or hoisting gear when substrate separates with chuck, and can utilize this difference to determine electrostatic force.
In this manual, any special characteristic, structure or the characteristics that all mean with describing at this embodiment quoted about " embodiment ", " embodiment ", " exemplary embodiment " etc. comprise at least one embodiment of the present invention.This term that diverse location in this manual occurs must not refer to same embodiment.In addition, when describing special characteristic, structure or characteristics, should be considered to those of ordinary skill in the art and can expect and this feature, structure or characteristics can be applied among other embodiment at any embodiment.
Though described some embodiment with reference to a plurality of illustrative embodiment, should be appreciated that those of ordinary skill in the art can visualize multiple other modifications and embodiment in the spirit and scope of the principle of the disclosure text.More particularly, in the scope of this specification, accompanying drawing and claims, can carry out various variants and modifications to configuration in element and/or combining and configuring.Except the variants and modifications aspect element and/or the configuration, it also will be conspicuous for the ordinary skill in the art that some replaceabilities are used.
Claims (17)
1. equipment of measuring chuck attachment force, this equipment comprises:
Be configured to accept chuck with attachment substrate;
The separator that substrate is separated with chuck;
The variable load bringing device that links to each other with separator, described variable load bringing device is operated separator by changing its load; And
Controller, its measure substrate with before chuck separates when substrate be attached on the separator or during the contact separation device variable load bringing device load and when substrate separates with chuck the variable load bringing device load, calculate the difference between them and utilize this difference to determine chuck attachment force, wherein said separator comprises:
The lowering or hoisting gear that substrate is separated with chuck; And
Transmission of drive force with the lowering or hoisting gear that moves up so that the drive unit that substrate separates with chuck, wherein said drive unit comprises the variable load bringing device linked to each other with lowering or hoisting gear actuating force being delivered to the power transmission of lowering or hoisting gear, and wherein said power transmission comprise at least two wheels and with described at least two power transmission parts that wheel connects.
2. equipment as claimed in claim 1 is characterized in that described power transmission part is made of silk thread or chain.
3. equipment as claimed in claim 1 is characterized in that, further comprises:
Be arranged in the chuck or on the chuck to detect substrate attached on the chuck or at least one transducer that separates with chuck.
4. equipment as claimed in claim 3 is characterized in that, described at least one transducer comprises one that is selected from pressure sensor, magnetic sensor or the optical pickocff.
5. equipment as claimed in claim 1 is characterized in that, described lowering or hoisting gear comprises that the contact substrate is delivered at least one lifter pin of substrate with the power that drive unit is applied.
6. equipment as claimed in claim 5 is characterized in that, further comprises:
The lifting shaft of the lifter plate of described at least one lifter pin of supporting and the described lifter plate of supporting.
7. equipment as claimed in claim 5 is characterized in that, further comprises:
Contact-detection sensor, it is arranged in described at least one lifter pin of contact substrate, whether contacts substrate to detect described at least one lifter pin.
8. equipment as claimed in claim 1 is characterized in that described chuck comprises electrostatic chuck, described device measuring electrostatic force.
9. method of measuring chuck attachment force, this method comprises:
Substrate is placed on the chuck;
Utilize adhesive force that substrate is attached on the chuck;
Measure the load of variable load bringing device when separator is attached on the substrate or contacts substrate;
By changing the load moving separating device of variable load bringing device, so that substrate separates with chuck;
Measure the load of variable load bringing device when substrate separates with chuck; And
Calculate variable load bringing device when substrate separates with chuck load and substrate with before chuck separates when separator is attached on the substrate or contacts substrate the difference between the load of variable load bringing device, and utilize this difference to determine chuck attachment force, wherein said separator comprises lowering or hoisting gear, described mobile step comprise move up lowering or hoisting gear so that substrate separate with chuck, described calculation procedure comprise that the load of the variable load bringing device that records when lowering or hoisting gear touches substrate is worked as in calculating and the load of the variable load bringing device that when substrate separates with chuck, records between difference, and utilize this difference to determine chuck attachment force, wherein said separator further comprises the drive unit of transmission of drive force with mobile lowering or hoisting gear, described drive unit comprises the variable load bringing device linked to each other with lowering or hoisting gear actuating force being delivered to the power transmission of lowering or hoisting gear, and wherein said power transmission comprise at least two wheels and with described at least two at least one power transmission parts that wheel connects.
10. method as claimed in claim 9 is characterized in that described chuck comprises electrostatic chuck, and described adhesive force comprises electrostatic force.
11. an equipment of measuring chuck attachment force, this equipment comprises:
Be configured to accept chuck with attachment substrate;
Separator, it comprises makes the lowering or hoisting gear that substrate separates with chuck and moves up lowering or hoisting gear so that the drive unit of substrate and chuck; And
Load measuring equipment, it measured lowering or hoisting gear before separator contact substrate first load, and when separating with chuck, measures substrate second load of lowering or hoisting gear, described load measuring equipment utilizes the difference between first load and second load to calculate chuck attachment force, and wherein said lowering or hoisting gear comprises:
Pass at least one the vertically mobile lifter pin of at least one respective openings that is arranged in the chuck; And
The lifter plate of described at least one lifter pin of supporting, wherein said drive unit comprises the variable load bringing device linked to each other with lowering or hoisting gear actuating force being delivered to the power transmission of lowering or hoisting gear, and wherein said power transmission comprise at least two wheels and with described at least two at least one power transmission parts that wheel connects.
12. equipment as claimed in claim 11 is characterized in that, further comprises:
The supporting arrangement of supporting chuck.
13. equipment as claimed in claim 12 is characterized in that, described supporting arrangement comprises the workbench of placing chuck on it and the scaffold that supports described workbench.
14. equipment as claimed in claim 13 is characterized in that, further comprises:
Be arranged at least one transducer on the described supporting arrangement or in the described supporting arrangement, it detects substrate attached to separating on the chuck or with chuck and whether described at least one lifter pin touches substrate.
15. equipment as claimed in claim 14 is characterized in that, further comprises:
At least one guide post, it is arranged on the described workbench, thereby makes described at least one lifter plate connect slidably with described guide post, and wherein said at least one guide post guides the vertical motion of described lowering or hoisting gear.
16. equipment as claimed in claim 11 is characterized in that, described load measuring equipment comprises:
Measure the load measuring device of described first load and described second load;
Store the memory of first load value and second load value;
Calculate the arithmetic unit of the difference between first load value and second load value; And
The display unit that shows described difference.
17. equipment as claimed in claim 11 is characterized in that, described chuck comprises electrostatic chuck, described device measuring electrostatic force.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060108177 | 2006-11-03 | ||
| KR1020060108176A KR101362673B1 (en) | 2006-11-03 | 2006-11-03 | Electro static force measuring apparatus and electro static force measuring method |
| KR10-2006-0108176 | 2006-11-03 | ||
| KR1020060108176 | 2006-11-03 | ||
| KR1020060108177A KR20080040342A (en) | 2006-11-03 | 2006-11-03 | Apparatus for absorption pressure measuring and will and method using the same |
| KR10-2006-0108175 | 2006-11-03 | ||
| KR10-2006-0108177 | 2006-11-03 | ||
| KR1020060108175 | 2006-11-03 | ||
| KR1020060108175A KR20080040801A (en) | 2006-11-03 | 2006-11-03 | Electro static force measuring apparatus and electro static force measuring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101174548A CN101174548A (en) | 2008-05-07 |
| CN101174548B true CN101174548B (en) | 2011-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101812340A Expired - Fee Related CN101174548B (en) | 2006-11-03 | 2007-10-25 | Apparatus and method for measuring chuck attachment force |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20080040801A (en) |
| CN (1) | CN101174548B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376176B (en) * | 2013-06-21 | 2015-10-28 | 清华大学 | The device of the electrostatic force of measurement of electrostatic chuck |
| CN103698068B (en) * | 2013-12-06 | 2014-11-12 | 清华大学 | Electrostatic chuck basic performance detection device and detection method thereof |
| CN104062040B (en) * | 2014-07-08 | 2016-08-24 | 北京华卓精科科技股份有限公司 | The measurement apparatus of electrostatic chuck electrostatic adsorption force |
| CN110491819B (en) * | 2018-05-14 | 2021-11-12 | 北京北方华创微电子装备有限公司 | Method for balancing electrostatic force and electrostatic chuck |
| CN110931413B (en) * | 2018-09-20 | 2022-03-04 | 北京华卓精科科技股份有限公司 | Electrostatic chuck separating device |
| KR102619624B1 (en) * | 2018-11-13 | 2023-12-29 | 삼성전자주식회사 | Apparatus of bonding substrates and method of bonding substrates |
| KR102367588B1 (en) * | 2019-12-06 | 2022-02-28 | 서울대학교산학협력단 | Design of electrodes for maximal electro-adhesion |
| CN111933565B (en) * | 2020-09-27 | 2021-01-29 | 北京京仪自动化装备技术有限公司 | Wafer adsorption force adjusting system and method for conveying manipulator and arm |
| CN113904581B (en) * | 2021-08-31 | 2024-05-14 | 南方科技大学 | Transmission device based on electrostatic adsorption |
| KR102677251B1 (en) * | 2021-10-28 | 2024-06-20 | 세메스 주식회사 | Substrate test apparatus and method for measuring dechucking force using the same |
| CN116454015B (en) * | 2023-06-19 | 2023-08-11 | 北京芯士联半导体科技有限公司 | Edge clamping type wafer chuck device |
-
2006
- 2006-11-03 KR KR1020060108175A patent/KR20080040801A/en active Search and Examination
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2007
- 2007-10-25 CN CN2007101812340A patent/CN101174548B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
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| CN101174548A (en) | 2008-05-07 |
| KR20080040801A (en) | 2008-05-09 |
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