CN111933565B - Wafer adsorption force adjusting system and method for conveying manipulator and arm - Google Patents
Wafer adsorption force adjusting system and method for conveying manipulator and arm Download PDFInfo
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- CN111933565B CN111933565B CN202011029265.6A CN202011029265A CN111933565B CN 111933565 B CN111933565 B CN 111933565B CN 202011029265 A CN202011029265 A CN 202011029265A CN 111933565 B CN111933565 B CN 111933565B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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Abstract
The embodiment of the invention provides a wafer adsorption force adjusting system, a method and an arm for a transmission manipulator, wherein the system comprises: the system comprises N pressure sensors, N wafer contactors, a controller, a static electricity generation controller and a static electricity generation device; the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors, wherein the pressure values are the sum of output values of the N pressure sensors; the controller is connected with the output ends of the N pressure sensors and used for determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model, and driving the static electricity generation controller to output a current actual voltage value by using the current target voltage value so that the static electricity generation device generates corresponding static electricity to generate adsorption force with the static electricity induction of the wafer, and the non-sliding transmission of the wafers with different thicknesses under different processes is realized.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a wafer adsorption force adjusting system and method for a conveying manipulator and an arm.
Background
In the prior art, in the production of semiconductors, due to the fact that semiconductor products are various and the process is complex, the thicknesses of wafers are greatly different in different wafer factories, and in addition, the contact area of a wafer contactor in contact with the wafers is required to be reduced as much as possible so as to avoid defects and exposure problems. None of the transfer methods in the industry are fully adaptable so that different series of wafer transfer robots have to be created to accommodate them, resulting in a significant investment.
Therefore, it is an urgent technical problem to be solved by those skilled in the art to provide a transfer robot capable of conveniently transferring wafers of different specifications.
Disclosure of Invention
The embodiment of the invention provides a wafer adsorption force adjusting system and method for a conveying manipulator and an arm, which can conveniently convey wafers of different specifications.
The embodiment of the invention provides a wafer adsorption force adjusting system for a conveying manipulator, which comprises: the device comprises N pressure sensors, N wafer contactors, a controller, a static electricity generation controller and a static electricity generation device, wherein N is a positive integer not less than 3;
the static electricity generating device is connected with a voltage output end of the static electricity generating controller and is used for generating static electricity to enable the wafer to generate induced charges;
the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors, wherein the pressure values are the sum of output values of the N pressure sensors;
the controller is connected with the output ends of the N pressure sensors and is used for determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model and driving the static generation controller to output a current actual voltage value by using the current target voltage value so as to enable the static generation device to generate corresponding static charges; and the preset static control parameter model is provided with a corresponding relation between a pressure value and a target voltage value.
Further, the preset static control parameter model is a preset static control voltmeter; the preset static control voltmeter is provided with a pressure value range and a corresponding target voltage value.
Further, the preset static control voltage model is a functional relation between a pressure value and the target voltage value.
Further, the device also comprises a power supply;
the static electricity generating device comprises a positive charge end and an electronic end;
the positive charge end and the electronic end are both arranged on the conveying manipulator;
the power supply is used for supplying power to the positive charge terminal and the electronic terminal, so that the positive charge terminal generates positive charge, and the electronic terminal generates electrons.
Further, still include: the alarm module is connected with the controller;
the controller is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current threshold value is exceeded, triggering the alarm module.
Further, the controller is further configured to acquire a current target voltage value and a current actual voltage value, and determine whether a difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; and if the current target voltage value does not exceed the preset threshold value, correcting the preset static control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
Further, the controller is specifically configured to reduce the target voltage value in the preset static control voltage model if the current target voltage value is smaller than the current actual voltage value; and if the current target voltage value is larger than the current actual voltage value, increasing the target voltage value in the preset static control voltage model.
Further, the controller is also used for sending out a wafer placement error alarm when the deviation of any one of the N pressure values corresponding to the N pressure sensors and other pressure values exceeds a threshold value.
An embodiment of the present invention further provides a method for adjusting a wafer suction force of a transfer robot, which is applied to any one of the wafer suction force adjusting systems described above, and includes:
when it is determined that a wafer is placed on the wafer contactor, obtaining a pressure value of the wafer, wherein the pressure value is the sum of output values of the N pressure sensors;
determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model;
driving the static electricity generation controller to output a current actual voltage value by using a current target voltage value so as to enable the static electricity generation device to generate corresponding static electricity;
and the preset static control parameter model is provided with a corresponding relation between a pressure value and a target voltage value.
Further, still include:
acquiring a current target voltage value and a current actual voltage value;
judging whether the difference value between the current target voltage value and the current actual voltage value exceeds a preset threshold value or not;
and if the current target voltage value does not exceed the preset threshold value, correcting the preset static control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
According to the wafer adsorption force adjusting system and method for the conveying manipulator and the arm, different static charges generated by the static electricity generating device are controlled to be different by utilizing different weights of wafers with different specifications, so that different positive pressures are generated, the static friction force in the wafer transferring process is ensured, the positive pressures can be converted into the pressure values of electric signals by the pressure sensor below the wafer contactor, and the non-sliding transmission of the wafers with different thicknesses in different processes is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a wafer chucking force adjustment system for a transfer robot according to an embodiment of the present invention;
FIG. 2 is a voltage diagram of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention;
FIG. 3 is a force-electrical relationship diagram of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention;
FIG. 4 is a top view of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention;
figure 5 is an elevation view of a wafer chucking force adjustment system for a transfer robot according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating a wafer chucking force adjustment method for a transfer robot according to an embodiment of the present disclosure;
fig. 7 is a modified flowchart of a wafer chucking force adjustment method for a transfer robot according to an embodiment of the present disclosure.
Reference numerals:
1: a substrate; 11: a support portion; 12: a connecting portion; 13: a wiring groove;
2: a static electricity generating device; 21: a positive charge terminal; 22: an electronic terminal;
3: a wafer contactor; 4: a pressure sensor; 5: a first conductive line; 6: a second conductive line; 7: a wire distributor; 8: a controller; 9: a static electricity generation controller.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A wafer chucking force adjustment system for a transfer robot according to an embodiment of the present invention will be described with reference to fig. 1 to 5. FIG. 1 is a schematic diagram of a wafer chucking force adjustment system for a transfer robot according to an embodiment of the present invention; FIG. 2 is a voltage diagram of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention; FIG. 3 is a force-electrical relationship diagram of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention; FIG. 4 is a top view of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention; figure 5 is a front view of a wafer chucking force adjustment system for a transfer robot in accordance with an embodiment of the present invention.
In an embodiment of the present invention, a wafer chucking force adjusting system for a transfer robot includes: the device comprises N pressure sensors 4, N wafer contactors 3, a controller 8, a static electricity generation controller 9 and a static electricity generation device 2, wherein N is a positive integer not less than 3; the static electricity generating device 2 is connected with a voltage output end of the static electricity generating controller 9 and is used for generating static electricity to enable the wafer to generate induced charges; the N pressure sensors 4 are respectively connected with the N wafer contactors 3 and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors 3; the controller 8 is connected with the output ends of the N pressure sensors, and is configured to determine a corresponding current target voltage value according to the pressure value and a preset static control voltage model, and drive the static electricity generation controller 9 to output a current actual voltage value by using the current target voltage value, so that the static electricity generation device 2 generates corresponding static electricity; and the preset static control parameter model is provided with a corresponding relation between a pressure value and a target voltage value.
Specifically, as shown in fig. 1, there are a 1 st wafer contactor 301 and a 2 nd wafer contactor 302 … … nth wafer contactor 30N, and since the wafer contactor 3 is a solid member for contacting and supporting the wafer, at least 3 wafers are required to be able to fix the sheet-like wafers, and therefore, N is an integer greater than 2, that is, a natural number such as 3 or 4 … …. Correspondingly, N pressure sensors 4, namely the 1 st pressure sensor 401 and the 2 nd pressure sensor 402 … … nth pressure sensor 40N, may be disposed at the bottom of the wafer contactor 3 in a one-to-one correspondence manner, so that when a wafer is placed on the wafer contactor 3, the wafer can generate pressure on the pressure sensors 4, and the pressure sensors 4 acquire a pressure value caused by the wafer.
Further, as shown in fig. 2 and 3, it can be known that different types of wafers require different static friction forces, and the static friction force corresponds to the output voltage of the pressure sensor 4, and the output voltage of the pressure sensor 4 corresponds to the input voltage of the static electricity generating device 2, so that the corresponding relationship between the static friction force and the input voltage of the static electricity generating device 2 can be found, and the input voltage of the static electricity generating device 2 is the target voltage value to be generated by the static electricity generating device 2. Therefore, different target voltage values can be input to different types of wafers, and corresponding static friction force is generated.
Specifically, the preset static control parameter model may be set in the form of a preset static control voltage table, so that when the pressure sensor 4 transmits a voltage signal, that is, a signal of a pressure value, a corresponding target voltage value may be searched in the preset static control voltage table according to the pressure value; the preset static control voltmeter is provided with a pressure value range and a corresponding target voltage value.
Of course, the relationship expression between the pressure value and the target voltage value may also be performed in a functional manner, so as to obtain a more accurate target voltage value, that is, the preset electrostatic control voltage model is a functional relationship between the pressure value and the target voltage value. And after the pressure value is obtained, calculating by using the functional relation to obtain a target voltage value.
It should be noted that, in order to make the static electricity generating apparatus 2 generate positive and negative charges, a power supply may be provided; the static electricity generating device 2 comprises a positive charge end 21 and an electronic end; the positive charge end 21 and the electron end are both arranged on the conveying manipulator; the power supply is used for supplying power to the positive charge terminal 21 and the electronic terminal, so that the positive charge terminal 21 generates positive charge and the electronic terminal generates electrons.
As shown in fig. 4 and 5, the transfer robot includes: base member 1, power supply and static electricity generating device 2. The base body 1 includes a support portion 11 for supporting a wafer; the static electricity generating device 2 comprises a positive charge end 21 and an electronic end 22, wherein the positive charge end 21 and the electronic end 22 are both arranged on the supporting part 11, and the power supply is used for supplying power to the positive charge end 21 and the electronic end 22 so that the positive charge end 21 generates positive charges and the electronic end 22 generates electrons.
The wafer can be fixed and supported by the supporting portion 11 and move synchronously with the supporting portion 11, so that the wafer is transferred. The wafer and the supporting part 11 provide a fixing acting force through the static electricity generating device 2, after the static electricity generating device 2 is electrified, the positive charge end 21 generates positive charges, the positive charge end 21 attracts electrons in the wafer, the electronic end 22 generates electrons, and the electronic end 22 attracts the positive charges in the wafer, so that the static electricity adsorption and fixation of the wafer and the conveying manipulator are realized.
In one embodiment, the supporting portion 11 is provided with a wafer contactor 3, the wafer contactor 3 protrudes from the surface of the supporting portion 11, the surface of the wafer contactor 3 is used for contacting with the wafer, the contact area between the wafer and the substrate 1 is reduced, and the static friction force between the wafer and the surface of the wafer contactor 3 is used for preventing the wafer from moving relative to the substrate 1, so that the conveying stability of the wafer is ensured.
In one embodiment, the material of the base 1 is an insulating material, which may be ceramic, plastic, rubber, or the like. The base body 1 further comprises a connecting portion 12, and the connecting portion 12 is used for being connected with a driving component such as a motor and a cylinder. The supporting part 11 is a hollow circular ring-shaped structure, the wafer is supported by the circular ring-shaped supporting part 11, the stress on the wafer is uniform, and other operations can be performed on the wafer through the hollow part.
In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4, the pressure sensor 4 is used for measuring the pressure applied to the wafer contactor 3 by the wafer, and the static friction force between the wafer and the surface of the wafer contactor 3 can be calculated by the friction coefficient between the pressure and the surface of the wafer contactor 3. Wherein, the pressure of the wafer acting on the wafer contactor 3 is the sum of the gravity of the wafer and the attraction force of the static electricity generating device 2 to the wafer. The gravity of the wafer is not changed, and according to different set static friction forces, a user can adjust the attraction force of the static electricity generating device 2 to the wafer according to the pressure measured by the pressure sensor 4, namely adjust the voltage of the static electricity generating device 2.
In one embodiment, the substrate 1 defines a wiring channel 13, and the first wire 5 connecting the power source and the positive charge terminal 21 and the second wire 6 connecting the power source and the positive charge terminal 21 are disposed in the wiring channel 13. The wiring groove 13 is convenient for limiting the wiring path, the assembly is simpler and more convenient, and the wires are arranged in the wiring groove 13, so that the wiring is more tidy.
In one embodiment, referring to FIG. 2, the cabling channel 13 is a hollow chamber within the base 1, the upper and lower surfaces of the cabling channel 13 are closed, and the end of the cabling channel 13 is open to allow wires to be introduced into the cabling channel 13. The upper and lower surfaces of the wiring groove 13 are sealed to provide a relatively sealed environment for the positive charge terminal 21 and the electron terminal 22, so that the influence of the external environment on the positive charge terminal 21 and the electron terminal 22 is reduced, and the stability of coulomb force is improved.
In one embodiment, a wire distributor 7 is attached to the base 1, the wire distributor 7 being located at an end of the raceway arrangement 13 adjacent to the power source. The wiring distributor 7 is used for connecting a lead, the pressure sensor 4 is connected with a power supply through the wiring distributor 7, the lead of the positive charge end 21 and the lead of the electronic end are also connected with the power supply through the wiring distributor 7, the pressure sensor 4 and the static electricity generating device 2 can be simultaneously supplied with power through one power supply, and the structure is simplified.
On the basis of any one of the above embodiments, the embodiment of the invention is further provided with an alarm module connected with the controller 8; the controller 8 is further configured to obtain a current target voltage value and a current actual voltage value, and determine whether a difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; and if the current threshold value is exceeded, triggering the alarm module.
Further, the controller 8 is further configured to obtain a current target voltage value and a current actual voltage value, and determine whether a difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; and if the current target voltage value does not exceed the preset threshold value, correcting the preset static control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
Specifically, when the preset static control voltage model is corrected, the controller 8 is specifically configured to reduce the target voltage value in the preset static control voltage model if the current target voltage value is smaller than the current actual voltage value; and if the current target voltage value is larger than the current actual voltage value, increasing the target voltage value in the preset static control voltage model.
On the basis of the above embodiment, in this embodiment, in order to know whether there is a deviation in the wafer placement position, the controller 8 is further configured to issue a wafer placement error alarm when the deviation between any one of the N pressure values corresponding to the N pressure sensors 4 and the other pressure value exceeds a threshold value. That is, if the wafer is placed at the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of the pressure sensors is abnormal, it indicates that the abnormal pressure sensor 4 is subjected to too much or too little pressure, and the wafer is placed at an incorrect position.
According to the wafer adsorption force adjusting system, the wafer adsorption force adjusting method and the arm for the conveying manipulator, provided by the embodiment of the invention, different static charges generated by the static electricity generating device 2 are controlled to be different by utilizing different weights of wafers with different specifications, so that the adsorption force is generated by electrostatic induction of the wafer to generate different positive pressures, the static friction force in the wafer transferring process is ensured, the positive pressure can be converted into the pressure value of an electric signal by the pressure sensor 4 arranged below the wafer contactor 3, and the non-sliding transmission of the wafers with different thicknesses under different processes is realized.
The wafer suction force adjusting system for a transfer robot according to an embodiment of the present invention is described below, and the wafer suction force adjusting system for a transfer robot described below and the wafer suction force adjusting method for a transfer robot described above may be referred to in correspondence with each other.
Referring to fig. 6 and 7, fig. 6 is a flowchart illustrating a method for adjusting wafer chucking force of a transfer robot according to an embodiment of the present disclosure; fig. 7 is a modified flowchart of a wafer chucking force adjustment method for a transfer robot according to an embodiment of the present disclosure.
In another embodiment of the present invention, a wafer suction force adjusting method for a transfer robot is applied to the wafer suction force adjusting system as described in any one of the above, and is specifically executed by a controller, where the method specifically includes:
step S61: when the wafer is placed on the wafer contactor, acquiring a pressure value of the wafer;
step S62: determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model;
step S63: driving the static electricity generation controller to output a current actual voltage value by using a current target voltage value so as to enable the static electricity generation device to generate corresponding static electricity;
and the preset static control parameter model is provided with a corresponding relation between a pressure value and a target voltage value.
Further, in particular executed by a controller, the method in particular further comprises:
step S71: acquiring a current target voltage value and a current actual voltage value;
step S72: judging whether the difference value between the current target voltage value and the current actual voltage value exceeds a preset threshold value or not;
step S73: and if the current target voltage value does not exceed the preset threshold value, correcting the preset static control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A wafer chucking force adjustment system for a transfer robot, comprising: the device comprises N pressure sensors, N wafer contactors, a controller, a static electricity generation controller and a static electricity generation device, wherein N is a positive integer not less than 3;
the static electricity generating device is connected with a voltage output end of the static electricity generating controller and is used for generating static electricity to enable the wafer to generate induced charges;
the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors;
the controller is connected with the output ends of the N pressure sensors and is used for determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model, and driving the static electricity generation controller to output a current actual voltage value by using the current target voltage value so as to enable the static electricity generation device to generate corresponding static electricity and generate adsorption force by virtue of static electricity induction with the wafer; the preset static control voltage model is provided with a corresponding relation between a pressure value and a target voltage value;
the controller is further used for sending out a wafer placement error alarm when the deviation of any one of the N pressure values corresponding to the N pressure sensors and other pressure values exceeds a threshold value.
2. The wafer chucking force adjustment system of claim 1, wherein the predetermined electrostatic control voltage model is a predetermined electrostatic control voltmeter; the preset static control voltmeter is provided with a pressure value range and a corresponding target voltage value.
3. The wafer chucking force adjustment system of claim 1, wherein the predetermined electrostatic control voltage model is a function of a pressure value and the target voltage value.
4. The wafer chucking force adjustment system for a transfer robot as claimed in claim 1, further comprising a power supply;
the static electricity generating device comprises a positive charge end and an electronic end;
the positive charge end and the electronic end are both arranged on the conveying manipulator;
the power supply is used for supplying power to the positive charge terminal and the electronic terminal, so that the positive charge terminal generates positive charge, and the electronic terminal generates electrons.
5. The wafer chucking force adjustment system for a transfer robot as claimed in claim 1, further comprising: the alarm module is connected with the controller;
the controller is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current threshold value is exceeded, triggering the alarm module.
6. The wafer chucking force adjustment system for a transfer robot as claimed in claim 1,
the controller is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current target voltage value does not exceed the preset threshold value, correcting the preset static control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
7. The wafer chucking force adjustment system of claim 6, wherein the controller is specifically configured to reduce the target voltage value in the preset electrostatic control voltage model if the current target voltage value is less than the current actual voltage value; and if the current target voltage value is larger than the current actual voltage value, increasing the target voltage value in the preset static control voltage model.
8. A transfer robot characterized by being provided with the wafer suction force adjusting system as recited in any one of claims 1 to 7.
9. A wafer suction force adjusting method for a transfer robot, applied to the wafer suction force adjusting system according to any one of claims 1 to 7, comprising:
when the wafer is placed on the wafer contactor, acquiring a pressure value of the wafer;
determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model;
driving the static electricity generation controller to output a current actual voltage value by using a current target voltage value so as to enable the static electricity generation device to generate corresponding static electricity to generate an adsorption force with the static electricity induction of the wafer;
when the deviation of any one of the N pressure values corresponding to the N pressure sensors and other pressure values exceeds a threshold value, sending out a wafer placement error alarm;
and the preset static control voltage model is provided with a corresponding relation between a pressure value and a target voltage value.
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| CN113628998A (en) * | 2021-07-02 | 2021-11-09 | 华虹半导体(无锡)有限公司 | Method for improving wafer taking of Bernoulli arm |
| CN113899446B (en) * | 2021-12-09 | 2022-03-22 | 北京京仪自动化装备技术股份有限公司 | Wafer transmission system detection method and wafer transmission system |
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| CN111933565A (en) | 2020-11-13 |
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