CN213752665U

CN213752665U - Conveying manipulator

Info

Publication number: CN213752665U
Application number: CN202022158697.9U
Authority: CN
Inventors: 周亮
Original assignee: Beijing Jingyi Automation Equipment Co Ltd
Current assignee: Beijing Jingyi Automation Equipment Co Ltd
Priority date: 2020-09-27
Filing date: 2020-09-27
Publication date: 2021-07-20
Anticipated expiration: 2030-09-27

Abstract

The utility model relates to a semiconductor processing technology field provides a conveying manipulator, include: the substrate comprises a supporting part for supporting a wafer; the static electricity generating device comprises a positive charge end and an electronic end, wherein the positive charge end and the electronic end are arranged on the supporting part, and the power supply is used for supplying power to the positive charge end and the electronic end so that the positive charge end generates positive charges and the electronic end generates electrons. The utility model provides a conveying manipulator utilizes coulomb force to adsorb the wafer, can realize the conveying of the wafer of multiple specification, but reduction in production cost.

Description

Conveying manipulator

Technical Field

The utility model relates to a semiconductor processing technology field especially relates to conveying manipulator.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductor products are numerous, the process is complex, and the wafer is a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Wafer thicknesses vary greatly from fab to fab, and the contact area of the wafer contactor with the wafer is required to be as small as possible to avoid defects and exposure problems. In the related art, among the transfer robots for transferring wafers, a transfer robot of one specification is suitable for wafers of one specification, and at present, no transfer robot can transfer wafers of different specifications, so that the transfer cost of wafers is high, and the equipment investment is large.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a conveying manipulator utilizes coulomb's force to adsorb the wafer, can realize the conveying of the wafer of multiple specification, but reduction in production cost.

According to the utility model discloses conveying manipulator of first aspect embodiment includes:

a base body including a support portion for supporting a wafer;

a power source;

the static electricity generating device comprises a positive charge end and an electronic end, wherein the positive charge end and the electronic end are arranged on the supporting part, and the power supply is used for supplying power to the positive charge end and the electronic end so that the positive charge end generates positive charges and the electronic end generates electrons.

According to the utility model discloses an embodiment, the supporting part is equipped with the wafer contactor, wafer contactor protrusion in the surface of supporting part, the bottom of wafer contactor is equipped with pressure sensor.

According to the utility model discloses an embodiment, still include central processing unit, the power with pressure sensor all connect in central processing unit, the central processing unit memory has static generating device's input voltage with relation model between pressure sensor's the output voltage.

According to the utility model discloses an embodiment, the wafer contactor is in evenly distributed is a plurality of on the supporting part, every the bottom of wafer contactor all is equipped with pressure sensor.

According to an embodiment of the present invention, the pressure sensor is a piezoelectric ceramic sensor.

According to an embodiment of the present invention, the wafer contactor and the positive charge terminal are alternately arranged, and/or the wafer contactor and the electronic terminal are alternately arranged.

According to an embodiment of the utility model, the trough is constructed to the base member, connects the power with the first wire and the connection of positive charge end the power with the second wire of electron end all locates in the trough.

According to the utility model discloses an embodiment works as the supporting part is equipped with the wafer contactor, the bottom of wafer contactor is equipped with pressure sensor, pressure sensor locates in the trough.

According to the utility model discloses an embodiment, be connected with wiring distributor on the base member, wiring distributor locates the trough is close to the one end of power.

According to an embodiment of the present invention, the wiring groove is a hollow chamber in the base.

The embodiment of the utility model provides an in above-mentioned one or more technical scheme, one of following technological effect has at least:

the utility model discloses conveying manipulator, including base member, power and static generating device, static generating device includes the positive charge end and the electron end of being connected with the power, positive charge end and electron end all can with produce coulomb force between the wafer, realize fixed to the absorption of wafer, applicable in the conveying of the wafer of multiple specification, but reduction in production cost.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic front view of a transfer robot according to an embodiment of the present invention;

fig. 2 is a schematic side view of a transfer robot according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a control logic of a transfer robot according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a relationship model between an input voltage of the static electricity generating device of the conveying manipulator and an output voltage of the pressure sensor according to the embodiment of the present invention;

fig. 5 is a graph illustrating the relationship between the output voltage of the pressure sensor of the transfer robot and the static friction of the surface of the wafer contactor according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a first implementation manner of a reversing component of a conveying manipulator according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a second embodiment of a reversing component of a transfer robot according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram illustrating a distribution pattern of the positive charge end and the electron end of the transfer robot according to an embodiment of the present invention.

Reference numerals:

1: a substrate; 11: a support portion; 12: a connecting portion; 13: a wiring groove;

2: a static electricity generating device; 21: a positive charge terminal; 22: an electronic terminal;

3: a wafer contactor; 4: a pressure sensor;

5: a first conductive line; 51: a first resistor; 52: a second resistor; 53: a first capacitor;

6: a second conductive line; 61: a third resistor; 62: a fourth resistor; 63: a second capacitor;

7: a wire distributor;

8: a power source; 81: a first direct current power supply generator; 82: a second direct current power supply generator;

91: a reversing switch; 92: a first switch; 93: a second switch.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

An embodiment of the present invention, as shown in fig. 1 to 8, provides a transfer robot, including: base member 1, power supply and static electricity generating device 2. The base body 1 includes a support portion 11 for supporting a wafer; the static electricity generating device 2 comprises a positive charge end 21 and an electronic end 22, wherein the positive charge end 21 and the electronic end 22 are both arranged on the supporting part 11, and the power supply is used for supplying power to the positive charge end 21 and the electronic end 22 so that the positive charge end 21 generates positive charges and the electronic end 22 generates electrons.

The wafer can be fixed and supported by the supporting portion 11 and move synchronously with the supporting portion 11, so that the wafer is transferred. The wafer and the supporting part 11 provide a fixing acting force through the static electricity generating device 2, after the static electricity generating device 2 is electrified, the positive charge end 21 generates positive charges, the positive charge end 21 attracts electrons in the wafer, the electronic end 22 generates electrons, and the electronic end 22 attracts the positive charges in the wafer, so that the static electricity adsorption and fixation of the wafer and the conveying manipulator are realized.

In the embodiment, the electrostatic generator 2 of the dual-electrical property generates coulomb force to adsorb the wafer, so that a positive pressure is generated between the wafer and the supporting portion 11, thereby ensuring the static friction force during the wafer transferring process. The transmission manipulator of the embodiment is suitable for wafers with different thicknesses produced under different processes, can ensure the static friction force between the wafer and the supporting part 11, realizes the non-sliding transmission of the wafer, can realize the fully-adaptive transmission of various wafers, solves the problem of high cost of wafer transmission in the related technology, is beneficial to saving social resources, and has high economic value.

In one embodiment, the supporting portion 11 is provided with a wafer contactor 3, the wafer contactor 3 protrudes from the surface of the supporting portion 11, the surface of the wafer contactor 3 is used for contacting with the wafer, the contact area between the wafer and the substrate 1 is reduced, and the static friction force between the wafer and the surface of the wafer contactor 3 is used for preventing the wafer from moving relative to the substrate 1, so that the conveying stability of the wafer is ensured.

In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4, the pressure sensor 4 is used for measuring the pressure applied to the wafer contactor 3 by the wafer, and the static friction force between the wafer and the surface of the wafer contactor 3 can be calculated by the friction coefficient between the pressure and the surface of the wafer contactor 3, as shown in fig. 5. Wherein, the pressure of the wafer acting on the wafer contactor 3 is the sum of the gravity of the wafer and the attraction force of the static electricity generating device 2 to the wafer. The gravity of the wafer is not changed, and according to different set static friction forces, a user can adjust the attraction force of the static electricity generating device 2 to the wafer according to the pressure measured by the pressure sensor 4, namely adjust the voltage of the static electricity generating device 2.

In one embodiment, the transfer robot further comprises a central processing unit, to which the power supply and the pressure sensor 4 are connected, and in which a model of the relationship between the input voltage of the static electricity generating device 2 and the output voltage of the pressure sensor 4 is stored. When the transmission manipulator is used for transmitting the wafer, the pressure of the wafer acting on the wafer contactor 3 can be converted into an electric signal by the pressure sensor 4 at the bottom of the wafer contactor 3, the central processing unit receives the electric signal, and the electric signal corresponds to the output voltage of the pressure sensor 4 of the central relation model of the central processing unit so as to obtain and adjust the input voltage of the static electricity generating device 2, thereby ensuring that the transmission manipulator stably transmits the wafer.

The relation model is a curve relation between the input voltage of the static electricity generating device 2 and the output voltage of the pressure sensor 4, which is measured in advance in a laboratory according to the specification of the wafer. Referring to fig. 4, fig. 4 illustrates a relationship model between the input voltage of the electrostatic generator 2 and the output voltage of the pressure sensor 4. The central processing unit can store the relation models of wafers with various specifications, and can call the relation models corresponding to the wafers to be transmitted according to the requirements.

Furthermore, through a relation model measured in advance in a laboratory, the central processing unit can correct the relation model according to real-time data, so that the adjustment is more accurate.

Referring to fig. 3, the cpu transmits an input voltage required by the electrostatic generator to the electrostatic generator controller, and the electrostatic generator controller regulates and controls an output voltage of the electrostatic generator, and at this time, the pressure sensor measures a pressure of the wafer against the wafer contactor and feeds the measured pressure back to the cpu, which is a logical transmission relationship between voltage signals.

In one embodiment, a plurality of wafer contactors 3 are uniformly distributed on the supporting part 11, a pressure sensor 4 is arranged at the bottom of each wafer contactor, and the plurality of wafer contactors 3 provide a plurality of supporting points for the wafer, so that the wafer is supported more stably. Meanwhile, a plurality of sets of data can be measured by the plurality of pressure sensors 4, and the input voltage of the positive charge terminal 21 or the electronic terminal 22 at each position can be adjusted according to the pressure at the position; the average value of the input voltage of the static electricity generating device 2 can be obtained according to the average value of the multiple groups of data, and the input voltages of the multiple groups of positive charge terminals 21 and the multiple groups of electronic terminals 22 are synchronously adjusted; of course, the adjustment method of the input voltage of positive charge terminal 21 and the input voltage of electronic terminal 22 is not limited to the above, and may be adjusted in other manners.

In one embodiment, the pressure sensor 4 is a piezo-ceramic sensor. The piezoelectric ceramic sensor has high sensitivity, high reliability, high stability, high and low temperature resistance and good moisture resistance.

Of course, the pressure sensor 4 is not limited to a piezoelectric ceramic sensor, and other sensors that deform under pressure and convert the pressure into an electrical signal may be used.

In one embodiment, a plurality of positive charge terminals 21 are distributed on the substrate 1, and a plurality of electron terminals 22 are also distributed on the substrate 1, so that the wafer can be stressed at a plurality of positions, and the static friction force between the wafer and the wafer contactor 3 is ensured.

Referring to fig. 1, two positive charge terminals 21 are provided on the base 1, two electron terminals 22 are provided, and the positive charge terminals 21 are provided symmetrically to the electron terminals 22.

In one embodiment, the wafer contactor 3 and the positive charge terminal 21 are alternately arranged, the positive charge terminal 21 provides an acting force for attracting the wafer, and the wafer contactor 3 provides a supporting force for the wafer, wherein the attracting force and the supporting force are alternately distributed to help the wafer to be uniformly stressed.

Similarly, the alternating arrangement of the wafer contactors 3 and the electrical terminals 22 also helps to evenly stress the wafer.

As shown in fig. 1, the wafer contactor 3 and the positive charge terminal 21 are alternately arranged, and the wafer contactor 3 and the electronic terminal 22 are alternately arranged, so that the wafer is stressed more uniformly.

In one embodiment, the positive charge terminals and the electron terminals are alternately arranged, and the positive charge terminals, the electron terminals, the positive charge terminals, the electron terminals … … and the like are arranged in sequence in a clockwise or counterclockwise direction, so that the electric field is uniformly distributed.

In one embodiment, referring to fig. 8, the support 11 is provided with a predetermined path, and the positive charge terminals 21 and the electron terminals 22 are alternately arranged on the same predetermined path. On the same preset path, the positive charge terminals 21 and the electronic terminals 22 are alternately arranged, so that an electric field is uniformly distributed, uniform stress on the wafer is facilitated, stable wafer transmission is ensured, and damage to the wafer is reduced. The positive charge terminals 21 alternate with the electron terminals 22, and it is understood that the positive charge terminals 21, the electron terminals 22, the positive charge terminals 21, the electron terminals 22 … …, and so on are arranged in a clockwise or counterclockwise direction.

When one preset path is arranged, the wafer on the preset path is ensured to be uniformly stressed; when the positive charge ends and the electronic ends are uniformly distributed in the circumferential direction of the supporting part, the positive charge ends and the electronic ends are alternately arranged on the same circumference. When the preset paths are provided with a plurality of paths, the electric field on each preset path is ensured to be uniformly distributed.

Referring to fig. 8, a plurality of predetermined paths are provided on the supporting portion 11, and the positive charge terminals 21 correspond to the electronic terminals 22 on adjacent predetermined paths one by one. When two preset paths are arranged, two adjacent ends on the two preset paths are a positive charge end 21 and an electronic end 22 respectively; when three or more than three preset paths are arranged, two adjacent ends on any two preset paths are respectively the positive charge end 21 and the electronic end 22, so that all the positive charge ends 21 and the electronic ends 22 are ensured to be alternately arranged, and the electric field on the whole supporting part 11 is uniformly distributed.

Referring to fig. 1, the supporting portion is circular, and an electric terminal and a positive charge terminal are disposed on one side of the circular ring in a clockwise direction, so that electric fields on both sides are uniformly distributed. In one embodiment, the substrate 1 defines a wiring channel 13, and the first wire 5 connecting the power source and the positive charge terminal 21 and the second wire 6 connecting the power source and the electronic terminal 22 are disposed in the wiring channel 13. The wiring groove 13 is convenient for limiting the wiring path, the assembly is simpler and more convenient, and the wires are arranged in the wiring groove 13, so that the wiring is more tidy.

In one embodiment, referring to FIG. 2, the cabling channel 13 is a hollow chamber within the base 1, the upper and lower surfaces of the cabling channel 13 are closed, and the end of the cabling channel 13 is open to allow wires to be introduced into the cabling channel 13. The upper and lower surfaces of the wiring groove 13 are sealed to provide a relatively sealed environment for the positive charge terminal 21 and the electron terminal 22, so that the influence of the external environment on the positive charge terminal 21 and the electron terminal 22 is reduced, and the stability of coulomb force is improved.

The base body 1 can comprise an upper shell and a lower shell, the wiring groove 13 is limited between the upper shell and the lower shell, processing of the wiring groove 13 is facilitated, and installation of wires is facilitated.

It should be noted that the wiring groove 13 is not limited to a hollow chamber structure, and may be a groove recessed downward from the surface of the base 1.

In one embodiment, when the supporting portion 11 is provided with the wafer contactor 3, the bottom of the wafer contactor 3 is provided with the pressure sensor 4, and the pressure sensor 4 is disposed in the wiring groove 13. The pressure sensor 4 is also arranged in a relatively closed environment, so that the measurement accuracy of the pressure sensor 4 is ensured, and the influence of the environment on the measurement result is reduced.

In one embodiment, a wire distributor 7 is attached to the base 1, the wire distributor 7 being located at an end of the raceway arrangement 13 adjacent to the power source. The wiring distributor 7 is used for connecting a lead, the pressure sensor 4 is connected with a power supply through the wiring distributor 7, the leads of the positive charge end 21 and the electronic end are connected with the power supply through the wiring distributor 7, the pressure sensor 4 and the static electricity generating device 2 can be simultaneously powered through one power supply, and the structure is simplified.

The wiring distributor on one side of the base body can be simultaneously connected to the positive terminal and the negative terminal of the power supply, so that the positive charge terminal and the electronic terminal can be simultaneously arranged on one side of the supporting part, and the uniform distribution of an electric field is facilitated.

In one embodiment, the material of the base 1 is an insulating material, which may be ceramic, plastic, rubber, or the like. The base body 1 further comprises a connecting portion 12, and the connecting portion 12 is used for being connected with a driving component such as a motor and a cylinder. The supporting part 11 is a hollow circular ring-shaped structure, the wafer is supported by the circular ring-shaped supporting part 11, the stress on the wafer is uniform, and other operations can be performed on the wafer through the hollow part. The connecting part is positioned on one side of the supporting part, and the connecting part and the supporting part can be integrally formed or spliced and installed and can be selected according to requirements.

Referring to fig. 1 to 7, a reversing component is arranged between the power supply 8 and the static electricity generating device 2, the reversing component is in a first state, the positive charge terminal 21 is connected with the positive terminal of the power supply 8, and the electronic terminal 22 is connected with the negative terminal of the power supply 8; the commutation means is in the second state with the positive terminal 21 connected to the negative terminal of the power supply 8 and the electronic terminal 22 connected to the positive terminal of the power supply 8.

When the wafer is conveyed to a target position, the power supply 8 stops supplying power to the static electricity generating device 2, the positive charge end 21 and the electronic end 22 still have some residual charges, at the moment, the positive electrode end of the power supply 8 is connected with the electronic end 22 through the reversing component, the negative electrode end of the power supply 8 is connected with the positive charge end 21, so that the power supply 8 supplies positive charges to the electronic end 22 and supplies electrons to the positive charge end, the residual positive charges and electrons of the positive charge end 21 and the electronic end 22 are eliminated, acting forces between the positive charge end 21 and the wafer and between the electronic end 22 and the wafer are zero, the wafer can be smoothly moved away from the substrate 1, and the problems of sheet carrying and sheet breaking of the wafer possibly caused by residual coulomb force are solved.

After the wafer moves to the target position, the charges supplied to the positive charge end 21 and the electron end 22 by the power supply 8 can be switched through the reversing component, so that the residual coulomb force of the positive charge end 21 and the electron end 22 is eliminated. The transmission manipulator of the embodiment is suitable for wafers with different thicknesses produced under different processes, can ensure the static friction between the wafer and the supporting part 11, realizes the non-sliding transmission of the wafer, can realize the fully-adaptive transmission of various wafers, solves the problem of high wafer transmission cost in the related technology, also solves the problems of sheet carrying and breaking in the wafer transmission process, is favorable for saving social resources, and has high economic value.

Two embodiments of the commutation component:

in one embodiment, referring to fig. 6, the power supplies 8 are arranged in a group, the positive terminal of the power supply 8 is connected to the first wire 5, and the negative terminal of the power supply 8 is connected to the second wire 6; the reversing component is a reversing switch 91, two ends of the reversing switch 91 are respectively provided with a first lead 5 and a second lead 6, the reversing switch 91 is closed, the positive charge end 21 is connected with the positive electrode end, and the electronic end 22 is connected with the negative electrode end; the reversing switch 91 is turned on, the positive charge terminal 21 is connected to the negative terminal, and the electronic terminal 22 is connected to the positive terminal. By adjusting the electrifying direction of the power supply 8 to the static electricity generating device 2, the residual coulomb force between the wafer and the static electricity generating device 2 is eliminated, the wafer is prevented from being damaged by a conveying manipulator, and the safety of wafer conveying is improved.

Wherein the power supply 8 provides a direct current and the power supply 8 may be a direct current power supply generator. The first lead 5 comprises a first section and a second section, the second lead 6 comprises a third section and a fourth section, one end of the reversing switch 91 is connected to the butt joint position of the first section and the second section, and the other end of the reversing switch 91 is connected to the butt joint position of the third section and the fourth section. When the reversing switch 91 is closed, the first section is communicated with the second section, the third section is communicated with the fourth section, the positive electrode end is communicated with the positive charge end 21, and the negative electrode end is communicated with the electronic end 22; when the reversing switch 91 is turned on, the first section is communicated with the fourth section, the third section is communicated with the second section, the positive electrode end is communicated with the electronic terminal 22, and the negative electrode end is communicated with the positive charge terminal 21, so that residual coulomb force is eliminated in a reverse electrifying mode, the wafer can be separated from the substrate 1, and the wafer is not damaged.

In one embodiment, a first adjusting resistor is connected to the first conducting wire 5, and a second adjusting resistor is connected to the second conducting wire 6. The first adjusting resistor is used for adjusting the voltage of the positive charge terminal 21, and the second adjusting resistor is used for adjusting the voltage of the electronic terminal 22, so that the electrostatic generating device 2 can provide different adsorption forces according to different wafer specifications. The resistance values of the first adjusting resistor and the second adjusting resistor can be adjusted.

The first adjusting resistor comprises a first resistor 51 and a second resistor 52, the first resistor 51 is connected to the first segment, the second resistor 52 is connected to the second segment, and the voltages of all parts can be adjusted independently. The second adjusting resistor comprises a third resistor 61 and a fourth resistor 62, the third resistor 61 is connected to the third segment, the fourth resistor 62 is connected to the fourth segment, and the voltages of all parts can be adjusted independently.

Furthermore, a first capacitor 53 is connected to the first conducting wire 5, and a second capacitor 63 is connected to the second conducting wire 6, so that the voltage is more stable.

In one embodiment, referring to fig. 7, the difference from the embodiment shown in fig. 6 is that the power supply 8 includes a first direct current power supply generator 81 and a second direct current power supply generator 82 arranged in parallel and the positive terminal of the first direct current power supply generator 81 is arranged opposite to the positive terminal of the second direct current power supply generator 82, and at the same time, the negative terminal of the first direct current power supply generator 81 is arranged opposite to the negative terminal of the second direct current power supply generator 82. The reversing component comprises a first switch 92 and a second switch 93, the first switch 92 is connected to the branch where the first direct-current power supply generator 81 is located, the second switch 93 is connected to the branch where the second direct-current power supply generator 82 is located, the first switch 92 is opened, the second switch 93 is closed, the positive charge end 21 is connected with the positive electrode end of the first direct-current power supply generator 81, and the electronic end 22 is connected with the negative electrode end of the first direct-current power supply generator 81; the first switch 92 is closed and the second switch 93 is open, the positive terminal 21 is connected to the negative terminal of the second dc power supply generator 82, and the electronic terminal 22 is connected to the positive terminal of the second dc power supply generator 82. In this embodiment, two sets of power supplies 8 are provided in opposite directions, and the power supply direction to the electrostatic generator 2 is switched by switching the first dc power supply generator 81 and the second dc power supply generator 82 to eliminate the residual coulomb force, so that the wafer can be separated from the substrate 1 without damaging the wafer.

In this embodiment, a resistor and a capacitor are also connected to a wire between the power supply 8 and the static electricity generating device 2 to ensure stability of the circuit structure.

In one embodiment, the transfer robot comprises a power supply, a substrate 1, a static electricity generating device 2, a wafer contactor 3 and a piezoelectric ceramic sensor, wherein the wafer falls on the wafer contactor 3 of the support part 11, and the positive charge end 21 and the electronic end 22 of the static electricity generating device 2 are applied with voltage under the action of a static electricity generating device controller to generate coulomb force, so that static friction force between the wafer contactor 3 and the wafer is generated. Meanwhile, under the action of coulomb force, the piezoelectric ceramic sensor can sense the coulomb force actually generated and feed back the coulomb force to the central processing unit, the central processing unit regulates the input voltage of the static electricity generating device 2 according to the stored relation model, so that the wafer is always on the supporting part 11 of the substrate 1, and the wafer is carried by the transmission manipulator to the designated position of the system. After the wafer reaches the designated position, the central processing unit controls the output voltage of the electrostatic generator controller to be zero, the coulomb force disappears, and the wafer can be placed at the designated position. The application of the piezoelectric ceramic sensor realizes real-time static friction force measurement and feedback. The relation model between the input voltage of the static electricity generating device 2 and the output voltage of the piezoelectric ceramic sensor stored in the central processing unit can cover various working conditions and can be fully suitable for various wafer forms in the manufacture of integrated circuits. The material of the substrate 1 is ceramic. When the input voltage of the static electricity generating device 2 is zero, the piezoelectric ceramic sensor can also detect the residual static electricity after the load is removed.

An embodiment of the second aspect of the present invention provides a wafer suction force adjustment system for a transfer robot, including: the system comprises N pressure sensors 4, N wafer contactors 3, a central processing unit, a static electricity generating device controller and a static electricity generating device 2, wherein N is a positive integer not less than 3; the static electricity generating device 2 is connected with a voltage output end of the static electricity generating device controller and is used for generating static charges to generate induced charges with the wafer; the N pressure sensors 4 are respectively connected with the N wafer contactors 3 and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors 3; the central processing unit is connected with the output ends of the N pressure sensors 4 and is used for determining a corresponding current target voltage value according to the pressure value and a preset relation model and driving the static electricity generating device controller to output a current actual voltage value by using the current target voltage value so as to enable the static electricity generating device 2 to generate corresponding static electricity; the preset relation model is provided with a corresponding relation between the pressure value and the target voltage value.

Specifically, N pressure sensors 4, that is, the 1 st pressure sensor and the 2 nd pressure sensor … … nth pressure sensor are arranged at the bottom of the wafer contactor 3 in a one-to-one correspondence manner, so that when a wafer is placed on the wafer contactor 3, the wafer can generate pressure on the pressure sensors 4, and the pressure sensors 4 acquire pressure values caused by the wafer.

Further, as shown in fig. 4 and 5, it can be known that different types of wafers require different static friction forces, and the static friction force corresponds to the output voltage of the pressure sensor 4, and the output voltage of the pressure sensor 4 corresponds to the input voltage of the static electricity generating device 2, so that the corresponding relationship between the static friction force and the input voltage of the static electricity generating device 2 can be found, and the input voltage of the static electricity generating device 2 is the target voltage value to be generated by the static electricity generating device 2. Therefore, different target voltage values can be input to different types of wafers, and corresponding static friction force is generated.

Specifically, the preset relation model may be set in the form of a preset static control voltage table, so that when the pressure sensor 4 transmits a voltage signal, that is, a signal of a pressure value, a corresponding target voltage value may be searched in the preset static control voltage table according to the pressure value; the preset static control voltmeter is provided with a pressure value range and a corresponding target voltage value.

Of course, the relationship expression between the pressure value and the target voltage value may also be performed in a functional manner, so as to obtain a more accurate target voltage value, that is, the preset relationship model is a functional relationship between the pressure value and the target voltage value. And after the pressure value is obtained, calculating by using the functional relation to obtain a target voltage value.

It should be noted that the method of the present embodiment is applicable to the transfer robot in the above embodiments, and the positive charge head 21 and the electron head 22 of the static electricity generating device 2 are both disposed on the transfer robot; power supply 8 is used to supply power to positive charge terminal 21 and electronic terminal 22.

On the basis of any one of the above embodiments, the embodiment of the present invention further provides an alarm module connected with the central processing unit; the central processing unit is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current threshold value is exceeded, triggering an alarm module.

Further, the central processing unit is further configured to obtain a current target voltage value and a current actual voltage value, and determine whether a difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; and if the current target voltage value does not exceed the preset threshold value, correcting the preset relation model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.

Specifically, when the preset relation model is corrected, the central processor is specifically configured to reduce the target voltage value in the preset relation model if the current target voltage value is smaller than the current actual voltage value; and if the current target voltage value is larger than the current actual voltage value, increasing the target voltage value in the preset relation model.

On the basis of the above embodiment, in this embodiment, in order to know whether there is a deviation in the wafer placement position, the cpu is further configured to issue a wafer placement error alarm when the deviation between any one of the N pressure values corresponding to the N pressure sensors 4 and the other pressure value exceeds a threshold value. That is, if the wafer is placed at the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of the pressure sensors is abnormal, it indicates that the abnormal pressure sensor 4 is subjected to too much or too little pressure, and the wafer is placed at an incorrect position.

The wafer suction force adjusting method for a transfer robot according to an embodiment of the present invention is described below, and the wafer suction force adjusting method for a transfer robot described below and the wafer suction force adjusting system for a transfer robot described above may be referred to with each other.

The embodiment of the utility model provides a pair of wafer adsorption affinity governing system and method for conveying manipulator, weight through utilizing the wafer of different specifications is different, thereby the static charge that control static generating device 2 produced is different, with produce the adsorption affinity with wafer electrostatic induction, produce different positive pressure, guarantee the static friction force of wafer transfer in-process, positive pressure can be turned into the pressure value of signal of telecommunication by wafer contactor 3 beneath pressure sensor 4, thereby under the realization produces various different technologies, the no slip transmission of different thickness wafers.

The embodiment of the utility model provides a still provide a wafer adsorption affinity governing method for conveying manipulator, be applied to as above any kind of wafer adsorption affinity governing system, specifically by central processing unit execution, this method specifically includes:

step S61: when the wafer is placed on the wafer contactor 3, acquiring a pressure value of the wafer;

step S62: determining a corresponding current target voltage value according to the pressure value and a preset relation model;

step S63: driving the static electricity generating device controller to output the current actual voltage value by using the current target voltage value so as to enable the static electricity generating device 2 to generate corresponding static electricity;

the preset relation model is provided with a corresponding relation between the pressure value and the target voltage value.

Further, specifically executed by the central processing unit, the method specifically further includes:

step S71: acquiring a current target voltage value and a current actual voltage value;

step S72: judging whether the difference value between the current target voltage value and the current actual voltage value exceeds a preset threshold value or not;

step S73: and if the current target voltage value does not exceed the preset threshold value, correcting the preset relation model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.

The embodiment of the third aspect of the present invention provides a wafer inspection system for a transfer robot, including: the system comprises N pressure sensors 4, N wafer contactors 3 and a central processing unit, wherein N is a positive integer not less than 3; the N pressure sensors 4 are respectively connected with the N wafer contactors 3 and used for acquiring the pressure value of the wafer after the wafer is placed on the wafer contactor 3, wherein the pressure value is the sum of the output values of the N pressure sensors 4; the central processing unit is connected with the output ends of the N pressure sensors 4 and is used for judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.

Specifically, as shown in fig. 1, pressure sensors 4 are arranged at the bottom of each wafer contactor 3 in a one-to-one correspondence manner, when a wafer is placed on the wafer contactor 3, the wafer can generate pressure on the pressure sensors 4, and the pressure sensors 4 acquire pressure values caused by the wafer. The pressure value is the sum of the output values of the N pressure sensors 4, that is, the pressure value measured by each pressure sensor 4 needs to be summed, if the position of the wafer is correctly placed and is at the midpoint, the pressure value measured by each pressure sensor 4 is the same, but if the position of the wafer is not at the midpoint, the pressure value measured by each pressure sensor 4 may not be the same, but even if not the same, the sum of the output values of the sensors is the total pressure value generated by the wafer.

Specifically, when the central processor determines by using the pressure generated by the pressure sensor 4, the central processor may be specifically configured to search a pressure value range corresponding to the pressure value in a preset pressure value table; if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range; and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal. For example, the pressure value is 5, and there are: the range of the first pressure value is 1-2, the range of the second pressure value is 2-3, and the range of the third pressure value is 3-4; if only the three pressure ranges exist, the current wafer is an abnormal wafer, and an abnormal alarm signal should be sent out. And if the fourth pressure value range 4-5 exists in the preset pressure value table, the current wafer belongs to the fourth pressure value range, and therefore the type of the current wafer can be judged. Of course, the preset pressure value table also contains the wafer types corresponding to the pressure value ranges such as the first pressure value range, the second pressure value range … …, and the like. In particular, the wafer type may be a process type or may be a different customer type from the wafer.

It should be noted that, in order to determine whether the wafer is placed on the transfer robot, a camera device may be further disposed in the wafer detection system, and the camera device is configured to capture a real-time image of the transfer robot; the central processing unit is further configured to receive the real-time image, determine whether the wafer is placed on the wafer contactor 3 according to the real-time image, and start the pressure sensor 4 when the wafer is placed on the wafer contactor 3. That is, the wafer is determined whether it is in place by image recognition. Of course, a neural network is required to be set in the central processing unit, and the neural network is trained on the image sample with the identification number wafer in place.

The embodiment of the utility model provides a still provide a wafer detection method for conveying manipulator, be applied to the wafer detecting system in any kind of above-mentioned embodiment, include:

step S41: when the wafer is placed on the wafer contactor 3, acquiring a pressure value of the wafer;

step S42: judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.

Further, the determining the type of the wafer according to the pressure value and the preset pressure value table includes the following steps

The method comprises the following steps:

step S51: searching a pressure value range corresponding to the pressure value in a preset pressure value table;

step S52: if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range;

step S53: and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal.

The embodiment of the utility model provides a wafer detecting system and method for conveying manipulator has increased pressure sensor 4, can judge the type of this wafer and whether take place unusually according to the pressure value of the wafer that pressure sensor 4 obtained, from can differentiateing different ground wafer specifications effectively to can discover the wafer abnormal conditions.

The above embodiments are merely illustrative, and not restrictive, of the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalent substitutions may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all of the technical solutions should be covered by the scope of the claims of the present invention.

Claims

1. A transfer robot, comprising:

a base body including a support portion for supporting a wafer;

a power source;

2. The transfer robot of claim 1, wherein the support portion has a wafer contactor protruding from a surface of the support portion, and a pressure sensor is disposed at a bottom of the wafer contactor.

3. The transfer robot of claim 2, further comprising a central processor, wherein the power source and the pressure sensor are both connected to the central processor.

4. The transfer robot as claimed in claim 2, wherein the plurality of wafer contactors are uniformly distributed on the support part, and a bottom of each of the wafer contactors is provided with the pressure sensor.

5. The transfer robot of claim 2, wherein the pressure sensor is a piezo ceramic sensor.

6. The transfer robot of claim 2, wherein the wafer contactors alternate with the positive charge tips and/or the wafer contactors alternate with the electronic tips.

7. The transfer robot of any one of claims 1-6, wherein the base defines a cabling channel, and wherein a first wire connecting the power source to the positive charge terminal and a second wire connecting the power source to the electronic terminal are disposed within the cabling channel.

8. The transfer robot of claim 7, wherein the pressure sensor is disposed in the cabling channel in the case where the transfer robot has a pressure sensor.

9. The transfer robot of claim 7, wherein a wire distributor is coupled to the base and is disposed at an end of the cabling channel proximate the power source.

10. The transfer robot of claim 7, wherein the cabling trough is a hollow chamber within the base.