CN113628998A - Method for improving wafer taking of Bernoulli arm - Google Patents
Method for improving wafer taking of Bernoulli arm Download PDFInfo
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- CN113628998A CN113628998A CN202110746865.2A CN202110746865A CN113628998A CN 113628998 A CN113628998 A CN 113628998A CN 202110746865 A CN202110746865 A CN 202110746865A CN 113628998 A CN113628998 A CN 113628998A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 235000012431 wafers Nutrition 0.000 claims abstract description 105
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a method for improving the wafer taking of a Bernoulli arm, which relates to the technical field of semiconductor manufacturing and comprises the following steps: measuring the total weight of the wafer cassette by a weight measuring unit; loading the wafer box to a wafer input port; sensing the number of wafers in the wafer cassette; calculating the weight of the single wafer in the wafer box according to the total weight and the number; and selecting a compressed gas pipeline according to the weight of the single wafer, so that the Bernoulli arm generates corresponding suction force to suck the wafer. The invention selects the compressed gas pipeline according to the weight of the single wafer, so that the Bernoulli arm generates corresponding suction, the suction and transmission requirements of the common thick wafer and the ultrathin wafer can be met simultaneously, and the operation efficiency and the reliability of the equipment are improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a method for improving wafer taking of a Bernoulli arm.
Background
In a back side thinning (BGBM) process, a bernoulli non-contact arm is generally used to suck the front side of a wafer (wafer) during a laser annealing process. However, when the polishing pad (dummy), taiko wafer or ultra-thin taiko wafer is sucked by a bernoulli non-contact arm, the pressure of Compressed Dry Air (CDA) used is not changed, and the vacuum suction force is also not changed. When the thickness of the wafer is larger, the suction force of the Bernoulli non-contact arm is required to be larger, and if the suction force is too small, the wafer with larger thickness risks falling fragments. When the thickness of the wafer is thinner, the suction force of the Bernoulli non-contact arm is required to be smaller, and if the suction force is too large, the wafer is at risk of splitting.
Disclosure of Invention
The invention provides a method for improving the wafer taking of a Bernoulli arm, which comprises the following steps:
s11: measuring the total weight of the wafer cassette by a weight measuring unit;
s12: loading the wafer box to the wafer input port;
s13: sensing the number of wafers in the wafer box;
s14: calculating the weight of the single wafer in the wafer box according to the total weight and the quantity; and
s15: and selecting a compressed gas pipeline according to the weight of the single wafer, so that the Bernoulli arm generates corresponding suction to suck the wafer.
Furthermore, the compressed gas pipeline comprises a plurality of first compressed gas pipelines and a plurality of second compressed gas pipelines, one ends of the plurality of first compressed gas pipelines receive compressed gas, and the second compressed gas pipelines are connected between the other ends of the plurality of first compressed gas pipelines and the cylinder.
Furthermore, a plurality of weight intervals are set, wherein each weight interval corresponds to each first compressed gas pipeline one by one.
Further, when the weight of the single wafer is within the corresponding weight range, the corresponding first compressed gas pipeline is selected.
Further, each first compressed gas line includes a first solenoid valve; and selecting the corresponding first compressed gas pipeline by controlling the opening or closing of the first electromagnetic valves of the plurality of first compressed gas pipelines.
Further, each first compressed gas line further includes a check valve and a pressure reducing valve.
Further, step S15 specifically includes: and selecting the first compressed gas pipeline according to the weight of the single wafer, so that the compressed gas flows into the cylinder through the corresponding first compressed gas pipeline and the second compressed gas pipeline, the cylinder acts, and the Bernoulli arm generates suction to suck the wafer.
Further, the second compressed gas line includes a flow meter and a second solenoid valve.
Further, the cylinder includes a position sensor.
Further, the method further includes step S16: and the position of the cylinder is measured by the position sensor, and the cylinder action is controlled.
Drawings
FIG. 1 is a schematic flow chart of a method for improving wafer taking by a Bernoulli arm, in accordance with one embodiment of the present invention.
Fig. 2 is a schematic structural view illustrating measurement of the total weight of a wafer cassette according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of a wafer cassette loaded into a wafer input port according to an embodiment of the invention.
Fig. 4 is a schematic structural diagram of a compressed gas pipeline according to an embodiment of the invention.
Detailed Description
The technical solutions in the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity, and the same reference numerals denote the same elements throughout. It will be understood that when an element or layer is referred to as being "on" …, "adjacent to …," "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on …," "directly adjacent to …," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatial relationship terms such as "under …", "under …", "below", "under …", "above …", "above", and the like, may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "below …" and "below …" can encompass both an orientation of up and down. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
A flow chart of a method for improving a bernoulli arm to take a wafer according to an embodiment of the present invention is provided, and specifically, please refer to fig. 1, which is a flow chart of a method for improving a bernoulli arm to take a wafer according to an embodiment of the present invention. The method for improving the wafer taking of the Bernoulli arm in one embodiment of the invention comprises the following steps:
s11: the total weight of the wafer cassette is measured by a weight measuring unit.
Specifically, as shown in fig. 2, the wafer cassette 10 is loaded on the weight measuring unit 12, the weight measuring unit 12 measures the total weight of the wafer cassette 10, and the total weight is uploaded to an upper computer, wherein the wafer cassette 10 contains a plurality of wafers 11.
S12: loading the wafer box to the wafer input port.
Specifically, as shown in fig. 3, after the total weight of the wafer cassette 10 is measured, the wafer cassette 10 is loaded on a wafer input port 13(load port).
S13: sensing the number of wafers in the cassette.
Specifically, as shown in fig. 3, the wafer box 10 is placed in the sensing area on the wafer input port 13, and the sensing area senses the number of the wafers 11 in the wafer box 10 and uploads the number of the wafers 11 to the upper computer.
S14: and calculating the weight of the single wafer in the wafer box according to the total weight and the number.
Specifically, as shown in fig. 2 and 3, the total weight of the wafer cassette 10 and the number of wafers 11 calculate the weight of the individual wafers 11 in the wafer cassette 10.
S15: and selecting a compressed gas pipeline according to the weight of the single wafer, so that the Bernoulli arm generates corresponding suction force to suck the wafer.
Specifically, as shown in fig. 4, the compressed gas line includes a plurality of first compressed gas lines 4 and second compressed gas lines 5. One end of the plurality of first Compressed gas pipes 4 receives Compressed gas (CDA), and the second Compressed gas pipe 5 connects between the other end of the plurality of first Compressed gas pipes 4 and the cylinder 14. In the present embodiment, the gas pressures in the plurality of first compressed gas pipes 4 are different.
The upper computer calculates the weight of the single wafer 11, and compares the weight of the single wafer 11 with a plurality of preset weight intervals to determine the weight interval corresponding to the weight of the single wafer 11, wherein the plurality of weight intervals correspond to the plurality of first compressed gas pipelines 4 one by one. The upper computer selects the corresponding first compressed gas pipeline 4 according to the weight interval corresponding to the weight of the single wafer 11. In the embodiment, the first compressed gas line 4 comprises a first solenoid valve 32. The upper computer outputs a control signal to the electric signal control board 24 according to the weight of the single wafer 11, and then the electric control signal board outputs a signal to control the conduction of the first electromagnetic valve 32 corresponding to the first compressed gas pipeline 4, so that the compressed gas flows into the second compressed gas pipeline 5 from the corresponding first compressed gas pipeline 4, and then the second compressed gas pipeline 5 provides the compressed gas for the cylinder 14, so that the cylinder 14 acts, and further the bernoulli arm is driven to generate corresponding suction force to suck the wafer 11.
In some embodiments, the first solenoid valve 32 of each first compressed gas line 4 is connected to the pressure reducing valve 21. The pressure reducing valve 21 supplies pilot gas to the first solenoid valve 32.
According to the weight of the single wafer 11, one of the first compressed gas pipelines 4 with different air pressures is selected to enable the Bernoulli arm to generate suction forces with different sizes, the requirements for sucking and transmitting the wafer with the common thickness and the ultrathin wafer can be met simultaneously, the risk that the wafer is broken due to the fact that the suction force of the wafer with the common thickness is too small or the risk that the wafer is broken due to the fact that the suction force of the ultrathin wafer is too large can be avoided, and the operation efficiency and the reliability of the equipment are improved.
In the present embodiment, each first compressed gas line 4 further comprises a check valve and a pressure reducing valve. The non-return valve is used to open when compressed gas flows from the first compressed gas line 4 to the second compressed gas line 5. The pressure reducing valve serves to regulate the pressure of the compressed gas in the first compressed gas line 4.
In the present embodiment, the second compressed gas line 5 includes a second solenoid valve 23 and a flow meter 22. The flow meter 22 is used to detect the flow rate of the compressed gas in the second compressed gas line 5.
In the present embodiment, the cylinder 14 includes a position sensor. The position sensor is used for measuring the position of the piston, then transmitting a measuring signal to the cylinder action control plate 25, and then the cylinder action control plate outputs a control signal to control the action of the second electromagnetic valve 23 so as to enable the cylinder 14 to act.
In the embodiment, one of the first compressed gas pipelines 4 with different air pressures is selected according to the weight of the single wafer 11, so that the bernoulli arms generate suction forces with different sizes, the suction and transmission requirements of the wafer with the common thickness and the ultrathin wafer can be met, and the bernoulli arms can perform vacuum maintenance under the condition of extreme equipment power failure, so that the wafer is prevented from falling into fragments, and the operation efficiency and the reliability of the equipment are improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for improving the taking of a wafer by a Bernoulli arm, which is characterized by comprising the following steps:
s11: measuring the total weight of the wafer cassette by a weight measuring unit;
s12: loading the wafer box to a wafer input port;
s13: sensing the number of wafers in the wafer cassette;
s14: calculating the weight of the single wafer in the wafer box according to the total weight and the number; and
s15: and selecting a compressed gas pipeline according to the weight of the single wafer, so that the Bernoulli arm generates corresponding suction force to suck the wafer.
2. The method of improving bernoulli hand-fetching of wafers of claim 1, wherein the compressed gas line comprises a first plurality of compressed gas lines that receive compressed gas at one end and a second compressed gas line that is connected between the other end of the first plurality of compressed gas lines and the cylinder.
3. The method of claim 2, wherein a plurality of weight ranges are defined, wherein each weight range corresponds to one of the first compressed gas lines.
4. The method of improving Bernoulli arm wafer taking according to claim 3, wherein when the weight of the single wafer is within the corresponding weight range, the corresponding first compressed gas line is selected.
5. The method of improving bernoulli arm wafer taking according to claim 2, wherein each of the first compressed gas lines comprises a first solenoid valve; and selecting the corresponding first compressed gas pipeline by controlling the first electromagnetic valves of the plurality of first compressed gas pipelines to be opened or closed.
6. The method of improving bernoulli arm wafer taking according to claim 5, wherein each of the first compressed gas lines further comprises a check valve and a pressure relief valve.
7. The method for improving bernoulli arm wafer taking as claimed in claim 2, wherein step S15 specifically comprises: and selecting the first compressed gas pipeline according to the weight of the single wafer, so that compressed gas flows into the cylinder through the corresponding first compressed gas pipeline and the second compressed gas pipeline, the cylinder is actuated, and the Bernoulli arm generates corresponding suction force to suck the wafer.
8. The method for improving bernoulli arm wafer taking according to claim 2, wherein the second compressed gas line comprises a flow meter and a second solenoid valve.
9. The method for improving bernoulli arm wafer taking according to claim 2, wherein the cylinder comprises a position sensor.
10. The method for improving bernoulli arm wafer taking according to claim 9, further comprising step S16:
and measuring the position of the cylinder through the position sensor, and controlling the action of the cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110746865.2A CN113628998A (en) | 2021-07-02 | 2021-07-02 | Method for improving wafer taking of Bernoulli arm |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110746865.2A CN113628998A (en) | 2021-07-02 | 2021-07-02 | Method for improving wafer taking of Bernoulli arm |
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| CN113628998A true CN113628998A (en) | 2021-11-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115332143A (en) * | 2022-10-12 | 2022-11-11 | 泓浒(苏州)半导体科技有限公司 | Data processing method and system suitable for mechanical arm for wafer transmission |
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