CN101030568B - 半导体器件和金属互连 - Google Patents
半导体器件和金属互连 Download PDFInfo
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- CN101030568B CN101030568B CN2007100889078A CN200710088907A CN101030568B CN 101030568 B CN101030568 B CN 101030568B CN 2007100889078 A CN2007100889078 A CN 2007100889078A CN 200710088907 A CN200710088907 A CN 200710088907A CN 101030568 B CN101030568 B CN 101030568B
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- copper
- interconnection
- metal layer
- layer
- containing metal
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Abstract
Description
互连结构 | 淀积方法 | 含银量重量% | 成品率 |
a1 | 电镀→偏压溅射 | 0.1 | 88~98 |
a2 | 电镀→偏压溅射 | 0 | 78~84 |
a3 | 电镀 | 0.1 | 72~82 |
a4 | 电镀 | 0 | 8~19 |
Claims (2)
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JP198432/2002 | 2002-07-08 | ||
JP2002198432A JP4555540B2 (ja) | 2002-07-08 | 2002-07-08 | 半導体装置 |
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CN101030568B true CN101030568B (zh) | 2010-05-26 |
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JP (1) | JP4555540B2 (zh) |
CN (2) | CN100339972C (zh) |
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