CN100576479C - 用于将封装材料进给到模具空腔中的方法和装置 - Google Patents

用于将封装材料进给到模具空腔中的方法和装置 Download PDF

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Publication number
CN100576479C
CN100576479C CN200580017080A CN200580017080A CN100576479C CN 100576479 C CN100576479 C CN 100576479C CN 200580017080 A CN200580017080 A CN 200580017080A CN 200580017080 A CN200580017080 A CN 200580017080A CN 100576479 C CN100576479 C CN 100576479C
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CN
China
Prior art keywords
encapsulating material
mould cavity
mould
feed arrangement
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200580017080A
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English (en)
Chinese (zh)
Other versions
CN1957453A (zh
Inventor
W·O·德容
J·L·G·M·文罗伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flyco International Ltd
Besi Netherlands BV
Original Assignee
Fico BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico BV filed Critical Fico BV
Publication of CN1957453A publication Critical patent/CN1957453A/zh
Application granted granted Critical
Publication of CN100576479C publication Critical patent/CN100576479C/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0077—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the mould filling gate ; accessories for connecting the mould filling gate with the filling spout
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B29C45/0416—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement co-operating with fixed mould halves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/74—Heating or cooling of the injection unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN200580017080A 2004-04-08 2005-04-07 用于将封装材料进给到模具空腔中的方法和装置 Active CN100576479C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1025905 2004-04-08
NL1025905A NL1025905C2 (nl) 2004-04-08 2004-04-08 Werkwijze en inrichting voor het aan een vormholte toevoeren van omhulmateriaal.

Publications (2)

Publication Number Publication Date
CN1957453A CN1957453A (zh) 2007-05-02
CN100576479C true CN100576479C (zh) 2009-12-30

Family

ID=34964313

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580017080A Active CN100576479C (zh) 2004-04-08 2005-04-07 用于将封装材料进给到模具空腔中的方法和装置

Country Status (5)

Country Link
JP (1) JP4819796B2 (nl)
KR (1) KR101199096B1 (nl)
CN (1) CN100576479C (nl)
NL (1) NL1025905C2 (nl)
WO (1) WO2005098932A2 (nl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107283782A (zh) * 2016-03-31 2017-10-24 宜品股份有限公司 热熔胶封装机
CN106608032A (zh) * 2016-12-09 2017-05-03 安徽优丽普科技股份有限公司 一种pvc板材连续挤塑设备
KR102477355B1 (ko) * 2018-10-23 2022-12-15 삼성전자주식회사 캐리어 기판 및 이를 이용한 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8302530A (nl) * 1983-07-14 1985-02-01 Jacob Van Noort Integrated circuit en werkwijze, spuitgietvorm en spuitgietmachine ter vervaardiging van voorwerpen.
EP0787569A2 (en) * 1996-01-31 1997-08-06 Sumitomo Bakelite Company Limited Method of producing epoxy resin-encapsulated semiconductor device
CN1482657A (zh) * 2002-08-08 2004-03-17 爱立发株式会社 树脂固化系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537474Y2 (nl) * 1987-03-25 1993-09-22
JPH01317732A (ja) * 1988-06-20 1989-12-22 Japan Steel Works Ltd:The 射出成形機における射出能力向上方法及び装置
JPH08192438A (ja) * 1994-11-17 1996-07-30 Hitachi Ltd 半導体集積回路装置の製造方法およびそれに用いるモールド装置
JPH09141688A (ja) * 1995-11-20 1997-06-03 Towa Kk 電子部品の射出成形方法及び装置
JPH09286046A (ja) * 1996-04-23 1997-11-04 Matsushita Electric Works Ltd Ｌｉｍ成形装置
JP3992893B2 (ja) * 1999-12-02 2007-10-17 富士通株式会社 半導体装置のアンダーフィル方法
JP2001160129A (ja) * 2000-09-26 2001-06-12 Dainippon Printing Co Ltd Ｉｃカード用カード基材の製造方法
JP2003170465A (ja) * 2001-12-04 2003-06-17 Matsushita Electric Ind Co Ltd 半導体パッケージの製造方法およびそのための封止金型
JP2004063851A (ja) * 2002-07-30 2004-02-26 Renesas Technology Corp 樹脂封止装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8302530A (nl) * 1983-07-14 1985-02-01 Jacob Van Noort Integrated circuit en werkwijze, spuitgietvorm en spuitgietmachine ter vervaardiging van voorwerpen.
EP0787569A2 (en) * 1996-01-31 1997-08-06 Sumitomo Bakelite Company Limited Method of producing epoxy resin-encapsulated semiconductor device
EP0985513A2 (en) * 1996-01-31 2000-03-15 Sumitomo Bakelite Company Limited Method of producing epoxy resin-encapsulated semiconductor device
CN1482657A (zh) * 2002-08-08 2004-03-17 爱立发株式会社 树脂固化系统

Also Published As

Publication number Publication date
WO2005098932A2 (nl) 2005-10-20
KR101199096B1 (ko) 2012-11-08
JP2007533132A (ja) 2007-11-15
NL1025905C2 (nl) 2005-10-11
KR20070004079A (ko) 2007-01-05
WO2005098932A3 (en) 2006-01-19
JP4819796B2 (ja) 2011-11-24
CN1957453A (zh) 2007-05-02

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Effective date: 20130816

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Patentee after: FLYCO International Ltd.

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Patentee before: Fico B.V.

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