JP2007533132A - 型空洞へ封入材料を供給するための方法およびデバイス - Google Patents
型空洞へ封入材料を供給するための方法およびデバイス Download PDFInfo
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- JP2007533132A JP2007533132A JP2007507258A JP2007507258A JP2007533132A JP 2007533132 A JP2007533132 A JP 2007533132A JP 2007507258 A JP2007507258 A JP 2007507258A JP 2007507258 A JP2007507258 A JP 2007507258A JP 2007533132 A JP2007533132 A JP 2007533132A
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- 239000000463 material Substances 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 32
- 230000003213 activating effect Effects 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 25
- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 17
- 230000004913 activation Effects 0.000 claims description 11
- 230000013011 mating Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 description 8
- 239000008188 pellet Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0077—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the mould filling gate ; accessories for connecting the mould filling gate with the filling spout
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
- B29C45/0416—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement co-operating with fixed mould halves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/74—Heating or cooling of the injection unit
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
【解決手段】本発明は、次の処理ステップからなる。A)供給デバイス内で、供給すべき封入材料を少なくとも部分的に活性化すること。B)供給デバイスへ、封入すべき電子部品を持つ型空洞を結合すること。C)供給デバイスから型空洞へ、少なくとも部分的に活性化した封入材料を運ぶこと。そしてD)供給デバイスと、封入材料で少なくとも部分的に充填した型空洞とを分離すること。
【選択図】図1
Description
Claims (23)
- 電子部品を封入する目的で、型空洞内へ封入材料を供給するための方法であって、
A)供給すべき前記封入材料を少なくとも部分的に、供給デバイス内で活性化させる処理ステップ、
B)前記供給デバイスへ、封入すべき電子部品を含む型空洞を結合する処理ステップ、
C)前記少なくとも部分的に活性化した封入材料を前記供給デバイスから前記型空洞へ運ぶ処理ステップ、そして
D)前記供給デバイスと、封入材料で少なくとも部分的に充填した型空洞とを切り離す処理ステップからなる、方法。 - 処理ステップA)中に、前記封入材料が、加熱によって少なくとも部分的に活性化されることを特徴とする、請求項1に記載の方法。
- 前記供給デバイスが、連続的に、異なる型空洞と共作用することを特徴とする、請求項1または2に記載の方法。
- 前記供給デバイスが、前記封入材料とは別に発散ガスを排出することを特徴とする、前述の請求項のいずれかに記載の方法。
- 処理ステップB)による前記供給デバイスの前記型空洞への結合中に、前記供給デバイスが開口することを特徴とする、前述の請求項のいずれかに記載の方法。
- 処理ステップD)による前記供給デバイスと前記型空洞との切り離し中に、前記供給デバイスが閉じることを特徴とする、前述の請求項のいずれかに記載の方法。
- 電子部品を封入する目的で、型空洞へ封入材料を供給するためのデバイスであって、
・不活性封入材料を収容するための容器、
・前記封入材料を少なくとも部分的に活性化するための、前記容器に結合する活性化手段、
・前記活性化手段に沿って前記容器から前記封入材料を変位させるための輸送手段、そして
・前記少なくとも部分的に活性化した封入材料のための、前記活性化手段に結合する放出口からなる、デバイス。 - 前記活性化手段が、加熱手段から形成されることを特徴とする、請求項7に記載の供給デバイス。
- 前記加熱手段が、接触加熱素子によって形成されることを特徴とする、請求項8に記載の供給デバイス。
- 前記加熱手段が、放射線源によって形成されることを特徴とする、請求項8または9に記載の供給デバイス。
- 前記輸送手段が、前記封入材料を前記容器から前記活性化手段に沿って前記放出口へと付勢する、少なくとも一つのプランジャからなることを特徴とする、請求項7から10のいずれかに記載の供給デバイス。
- 前記放出口には、電子部品の周りに型空洞を区画形成する型との共作用に適応したカプリングが設けられていることを特徴とする、請求項7から11のいずれかに記載の供給デバイス。
- 前記放出口には、遮断バルブが設けられていることを特徴とする、請求項7から12のいずれかに記載の供給デバイス。
- 前記デバイスが、また、清掃手段を備えることを特徴とする、請求項7から13のいずれかに記載の供給デバイス。
- 電子部品を封入するための型であって、相互に対して変位可能な、少なくとも二つの型部品からなり、これらの型部品は、少なくとも一つの電子部品を備えた担体を、前記電子部品が型空洞内に配置させるよう、受容するように適応しており、前記型が、また、前記型空洞に結合し、封入材料の供給デバイスと共作用するように適応した嵌合カプリングを備える、型。
- 前記型が、前記嵌合カプリング手段を閉じるための遮断手段を備えることを特徴とする、請求項15に記載の型。
- 電子部品を封入するための封入デバイスであって、請求項7から14のいずれかに記載の供給デバイス、そして前記供給デバイスと共作用する、請求項15または16に記載の少なくとも一つの型からなる、封入デバイス。
- 前記封入デバイスが、請求項15または16に記載の複数の型を備えることを特徴とする、請求項17に記載の封入デバイス。
- 前記封入デバイスが、また、前記供給デバイスに対して前記型を変位させるための輸送システムを備えることを特徴とする、請求項18に記載の封入デバイス。
- 前記輸送システムがエンドレスであることを特徴とする、請求項19に記載の封入デバイス。
- 前記デバイスが、また、封入材料で封入した電子部品を、型から取り除くための放出デバイスを備えることを特徴とする、請求項17から20のいずれかに記載の封入デバイス。
- 前記デバイスが、また、型部品を閉じるための静止遮断手段を備え、前記型部品は前記遮断手段に対して変位可能であることを特徴とする、請求項19から21のいずれかに記載の封入デバイス。
- 前記デバイスが、また、前記型部品を開けるための静止開口手段を備え、前記型部品は前記遮断手段に対して変位可能であることを特徴とする、請求項19から22のいずれかに記載の封入デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1025905A NL1025905C2 (nl) | 2004-04-08 | 2004-04-08 | Werkwijze en inrichting voor het aan een vormholte toevoeren van omhulmateriaal. |
NL1025905 | 2004-04-08 | ||
PCT/NL2005/000265 WO2005098932A2 (en) | 2004-04-08 | 2005-04-07 | Method and device for feeding encapsulating material to a mould cavity |
Publications (3)
Publication Number | Publication Date |
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JP2007533132A true JP2007533132A (ja) | 2007-11-15 |
JP2007533132A6 JP2007533132A6 (ja) | 2008-02-14 |
JP4819796B2 JP4819796B2 (ja) | 2011-11-24 |
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JP2007507258A Active JP4819796B2 (ja) | 2004-04-08 | 2005-04-07 | 型空洞へ封入材料を供給するための方法およびデバイス |
Country Status (5)
Country | Link |
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JP (1) | JP4819796B2 (ja) |
KR (1) | KR101199096B1 (ja) |
CN (1) | CN100576479C (ja) |
NL (1) | NL1025905C2 (ja) |
WO (1) | WO2005098932A2 (ja) |
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CN107283782A (zh) * | 2016-03-31 | 2017-10-24 | 宜品股份有限公司 | 热熔胶封装机 |
CN106608032A (zh) * | 2016-12-09 | 2017-05-03 | 安徽优丽普科技股份有限公司 | 一种pvc板材连续挤塑设备 |
KR102477355B1 (ko) * | 2018-10-23 | 2022-12-15 | 삼성전자주식회사 | 캐리어 기판 및 이를 이용한 기판 처리 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63152238U (ja) * | 1987-03-25 | 1988-10-06 | ||
JPH08192438A (ja) * | 1994-11-17 | 1996-07-30 | Hitachi Ltd | 半導体集積回路装置の製造方法およびそれに用いるモールド装置 |
JPH09141688A (ja) * | 1995-11-20 | 1997-06-03 | Towa Kk | 電子部品の射出成形方法及び装置 |
JPH09286046A (ja) * | 1996-04-23 | 1997-11-04 | Matsushita Electric Works Ltd | Lim成形装置 |
JP2001160129A (ja) * | 2000-09-26 | 2001-06-12 | Dainippon Printing Co Ltd | Icカード用カード基材の製造方法 |
JP2001160563A (ja) * | 1999-12-02 | 2001-06-12 | Fujitsu Ltd | 半導体装置のアンダーフィル方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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NL8302530A (nl) * | 1983-07-14 | 1985-02-01 | Jacob Van Noort | Integrated circuit en werkwijze, spuitgietvorm en spuitgietmachine ter vervaardiging van voorwerpen. |
JPH01317732A (ja) * | 1988-06-20 | 1989-12-22 | Japan Steel Works Ltd:The | 射出成形機における射出能力向上方法及び装置 |
EP0787569B1 (en) * | 1996-01-31 | 2002-10-02 | Sumitomo Bakelite Company Limited | Method of producing epoxy resin-encapsulated semiconductor device |
JP2003170465A (ja) * | 2001-12-04 | 2003-06-17 | Matsushita Electric Ind Co Ltd | 半導体パッケージの製造方法およびそのための封止金型 |
JP2004063851A (ja) * | 2002-07-30 | 2004-02-26 | Renesas Technology Corp | 樹脂封止装置 |
JP4245417B2 (ja) * | 2002-08-08 | 2009-03-25 | アスリートFa株式会社 | 樹脂硬化システム |
-
2004
- 2004-04-08 NL NL1025905A patent/NL1025905C2/nl not_active IP Right Cessation
-
2005
- 2005-04-07 KR KR1020067022919A patent/KR101199096B1/ko active IP Right Grant
- 2005-04-07 JP JP2007507258A patent/JP4819796B2/ja active Active
- 2005-04-07 WO PCT/NL2005/000265 patent/WO2005098932A2/en active Application Filing
- 2005-04-07 CN CN200580017080A patent/CN100576479C/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63152238U (ja) * | 1987-03-25 | 1988-10-06 | ||
JPH08192438A (ja) * | 1994-11-17 | 1996-07-30 | Hitachi Ltd | 半導体集積回路装置の製造方法およびそれに用いるモールド装置 |
JPH09141688A (ja) * | 1995-11-20 | 1997-06-03 | Towa Kk | 電子部品の射出成形方法及び装置 |
JPH09286046A (ja) * | 1996-04-23 | 1997-11-04 | Matsushita Electric Works Ltd | Lim成形装置 |
JP2001160563A (ja) * | 1999-12-02 | 2001-06-12 | Fujitsu Ltd | 半導体装置のアンダーフィル方法 |
JP2001160129A (ja) * | 2000-09-26 | 2001-06-12 | Dainippon Printing Co Ltd | Icカード用カード基材の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070004079A (ko) | 2007-01-05 |
NL1025905C2 (nl) | 2005-10-11 |
WO2005098932A2 (en) | 2005-10-20 |
CN1957453A (zh) | 2007-05-02 |
CN100576479C (zh) | 2009-12-30 |
KR101199096B1 (ko) | 2012-11-08 |
JP4819796B2 (ja) | 2011-11-24 |
WO2005098932A3 (en) | 2006-01-19 |
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