CN100541838C - 使用量子点和非量子荧光材料发射输出光的装置和方法 - Google Patents
使用量子点和非量子荧光材料发射输出光的装置和方法 Download PDFInfo
- Publication number
- CN100541838C CN100541838C CNB2005100769715A CN200510076971A CN100541838C CN 100541838 C CN100541838 C CN 100541838C CN B2005100769715 A CNB2005100769715 A CN B2005100769715A CN 200510076971 A CN200510076971 A CN 200510076971A CN 100541838 C CN100541838 C CN 100541838C
- Authority
- CN
- China
- Prior art keywords
- light
- quantum dot
- quantum
- fluorescent material
- phosphor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002096 quantum dot Substances 0.000 title claims abstract description 61
- 239000000463 material Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 8
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 8
- -1 CdPo Inorganic materials 0.000 claims description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 5
- 230000002950 deficient Effects 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 235000013351 cheese Nutrition 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000008187 granular material Substances 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000035755 proliferation Effects 0.000 claims description 4
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 4
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 claims description 3
- 229910004613 CdTe Inorganic materials 0.000 claims description 3
- 229910004262 HgTe Inorganic materials 0.000 claims description 3
- 229910017680 MgTe Inorganic materials 0.000 claims description 3
- 229910002665 PbTe Inorganic materials 0.000 claims description 3
- 229910020684 PbZr Inorganic materials 0.000 claims description 3
- 229910002367 SrTiO Inorganic materials 0.000 claims description 3
- 238000005411 Van der Waals force Methods 0.000 claims description 3
- 229910007709 ZnTe Inorganic materials 0.000 claims description 3
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 101100136092 Drosophila melanogaster peng gene Proteins 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000004706 metal oxides Chemical group 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011824 nuclear material Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 239000004054 semiconductor nanocrystal Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H01L33/502—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H01L33/504—
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/966,534 | 2004-10-14 | ||
US10/966,534 US7102152B2 (en) | 2004-10-14 | 2004-10-14 | Device and method for emitting output light using quantum dots and non-quantum fluorescent material |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1761078A CN1761078A (zh) | 2006-04-19 |
CN100541838C true CN100541838C (zh) | 2009-09-16 |
Family
ID=36179805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100769715A Active CN100541838C (zh) | 2004-10-14 | 2005-06-09 | 使用量子点和非量子荧光材料发射输出光的装置和方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7102152B2 (zh) |
JP (1) | JP5514391B2 (zh) |
CN (1) | CN100541838C (zh) |
TW (1) | TWI373516B (zh) |
Families Citing this family (146)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030015708A1 (en) | 2001-07-23 | 2003-01-23 | Primit Parikh | Gallium nitride based diodes with low forward voltage and low reverse current operation |
US9470826B2 (en) * | 2003-02-12 | 2016-10-18 | Hon Hai Precision Industry Co., Ltd. | Color filter and display panel using same |
US7667766B2 (en) * | 2003-12-18 | 2010-02-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Adjustable spectrum flash lighting for image acquisition |
US7318651B2 (en) * | 2003-12-18 | 2008-01-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Flash module with quantum dot light conversion |
JPWO2005086239A1 (ja) * | 2004-03-05 | 2008-01-24 | コニカミノルタホールディングス株式会社 | 白色発光ダイオード(led)及び白色ledの製造方法 |
US20050199784A1 (en) * | 2004-03-11 | 2005-09-15 | Rizal Jaffar | Light to PWM converter |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
JP2006083219A (ja) * | 2004-09-14 | 2006-03-30 | Sharp Corp | 蛍光体およびこれを用いた発光装置 |
DE102004053116A1 (de) * | 2004-11-03 | 2006-05-04 | Tridonic Optoelectronics Gmbh | Leuchtdioden-Anordnung mit Farbkonversions-Material |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7522211B2 (en) * | 2005-02-10 | 2009-04-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Studio light |
KR101142519B1 (ko) * | 2005-03-31 | 2012-05-08 | 서울반도체 주식회사 | 적색 형광체 및 녹색 형광체를 갖는 백색 발광다이오드를채택한 백라이트 패널 |
KR100682874B1 (ko) * | 2005-05-02 | 2007-02-15 | 삼성전기주식회사 | 백색 led |
CN101176385A (zh) * | 2005-05-12 | 2008-05-07 | 出光兴产株式会社 | 色变换材料组合物及含有该组合物的色变换介质 |
EP2305776B1 (en) * | 2005-05-24 | 2013-03-06 | Seoul Semiconductor Co., Ltd. | Alkaline earth metal sulfide based red phosphor and white light emitting device thereof |
US9297092B2 (en) | 2005-06-05 | 2016-03-29 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US8718437B2 (en) * | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
CA2597697C (en) * | 2005-06-23 | 2014-12-02 | Rensselaer Polytechnic Institute | Package design for producing white light with short-wavelength leds and down-conversion materials |
US20070012928A1 (en) * | 2005-07-13 | 2007-01-18 | Zouyan Peng | Light emitting diode comprising semiconductor nanocrystal complexes and powdered phosphors |
US7495383B2 (en) * | 2005-08-01 | 2009-02-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Phosphor based on a combination of quantum dot and conventional phosphors |
US8835952B2 (en) | 2005-08-04 | 2014-09-16 | Cree, Inc. | Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants |
US7646035B2 (en) * | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
WO2007018039A1 (ja) * | 2005-08-05 | 2007-02-15 | Matsushita Electric Industrial Co., Ltd. | 半導体発光装置 |
KR100724591B1 (ko) * | 2005-09-30 | 2007-06-04 | 서울반도체 주식회사 | 발광 소자 및 이를 포함한 led 백라이트 |
JP2007157831A (ja) * | 2005-12-01 | 2007-06-21 | Sharp Corp | 発光装置 |
KR100745745B1 (ko) * | 2006-02-21 | 2007-08-02 | 삼성전기주식회사 | 나노복합재료 및 그 제조방법 |
KR100828891B1 (ko) | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US9951438B2 (en) | 2006-03-07 | 2018-04-24 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US9701899B2 (en) | 2006-03-07 | 2017-07-11 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
EP2041478B1 (en) * | 2006-03-07 | 2014-08-06 | QD Vision, Inc. | An article including semiconductor nanocrystals |
US8849087B2 (en) * | 2006-03-07 | 2014-09-30 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
WO2007105845A1 (en) * | 2006-03-16 | 2007-09-20 | Seoul Semiconductor Co., Ltd. | Fluorescent material and light emitting diode using the same |
JP2009538536A (ja) * | 2006-05-26 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 固体発光デバイス、および、それを製造する方法 |
KR101258229B1 (ko) * | 2006-06-30 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
US20080012001A1 (en) * | 2006-07-12 | 2008-01-17 | Evident Technologies | Shaped articles comprising semiconductor nanocrystals and methods of making and using same |
KR100901947B1 (ko) * | 2006-07-14 | 2009-06-10 | 삼성전자주식회사 | 반도체 나노결정을 이용하는 백색 발광 다이오드 및 그의제조방법 |
US7804147B2 (en) | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
JP5326229B2 (ja) * | 2006-09-08 | 2013-10-30 | 日亜化学工業株式会社 | 発光装置 |
US7769066B2 (en) | 2006-11-15 | 2010-08-03 | Cree, Inc. | Laser diode and method for fabricating same |
US7813400B2 (en) | 2006-11-15 | 2010-10-12 | Cree, Inc. | Group-III nitride based laser diode and method for fabricating same |
WO2008063652A1 (en) | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Blue emitting semiconductor nanocrystals and compositions and devices including same |
WO2008133660A2 (en) | 2006-11-21 | 2008-11-06 | Qd Vision, Inc. | Nanocrystals including a group iiia element and a group va element, method, composition, device and other prodcucts |
WO2008063658A2 (en) | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Semiconductor nanocrystals and compositions and devices including same |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
US7834367B2 (en) | 2007-01-19 | 2010-11-16 | Cree, Inc. | Low voltage diode with reduced parasitic resistance and method for fabricating |
CN101627482A (zh) * | 2007-03-08 | 2010-01-13 | 3M创新有限公司 | 发光元件阵列 |
US7638811B2 (en) * | 2007-03-13 | 2009-12-29 | Cree, Inc. | Graded dielectric layer |
US20080246044A1 (en) * | 2007-04-09 | 2008-10-09 | Siew It Pang | LED device with combined Reflector and Spherical Lens |
US7999283B2 (en) | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
WO2009014590A2 (en) | 2007-06-25 | 2009-01-29 | Qd Vision, Inc. | Compositions and methods including depositing nanomaterial |
US9136498B2 (en) | 2007-06-27 | 2015-09-15 | Qd Vision, Inc. | Apparatus and method for modulating photon output of a quantum dot light emitting device |
TWI365546B (en) * | 2007-06-29 | 2012-06-01 | Ind Tech Res Inst | Light emitting diode device and fabrication method thereof |
US20090001403A1 (en) * | 2007-06-29 | 2009-01-01 | Motorola, Inc. | Inductively excited quantum dot light emitting device |
KR101730164B1 (ko) * | 2007-07-18 | 2017-04-25 | 삼성전자주식회사 | 고체 조명에 유용한 양자점-기반 광 시트 |
WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US20090054752A1 (en) * | 2007-08-22 | 2009-02-26 | Motorola, Inc. | Method and apparatus for photoplethysmographic sensing |
US11114594B2 (en) * | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US8128249B2 (en) * | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
US8519437B2 (en) | 2007-09-14 | 2013-08-27 | Cree, Inc. | Polarization doping in nitride based diodes |
US9012937B2 (en) | 2007-10-10 | 2015-04-21 | Cree, Inc. | Multiple conversion material light emitting diode package and method of fabricating same |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
TW200921929A (en) * | 2007-11-02 | 2009-05-16 | Innolux Display Corp | Light emitting diode |
US8003021B2 (en) * | 2007-11-08 | 2011-08-23 | Toyota Motor Engineering And Manufacturing North America, Inc. | Synthesis of Pb alloy and core/shell nanowires |
WO2009145813A1 (en) | 2008-03-04 | 2009-12-03 | Qd Vision, Inc. | Particles including nanoparticles, uses thereof, and methods |
DE102008021666A1 (de) * | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung |
US9287469B2 (en) * | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
JP2011524064A (ja) * | 2008-05-06 | 2011-08-25 | キユーデイー・ビジヨン・インコーポレーテツド | 量子閉じ込め半導体ナノ粒子を含有する固体照明装置 |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
US8028537B2 (en) | 2009-05-01 | 2011-10-04 | Abl Ip Holding Llc | Heat sinking and flexible circuit board, for solid state light fixture utilizing an optical cavity |
US8172424B2 (en) * | 2009-05-01 | 2012-05-08 | Abl Ip Holding Llc | Heat sinking and flexible circuit board, for solid state light fixture utilizing an optical cavity |
US7845825B2 (en) * | 2009-12-02 | 2010-12-07 | Abl Ip Holding Llc | Light fixture using near UV solid state device and remote semiconductor nanophosphors to produce white light |
US8021008B2 (en) | 2008-05-27 | 2011-09-20 | Abl Ip Holding Llc | Solid state lighting using quantum dots in a liquid |
US7980728B2 (en) * | 2008-05-27 | 2011-07-19 | Abl Ip Holding Llc | Solid state lighting using light transmissive solid in or forming optical integrating volume |
US8212469B2 (en) | 2010-02-01 | 2012-07-03 | Abl Ip Holding Llc | Lamp using solid state source and doped semiconductor nanophosphor |
CN102113119A (zh) * | 2008-05-29 | 2011-06-29 | 克利公司 | 具有近场混合的光源 |
DE102008050643B4 (de) | 2008-10-07 | 2022-11-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtmittel |
DE102008057140A1 (de) * | 2008-11-13 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US8360617B2 (en) * | 2008-11-25 | 2013-01-29 | Samsung Electronics Co., Ltd. | Lighting system including LED with glass-coated quantum-dots |
US20100264371A1 (en) * | 2009-03-19 | 2010-10-21 | Nick Robert J | Composition including quantum dots, uses of the foregoing, and methods |
WO2010129374A2 (en) | 2009-04-28 | 2010-11-11 | Qd Vision, Inc. | Optical materials, optical components, and methods |
US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
EP2465147B1 (en) | 2009-08-14 | 2019-02-27 | Samsung Electronics Co., Ltd. | Lighting devices, an optical component for a lighting device, and methods |
WO2011031876A1 (en) | 2009-09-09 | 2011-03-17 | Qd Vision, Inc. | Formulations including nanoparticles |
JP5744033B2 (ja) | 2009-09-09 | 2015-07-01 | キユーデイー・ビジヨン・インコーポレーテツド | ナノ粒子を含む粒子、それの使用および方法 |
CN102597848B (zh) | 2009-10-17 | 2016-06-01 | Qd视光有限公司 | 光学元件、包括其的产品、以及用于制造其的方法 |
US9163802B2 (en) * | 2009-12-02 | 2015-10-20 | Abl Ip Holding Llc | Lighting fixtures using solid state device and remote phosphors to produce white light |
US20110127555A1 (en) * | 2009-12-02 | 2011-06-02 | Renaissance Lighting, Inc. | Solid state light emitter with phosphors dispersed in a liquid or gas for producing high cri white light |
US8118454B2 (en) | 2009-12-02 | 2012-02-21 | Abl Ip Holding Llc | Solid state lighting system with optic providing occluded remote phosphor |
US8217406B2 (en) * | 2009-12-02 | 2012-07-10 | Abl Ip Holding Llc | Solid state light emitter with pumped nanophosphors for producing high CRI white light |
US8536615B1 (en) | 2009-12-16 | 2013-09-17 | Cree, Inc. | Semiconductor device structures with modulated and delta doping and related methods |
US8604461B2 (en) * | 2009-12-16 | 2013-12-10 | Cree, Inc. | Semiconductor device structures with modulated doping and related methods |
KR101833313B1 (ko) | 2010-01-28 | 2018-03-02 | 이섬 리서치 디벨러프먼트 컴파니 오브 더 히브루 유니버시티 오브 예루살렘 엘티디. | 규정된 컬러 방출을 위한 조명 장치 |
US9719012B2 (en) * | 2010-02-01 | 2017-08-01 | Abl Ip Holding Llc | Tubular lighting products using solid state source and semiconductor nanophosphor, E.G. for florescent tube replacement |
KR100969100B1 (ko) | 2010-02-12 | 2010-07-09 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
US8517550B2 (en) | 2010-02-15 | 2013-08-27 | Abl Ip Holding Llc | Phosphor-centric control of color of light |
US20110236958A1 (en) * | 2010-03-23 | 2011-09-29 | Lan Wong | Multistory Bioreaction System for Enhancing Photosynthesis |
US8222025B2 (en) * | 2010-03-23 | 2012-07-17 | Lan Wong | Multistory bioreaction system for enhancing photosynthesis |
KR101683270B1 (ko) | 2010-03-31 | 2016-12-21 | 삼성전자 주식회사 | 백색 발광 다이오드를 포함하는 액정 디스플레이 장치 |
CN102222750A (zh) * | 2010-04-19 | 2011-10-19 | 海洋王照明科技股份有限公司 | 白光led装置及其制作方法 |
US8089207B2 (en) | 2010-05-10 | 2012-01-03 | Abl Ip Holding Llc | Lighting using solid state device and phosphors to produce light approximating a black body radiation spectrum |
EP2577734B1 (en) | 2010-05-27 | 2019-11-13 | Merck Patent GmbH | Down conversion |
US8702277B2 (en) | 2010-07-12 | 2014-04-22 | Samsung Electronics Co., Ltd. | White light emitting diode and liquid crystal display including the same |
KR101261461B1 (ko) * | 2010-07-14 | 2013-05-10 | 엘지이노텍 주식회사 | 액정 표시 장치 |
JP2012036265A (ja) * | 2010-08-05 | 2012-02-23 | Sharp Corp | 照明装置 |
US8513955B2 (en) | 2010-09-28 | 2013-08-20 | Tyco Electronics Corporation | SSL budgeting and coding system for lighting assembly |
US9431585B2 (en) * | 2010-09-29 | 2016-08-30 | Koninklijke Philips Electronics N.V. | Wavelength converted light emitting device |
US8362507B2 (en) | 2010-11-01 | 2013-01-29 | Tyco Electronics Corporation | Optic assembly utilizing quantum dots |
US9091399B2 (en) * | 2010-11-11 | 2015-07-28 | Bridgelux, Inc. | Driver-free light-emitting device |
KR20120054484A (ko) * | 2010-11-19 | 2012-05-30 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이의 제조방법 |
EP2655961A4 (en) | 2010-12-23 | 2014-09-03 | Qd Vision Inc | OPTICAL ELEMENT CONTAINING QUANTUM POINTS |
JP5937521B2 (ja) | 2011-01-28 | 2016-06-22 | 昭和電工株式会社 | 量子ドット蛍光体を含む組成物、量子ドット蛍光体分散樹脂成形体、量子ドット蛍光体を含む構造物、発光装置、電子機器、機械装置及び量子ドット蛍光体分散樹脂成形体の製造方法 |
CA2771851C (en) | 2011-04-12 | 2018-07-24 | Research In Motion Limited | Camera flash for improved color balance |
US20130001597A1 (en) * | 2011-06-28 | 2013-01-03 | Osram Sylvania Inc. | Lighting Device Having a Color Tunable Wavelength Converter |
US20130056706A1 (en) * | 2011-09-01 | 2013-03-07 | Kevin C. Baxter | Quantum dot led light system and method |
KR101644050B1 (ko) * | 2011-09-09 | 2016-08-01 | 삼성전자 주식회사 | 반도체 나노결정을 포함하는 케이스 및 이를 포함하는 광전자 소자 |
WO2013078251A1 (en) | 2011-11-22 | 2013-05-30 | Qd Vision, Inc. | Stress-resistant component for use with quantum dots |
KR101362263B1 (ko) * | 2012-01-30 | 2014-02-13 | 국민대학교산학협력단 | 광산란을 최소화하는 형광체-기지 복합체 분말 및 이를 포함하는 led 구조체 |
CN104205374B (zh) | 2012-03-30 | 2020-10-16 | 亮锐控股有限公司 | 具有波长转换侧面涂层的发光器件 |
US9599293B2 (en) * | 2012-04-05 | 2017-03-21 | Koninklijke Philips N.V. | Full spectrum light emitting arrangement |
WO2013150413A1 (en) * | 2012-04-05 | 2013-10-10 | Koninklijke Philips N.V. | Light emitting arrangement comprising quantum dots |
TW201341725A (zh) * | 2012-04-13 | 2013-10-16 | 瑞儀光電股份有限公司 | 光源模組 |
US9929325B2 (en) | 2012-06-05 | 2018-03-27 | Samsung Electronics Co., Ltd. | Lighting device including quantum dots |
CN102731965B (zh) * | 2012-06-25 | 2015-04-08 | 广东普加福光电科技有限公司 | 量子点荧光材料及其制备方法、以及led补/闪光灯 |
TW201403878A (zh) * | 2012-07-06 | 2014-01-16 | Formosa Epitaxy Inc | 一種發光元件 |
US20140170786A1 (en) | 2012-12-13 | 2014-06-19 | Juanita N. Kurtin | Ceramic composition having dispersion of nano-particles therein and methods of fabricating same |
KR20140089641A (ko) * | 2013-01-03 | 2014-07-16 | 삼성디스플레이 주식회사 | 발광다이오드 패키지 및 이를 갖는 표시 장치 |
US9142732B2 (en) * | 2013-03-04 | 2015-09-22 | Osram Sylvania Inc. | LED lamp with quantum dots layer |
JP2014175354A (ja) * | 2013-03-06 | 2014-09-22 | Disco Abrasive Syst Ltd | 発光ダイオード |
DE102013102482A1 (de) * | 2013-03-12 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
CN105264042A (zh) * | 2013-06-05 | 2016-01-20 | 柯尼卡美能达株式会社 | 光学材料、光学膜及发光器件 |
KR102294837B1 (ko) | 2013-08-16 | 2021-08-26 | 삼성전자주식회사 | 광학 부품을 제조하는 방법, 광학 부품, 및 그것을 포함하는 제품 |
WO2016056727A1 (en) * | 2014-10-10 | 2016-04-14 | Lg Electronics Inc. | Light emitting device package and method of fabricating the same |
TWI687322B (zh) | 2014-12-24 | 2020-03-11 | 日商可樂麗股份有限公司 | 電子裝置及其製造方法 |
JP6628056B2 (ja) | 2015-01-31 | 2020-01-08 | エルジー・ケム・リミテッド | 光変換素子及びそれを含むディスプレイ装置 |
JP6971972B2 (ja) | 2015-09-10 | 2021-11-24 | リテック−ヴェルメーゲンズヴェルワルツングスゲゼルシャフト エムベーハーLITEC−Vermoegensverwaltungsgesellschaft mbH | 光変換材料 |
KR102512069B1 (ko) | 2015-12-31 | 2023-03-21 | 삼성디스플레이 주식회사 | 청색 유기 발광 소자 및 이를 포함하는 표시 장치 |
CN105679894B (zh) * | 2016-03-30 | 2018-08-28 | 深圳市聚飞光电股份有限公司 | 一种基于红光量子点的高色域白光led灯珠的制作方法 |
JP6750026B2 (ja) * | 2016-11-07 | 2020-09-02 | 富士フイルム株式会社 | 蛍光体含有フィルムおよびバックライトユニット |
US10290779B2 (en) * | 2016-12-15 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting element |
CN107425106B (zh) * | 2017-08-21 | 2019-07-19 | 苏州轻光材料科技有限公司 | 一种量子点组合紫外激发白光led发光装置 |
WO2019121455A1 (de) | 2017-12-18 | 2019-06-27 | Merck Patent Gmbh | Lichtkonvertierendes material |
WO2020023721A1 (en) | 2018-07-25 | 2020-01-30 | Natus Medical Incorporated | Real-time removal of ir led reflections from an image |
KR102085275B1 (ko) * | 2019-01-28 | 2020-03-05 | 삼성전자주식회사 | 백색 발광 다이오드, 백라이트 유닛, 및 이를 포함한 디스플레이 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
JP3954304B2 (ja) * | 2000-12-20 | 2007-08-08 | 株式会社東芝 | 発光装置 |
US6870311B2 (en) * | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
JP3978101B2 (ja) * | 2002-08-29 | 2007-09-19 | 岡谷電機産業株式会社 | 発光ダイオード及びその製造方法 |
JP4171890B2 (ja) * | 2003-01-30 | 2008-10-29 | 株式会社ファインラバー研究所 | 赤色発光蛍光体及び発光装置 |
US7279832B2 (en) * | 2003-04-01 | 2007-10-09 | Innovalight, Inc. | Phosphor materials and illumination devices made therefrom |
JP2005228996A (ja) * | 2004-02-13 | 2005-08-25 | Matsushita Electric Works Ltd | 発光装置 |
JP4019067B2 (ja) * | 2004-04-30 | 2007-12-05 | サンケン電気株式会社 | 半導体発光装置 |
JP2004260219A (ja) * | 2004-06-14 | 2004-09-16 | Toyoda Gosei Co Ltd | 3族窒化物半導体発光素子 |
-
2004
- 2004-10-14 US US10/966,534 patent/US7102152B2/en active Active
-
2005
- 2005-05-19 TW TW094116371A patent/TWI373516B/zh active
- 2005-06-09 CN CNB2005100769715A patent/CN100541838C/zh active Active
- 2005-10-11 JP JP2005296064A patent/JP5514391B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TWI373516B (en) | 2012-10-01 |
CN1761078A (zh) | 2006-04-19 |
JP2006114900A (ja) | 2006-04-27 |
JP5514391B2 (ja) | 2014-06-04 |
US20060081862A1 (en) | 2006-04-20 |
US7102152B2 (en) | 2006-09-05 |
TW200611967A (en) | 2006-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100541838C (zh) | 使用量子点和非量子荧光材料发射输出光的装置和方法 | |
US7481562B2 (en) | Device and method for providing illuminating light using quantum dots | |
KR101259502B1 (ko) | 양자 도트 인광체와 종래의 인광체의 조합에 근거한 인광체 | |
CN101794855B (zh) | 半导体发光装置及半导体发光装置的制造方法 | |
CN101252159B (zh) | 白色发光器件 | |
KR100849766B1 (ko) | 발광 장치 | |
US7462983B2 (en) | White light emitting device | |
US6653765B1 (en) | Uniform angular light distribution from LEDs | |
US7737457B2 (en) | Phosphor down converting element for an LED package and fabrication method | |
US20060113895A1 (en) | Light emitting device with multiple layers of quantum dots and method for making the device | |
US20070090381A1 (en) | Semiconductor light emitting device | |
US20040263073A1 (en) | White light emitting device | |
CN102804423A (zh) | 磷光体转换ir led | |
US20050156510A1 (en) | Device and method for emitting output light using group IIB element selenide-based and group IIA element gallium sulfide-based phosphor materials | |
CN107408610B (zh) | 发光器件 | |
CN1828952A (zh) | 具有带光致发光材料的光子晶体层的发光设备及制造方法 | |
JP2013033916A (ja) | 発光装置及びその製造方法 | |
JP5109226B2 (ja) | 発光装置 | |
US20060006396A1 (en) | Phosphor mixture of organge/red ZnSe0.5S0.5:Cu,Cl and green BaSrGa4S7:Eu for white phosphor-converted led | |
CN101140976A (zh) | 发光器件、发光器件的制造方法和包含发光器件的光源器件 | |
US20060006397A1 (en) | Device and method for emitting output light using group IIA/IIB selenide sulfur-based phosphor material | |
JP2008227550A (ja) | 発光ダイオード、その製造方法および白色照明装置 | |
US20050167684A1 (en) | Device and method for emitting output light using group IIB element selenide-based phosphor material | |
US20050269932A1 (en) | Apparatus, device and method for emitting output light using group IIB element selenide-based phosphor material and/or thiogallate-based phosphor material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070105 Address after: Singapore Singapore Applicant after: Avago Technologies ECBU IP (Singapore) Pte. Ltd. Address before: Singapore Singapore Applicant before: Avago Technologies General IP (Singapore) Pte. Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TAIWAN SEMICONDUCTOR MFG Free format text: FORMER OWNER: AGILENT TECHNOLOGIES INC. Effective date: 20111103 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: TAIWAN, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20111103 Address after: Taiwan, China Patentee after: Taiwan Semiconductor Manufacturing Co.,Ltd. Address before: Singapore, Singapore Patentee before: Avago Technologies ECBU IP (singapore) Pte. Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160509 Address after: Hsinchu City, Taiwan, China Patentee after: EPISTAR Corp. Address before: Hsinchu City, Taiwan, China Patentee before: Yuanxin Optoelectronics Co.,Ltd. Effective date of registration: 20160509 Address after: Hsinchu City, Taiwan, China Patentee after: Yuanxin Optoelectronics Co.,Ltd. Address before: Taiwan, China Patentee before: Taiwan Semiconductor Manufacturing Co.,Ltd. |