CN100524715C - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN100524715C CN100524715C CNB2007100844838A CN200710084483A CN100524715C CN 100524715 C CN100524715 C CN 100524715C CN B2007100844838 A CNB2007100844838 A CN B2007100844838A CN 200710084483 A CN200710084483 A CN 200710084483A CN 100524715 C CN100524715 C CN 100524715C
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- electrode pad
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- copper
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- Condensed Matter Physics & Semiconductors (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006194852 | 2006-07-14 | ||
JP2006194852A JP5162851B2 (ja) | 2006-07-14 | 2006-07-14 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101106115A CN101106115A (zh) | 2008-01-16 |
CN100524715C true CN100524715C (zh) | 2009-08-05 |
Family
ID=38948418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100844838A Expired - Fee Related CN100524715C (zh) | 2006-07-14 | 2007-03-02 | 半导体器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7723847B2 (zh) |
JP (1) | JP5162851B2 (zh) |
KR (1) | KR100778041B1 (zh) |
CN (1) | CN100524715C (zh) |
TW (1) | TWI337765B (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7952207B2 (en) * | 2007-12-05 | 2011-05-31 | International Business Machines Corporation | Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening |
US20090206480A1 (en) * | 2008-02-20 | 2009-08-20 | Atmel Corporation | Fabricating low cost solder bumps on integrated circuit wafers |
US8211583B2 (en) | 2008-05-08 | 2012-07-03 | Bloom Energy Corporation | Derivation of control parameters of fuel cell systems for flexible fuel operation |
JP4896261B2 (ja) * | 2008-06-23 | 2012-03-14 | 三菱電機株式会社 | モータ用端子の絶縁ハウジング |
JP5432543B2 (ja) * | 2009-02-21 | 2014-03-05 | 新日本無線株式会社 | 半導体装置の製造方法 |
EP2567450A4 (en) | 2010-05-04 | 2018-01-17 | Remy Technologies, LLC | Electric machine cooling system and method |
US9054565B2 (en) | 2010-06-04 | 2015-06-09 | Remy Technologies, Llc | Electric machine cooling system and method |
WO2011156513A2 (en) | 2010-06-08 | 2011-12-15 | Remy Technologies, Llc | Electric machine cooling system and method |
US8614538B2 (en) | 2010-06-14 | 2013-12-24 | Remy Technologies, Llc | Electric machine cooling system and method |
US8482169B2 (en) | 2010-06-14 | 2013-07-09 | Remy Technologies, Llc | Electric machine cooling system and method |
US8446056B2 (en) | 2010-09-29 | 2013-05-21 | Remy Technologies, Llc | Electric machine cooling system and method |
US8492952B2 (en) | 2010-10-04 | 2013-07-23 | Remy Technologies, Llc | Coolant channels for electric machine stator |
US8508085B2 (en) | 2010-10-04 | 2013-08-13 | Remy Technologies, Llc | Internal cooling of stator assembly in an electric machine |
US8395287B2 (en) | 2010-10-04 | 2013-03-12 | Remy Technologies, Llc | Coolant channels for electric machine stator |
US8593021B2 (en) | 2010-10-04 | 2013-11-26 | Remy Technologies, Llc | Coolant drainage system and method for electric machines |
US8648506B2 (en) | 2010-11-09 | 2014-02-11 | Remy Technologies, Llc | Rotor lamination cooling system and method |
US8497608B2 (en) | 2011-01-28 | 2013-07-30 | Remy Technologies, Llc | Electric machine cooling system and method |
WO2012145302A2 (en) | 2011-04-18 | 2012-10-26 | Remy Technologies, Llc | Electric machine module cooling system and method |
US8692425B2 (en) | 2011-05-10 | 2014-04-08 | Remy Technologies, Llc | Cooling combinations for electric machines |
WO2012167274A1 (en) | 2011-06-03 | 2012-12-06 | Remy Technologies, Llc | Electric machine module cooling system and method |
US9041260B2 (en) | 2011-07-08 | 2015-05-26 | Remy Technologies, Llc | Cooling system and method for an electronic machine |
US8803381B2 (en) | 2011-07-11 | 2014-08-12 | Remy Technologies, Llc | Electric machine with cooling pipe coiled around stator assembly |
US8546982B2 (en) | 2011-07-12 | 2013-10-01 | Remy Technologies, Llc | Electric machine module cooling system and method |
US9048710B2 (en) | 2011-08-29 | 2015-06-02 | Remy Technologies, Llc | Electric machine module cooling system and method |
US8975792B2 (en) | 2011-09-13 | 2015-03-10 | Remy Technologies, Llc | Electric machine module cooling system and method |
WO2013067659A1 (zh) * | 2011-11-11 | 2013-05-16 | Chu Tse-Ming | 晶圆焊垫的凸块结构及其制造方法 |
US9099900B2 (en) | 2011-12-06 | 2015-08-04 | Remy Technologies, Llc | Electric machine module cooling system and method |
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-
2006
- 2006-07-14 JP JP2006194852A patent/JP5162851B2/ja not_active Expired - Fee Related
- 2006-11-21 KR KR1020060114886A patent/KR100778041B1/ko not_active IP Right Cessation
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2007
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- 2007-02-09 TW TW096104834A patent/TWI337765B/zh not_active IP Right Cessation
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US7723847B2 (en) | 2010-05-25 |
US20080012128A1 (en) | 2008-01-17 |
CN101106115A (zh) | 2008-01-16 |
TWI337765B (en) | 2011-02-21 |
JP2008021950A (ja) | 2008-01-31 |
TW200805531A (en) | 2008-01-16 |
JP5162851B2 (ja) | 2013-03-13 |
KR100778041B1 (ko) | 2007-11-21 |
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