CN100524617C - 显影装置和显影方法 - Google Patents

显影装置和显影方法 Download PDF

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Publication number
CN100524617C
CN100524617C CNB2005800242508A CN200580024250A CN100524617C CN 100524617 C CN100524617 C CN 100524617C CN B2005800242508 A CNB2005800242508 A CN B2005800242508A CN 200580024250 A CN200580024250 A CN 200580024250A CN 100524617 C CN100524617 C CN 100524617C
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CN
China
Prior art keywords
developer
mesh
substrate
suppression element
liquid flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800242508A
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English (en)
Chinese (zh)
Other versions
CN1989593A (zh
Inventor
北村哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1989593A publication Critical patent/CN1989593A/zh
Application granted granted Critical
Publication of CN100524617C publication Critical patent/CN100524617C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2005800242508A 2004-05-18 2005-05-17 显影装置和显影方法 Expired - Fee Related CN100524617C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP148115/2004 2004-05-18
JP2004148115A JP4343025B2 (ja) 2004-05-18 2004-05-18 現像装置及び現像方法

Publications (2)

Publication Number Publication Date
CN1989593A CN1989593A (zh) 2007-06-27
CN100524617C true CN100524617C (zh) 2009-08-05

Family

ID=35394412

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800242508A Expired - Fee Related CN100524617C (zh) 2004-05-18 2005-05-17 显影装置和显影方法

Country Status (5)

Country Link
US (1) US7651284B2 (enExample)
JP (1) JP4343025B2 (enExample)
KR (1) KR100843275B1 (enExample)
CN (1) CN100524617C (enExample)
WO (1) WO2005112077A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method
JP4781834B2 (ja) * 2006-02-07 2011-09-28 大日本スクリーン製造株式会社 現像装置および現像方法
JP2007214365A (ja) * 2006-02-09 2007-08-23 Sokudo:Kk 基板処理装置
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
JP4924186B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP4924187B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 現像装置、現像方法及び塗布、現像装置並びに記憶媒体
JP4893799B2 (ja) * 2009-10-23 2012-03-07 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP4927158B2 (ja) * 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
CN102109776A (zh) * 2011-03-18 2011-06-29 常州瑞择微电子科技有限公司 光刻胶显影工艺及其装置
US20130067761A1 (en) * 2011-09-16 2013-03-21 Shenzhen China Star Optoelectronics Technology Co. Ltd. Drying apparatus
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
CN104483812A (zh) * 2014-11-29 2015-04-01 复旦大学 利用热显影增强电子束光刻胶对比度的制备高密度平整图形的方法
KR102712571B1 (ko) * 2018-08-06 2024-10-04 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 기판 연마 장치
JP7536671B2 (ja) * 2021-01-29 2024-08-20 キオクシア株式会社 基板処理装置
KR102845583B1 (ko) * 2022-07-27 2025-08-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276321A (ja) * 1985-05-31 1986-12-06 Nec Corp 半導体基板現像装置
JP3167317B2 (ja) * 1990-10-18 2001-05-21 株式会社東芝 基板処理装置及び同方法
JPH06310419A (ja) * 1993-04-26 1994-11-04 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3120168B2 (ja) * 1994-05-30 2000-12-25 東京エレクトロン株式会社 処理方法及び処理装置
JP3686241B2 (ja) * 1997-11-18 2005-08-24 東京エレクトロン株式会社 処理方法及び処理装置
JP2002015983A (ja) * 2000-06-30 2002-01-18 Minolta Co Ltd フィルム基板のウェット処理方法、及びウェット処理に用いられるフィルム基板保持装置
JP3920608B2 (ja) * 2001-09-21 2007-05-30 東京エレクトロン株式会社 現像装置及び現像方法
EP1566700B1 (en) * 2004-02-23 2016-08-03 FUJIFILM Corporation Automatic development method of photosensitive lithographic printing plate and automatic development device thereof
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method

Also Published As

Publication number Publication date
US7651284B2 (en) 2010-01-26
US20070065145A1 (en) 2007-03-22
WO2005112077A1 (ja) 2005-11-24
KR100843275B1 (ko) 2008-07-03
JP2005332882A (ja) 2005-12-02
KR20070011509A (ko) 2007-01-24
CN1989593A (zh) 2007-06-27
JP4343025B2 (ja) 2009-10-14

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090805

Termination date: 20180517