CN100521144C - 基板保持装置 - Google Patents

基板保持装置 Download PDF

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Publication number
CN100521144C
CN100521144C CNB2007101452754A CN200710145275A CN100521144C CN 100521144 C CN100521144 C CN 100521144C CN B2007101452754 A CNB2007101452754 A CN B2007101452754A CN 200710145275 A CN200710145275 A CN 200710145275A CN 100521144 C CN100521144 C CN 100521144C
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CN
China
Prior art keywords
valve
substrate
mentioned
vacuum
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CNB2007101452754A
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English (en)
Chinese (zh)
Other versions
CN101131954A (zh
Inventor
升芳明
宫本英典
吉泽健司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ameco Technology Co ltd
Process Equipment Business Division Preparation Co ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN101131954A publication Critical patent/CN101131954A/zh
Application granted granted Critical
Publication of CN100521144C publication Critical patent/CN100521144C/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
CNB2007101452754A 2006-08-24 2007-08-17 基板保持装置 Active CN100521144C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006227245 2006-08-24
JP2006227245A JP4771893B2 (ja) 2006-08-24 2006-08-24 基板保持装置

Publications (2)

Publication Number Publication Date
CN101131954A CN101131954A (zh) 2008-02-27
CN100521144C true CN100521144C (zh) 2009-07-29

Family

ID=39129152

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007101452754A Active CN100521144C (zh) 2006-08-24 2007-08-17 基板保持装置

Country Status (4)

Country Link
JP (1) JP4771893B2 (https=)
KR (1) KR100906554B1 (https=)
CN (1) CN100521144C (https=)
TW (1) TW200816358A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110124908A (zh) * 2019-06-21 2019-08-16 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶片真空吸附装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
CN102179881A (zh) * 2011-04-01 2011-09-14 石金精密科技（深圳）有限公司 平面薄板吸附固定系统
CN102496587B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆在位检测装置以及晶圆在位检测方法
CN102496595B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆托架、晶圆交换装置以及晶圆在位检测方法
JP6057599B2 (ja) * 2012-08-09 2017-01-11 タツモ株式会社 吸着定盤及びその製造方法
TW201509544A (zh) * 2013-09-05 2015-03-16 Rich Chen Automatically Controlled Co Ltd 基板塗佈裝置及塗佈方法
CN106853432B (zh) * 2016-11-24 2019-04-16 重庆市永川区锐峰玻璃制品有限公司 旋转涂胶台
CN111132539A (zh) * 2020-01-17 2020-05-08 安徽博微长安电子有限公司 一种手动点胶贴片机无损贴装凝胶盒中芯片的工装及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880264B2 (ja) * 1990-07-12 1999-04-05 キヤノン株式会社 基板保持装置
JPH08125000A (ja) * 1994-10-24 1996-05-17 Nec Kyushu Ltd ウェーハチャック
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
JPH0945755A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd ウェハチャックおよびウェハ吸着方法
JP2003023060A (ja) * 2001-07-10 2003-01-24 Shimadzu Corp 吊り下げ型基板保持装置および液晶パネル製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110124908A (zh) * 2019-06-21 2019-08-16 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶片真空吸附装置
CN110124908B (zh) * 2019-06-21 2021-09-07 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶片真空吸附装置

Also Published As

Publication number Publication date
KR100906554B1 (ko) 2009-07-07
CN101131954A (zh) 2008-02-27
TWI360195B (https=) 2012-03-11
JP2008053391A (ja) 2008-03-06
KR20080018808A (ko) 2008-02-28
TW200816358A (en) 2008-04-01
JP4771893B2 (ja) 2011-09-14

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GR01 Patent grant
TR01 Transfer of patent right
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Effective date of registration: 20230608

Address after: Kanagawa, Japan

Patentee after: Process Equipment Business Division Preparation Co.,Ltd.

Address before: Kanagawa

Patentee before: TOKYO OHKA KOGYO Co.,Ltd.

Effective date of registration: 20230608

Address after: Ibaraki

Patentee after: Ameco Technology Co.,Ltd.

Address before: Kanagawa, Japan

Patentee before: Process Equipment Business Division Preparation Co.,Ltd.