KR100906554B1 - 기판 유지장치 - Google Patents

기판 유지장치 Download PDF

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Publication number
KR100906554B1
KR100906554B1 KR1020070083176A KR20070083176A KR100906554B1 KR 100906554 B1 KR100906554 B1 KR 100906554B1 KR 1020070083176 A KR1020070083176 A KR 1020070083176A KR 20070083176 A KR20070083176 A KR 20070083176A KR 100906554 B1 KR100906554 B1 KR 100906554B1
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KR
South Korea
Prior art keywords
substrate
valve
surface plate
vacuum
state
Prior art date
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Application number
KR1020070083176A
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English (en)
Korean (ko)
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KR20080018808A (ko
Inventor
요시아키 마스
히데노리 미야모토
겐지 요시자와
Original Assignee
도쿄 오카 고교 가부시키가이샤
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Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20080018808A publication Critical patent/KR20080018808A/ko
Application granted granted Critical
Publication of KR100906554B1 publication Critical patent/KR100906554B1/ko
Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도쿄 오카 고교 가부시키가이샤
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
KR1020070083176A 2006-08-24 2007-08-20 기판 유지장치 Active KR100906554B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00227245 2006-08-24
JP2006227245A JP4771893B2 (ja) 2006-08-24 2006-08-24 基板保持装置

Publications (2)

Publication Number Publication Date
KR20080018808A KR20080018808A (ko) 2008-02-28
KR100906554B1 true KR100906554B1 (ko) 2009-07-07

Family

ID=39129152

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070083176A Active KR100906554B1 (ko) 2006-08-24 2007-08-20 기판 유지장치

Country Status (4)

Country Link
JP (1) JP4771893B2 (https=)
KR (1) KR100906554B1 (https=)
CN (1) CN100521144C (https=)
TW (1) TW200816358A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101488227B1 (ko) * 2012-08-09 2015-01-30 다즈모 가부시키가이샤 흡착정반

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
CN102179881A (zh) * 2011-04-01 2011-09-14 石金精密科技（深圳）有限公司 平面薄板吸附固定系统
CN102496587B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆在位检测装置以及晶圆在位检测方法
CN102496595B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆托架、晶圆交换装置以及晶圆在位检测方法
TW201509544A (zh) * 2013-09-05 2015-03-16 Rich Chen Automatically Controlled Co Ltd 基板塗佈裝置及塗佈方法
CN106853432B (zh) * 2016-11-24 2019-04-16 重庆市永川区锐峰玻璃制品有限公司 旋转涂胶台
CN110124908B (zh) * 2019-06-21 2021-09-07 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶片真空吸附装置
CN111132539A (zh) * 2020-01-17 2020-05-08 安徽博微长安电子有限公司 一种手动点胶贴片机无损贴装凝胶盒中芯片的工装及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023060A (ja) * 2001-07-10 2003-01-24 Shimadzu Corp 吊り下げ型基板保持装置および液晶パネル製造装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880264B2 (ja) * 1990-07-12 1999-04-05 キヤノン株式会社 基板保持装置
JPH08125000A (ja) * 1994-10-24 1996-05-17 Nec Kyushu Ltd ウェーハチャック
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
JPH0945755A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd ウェハチャックおよびウェハ吸着方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023060A (ja) * 2001-07-10 2003-01-24 Shimadzu Corp 吊り下げ型基板保持装置および液晶パネル製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101488227B1 (ko) * 2012-08-09 2015-01-30 다즈모 가부시키가이샤 흡착정반

Also Published As

Publication number Publication date
CN101131954A (zh) 2008-02-27
CN100521144C (zh) 2009-07-29
TWI360195B (https=) 2012-03-11
JP2008053391A (ja) 2008-03-06
KR20080018808A (ko) 2008-02-28
TW200816358A (en) 2008-04-01
JP4771893B2 (ja) 2011-09-14

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