TW200816358A - Board retainer - Google Patents

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Info

Publication number
TW200816358A
TW200816358A TW096119595A TW96119595A TW200816358A TW 200816358 A TW200816358 A TW 200816358A TW 096119595 A TW096119595 A TW 096119595A TW 96119595 A TW96119595 A TW 96119595A TW 200816358 A TW200816358 A TW 200816358A
Authority
TW
Taiwan
Prior art keywords
valve
substrate
vacuum
state
end side
Prior art date
Application number
TW096119595A
Other languages
English (en)
Chinese (zh)
Other versions
TWI360195B (https=
Inventor
Yoshiaki Masu
Hidenori Miyamoto
Kenji Yoshizawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200816358A publication Critical patent/TW200816358A/zh
Application granted granted Critical
Publication of TWI360195B publication Critical patent/TWI360195B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
TW096119595A 2006-08-24 2007-05-31 Board retainer TW200816358A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006227245A JP4771893B2 (ja) 2006-08-24 2006-08-24 基板保持装置

Publications (2)

Publication Number Publication Date
TW200816358A true TW200816358A (en) 2008-04-01
TWI360195B TWI360195B (https=) 2012-03-11

Family

ID=39129152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119595A TW200816358A (en) 2006-08-24 2007-05-31 Board retainer

Country Status (4)

Country Link
JP (1) JP4771893B2 (https=)
KR (1) KR100906554B1 (https=)
CN (1) CN100521144C (https=)
TW (1) TW200816358A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
CN102179881A (zh) * 2011-04-01 2011-09-14 石金精密科技（深圳）有限公司 平面薄板吸附固定系统
CN102496587B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆在位检测装置以及晶圆在位检测方法
CN102496595B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆托架、晶圆交换装置以及晶圆在位检测方法
JP6057599B2 (ja) * 2012-08-09 2017-01-11 タツモ株式会社 吸着定盤及びその製造方法
TW201509544A (zh) * 2013-09-05 2015-03-16 Rich Chen Automatically Controlled Co Ltd 基板塗佈裝置及塗佈方法
CN106853432B (zh) * 2016-11-24 2019-04-16 重庆市永川区锐峰玻璃制品有限公司 旋转涂胶台
CN110124908B (zh) * 2019-06-21 2021-09-07 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶片真空吸附装置
CN111132539A (zh) * 2020-01-17 2020-05-08 安徽博微长安电子有限公司 一种手动点胶贴片机无损贴装凝胶盒中芯片的工装及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880264B2 (ja) * 1990-07-12 1999-04-05 キヤノン株式会社 基板保持装置
JPH08125000A (ja) * 1994-10-24 1996-05-17 Nec Kyushu Ltd ウェーハチャック
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
JPH0945755A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd ウェハチャックおよびウェハ吸着方法
JP2003023060A (ja) * 2001-07-10 2003-01-24 Shimadzu Corp 吊り下げ型基板保持装置および液晶パネル製造装置

Also Published As

Publication number Publication date
KR100906554B1 (ko) 2009-07-07
CN101131954A (zh) 2008-02-27
CN100521144C (zh) 2009-07-29
TWI360195B (https=) 2012-03-11
JP2008053391A (ja) 2008-03-06
KR20080018808A (ko) 2008-02-28
JP4771893B2 (ja) 2011-09-14

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