CN100495909C - 压电振荡器和电子设备 - Google Patents
压电振荡器和电子设备 Download PDFInfo
- Publication number
- CN100495909C CN100495909C CNB200510077849XA CN200510077849A CN100495909C CN 100495909 C CN100495909 C CN 100495909C CN B200510077849X A CNB200510077849X A CN B200510077849XA CN 200510077849 A CN200510077849 A CN 200510077849A CN 100495909 C CN100495909 C CN 100495909C
- Authority
- CN
- China
- Prior art keywords
- aforementioned
- piezoelectric oscillator
- terminals
- terminal
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004165782 | 2004-06-03 | ||
| JP2004165782A JP4244865B2 (ja) | 2004-06-03 | 2004-06-03 | 圧電発振器および電子機器 |
| JPJP2004165782 | 2004-06-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1705224A CN1705224A (zh) | 2005-12-07 |
| CN100495909C true CN100495909C (zh) | 2009-06-03 |
Family
ID=35446905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510077849XA Expired - Fee Related CN100495909C (zh) | 2004-06-03 | 2005-06-03 | 压电振荡器和电子设备 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7259501B2 (https=) |
| JP (1) | JP4244865B2 (https=) |
| KR (1) | KR100779274B1 (https=) |
| CN (1) | CN100495909C (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105634472A (zh) * | 2011-03-11 | 2016-06-01 | 精工爱普生株式会社 | 压电器件与电子设备 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7656071B2 (en) | 2002-10-21 | 2010-02-02 | Hrl Laboratories, Llc | Piezoelectric actuator for tunable electronic components |
| US7085121B2 (en) | 2002-10-21 | 2006-08-01 | Hrl Laboratories, Llc | Variable capacitance membrane actuator for wide band tuning of microstrip resonators and filters |
| US7098577B2 (en) * | 2002-10-21 | 2006-08-29 | Hrl Laboratories, Llc | Piezoelectric switch for tunable electronic components |
| JP4251070B2 (ja) * | 2003-12-10 | 2009-04-08 | エプソントヨコム株式会社 | 圧電発振器、電子部品、及び圧電発振器の製造方法 |
| US7710002B2 (en) * | 2006-06-21 | 2010-05-04 | Epson Toyocom Corporation | Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator |
| JP4554398B2 (ja) * | 2005-03-03 | 2010-09-29 | セイコーエプソン株式会社 | 弾性表面波デバイス及び弾性表面波デバイスの製造方法 |
| JP5007494B2 (ja) * | 2005-07-04 | 2012-08-22 | セイコーエプソン株式会社 | 電子デバイスの製造方法 |
| JP2007089117A (ja) * | 2005-08-24 | 2007-04-05 | Seiko Instruments Inc | 圧電振動子、発振器、電子部品、電子機器、圧電振動子の製造方法及び電子部品の製造方法 |
| JP4145935B2 (ja) * | 2006-04-27 | 2008-09-03 | エプソントヨコム株式会社 | 圧電デバイス |
| JP4151711B2 (ja) * | 2006-05-24 | 2008-09-17 | エプソントヨコム株式会社 | 圧電デバイス |
| JP2008118585A (ja) * | 2006-11-08 | 2008-05-22 | Nippon Dempa Kogyo Co Ltd | 表面実装用の電子部品 |
| JP5339681B2 (ja) * | 2007-02-21 | 2013-11-13 | 日本電波工業株式会社 | 表面実装用の水晶振動子 |
| JP5072436B2 (ja) * | 2007-05-22 | 2012-11-14 | 日本電波工業株式会社 | 表面実装用の水晶発振器 |
| JP5048471B2 (ja) * | 2007-12-05 | 2012-10-17 | セイコーインスツル株式会社 | パッケージの製造方法、パッケージ、電子デバイス、圧電振動子、発振器、電子機器及び電波時計 |
| JP2009164691A (ja) * | 2007-12-28 | 2009-07-23 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
| JP4872981B2 (ja) * | 2008-07-29 | 2012-02-08 | セイコーエプソン株式会社 | 圧電デバイスを備えた電子モジュール及びその製造方法 |
| JP5272834B2 (ja) * | 2009-03-23 | 2013-08-28 | セイコーエプソン株式会社 | 電子デバイスの電気的特性の検査方法、電子デバイス検査用冶具 |
| TWI548204B (zh) * | 2010-03-29 | 2016-09-01 | Kyocera Kinseki Corp | Piezoelectric vibrator |
| JP7484429B2 (ja) * | 2020-05-29 | 2024-05-16 | セイコーエプソン株式会社 | 発振器、電子機器、及び移動体 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4471259A (en) * | 1982-08-26 | 1984-09-11 | Motorola Inc. | Crystal package for a high-G environment |
| US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
| JPH088682A (ja) * | 1994-06-17 | 1996-01-12 | Fujitsu Ltd | 直列共振デバイス及びその製造方法と試験方法 |
| EP0961404B1 (en) * | 1998-05-29 | 2008-07-02 | Fujitsu Limited | Surface-acoustic-wave filter having an improved suppression outside a pass-band |
| JP3406846B2 (ja) * | 1998-08-31 | 2003-05-19 | 京セラ株式会社 | 温度補償型水晶発振器 |
| US6642167B1 (en) * | 1999-11-09 | 2003-11-04 | Murata Manufacturing Co., Ltd. | Dielectric ceramic composition, monolithic ceramic substrate, ceramic electronic component, and monolithic ceramic electronic component |
| JP2001177044A (ja) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | 電子部品モジュール及び圧電発振器 |
| JP2001220230A (ja) * | 2000-02-09 | 2001-08-14 | Murata Mfg Co Ltd | 誘電体磁器組成物 |
| JP3680765B2 (ja) * | 2000-07-21 | 2005-08-10 | 株式会社村田製作所 | 誘電体磁器組成物 |
| JP3444420B2 (ja) * | 2001-03-26 | 2003-09-08 | セイコーエプソン株式会社 | 弾性表面波装置及びその製造方法 |
| JP3974346B2 (ja) * | 2001-03-30 | 2007-09-12 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
| EP1381151B1 (en) * | 2001-04-18 | 2010-06-23 | Epson Toyocom Corporation | Piezoelectric oscillator and its manufacturing method |
-
2004
- 2004-06-03 JP JP2004165782A patent/JP4244865B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-02 US US11/142,473 patent/US7259501B2/en not_active Expired - Lifetime
- 2005-06-02 KR KR1020050047191A patent/KR100779274B1/ko not_active Expired - Fee Related
- 2005-06-03 CN CNB200510077849XA patent/CN100495909C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105634472A (zh) * | 2011-03-11 | 2016-06-01 | 精工爱普生株式会社 | 压电器件与电子设备 |
| CN105634472B (zh) * | 2011-03-11 | 2018-10-30 | 精工爱普生株式会社 | 压电器件与电子设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1705224A (zh) | 2005-12-07 |
| KR100779274B1 (ko) | 2007-11-23 |
| KR20060049505A (ko) | 2006-05-19 |
| JP4244865B2 (ja) | 2009-03-25 |
| US20050269911A1 (en) | 2005-12-08 |
| US7259501B2 (en) | 2007-08-21 |
| JP2005348120A (ja) | 2005-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090603 Termination date: 20200603 |