CN100468675C - Cof基板用层合体的制造方法 - Google Patents
Cof基板用层合体的制造方法 Download PDFInfo
- Publication number
- CN100468675C CN100468675C CN 200580041088 CN200580041088A CN100468675C CN 100468675 C CN100468675 C CN 100468675C CN 200580041088 CN200580041088 CN 200580041088 CN 200580041088 A CN200580041088 A CN 200580041088A CN 100468675 C CN100468675 C CN 100468675C
- Authority
- CN
- China
- Prior art keywords
- conductor
- insulating barrier
- cof
- stacked body
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Abstract
Description
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004371080 | 2004-12-22 | ||
JP371080/2004 | 2004-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101076885A CN101076885A (zh) | 2007-11-21 |
CN100468675C true CN100468675C (zh) | 2009-03-11 |
Family
ID=36601601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200580041088 Expired - Fee Related CN100468675C (zh) | 2004-12-22 | 2005-12-13 | Cof基板用层合体的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5064035B2 (zh) |
KR (1) | KR101169829B1 (zh) |
CN (1) | CN100468675C (zh) |
TW (1) | TWI400742B (zh) |
WO (1) | WO2006068000A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4823884B2 (ja) * | 2006-12-11 | 2011-11-24 | 新日鐵化学株式会社 | フレキシブル銅張積層板の製造方法 |
JP4828439B2 (ja) * | 2007-01-15 | 2011-11-30 | 新日鐵化学株式会社 | フレキシブル積層板の製造方法 |
US8238114B2 (en) * | 2007-09-20 | 2012-08-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing same |
JP6094044B2 (ja) * | 2011-03-23 | 2017-03-15 | 大日本印刷株式会社 | 放熱基板およびそれを用いた素子 |
CN103442511A (zh) * | 2013-08-20 | 2013-12-11 | 珠海亚泰电子科技有限公司 | 一种高频基板 |
JP6572083B2 (ja) * | 2015-09-30 | 2019-09-04 | 大日本印刷株式会社 | 発光素子用基板、モジュール及び発光素子用基板の製造方法 |
CN110868799A (zh) * | 2019-11-15 | 2020-03-06 | 江苏上达电子有限公司 | 一种透明cof设计方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1491073A (zh) * | 2002-09-02 | 2004-04-21 | 古河电路铜箔株式会社 | 薄膜上的集成电路芯片用、等离子显示器用或高频印刷电路板用铜箔 |
CN1533686A (zh) * | 2002-05-13 | 2004-09-29 | ���������kҵ��ʽ���� | 软膜上芯片用软性印刷线路板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100491465B1 (ko) * | 1998-08-31 | 2005-05-25 | 히다치 가세고교 가부시끼가이샤 | 금속용 연마액 및 연마 방법 |
TWI224128B (en) * | 1998-12-28 | 2004-11-21 | Hitachi Chemical Co Ltd | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
TW591089B (en) * | 2001-08-09 | 2004-06-11 | Cheil Ind Inc | Slurry composition for use in chemical mechanical polishing of metal wiring |
JP4522039B2 (ja) * | 2002-03-28 | 2010-08-11 | 旭化成イーマテリアルズ株式会社 | Cof用配線板の製造方法 |
JP2004119961A (ja) * | 2002-09-02 | 2004-04-15 | Furukawa Techno Research Kk | チップオンフィルム用、プラズマディスプレイ用、または高周波プリント配線板用銅箔 |
-
2005
- 2005-12-13 CN CN 200580041088 patent/CN100468675C/zh not_active Expired - Fee Related
- 2005-12-13 KR KR1020077016686A patent/KR101169829B1/ko active IP Right Grant
- 2005-12-13 WO PCT/JP2005/022825 patent/WO2006068000A1/ja active Application Filing
- 2005-12-13 JP JP2006548842A patent/JP5064035B2/ja not_active Expired - Fee Related
- 2005-12-21 TW TW94145585A patent/TWI400742B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1533686A (zh) * | 2002-05-13 | 2004-09-29 | ���������kҵ��ʽ���� | 软膜上芯片用软性印刷线路板 |
CN1491073A (zh) * | 2002-09-02 | 2004-04-21 | 古河电路铜箔株式会社 | 薄膜上的集成电路芯片用、等离子显示器用或高频印刷电路板用铜箔 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2006068000A1 (ja) | 2008-08-07 |
KR101169829B1 (ko) | 2012-07-30 |
KR20070091027A (ko) | 2007-09-06 |
TW200634903A (en) | 2006-10-01 |
JP5064035B2 (ja) | 2012-10-31 |
CN101076885A (zh) | 2007-11-21 |
TWI400742B (zh) | 2013-07-01 |
WO2006068000A1 (ja) | 2006-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: NIPPON STEEL + SUMITOMO METAL CORPORATION Free format text: FORMER NAME: NIPPON SEEL CHEMICAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Nippon Steel Chemical Co. Address before: Tokyo, Japan Patentee before: Nippon Seel Chemical Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191213 Address after: No.13-1, No.1, No.1, No Patentee after: Nippon Iron Chemical Materials Co., Ltd. Address before: Tokyo, Japan Patentee before: Nippon Steel Chemical Co. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090311 Termination date: 20191213 |